CN216353717U - Planar Magnetics and Power Modules - Google Patents

Abstract

The present application provides a planar magnetic element and a power module including the planar magnetic element. The planar magnetic element includes a first magnetic core, a second magnetic core, a magnetic column, a circuit board, and a support structure. The first magnetic core and the second magnetic core are arranged on opposite sides of the circuit board, and the circuit board includes a first plane close to the first magnetic core and a second plane close to the second magnetic core. The circuit board also includes a through hole communicating between the first plane and the second plane. The magnetic columns pass through the through holes and are respectively abutted against the first magnetic core and the second magnetic core. The support structure is located between the first magnetic core and the first plane, and abuts the first magnetic core and the first plane, respectively, so that a first gap is formed between the first magnetic core and the first plane, and at the same time, the second A second gap is formed between the magnetic core and the second plane. The first gap and the second gap of the planar magnetic element of the present application increase the heat dissipation area, thereby reducing the thermal cascade effect, and can improve the working reliability of the planar magnetic element.

Description

Planar Magnetics and Power Modules

technical field

The present application relates to the field of electronic devices, and in particular, to a planar magnetic element and a power module including the planar magnetic element.

Background technique

Planar magnetic technology has the advantages of small size and light weight, which can significantly improve the power density of magnetic components, so it is more and more widely used in power modules. The magnetic core of the planar magnetic element is stacked on the circuit board, and the area available for heat dissipation on the outer surface of the planar magnetic element is relatively small, which limits the heat dissipation capability of the planar magnetic element. Therefore, the planar magnetic components are prone to thermal cascading, which affects the normal operation of the power module.

Utility model content

The present application provides a planar magnetic element and a power module. While realizing the miniaturization of the planar magnetic element, the heat dissipation area of the planar magnetic element can be increased. This application specifically includes the following technical solutions:

In a first aspect, the present application provides a planar magnetic element, comprising a first magnetic core, a second magnetic core, a magnetic column, a circuit board and a support structure; the first magnetic core and the second magnetic core are arranged on opposite sides of the circuit board , the circuit board includes a first plane close to the first magnetic core and a second plane close to the second magnetic core; the circuit board also includes a through hole, the through hole is connected between the first plane and the second plane, and the magnetic column passes through a through hole, the magnetic column abuts against the first magnetic core and the second magnetic core respectively; the supporting structure is located between the first magnetic core and the first plane, and the supporting structure abuts against the first magnetic core and the first plane respectively, so that the A first gap is formed between the first magnetic core and the first plane, and at the same time, a second gap is formed between the second magnetic core and the second plane.

The planar magnetic element of the present application presses against the first magnetic core and the second magnetic core respectively through the magnetic columns passing through the circuit board, so as to ensure the relative distance between the first magnetic core and the second magnetic core. Then, the height of the first gap is controlled through the support structures abutting against the first magnetic core and the first plane, and thus the height of the second gap is indirectly controlled. The formation of the first gap and the second gap also increases the heat dissipation area of the planar magnetic element of the present application, and reduces the thermal cascade effect of the planar magnetic element. The operational reliability of the planar magnetic element of the present application is also improved accordingly.

In a possible implementation manner, the first gap includes a first ventilation channel, the first ventilation channel runs through between the first magnetic core and the first plane along a first direction, and the first direction is parallel to the first plane; the second The gap includes a second air channel, and the second air channel also penetrates between the second magnetic core and the second plane along the first direction.

In this implementation manner, when the first air passage penetrates between the first magnetic core and the first plane along the first direction, the cooling air in the first gap can be convective along the first direction, thereby ensuring the safety of the first gap. When the second air passage penetrates between the second magnetic core and the second plane along the first direction, the cooling air convection in the second gap can also be ensured, and the heat dissipation effect of the second gap can be ensured.

In a possible implementation manner, the first gap includes at least two first ventilation channels, and in a second direction perpendicular to the first direction, at least one first ventilation channel is provided on each side of the magnetic column; The two gaps include at least two second air passages, and in the second direction, at least one second air passage is provided on both sides of the magnetic column.

In this implementation manner, because the magnetic column is connected between the first magnetic core and the second magnetic core, the magnetic column will hinder the circulation of cooling air. However, arranging the first air channel and the second air channel on opposite sides of the magnetic column can make the heat dissipation effects of the first gap and the second gap more balanced, and avoid the phenomenon of local overheating.

In a possible implementation manner, the size of the first gap is greater than or equal to 1 mm; the size of the second gap is also greater than or equal to 1 mm.

In this implementation manner, the size of the first gap is set, that is, the minimum distance from the first magnetic core to the first plane is controlled. The minimum distance can ensure the cooperative work between the first magnetic core, the circuit board and the magnetic column, and at the same time provide enough space for cooling air to flow. The size of the second gap is also used to ensure the minimum distance from the second magnetic core to the second plane.

In a possible implementation manner, the magnetic column and the first magnetic core are integrally formed.

In a possible implementation manner, the support structure and the first magnetic core are integrally formed.

In a possible implementation manner, the support structure is configured as a spacer, and the spacer is respectively bonded to the first magnetic core and the first plane.

In a possible implementation manner, the circuit board includes two through holes, the two through holes are arranged at intervals, the number of corresponding magnetic columns is also two, and the two magnetic columns are respectively contacted with the first magnetic core and the second magnetic core hold.

In this implementation manner, the two magnetic columns are arranged at intervals, and a circulation path can be formed between the first magnetic core and the second magnetic core.

In a possible implementation manner, the two magnetic columns are spaced apart along the first direction.

In a possible implementation manner, the circuit board is further provided with windings, and the windings surround the periphery of the through holes.

In this implementation manner, the wire wraps around the periphery of the through hole, that is, the wire wraps around the periphery of the magnetic column. The magnetic column can increase the magnetic flux in the winding, which in turn increases the inductance of the planar magnetic element.

In a second aspect, the present application provides a power module, including an air supply unit, and at least one planar magnetic element provided in the first aspect of the present application. The air supply unit is used to supply air toward the first gap and the second gap at the same time, so as to dissipate heat from the planar magnetic element. It can be understood that, in the power module provided in the second aspect of the present application, because the planar magnetic element provided in the first aspect of the present application is used, the heat dissipation effect is improved, and thus the working reliability is improved.

Description of drawings

1 is a schematic structural diagram of a power supply module provided by the present application;

2 is a schematic structural diagram of a planar magnetic element in a power module provided by the present application;

3 is an exploded lateral schematic view of a planar magnetic element in a power module provided by the present application;

4 is a schematic diagram of an exploded structure of a planar magnetic element in a power module provided by the present application;

5 is a side partial schematic diagram of a planar magnetic element in a power module provided by the present application;

6 is a schematic diagram of a cooling air path of a power module provided by the present application;

7 is a schematic diagram of a cooling air path of a power module in the prior art;

8 is a schematic plan view of a first magnetic core in a planar magnetic element provided by the present application;

9 is a schematic structural diagram of a circuit board in a planar magnetic element provided by the present application;

10 is an equivalent circuit diagram of a planar magnetic element provided by the present application;

11 is another side schematic view of a planar magnetic element provided by the present application;

12 is a schematic structural diagram of another embodiment of the first magnetic core in a planar magnetic element provided by the present application;

13a, 13b and 13c are schematic cross-sectional views of different embodiments of magnetic columns in a planar magnetic element provided by the present application;

14 is a schematic structural diagram of another embodiment of the first magnetic core in a planar magnetic element provided by the present application;

15 is a schematic structural diagram of another embodiment of the first magnetic core in a planar magnetic element provided by the present application;

FIG. 16 is a schematic side view of another embodiment of the first magnetic core in a planar magnetic element provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present application.

FIG. 1 is a schematic structural diagram of a power module 200 provided by the present application.

The power module 200 includes an air supply unit 201 and the planar magnetic element 100 provided by the present application. The air supply unit 201 and the planar magnetic element 100 are arranged side by side along the first direction 001 , and the air supply unit 201 may provide cooling air toward the planar magnetic element 100 along the first direction 001 to promote the heat dissipation effect of the planar magnetic element 100 . In the schematic diagram of FIG. 1 , the planar magnetic element 100 is in the shape of a plate, which is arranged substantially parallel to the first direction 001 and is located in the middle of the air supply unit 201 . Therefore, the cooling air sent by the air supply unit 201 can flow through the upper and lower sides of the plate-shaped planar magnetic element 100 respectively, which enlarges the action area of the cooling air on the planar magnetic element 100 and improves its heat dissipation effect.

The planar magnetic element 100 of the present application can be used as a planar transformer or a planar inductor, and correspondingly, the power module 200 of the present application can be used as a switching power supply or a power converter. The application scope of the power supply module 200 may include an AC power supply, a DC power supply, a fast charging adapter, an on board charger (OBC), an uninterruptible power supply (UPS), and the like. Because the volume of the planar magnetic element 100 of the present application is relatively small, the volume of the power module 200 equipped with the planar magnetic element 100 is also controlled accordingly.

FIG. 2 is a schematic structural diagram of a planar magnetic element 100 provided by the present application.

The planar magnetic element 100 of the present application includes a first magnetic core 10 , a second magnetic core 20 , a magnetic column 30 , a circuit board 40 and a support structure 50 . The first magnetic core 10 , the second magnetic core 20 and the circuit board 40 are all substantially plate-shaped. The first magnetic core 10 and the second magnetic core 20 are arranged on two sides of the circuit board 40 , that is, the first magnetic core 10 , the circuit board 40 and the second magnetic core 20 are stacked in sequence. Please refer to FIG. 3 , wherein the circuit board 40 includes a first plane 401 and a second plane 402 opposite to each other, and the first plane 401 is located close to the first magnetic core 10 and is disposed toward the first magnetic core 10 . The second plane 402 is located close to the second magnetic core 20 and is disposed toward the second magnetic core 20 .

Correspondingly, the first magnetic core 10 includes a first inner surface 11 that is opposite to the first plane 401 , that is, the first magnetic core 10 includes a first inner surface 11 that is close to and faces the circuit board 40 . . The second magnetic core 20 includes a second inner surface 21 that is opposite to the second plane 402 , that is, the second magnetic core 20 includes a second inner surface 21 that is close to and faces the circuit board 40 . It can be understood that the first inner surface 11 and the second inner surface 21 are also opposite to each other.

Referring to FIG. 4 , through holes 41 are formed on the circuit board 40 . The through hole 41 penetrates through the circuit board 40 , and the through hole 41 is connected between the first plane 401 and the second plane 402 . In the embodiment of FIG. 4 , the number of the through holes 41 is two, and the two through holes 41 are arranged at intervals along the first direction 001 . The first direction 001 is a direction parallel to the first plane 401 of the circuit board 40 , and can also be understood as the length direction of the first magnetic core 10 and the second magnetic core 20 in this embodiment. It can be understood that in other embodiments, the number of the through holes 41 may also be multiple, and the arrangement direction of the multiple through holes 41 may be any direction parallel to the first plane 401 .

The magnetic column 30 passes through the through hole 41 and abuts between the first magnetic core 10 and the second magnetic core 20 respectively. Specifically, the magnetic column 30 includes a first end 31 and a second end 32 opposite to each other, the first end 31 of the first end 31 is located on the side of the first plane 401 away from the second plane 402 , and the first end 31 is connected to the first end 31 of the first magnetic core 10 . The inner surfaces 11 are in contact with each other and form a mutually abutting structure; the second end 32 of the magnetic column 30 is located on the side of the second plane 402 away from the first plane 401 , and the second end 32 is connected to the second inner surface of the second magnetic core 20 21 are in contact and form a structure against each other. Therefore, the distance between the first magnetic core 10 and the second magnetic core 20 is the distance between the first end 31 to the second end 32 of the magnetic column 30 , that is, the length dimension of the magnetic column 30 . In the planar magnetic element 100 of the present application, the length dimension of the magnetic column 30 is greater than the thickness dimension of the circuit board 40 , so the minimum distance H1 between the first magnetic core 10 and the second magnetic core 20 is also greater than the thickness of the circuit board 40 Dimension D (see Figure 5).

The support structure 50 is located between the first magnetic core 10 and the circuit board 40 . In the embodiment shown in Figures 3 and 4, the support structure 50 is implemented in the form of spacers 51. The spacer 51 and the first magnetic core 10 are independent components. The spacer 51 includes a first support surface 511 close to and facing the first inner surface 11 , and the spacer 51 also includes a second support close to and toward the first plane 401 . face 512. The first support surface 511 and the first inner surface 11 are in contact with and abut against each other, and the second support surface 512 and the first plane 401 are in contact with and abut against each other. Thus, the first gap 12 is formed between the first inner surface 11 and the first plane 401 . The height h1 of the first gap 12 is the thickness of the gasket 51 .

Please continue to refer to FIG. 5 , in the planar magnetic element 100 of the present application, the relative relationship between the first inner surface 11 of the first magnetic core 10 and the first plane 41 of the circuit board 40 can be controlled by the supporting action of the support structure 50 . The distance, that is, the thickness dimension to the first gap 12 is controlled. As mentioned above, the relative distance H1 between the first inner surface 11 of the first magnetic core 10 and the second inner surface 21 of the second magnetic core 20 is limited by the length dimension of the magnetic column 30 . Therefore, based on the calculation of the dimension chain, the distance h2 between the second inner surface 21 and the second plane 402 can be obtained:

h2=H1–h1–D formula (1);

where D is the thickness of the circuit board 40 . By controlling the length dimension H1 of the magnetic column 30 , the thickness dimension h1 of the pad 51 , and the limitation of the thickness dimension D of the circuit board 40 , the distance between the second inner surface 21 and the second plane 402 can be controlled. distance h2. That is, the planar magnetic element 100 of the present application can control the dimension chain so that the second gap 22 is formed between the second magnetic core 20 and the circuit board 40 (h2>0 at this time). The second gap 22 is thus formed between the second inner surface 22 and the second plane 402. The effect of the second gap 22 is similar to that of the first gap 12 , so that the first inner surface 11 of the first magnetic core 10 , the second inner surface 21 of the second magnetic core 20 , and the first plane 401 and the second The two flat surfaces 402 are exposed respectively, for increasing the heat dissipation area of the planar magnetic element 100 .

Further, please refer to Figure 6. At the same time, two passages for cooling air flow are formed between the circuit board 40 and the first magnetic core 10 and between the circuit board 40 and the second magnetic core 20 . For the power module 200 of the present application, when the air supply unit 201 supplies air toward the first gap 12 and the second gap 22 at the same time, the cooling air can pass through the planar magnetic element 100 from the first gap 12 and the second gap 22 , In turn, the heat dissipation effect of the first inner surface 11 , the second inner surface 21 , and the first plane 401 and the second plane 402 is improved, so as to ensure the working reliability of the planar magnetic element 100 of the present application.

FIG. 7 illustrates a structure of a power supply module 200a in the prior art. In the prior art illustrated in FIG. 7 , the power module 200a also includes an air supply unit 201a and a planar magnetic element 100a. The prior art planar magnetic element 100a also includes a first magnetic core 10a, a second magnetic core 20a, a magnetic column (not shown) and a circuit board 40a. The first magnetic core 10a and the second magnetic core 20a are also arranged on two sides of the circuit board 40a, but the first magnetic core 10a and the second magnetic core 20a are respectively attached to the plane of the circuit board 40a. The magnetic columns are accommodated inside the circuit board 40a, and are respectively contacted with the first magnetic core 10a and the second magnetic core 20a.

Therefore, when the air blowing unit 201a blows air toward the planar magnetic element 100a, the cooling air can only be directed from the outer surface of the first magnetic core 10a away from the circuit board 40a, and the second magnetic core 20a away from the circuit board 40a. flow over the outer surface. The heat dissipation area of the prior art planar magnetic element 100a is relatively small. However, the structure of the planar magnetic element 100 shown in FIG. 6 of the present application increases the structures of the first gap 12 and the second gap 22 compared with the planar magnetic element 100 a of the prior art, so the heat dissipation area also increases the first inner surface 11, the second inner surface 21, and four planes of the first plane 401 and the second plane 402, so that a better heat dissipation effect can be obtained. It can be understood that, for the power module 200 of the present application, even if the embodiment of the air supply unit 201 is not provided, the single planar magnetic element 100 still increases the number of heat dissipation surfaces compared with the prior art, and can thus obtain The better heat dissipation effect improves the working reliability of the power module 200 .

In one embodiment, the height dimension of the first gap 12, that is, the distance h1 between the first inner surface 11 and the first plane 401, may be set as h1≥1mm. At the same time, the height dimension of the second gap 22, that is, the distance h2 between the second inner surface 21 and the second plane 402, can be set as h2≥1mm. It has been verified by experiments that when the height dimensions of the first gap 12 and the second gap 22 are controlled within a small range, the performance of the planar magnetic element 100 is relatively weakly affected, but its heat dissipation effect is relatively significantly improved.

On the other hand, the height dimension of the first gap 12 and the second gap 22 is also related to the area dimension of the first inner surface 11 and the second inner surface 21 . It can be understood that when the area of the first inner surface 11 and the second inner surface 21 is larger, the height dimension of the first gap 12 and the second gap 22 also needs to be correspondingly increased in order to provide sufficient heat dissipation space and achieve better heat dissipation. cooling effect.

Referring to FIG. 8 , the present embodiment is developed based on a structure in which the first magnetic core 10 is a rectangular parallelepiped and the first inner surface 11 is a rectangle. In this embodiment, the first inner surface 11 has an area S, and the length dimension of the first inner surface 11 along the first direction 001 is A. At this time, when the conditions are met: S≤400mm ² , and A≤20mm, the height dimension of the first gap 12 should be set to 1mm≤h1≤1.5mm; when the conditions are met: 400mm ² ≤S≤1600mm ² , and A≤ When 40mm, the height dimension of the first gap 12 should be set to 1.5mm≤h1≤2mm; when the conditions are met: 1600mm ² ≤S≤3600mm ² , and A≤60mm, the height dimension of the first gap 12 should be set to 2mm≤ h1≤3mm; when the condition is satisfied: 3600mm ² ≤S, the height dimension of the first gap 12 should be set to 3mm≤h1. Therefore, the height dimension of the first gap 12 increases correspondingly with the increase of the area and length dimension of the first inner surface 11 , which can ensure the heat dissipation effect of the planar magnetic element 100 . The height dimension of the first gap 12 may also increase correspondingly with the increase of the length dimension of the first inner surface 11 , which can also ensure the heat dissipation effect of the planar magnetic element 100 . It can be understood that the height dimension of the second gap 22 can also be adjusted correspondingly with the change of the area and the length dimension of the second inner surface 21 .

On the other hand, in the embodiment where the power supply module 200 is provided with the air supply unit 201 , the flow rate of the cooling air provided by the air supply unit 201 can also be used to match the height dimension of the first gap 12 and the second gap 22 . In an embodiment, when the cooling air flow rate V provided by the air supply unit 201 satisfies the conditions: when V≤2m/s, the height dimension of the first gap 12 should be set to 3mm≤h1; when 2m/s≤V≤4m/s , the height dimension of the first gap 12 should be set to 2mm≤h1≤3mm; when 4m/s≤V≤6m/s, the height dimension of the first gap 12 should be set to 1.5mm≤h1≤2mm; when 6m/s≤V≤6m/s When s≤V, the height dimension of the first gap 12 is preferably set to be 1mm≤h1≤1.5mm. It can be seen that, in this embodiment, the height dimension of the first gap 12 can be correspondingly reduced as the cooling air flow rate of the air supply unit 201 increases. That is, when the cooling air flows faster, the height dimension of the first gap 12 can be appropriately reduced, which also meets the heat dissipation requirement of the planar magnetic element 100 . It can be understood that the height dimension of the second gap 22 can also be adjusted correspondingly with the change of the flow rate of the air supply unit 201 .

See FIG. 9 for an embodiment. For the circuit board 40 of the present application, a wire 42 is further provided at the position of the through hole 41 . The winding 42 is conductive and can be made of copper wire. The wire 42 surrounds the periphery of the through hole 41. When the magnetic column 30 passes through the through hole 41, the wire 42 surrounds the periphery of the magnetic column 30. Therefore, the winding 42 is formed into a coil structure surrounding the periphery of the magnetic column, and the planar magnetic element 100 of the present application can be equivalent to the transformer structure shown in FIG. 10 : the first magnetic core 10 , the second magnetic core 20 and the two magnetic The pillars 30 enclose a magnetic circulation path. One of the windings 42 on the periphery of the magnetic column 30 is formed as the primary coil of the transformer, serving as the input end; the winding 42 on the periphery of the other magnetic column 30 is formed as the secondary coil of the transformer, serving as the output end.

It should be mentioned that FIG. 9 and FIG. 10 only illustrate an implementation manner of the planar magnetic element 100 of the present application as a transformer. In other embodiments, the planar magnetic element 100 can also be used as other components such as an inductor, and its structure is similar to that of the above-mentioned transformer. On the other hand, in the schematic diagram of FIG. 9 , the winding 42 surrounds the periphery of the through hole 41 along the first plane 401 , and is helical with respect to the through hole 41 . In other embodiments, the windings 42 may also extend along the thickness direction of the circuit board 40 and also surround the periphery of the through holes 41 in a spiral shape.

Referring to FIG. 11 for an embodiment, in the second direction 002 perpendicular to the first direction 001 , the first gap 12 includes a first ventilation channel 121 , and the second gap 22 includes a second ventilation channel 221 . Specifically, the first ventilation channel 121 penetrates between the first magnetic core 10 and the circuit board 40 along the first direction 001 , and the second ventilation channel 221 penetrates between the second magnetic core 20 and the circuit board 40 along the first direction 001 between. When the air supply unit 201 sends cooling air along the first direction 001, the cooling air may pass through the first air passage 121 and the second air passage 221, respectively, and face the first inner surface 11 and the first plane 401, and The second inner surface 21 and the second plane 402 form a heat dissipation effect.

In the embodiment of FIG. 11 , the number of the first air passages 121 is also two, and the two first air passages 121 are arranged on both sides of the magnetic column 30 along the second direction 002 . That is, the magnetic column 30 may be located in the middle of the first magnetic core 10 along the second direction 002 , so that on opposite sides of the magnetic column 30 , a first ventilation channel 121 is respectively formed. Therefore, when the cooling air flows through the first air passages 121 on both sides of the magnetic column 30 , the heat dissipation effect on the first inner surface 11 and the first plane 401 is relatively uniform. It can be understood that the magnetic column 30 is also located in the middle position relative to the second magnetic core 20 . At this time, second ventilation channels 221 are also formed on both sides of the magnetic column 30 . The second air passages 221 on both sides can also make the heat dissipation effect of the second inner surface 21 and the second plane 402 relatively uniform.

In the embodiment of FIG. 11 , the position of the spacer 51 is set corresponding to the position of the magnetic column 30 , that is, the spacer 51 is also located in the middle position relative to the first magnetic core 10 . Further, the projection of the spacer 51 on the magnetic column 30 along the first direction 001 does not exceed the width of the magnetic column 30 . Specifically, the magnetic column 30 has a first width dimension L1 along the second direction 002, and the spacer 51 has a second width dimension L2. L1≧L2 is set, and the opposite ends of the spacer 51 along the second direction 002 do not exceed the edge of the magnetic column 30 . Therefore, while supporting the first magnetic core 10 and the circuit board 40 , the spacer 51 will not enter the area of the first air passage 121 , and thus will not block the area of the first air passage 121 , and will be lifted along the first direction. 001 is the cooling gas flow through the first ventilation duct 121 . It should be mentioned that when the number of spacers 51 is multiple, the projections of the multiple spacers 51 on the magnetic column 30 along the first direction 001 need to be located in the area of the magnetic column 30 and not exceed the area of the magnetic column 30 . width range, thereby ensuring that the cross-sectional area of the first ventilation channel 121 is maximized.

Referring to FIG. 12 for an embodiment, the first magnetic core 10 and the magnetic column 30 may be implemented by an integrally formed structure. Specifically, through the control of the processing technology, a structure in which the first magnetic core 10 and the magnetic column 30 are integrated is directly formed, so that after the magnetic column 30 is correspondingly inserted into the through hole 41 of the circuit board 40, the first magnetic core 10 and the magnetic column are completed. 30 Assembly in planar magnetic element 100. The relative position between the first magnetic core 10 and the magnetic column 30 provided in this embodiment is guaranteed, and the assembly process of the planar magnetic core element 100 is simplified.

Please refer to FIGS. 13 a , 13 b and 13 c simultaneously. For the cross-sectional shape of the magnetic column 30 of the present application, it can be configured in any shape such as a rectangle, a circle or an ellipse. As long as the magnetic column 30 has a certain cross-sectional area and can provide a magnetic flux that meets preset requirements, the function of the magnetic column 30 can be achieved. Correspondingly, the shape of the through hole 41 of the circuit board 40 can also match the cross-sectional shape of the magnetic column 30 , so that the distance between the winding 42 and the magnetic column 30 is relatively close to form a more reliable coil structure.

For another embodiment, please refer to FIG. 14 . Through the control of the processing technology, the support structure 50 (shown as the support block 52 in FIG. 14 ) can also be fabricated on the first magnetic core 10 , that is, the support structure 50 and the first magnetic core 10 . The magnetic core 10 is also integrally formed. In this embodiment, the support block 52 is protruded on the first inner surface 11 , and the first magnetic core 10 is in contact with the first inner surface 11 of the first magnetic core 10 because of the contact between the support block 52 and the first plane 401 of the circuit board 40 . A first gap 11 is formed between the planes 401 .

In the illustrated structure, the support block 52 is also formed between the two magnetic columns 30 . The two magnetic columns 30 can also be integrally formed with the first magnetic core 10 , so that the first magnetic core 10 can be integrally formed with the magnetic column 30 and the support block 52 at the same time. The support block 52 is connected between the two magnetic columns 30 to enhance the structural stability of the magnetic columns 30 . The relative position between the support block 52 itself and the first magnetic core 10 is also guaranteed. Meanwhile, in the assembly process of the planar magnetic element 100 , the first magnetic core 10 , the magnetic column 30 and the support block 52 are assembled in the same step, which further simplifies the assembly process of the planar magnetic element 100 .

For an embodiment, please refer to FIG. 15 . In this embodiment, the support structure 50 is implemented in the form of a support bar 53 . The support bars 53 are also formed integrally with the first magnetic core 10. Further, the support bar 53 also extends along the first direction 001 to form at least two first ventilation channels 121 in the first gap 12 (see FIG. 16 ). Similar to the structure of the support block 52 , the support bar 53 is also protruded on the first inner surface 11 , and the first magnetic core 10 is located on the first inner surface 11 due to the contact between the support bar 53 and the first plane 401 of the circuit board 40 . A first gap 11 is formed between it and the first plane 401 .

At the same time, the support bars 53 can also be distributed on both sides of the magnetic column 30 , so that a plurality of first air passages 121 are respectively formed on both sides of the magnetic column 30 . In this embodiment, when the support bars 53 are distributed on both sides of the magnetic column 30 , the number of the first air passages 121 is at least four. As can be seen from FIG. 16 , because the support bars 53 are integrally formed with the first magnetic core 10 , during the operation of the planar magnetic element 100 , the heat generated by the first magnetic core 10 will be simultaneously transferred to each support bar 53 . Since the support bar 53 is used to form the first ventilation channel 121 , the side wall of the support bar 53 is also used to form the inner wall of the first ventilation channel 121 . When the cooling air flows through each of the first air passages 121 , the cooling air will contact the side walls of each of the support bars 53 and carry the heat on the support bars 53 away from the planar magnetic element 100 . That is, the structure of the support bar 53 further increases the heat dissipation area of the first magnetic core 10, thereby enabling the planar magnetic element 100 of the present application to obtain a better heat dissipation effect.

The above descriptions are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, such as reducing Or adding a structural member, changing the shape of the structural member, etc., shall all be covered within the protection scope of the present application; the embodiments of the present application and the features in the embodiments can be combined with each other under the condition of no conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A planar magnetic element is characterized by comprising a first magnetic core, a second magnetic core, a magnetic column, a circuit board and a supporting structure;

the first and second magnetic cores are arranged on opposite sides of the circuit board, the circuit board including a first plane adjacent the first magnetic core and a second plane adjacent the second magnetic core;

the circuit board further comprises a through hole, the through hole is communicated between the first plane and the second plane, the magnetic column penetrates through the through hole, and the magnetic column is respectively abutted against the first magnetic core and the second magnetic core;

the supporting structure is located between the first magnetic core and the first plane, and the supporting structure is abutted to the first magnetic core and the first plane respectively, so that a first gap is formed between the first magnetic core and the first plane, and a second gap is formed between the second magnetic core and the second plane.

2. A planar magnetic component as claimed in claim 1, wherein the first gap comprises a first air duct extending in a first direction between the first core and the first plane, the first direction being parallel to the first plane;

the second gap includes a second air passage, and the second air passage also penetrates between the second magnetic core and the second plane along the first direction.

3. The planar magnetic component of claim 2, wherein the first gap comprises at least two first air channels, and at least one first air channel is disposed on each of two sides of the magnetic pillar in a second direction perpendicular to the first direction;

the second gap comprises at least two second air passages, and in the second direction, at least one second air passage is respectively arranged on two sides of the magnetic column.

4. A planar magnetic component as claimed in any of claims 1 to 3, wherein the size of the first gap is greater than or equal to 1 mm; the second gap is also greater than or equal to 1mm in size.

5. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the magnetic post is of integral construction with the first magnetic core.

6. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the support structure is of integral construction with the first magnetic core.

7. A planar magnetic component as claimed in any of claims 1 to 3, wherein the support structure is configured as a shim bonded to the first magnetic core and the first planar surface respectively.

8. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the circuit board includes two through holes, the two through holes are spaced apart from each other, the number of the through holes is two corresponding to the number of the magnetic pillars, and the two magnetic pillars are respectively abutted against the first magnetic core and the second magnetic core.

9. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the circuit board is further provided with a winding, the winding surrounding the periphery of the through hole.

10. A power supply module, characterized by comprising an air supply unit and at least one planar magnetic element according to any one of claims 1 to 9, wherein the air supply unit is used for supplying air towards the first gap and the second gap simultaneously so as to dissipate heat of the planar magnetic element.

Images