CN113900310B

CN113900310B - Liquid crystal device and method for manufacturing the same

Info

Publication number: CN113900310B
Application number: CN202111165380.0A
Authority: CN
Inventors: 贾振宇; 席克瑞; 林柏全; 王逸; 韩笑男; 秦锋
Original assignee: Shanghai Tianma Microelectronics Co Ltd
Current assignee: Shanghai Tianma Microelectronics Co Ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2024-07-02
Anticipated expiration: 2041-09-30
Also published as: CN113900310A

Abstract

The invention discloses a liquid crystal device and a manufacturing method thereof, belonging to the technical field of display and wireless communication, wherein the liquid crystal device comprises a first substrate, a second substrate and a liquid crystal layer, wherein the first substrate and the second substrate are oppositely arranged; the first substrate comprises a first area and a step area which are adjacently arranged along the direction parallel to the plane where the first substrate is positioned, and the area of the first substrate beyond the edge of the second substrate is the step area; the first substrate of the step area comprises a plurality of conductive pads; in the direction perpendicular to the plane where the first substrate is located, one side of the conductive bonding pad far away from the first substrate comprises a compensation conductive structure, and a flexible circuit board is attached to one side of the compensation conductive structure far away from the first substrate; the flexible circuit board comprises a plurality of pins, and the pins are electrically connected with the conductive pads through the compensation conductive structures. The manufacturing method of the liquid crystal device is used for manufacturing the liquid crystal device. The invention can reduce the difficulty of binding the flexible circuit board and better realize the effect of narrow frame.

Description

Liquid crystal device and method for manufacturing the same

Technical Field

The invention relates to the technical field of display and wireless communication, in particular to a liquid crystal device and a manufacturing method thereof.

Background

With the continuous development of communication technology, the demand for high-capacity and high-transmission speed communication is increasing. The liquid crystal antenna is an antenna which adjusts the alignment direction of a phased array antenna by changing the phase shift of a phase shifter by controlling the deflection direction of liquid crystal using dielectric anisotropy of liquid crystal. Compared with the traditional horn antenna, spiral antenna, array antenna and the like, the liquid crystal antenna has the characteristics of miniaturization, wide frequency band, multiband, high gain and the like, and is an antenna more suitable for the development direction of the current technology. In the field of display technology, liquid crystal display devices are widely used in the fields of light weight, thin profile, low power consumption and high contrast ratio, and are commonly used as displays of handheld terminals such as smart phones and tablet computers.

In the field of wireless communication technology and in the field of display technology, most liquid crystal devices have different sized rims around the periphery. For example, the conventional liquid crystal antenna structure adopts a passive driving mode, and the driving electrodes are required to be connected by binding a circuit board at the edge of the frame, so that the connection between external driving signals and the liquid crystal phase shifter unit is realized. The existing display screen also adopts a similar mode to realize the access of the driving signals. Because of the technical characteristics of the binding circuit board, a step structure is arranged at the binding position and is used for crimping the golden finger on the circuit board and the bonding pad on the liquid crystal device.

With the development of electronic display products, people pay more and more attention to the aspects of appearance, functions and the like, and in the preparation process of the electronic products, the space area occupied by the binding circuit board is larger, namely, the step size is one of main sources of the frame size, so that the development of extremely narrow frames of the corresponding electronic products is completely limited. In the display device, the smaller the frame is, the larger the screen ratio is, and the larger the display area is. In a tiled display device, too large a gap between the screens can affect the visual effect of the displayed image. The liquid crystal antenna also has the requirement of splicing and assembling at the later stage, the space between the antenna units needs to be controlled to a certain extent, but once large-size steps exist, the space between the antenna units is difficult to control, so that the performance of the antenna after assembling is reduced.

Therefore, the technical problem to be solved by the person skilled in the art is to provide a liquid crystal device capable of reducing the size of the frame of the binding circuit board region and better realizing the narrow frame and the manufacturing method thereof.

Disclosure of Invention

In view of the above, the present invention provides a liquid crystal device and a method for manufacturing the same, so as to solve the problem that the liquid crystal device in the prior art has a wider frame and is difficult to better achieve a narrow frame effect.

The invention discloses a liquid crystal device, comprising: a first substrate and a second substrate disposed opposite to each other, and a liquid crystal layer disposed between the first substrate and the second substrate; the first substrate comprises a first area and a step area which are adjacently arranged along the direction parallel to the plane of the first substrate, the area of the first substrate beyond the edge of the second substrate is the step area, and the area of the second substrate opposite to the first substrate is the first area; the first substrate of the step area comprises a plurality of conductive pads; in the direction perpendicular to the plane where the first substrate is located, one side of the conductive bonding pad far away from the first substrate comprises a compensation conductive structure, and a flexible circuit board is attached to one side of the compensation conductive structure far away from the first substrate; the flexible circuit board comprises a plurality of pins, and the pins are electrically connected with the conductive pads through the compensation conductive structures.

Based on the same inventive concept, the invention also discloses a manufacturing method of the liquid crystal device, wherein the manufacturing method is used for manufacturing the liquid crystal device; the manufacturing method comprises the following steps: providing a first substrate; the first substrate comprises a first area and a step area which are adjacently arranged along the direction parallel to the plane where the first substrate is positioned; a plurality of conductive pads are arranged on the first substrate of the step area; providing a second substrate; aligning the first substrate and the second substrate, and arranging a liquid crystal layer so that the liquid crystal layer is positioned between the first substrate and the second substrate; the area of the first substrate, which exceeds the edge of the second substrate, is a step area, and the area of the second substrate, which is opposite to the first substrate, is a first area; setting a compensation conductive structure on one side of the conductive pad far away from the first substrate along the direction perpendicular to the plane of the first substrate; attaching a flexible circuit board to one side of the compensation conductive structure away from the first substrate; the flexible circuit board comprises a plurality of pins, and the pins are electrically connected with the conductive pads through the compensation conductive structures.

Compared with the prior art, the liquid crystal device and the manufacturing method thereof provided by the invention have the advantages that at least the following effects are realized:

In the liquid crystal device, in the direction perpendicular to the plane where the first substrate is located, the compensation conductive structure is arranged on one side, away from the first substrate, of the conductive bonding pad of the step area, the flexible circuit board is attached to one side, away from the first substrate, of the compensation conductive structure, the flexible circuit board comprises a plurality of pins, the pins are electrically connected with the conductive bonding pad through the compensation conductive structure, the compensation conductive structure is equivalent to the height of the conductive bonding pad used for compensating the first substrate, the step area which is as narrow as possible can be arranged at the position, close to the edge, of the first substrate, the width of each conductive bonding pad is exposed, and the compensation conductive structure is arranged on the surface of one side, away from the first substrate, of the compensation conductive structure is attached to the flexible circuit board, and the compensation conductive structure is used as a connection structure of the flexible circuit board and the conductive bonding pad, so that the height of a connecting piece between the conductive bonding pad and the flexible circuit board can be compensated while at least one pin on the flexible circuit board is electrically connected with one conductive bonding pad through the compensation conductive structure. The arrangement of the compensation conductive structure with a certain height in the direction perpendicular to the plane of the first substrate ensures that the conductive structure formed by the conductive bonding pad and the compensation conductive structure in the step area is protruded outwards, so that the dimension of the conductive bonding pad in the direction perpendicular to the plane of the first substrate can be enlarged, then the flexible circuit board for providing driving signals is bound outside the compensation conductive structure, the difficulty of binding the flexible circuit board can be reduced, the purpose of reducing the width of the step area is achieved, and the narrow frame effect of the liquid crystal device can be better realized.

Of course, it is not necessary for any one product to practice the invention to achieve all of the technical effects described above at the same time.

Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic plan view of a liquid crystal device according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of the flexible circuit board of FIG. 1 in the direction A-A' after bending;

FIG. 3 is a schematic cross-sectional view of the flexible circuit board of FIG. 1 in the direction A-A' after being bent onto the first substrate;

FIG. 4 is a schematic view of another cross-sectional structure of the flexible circuit board of FIG. 1 in the direction A-A' after bending;

FIG. 5 is a schematic view of another planar structure of a liquid crystal device according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of the flexible circuit board of FIG. 5 in the B-B' direction after bending;

fig. 7 is a schematic plan view of another liquid crystal device according to an embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of the flexible circuit board of FIG. 7 in the C-C' direction after bending;

FIG. 9 is a schematic cross-sectional view of the flexible printed circuit board of FIG. 7 in the C-C' direction after being bent onto the first substrate;

fig. 10 is a schematic plan view of another liquid crystal device according to an embodiment of the present invention;

FIG. 11 is a schematic cross-sectional view of the flexible circuit board of FIG. 10 in the direction D-D' after bending;

FIG. 12 is a schematic cross-sectional view of the flexible circuit board of FIG. 7 after bending to form C-C';

fig. 13 is a schematic plan view of another liquid crystal device according to an embodiment of the present invention;

FIG. 14 is a schematic view of the cross-sectional structure in the direction E-E' of FIG. 13;

FIG. 15 is a flow chart of a method for fabricating a liquid crystal device according to an embodiment of the present invention;

Fig. 16 is a schematic structural diagram of a first substrate provided in the manufacturing method according to the embodiment of the present invention;

fig. 17 is a schematic structural diagram of a manufacturing method of a conductive pad on a first substrate according to an embodiment of the present invention;

Fig. 18 is a schematic structural diagram of a second substrate provided in the manufacturing method according to the embodiment of the present invention;

fig. 19 is a schematic structural diagram of a first substrate and a second substrate after they are formed into a box in the manufacturing method according to the embodiment of the present invention;

fig. 20 is a schematic structural diagram of a compensation conductive structure fabricated in a step region in the fabrication method according to the embodiment of the present invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic plan view of a liquid crystal device according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional view of A-A' of the flexible circuit board in fig. 1 after bending (it is understood that, for clarity of illustration of the structure of the embodiment, fig. 1 is filled with transparency), and a liquid crystal device 000 according to the embodiment includes: a first substrate 10 and a second substrate 20 disposed opposite to each other, and a liquid crystal layer 30 between the first substrate 10 and the second substrate 20;

Along the direction X parallel to the plane of the first substrate 10, the first substrate 10 includes a first area A1 and a step area A2 that are adjacently arranged, the area of the first substrate 10 beyond the edge of the second substrate 20 is the step area A2, and the area of the second substrate 20 opposite to the first substrate 10 is the first area A1;

The first substrate 10 of the step area A2 includes a plurality of conductive pads 101 thereon;

in the direction Z perpendicular to the plane of the first substrate 10, one side of the conductive pad 101 away from the first substrate 10 comprises a compensating conductive structure 40, and one side of the compensating conductive structure 40 away from the first substrate 10 is attached with a flexible circuit board 50;

The flexible circuit board 50 includes a plurality of pins 501, the pins 501 being electrically connected to the conductive pads 101 through the compensating conductive structures 40.

Specifically, the liquid crystal device 000 of the present embodiment includes a first substrate 10 and a second substrate 20 disposed opposite to each other, and a liquid crystal layer 30 between the first substrate 10 and the second substrate 20, wherein the first substrate 10 and the second substrate 20 are opposite to each other; alternatively, the planar area of the first substrate 10 may be greater than the planar area of the second substrate 20, so that when the first substrate 10 and the second substrate 20 are disposed opposite to each other, along the direction X parallel to the plane of the first substrate 10, at least one side edge of the first substrate 10 may be substantially flush with one side edge of the second substrate 20, and the first substrate 10 further has an area beyond the edge of the second substrate 20, which is the step area A2 of the first substrate 10. Along the direction X parallel to the plane of the first substrate 10, the first substrate 10 further includes a first area A1 disposed adjacent to the step area A2, and the area of the second substrate 20 opposite to the first substrate 10 is the first area A1, i.e. the area of the first substrate 10 and the second substrate 20 opposite to each other where the liquid crystal layer 30 is disposed is the first area A1 of the first substrate 10. Alternatively, the edge position of the second substrate 20 may be fixed to the first substrate 10 by the sealant 60, so as to seal the liquid crystal layer 30 between the first substrate 10 and the second substrate 20 after forming the box.

The step area A2 of the present embodiment is used for binding the flexible circuit board 50, and provides a driving signal for the liquid crystal device 000, for example, when the liquid crystal device 000 is a liquid crystal antenna, connection of driving electrodes (a structure included in the liquid crystal antenna, not shown in the drawing) needs to be performed by binding the driving circuit board (which may be the flexible circuit board 50) in the step area A2, so as to further realize connection of an external driving signal and a liquid crystal phase shifter unit (a structure included in the liquid crystal antenna, not shown in the drawing). Or, for example, when the liquid crystal device 000 is a display device, it is also necessary to implement the switching-in of the display driving signal by binding the driving circuit board (which may be the flexible circuit board 50) in the step area A2. The first substrate 10 of the step area A2 includes a plurality of conductive pads 101, alternatively, the plurality of conductive pads 101 may be uniformly arranged along the same direction (as shown in fig. 1), or the plurality of conductive pads 101 may be arranged in other manners, which are not specifically limited in this embodiment, and the arrangement manner of the conductive pads 101 in the step area A2 that is beneficial to realizing a narrow frame in the related art may be specifically understood, and fig. 1 of this embodiment is only illustrative.

In the liquid crystal device 000 of this embodiment, as shown in fig. 2, in the direction Z perpendicular to the plane of the first substrate 10, the compensating conductive structures 40 are disposed on one side of the conductive pads 101 far from the first substrate 10, optionally, the number of compensating conductive structures 40 may be the same as that of the conductive pads 101, the flexible circuit board 50 is attached to one side of the compensating conductive structures 40 far from the first substrate 10, the flexible circuit board 50 includes a plurality of pins 501, the pins 501 realize electrical connection with the conductive pads 101 through the compensating conductive structures 40, the compensating conductive structures 40 are equivalent to the height of the conductive pads 101 on the first substrate 10, and by disposing a step area A2 near the edge of the first substrate 10 as narrow as possible to meet the requirement of exposing the width of each conductive pad 101, and by disposing the compensating conductive structures 40 on one side surface of the first substrate 10 of the conductive pads 101, the compensating conductive structures 40 far from the first substrate 10 are attached with the flexible circuit board 50, the pins 501 of the flexible circuit board 50 realize electrical connection with the conductive pads 101 through the compensating conductive structures 40, and the compensating conductive structures 40 serve as the flexible circuit board 50 and connect at least one pin 101 with the conductive pad 101 through the high conductive structure 101. In the direction Z perpendicular to the plane of the first substrate 10, the compensation conductive structure 40 with a certain height is arranged, so that the conductive structure (including the conductive pad 101 and the conductive structure formed by the compensation conductive structure 40) of the step area A2 is convex, which can be understood as that the size of the conductive pad 101 in the direction Z perpendicular to the plane of the first substrate 10 is enlarged, and then the flexible circuit board 50 for providing driving signals is bound on the outer side of the compensation conductive structure 40, so that the difficulty of binding the flexible circuit board can be reduced, the purpose of reducing the width of the step area A2 in the direction X is achieved, and the narrow frame effect of the liquid crystal device can be better realized.

Optionally, each pin 501 of the flexible circuit board 50 is electrically connected to each conductive pad 101 through each compensating conductive structure 40, and the rest of the flexible circuit board 50 that is not attached to the compensating conductive structure 40 may be subjected to bending treatment, and since the flexible circuit board 50 has a certain flexibility, the flexible circuit board 50 may be bent to the first substrate 10 (as shown in fig. 3, fig. 3 is a schematic view of a cross-sectional structure of the flexible circuit board in a direction A-A' after being bent to the first substrate in fig. 1) or the back surface of the second substrate 20 (not shown in the drawings), and then connected to other driving boards (such as driving chips), so that the flexible circuit board 50 is prevented from occupying the space of the step area A2, and meanwhile, the driving board (such as driving chip) connected to the flexible circuit board 50 is prevented from occupying too much space of the step area A2, and further, the width of the step area A2 in the direction X is further reduced, so that the ultra-narrow frame is realized.

Optionally, anisotropic conductive adhesive (ACF, anisotropic Conductive Film) may be further disposed between the conductive pad 101 and the compensating conductive structure 40 in this embodiment, and anisotropic conductive adhesive may also be disposed between the compensating conductive structure 40 and the pins 501 of the flexible circuit board 50, so that the stability of electrical connection between the conductive pad 101 and the flexible circuit board 50 in the direction Z perpendicular to the plane of the first substrate 10 may be improved, and meanwhile, conduction short-circuits between adjacent conductive pads 101 may be avoided, conduction short-circuits between adjacent compensating conductive structures 40 may be avoided, and the purpose of conducting in the direction Z perpendicular to the plane of the first substrate 10 may be achieved.

Optionally, as shown in fig. 2, the compensating conductive structure 40 of the present embodiment may be an ellipsoidal or spherical or approximately spherical structure, so that the bonding surface of the flexible circuit board 50 and the compensating conductive structure 40 is a curved surface, so as to better match the flexibility of the flexible circuit board 50, and make the flexible circuit board 50 and the compensating conductive structure 40 directly more fit, and the fixing effect is better.

It should be noted that, the liquid crystal device 000 of the present embodiment may be a liquid crystal display device or a liquid crystal antenna, or the liquid crystal device 000 may be other liquid crystal devices having two opposite substrates, a step area A2 is required to be disposed on a certain substrate for binding the flexible circuit board 50, and the design structure of the present embodiment is applicable to any liquid crystal device that needs to be disposed with the step area A2 for binding the flexible circuit board 50, which is not particularly limited, and the type of the liquid crystal device 000 may be selected according to the actual requirement for structural design of the present embodiment during implementation. The area of the first region A1 of the first substrate 10, the area of the second substrate 20 opposite to the first substrate 10 may further include other structures capable of achieving a display effect or achieving a wireless communication effect, and the disclosure of the present embodiment is omitted herein.

It should be understood that, in fig. 1 of the present embodiment, for clarity of illustration of the arrangement structure of the step area A2 on the first substrate 10, the arrangement, the pitch and the number of the conductive pads 101 are merely drawn as examples, and in the specific implementation, the arrangement, the shape, the pitch and the number of the conductive pads 101 are not limited thereto, and the present embodiment is not limited thereto in particular.

In some alternative embodiments, please continue to refer to fig. 1-3, in this embodiment, the alignment direction of the plurality of compensating conductive structures 40 is the same as the alignment direction of the plurality of conductive pads 101, and two adjacent compensating conductive structures 40 are insulated from each other.

The embodiment explains that the number of the compensating conductive structures 40 disposed on the side of the conductive pad 101 far from the first substrate 10 may be the same as the number of the conductive pads 101, and the arrangement direction of the compensating conductive structures 40 is consistent with the arrangement direction of the conductive pads 101, so that each compensating conductive structure 40 is attached to and fixed with the corresponding conductive pad 101, and a certain distance between two adjacent compensating conductive structures 40 may be maintained, so that the two adjacent compensating conductive structures 40 are insulated from each other, and short circuit caused by too short distance between different compensating conductive structures 40 is avoided, thereby affecting transmission of driving signals.

It can be understood that the space between two adjacent compensating conductive structures 40 is not particularly limited in this embodiment, and it is only required to satisfy the requirement that the space occupied by the plurality of conductive pads 101 is as small as possible, and simultaneously, the requirement that the two adjacent compensating conductive structures 40 are insulated from each other so as not to generate a short circuit.

In some alternative embodiments, please refer to fig. 1 and fig. 4 in combination, fig. 4 is a schematic view of another cross-sectional structure of the flexible circuit board in the direction A-A' after bending in fig. 1, in this embodiment, the compensating conductive structure 40 and the conductive pad 101 are disposed with the same material, and on the first substrate 10, the compensating conductive structure 40 and the conductive pad 101 are formed as an integral structure.

The present embodiment illustrates that the height of the connection between the conductive pad 101 and the flexible circuit board 50 can be compensated while at least one pin 501 on the flexible circuit board 50 is electrically connected to one conductive pad 101 through one compensation conductive structure 40 due to the use of the compensation conductive structure 40 as a connection structure between the flexible circuit board 50 and the conductive pad 101. Therefore, the compensating conductive structure 40 and the conductive pad 101 can be disposed in the same material, i.e. when the conductive pad 101 is fabricated on the first substrate 10, the same material of the conductive pad 101 can be used to fabricate the compensating conductive structure 40 with a certain height, so that the compensating conductive structure 40 and the conductive pad 101 are integrated into one piece, which is beneficial to reducing the processing steps and improving the processing efficiency.

In some alternative embodiments, please continue to refer to fig. 1-4, the material of which the compensating conductive structure 40 is made according to the present embodiment includes any one of tin or silver paste. The embodiment explains that the manufacturing material of the compensating conductive structure 40 may be tin or silver paste, and the compensating conductive structure 40 may be manufactured by manufacturing tin balls and dispensing while satisfying the conductivity, the process of manufacturing the compensating conductive structure 40 on the side of the conductive pad 101 far from the first substrate 10 may be understood as similar to the process of manufacturing tin balls on a circuit board, and the formation of the ellipsoidal or spherical or approximately spherical compensating conductive structure 40 on each conductive pad 101 in the step area A2 is beneficial to realizing the forming effect of mutual insulation between two adjacent compensating conductive structures 40, and the conductive stability of the compensating conductive structure 40 may be ensured.

Further alternatively, as shown in fig. 1 and fig. 4, in the direction Z perpendicular to the plane of the first substrate 10, when the surface of the compensating conductive structure 40 on the side far away from the first substrate 10 (when the compensating conductive structure 40 is in an ellipsoidal or spherical or approximately spherical structure, the surface of the compensating conductive structure 40 on the side far away from the first substrate 10 has the highest point M) may be flush or nearly flush with the second substrate 20, so that the flexible circuit board 50 may be attached to the side of the compensating conductive structure 40 far away from the first substrate 10, closer to the side attachment binding, which is beneficial to further reducing the width of the step area A2. Optionally, since the height of the compensating conductive structure 40 in the direction Z perpendicular to the plane of the first substrate 10 is higher, at least a portion of the flexible circuit board 50 may be attached and fixed on the surface (not shown in the drawings) of the second substrate 20 on the side far away from the first substrate 10, so that the binding effect of the flexible circuit board 50 is more firm.

In some alternative embodiments, please refer to fig. 5 and fig. 6 in combination, fig. 5 is a schematic plan view of another plane structure of the liquid crystal device provided in the embodiment of the present invention, fig. 6 is a schematic cross-sectional view of the flexible circuit board in the direction B-B' after bending in fig. 5 (it is understood that, for clarity of illustrating the structure of this embodiment, fig. 5 is filled with transparency), in this embodiment, in a direction Z perpendicular to a plane of the first substrate 10, a surface of a side of the compensating conductive structure 40 away from the first substrate 10 is an arc surface, and a surface of a side of the compensating conductive structure 40 away from the first substrate 10 is convex to form an arc surface in a direction away from the first substrate 10.

The embodiment illustrates that the compensating conductive structure 40 disposed on the conductive pad 101 and electrically connected with the conductive pad 101 in a bonding manner may have an ellipsoidal shape or a spherical shape or a structure similar to a spherical shape, so that the bonding surface of the flexible circuit board 50 and the compensating conductive structure 40 on the side far away from the first substrate 10 is a curved surface, so that the flexible circuit board 50 is better matched with the flexibility of the flexible circuit board 50, the flexible circuit board 50 and the compensating conductive structure 40 have a contact surface with a larger area, the bonding is more compliant, and the fixing effect is better.

It can be appreciated that, in this embodiment, there is no specific requirement on the curvature radius of the cambered surface on the side of the compensation conductive structure 40 away from the first substrate 10, and only the cambered surface needs to be satisfied to enable the pins 501 of the flexible circuit board 50 to be better attached to the compensation conductive structure 40, so that the direction of the curvature semi-radial better implementing the electrical contact attachment is improved.

In some alternative embodiments, please continue to refer to fig. 5 and 6, in this embodiment, one end of the flexible circuit board 50 is attached to the second substrate 20.

The embodiment explains that when the height of the compensating conductive structure 40 in the direction Z perpendicular to the plane of the first substrate 10 is higher, at least part of the flexible circuit board 50 can be attached and fixed on the surface of the second substrate 20 away from the first substrate 10, that is, the pins 501 of the flexible circuit board 50 are attached and fixed to the second substrate 20 while the pins 501 are electrically connected to the conductive pads 101 by attaching to the compensating conductive structure 40, so that the binding effect of the flexible circuit board 50 is more firm, which is beneficial to reducing the possibility that the flexible circuit board 50 breaks in the step area A2, resulting in the pins 501 breaking off from the conductive pads 101.

In some alternative embodiments, please refer to fig. 7 and 8 in combination, fig. 7 is a schematic plan view of another liquid crystal device according to an embodiment of the present invention, fig. 8 is a schematic cross-sectional view of the flexible circuit board in the C-C direction after bending in fig. 7 (it is understood that, for clarity of illustration of the structure of the present embodiment, fig. 7 is filled with transparency), in this embodiment, the flexible circuit board 50 includes a signal input area 50A and a signal output area 50B, the pins 501 are located in the signal output area 50B, and the flexible circuit board 50 of the signal output area 50B is attached to the compensating conductive structure 40.

The present embodiment illustrates that the flexible circuit board 50 may be generally provided with a signal input area 50A and a signal output area 50B, the signal input area 50A and the signal output area 50B being disposed opposite to each other on both sides of the surface of the flexible circuit board 50, a pin 501 electrically connected to the conductive pad 101 of the step area A2 being located in the signal output area 50B, and the optional signal input area 50A may also be provided with a plurality of input pins (not illustrated in the drawing) for externally connecting to the driving circuit board, so that signals of the driving circuit board may be transmitted to the pin 501 of the signal output area 50B through the plurality of input pins of the signal input area 50A, and the function of providing driving signals to the liquid crystal device 000 is realized through the electrical connection of the pin 501 and the conductive pad 101.

Optionally, please continue to refer to fig. 7 and 8 in combination, the liquid crystal device 000 of the present embodiment further includes a driving chip 70, the driving chip 70 is electrically connected to the flexible circuit board 50, and the driving chip 70 is adhered and fixed to the flexible circuit board 50 in the signal input area 50A. That is, in this embodiment, the signal input area 50A of the flexible circuit board 50 may also be provided with a plurality of input pins (not shown in the figure) for binding the driving chip 70, so that the driving chip 70 may provide driving signals for the liquid crystal device 000, and meanwhile, the flexible circuit board 50 may also enable a portion of the flexible circuit board with the driving chip 70 to be bent, thereby being beneficial to reducing the width of the step area A2 and realizing a narrow frame effect.

It is to be understood that the flexible circuit board 50 and the driving Chip 70 of the present embodiment are bonded by using COF (Chip On Film) technology, wherein the driving Chip 70 is packaged On the flexible circuit board 50, for example, in a display panel in the related art, the COF technology is used for source driving and gate driving of display driving. In the driving process, the signal input area 50A of the flexible circuit board 50 is responsible for receiving the data signal transmitted from the outside, and the pin 501 of the signal output area 50B is connected to the display panel through the conductive pad 101, so as to transmit the data signal output by the driving chip 70 to the display panel, so as to drive the display panel to display. The COF technology is applied to the liquid crystal device 000, and the size of the edge step area A2 of the liquid crystal device 000 can be reduced better, so that an ultra-narrow frame is realized.

In some alternative embodiments, please continue to refer to fig. 7, 8 and 9, fig. 9 is a schematic cross-sectional view of fig. 7 in the C-C' direction after the flexible circuit board is bent onto the first substrate, and in this embodiment, the flexible circuit board 50 of the signal input area 50A is bent and attached to a side of the first substrate 10 away from the second substrate 20.

The embodiment illustrates that the driving chip 70 is encapsulated and fixed on the flexible circuit board 50, and after the flexible circuit board 50 of the signal output area 50B is electrically connected with the compensating conductive structure 40, the flexible circuit board 50 of the signal input area 50A can be bent due to the flexibility of the flexible circuit board 50, and the flexible circuit board 50 is bent and attached to the side of the first substrate 10 away from the second substrate 20, so that the width of the step area A2 occupied by the flexible circuit board 50 is reduced. Alternatively, as shown in fig. 9, one end of the flexible circuit board 50 is attached to and fixed to a side of the second substrate 20 away from the first substrate 10, and one end of the signal input area 50A of the flexible circuit board 50 is attached to and fixed to a side of the first substrate 10 away from the second substrate 20, so that the firmness of the flexible circuit board 50 can be further improved.

In some alternative embodiments, please refer to fig. 10 and 11 in combination, fig. 10 is a schematic plan view of another plane structure of the liquid crystal device provided in the embodiment of the present invention, fig. 11 is a schematic sectional view of the flexible circuit board in the direction D-D' after bending in fig. 10 (it is understood that, for clarity of illustrating the structure of the embodiment, fig. 10 is filled with transparency), in this embodiment, the flexible circuit board 50 includes a signal input area 50A and a signal output area 50B, the pins 501 are located in the signal output area 50B, and the flexible circuit board 50 of the signal output area 50B is attached to the compensating conductive structure 40;

The flexible circuit board 50 of the signal input area 50A is folded and attached to one side of the second substrate 20 away from the first substrate 10.

The embodiment illustrates that the flexible circuit board 50 may be flip-chip bonded, the flexible circuit board 50 of the signal output area 50B is attached to the compensating conductive structure 40, so as to electrically connect the pins 501 on the flexible circuit board 50 with the conductive pads 101, and the flexible circuit board 50 of the signal input area 50A may be bent and attached to the side of the second substrate 20 away from the first substrate 10 by using its flexibility, so as to be beneficial to reducing the width of the step area A2 occupied by the flexible circuit board 50. Alternatively, as shown in fig. 11, one end of the flexible circuit board 50 is attached to and fixed with the compensating conductive structure 40, and one end of the signal input area 50A of the flexible circuit board 50 is attached to and fixed with one side of the second substrate 20 away from the first substrate 10, so that the firmness of the flexible circuit board 50 can be further improved.

In some alternative embodiments, please refer to fig. 7 and 12 in combination, fig. 12 is a schematic cross-sectional view of the flexible circuit board of fig. 7 from C-C' to another after bending, in which the step area A2 includes a protective adhesive 80, and the protective adhesive 80 at least covers the compensating conductive structure 40 and a portion of the flexible circuit board 50.

The embodiment illustrates that after the flexible circuit board 50 is bound to the compensating conductive structure 40 of the step area A2, the protective glue 80 may be further disposed on the first substrate 10 of the step area A2, optionally, the protective glue 80 is made of an insulating material with viscosity, and the protective glue 80 may cover at least the compensating conductive structure 40 and part of the flexible circuit board 50 through a coating process, optionally, the protective glue 80 is in a fluid state in the process, and may also fill gaps between parts of the step area A2, so that the flexible circuit board 50 may be prevented from collapsing from the compensating conductive structure 40 under the action of an external force, the electrical connection effect may be affected, the stability between parts of the step area A2 may be ensured, and the erosion of external water and oxygen to the compensating conductive structures 40 and 50 may also be prevented through the arrangement of the protective glue 80, thereby being beneficial to improving the service life of the liquid crystal device 000. Further alternatively, as shown in fig. 12, when one end of the flexible circuit board 50 is adhered to and fixed to the surface of the second substrate 20 on the side far away from the first substrate 10, the protective adhesive 80 may also cover the portion where the flexible circuit board 50 is adhered to the second substrate 20, so as to be beneficial to better protecting the flexible circuit board 50.

In some alternative embodiments, please refer to fig. 13 and fig. 14 in combination, fig. 13 is a schematic plan view of another plane structure of a liquid crystal device according to an embodiment of the present invention, fig. 14 is a schematic cross-sectional view of the plane structure of fig. 13 along the direction E-E' (it is understood that, for clarity of illustration of the structure of the embodiment, fig. 13 is filled with transparency), the liquid crystal device 000 according to the embodiment may be a liquid crystal antenna, a side of the first substrate 10 facing the second substrate 20 includes a plurality of phase shifter structures 102, and a side of the second substrate 20 facing the first substrate 10 includes a metal layer 201.

Optionally, a side of the second substrate 20 remote from the first substrate 10 includes a plurality of radiation patches 202;

the metal formation 201 includes a plurality of through holes 201K, and an orthographic projection of the through holes 201K onto the second substrate 20 overlaps with an orthographic projection of the radiation patch 202 onto the second substrate 20.

The embodiment illustrates that the liquid crystal device 000 may be a liquid crystal antenna, where a side of the first substrate 10 facing the second substrate 20 includes a plurality of phase shifter structures 102, where the phase shifter structures 102 are used to guide transmission of microwave signals, the plurality of phase shifter structures 102 may be arranged on the first substrate 10 in an array, the phase shifter structures 102 may be microstrip lines, and the microstrip lines may be serpentine (not illustrated in the drawing) or spiral (not illustrated in the drawing) or zigzag (as illustrated in fig. 13) or other structures, and the facing area between the phase shifter structures 102 and the metal stratum 201 can be increased by the structure of the serpentine or spiral phase shifter structures 102, so as to ensure that as many liquid crystal molecules in the liquid crystal layer 30 as possible are in an electric field formed by the phase shifter structures 102 and the metal stratum 201, and improve the inversion efficiency of the liquid crystal molecules. The shape and distribution of the phase shifter structure 102 are not limited in this embodiment, and only needs to be able to realize the transmission of the microwave signal. It will be appreciated that, for clarity of illustration of the structure of the present embodiment, fig. 13 illustrates only 16 phase shifter structures 102 on the first substrate 10, but is not limited to this number, and the number of phase shifter structures 102 may be arrayed according to practical requirements in practical implementation.

The metal layer 201 of this embodiment includes a plurality of through holes 201K, where the orthographic projection of the through holes 201K onto the second substrate 20 overlaps with the orthographic projection of the radiation patch 202 onto the second substrate 20, and the through holes 201K may include two functions, a part of the number of through holes 201K may overlap with the phase shifter structure 102 of the microstrip line structure for coupling signals in the feeding network attached to the outside to the metal layer of the phase shifter structure 102, so that the signals are transmitted along the phase shifter structure 102 of the microstrip line structure, and another part of the number of through holes 201K may overlap with both the phase shifter structure 102 and the radiation patch 202 of the microstrip line structure for radiating microwave signals of the liquid crystal antenna. The liquid crystal layer 30 is located between the phase shifter structure 102 and the metal formation 201, and microwave signals are transmitted between the phase shifter structure 102 and the metal formation 201. In the transmission process of the microwave signal, the electric field intensity formed between the phase shifter structure 102 and the metal stratum 201 is controlled by the voltage applied to the phase shifter structure 102 and the metal stratum 201, so that the deflection angle of the liquid crystal molecules of the liquid crystal layer 30 in the corresponding space is adjusted, the orientation of the liquid crystal layer 30 is changed, the adjustment of the effective dielectric constant is realized, the phase shift of the microwave signal by the high-frequency signal in the phase shifter structure 102 is realized, and the effect of changing the microwave phase is achieved.

Optionally, a side of the second substrate 20 away from the first substrate 10 includes a plurality of radiation patches 202, and may further include a feeding network (not illustrated in the figure, and specifically can be understood with reference to the structure of the liquid crystal antenna in the related art), after the phase of the microwave signal is shifted, the microwave signal after the phase shift is radiated from the second substrate 20 through the through holes 201K of the metal layer 201, and is coupled with and radiated by the radiation patches 202, and is received and emitted by the feeding network.

It should be understood that the present embodiment is merely illustrative of one possible design structure of the liquid crystal device 000 as a liquid crystal antenna, and the structure of the liquid crystal device 000 includes but is not limited to this, and the specific structure of the liquid crystal device 000 can be designed according to actual requirements in the implementation, and the description of the present embodiment is omitted herein.

In some alternative embodiments, please refer to fig. 1-2, 15-20, fig. 15 is a flow chart of a manufacturing method of a liquid crystal device according to an embodiment of the present invention, fig. 16 is a schematic structural diagram of a first substrate provided in a manufacturing method according to an embodiment of the present invention, fig. 17 is a schematic structural diagram of a first substrate after a conductive pad is formed on the first substrate according to a manufacturing method according to an embodiment of the present invention, fig. 18 is a schematic structural diagram of a second substrate provided in a manufacturing method according to an embodiment of the present invention, fig. 19 is a schematic structural diagram of a first substrate and a second substrate after a box is formed in the first substrate and the second substrate according to a manufacturing method according to an embodiment of the present invention, and fig. 20 is a schematic structural diagram of a compensation conductive structure formed in a step region according to a manufacturing method according to an embodiment of the present invention. The manufacturing method of the embodiment comprises the following steps:

s10: providing a first substrate 10; wherein, along the direction X parallel to the plane of the first substrate 10, the first substrate 10 comprises a first area A1 and a step area A2 which are adjacently arranged;

s20: a plurality of conductive pads 101 are provided on the first substrate 10 of the step area A2;

s30: providing a second substrate 20;

S40: aligning the first substrate 10 and the second substrate 20, disposing the liquid crystal layer 30 such that the liquid crystal layer 30 is located between the first substrate 10 and the second substrate 20; the area of the first substrate 10 beyond the edge of the second substrate 20 is a step area A2, and the area of the second substrate 20 opposite to the first substrate 10 is a first area A1;

s50: a compensating conductive structure 40 is arranged on one side of the conductive pad 101 away from the first substrate 10 along a direction Z perpendicular to the plane of the first substrate 10;

s60: attaching a flexible circuit board 50 to the side of the compensation conductive structure 40 away from the first substrate 10; the flexible circuit board 50 includes a plurality of pins 501, and the pins 501 are electrically connected to the conductive pads 101 through the compensating conductive structures 40.

Specifically, the manufacturing method provided in this embodiment is used to manufacture the liquid crystal device 000 in the above embodiment, and for example, can be used to manufacture the liquid crystal device 000 in the corresponding embodiment of fig. 1 to 2. The manufacturing method at least comprises the following steps:

As shown in fig. 16, a first substrate 10 is provided; wherein, along the direction X parallel to the plane of the first substrate 10, the first substrate 10 comprises a first area A1 and a step area A2 which are adjacently arranged; alternatively, the first substrate 10 may be a glass substrate, and the provided first substrate 10 may include other functional structures located on a surface of one side of the first substrate 10, for example, when the to-be-manufactured liquid crystal device 000 is a display device, a structure such as a transistor array may be manufactured on a surface of one side of the first substrate 10, for example, when the to-be-manufactured liquid crystal device 000 is a liquid crystal antenna, a structure such as a phase shifter structure or a driving electrode may be manufactured on a surface of one side of the first substrate, which is not described herein, and the first substrate 10 provided in this embodiment may be understood as a substrate having a structure capable of realizing the function thereof manufactured on a surface of one side thereof, and the specific structure may be understood with reference to the structure of the liquid crystal device such as the display device or the liquid crystal antenna in the related art.

As shown in fig. 17, a plurality of conductive pads 101 are disposed on the first substrate 10 in the step area A2, alternatively, the plurality of conductive pads 101 may be arranged along the same direction or may be arranged in other manners, which is not limited in this embodiment, and it is only required that the step area A2 of the first substrate 10 includes a plurality of conductive pads 101 for transmitting a driving signal.

As shown in fig. 18, a second substrate 20 is provided; alternatively, the second substrate 20 may be a glass substrate, and the provided second substrate 10 may include other functional structures located on a surface of one side of the second substrate 10, for example, when the to-be-manufactured liquid crystal device 000 is a display device, structures such as a color resistor and a black matrix may be manufactured on a surface of one side of the second substrate 20, and when the to-be-manufactured liquid crystal device 000 is a liquid crystal antenna, structures such as a metal layer or a driving electrode may be manufactured on a surface of one side of the second substrate 20, which will not be described herein, and the second substrate 20 provided in this embodiment may be understood as a substrate having structures capable of realizing functions thereof manufactured on a surface of one side thereof, and specific structures may be understood with reference to structures of liquid crystal devices such as a display device or a liquid crystal antenna in the related art.

As shown in fig. 19, the first substrate 10 and the second substrate 20 are paired, and the liquid crystal layer 30 is disposed such that the liquid crystal layer 30 is filled between the first substrate 10 and the second substrate 20; the area of the first substrate 10 beyond the edge of the second substrate 20 is a step area A2, and the area of the second substrate 20 opposite to the first substrate 10 is a first area A1; alternatively, when the first substrate 10 and the second substrate 20 are paired, the edge position of the second substrate 20 may be fixed to the first substrate 10 by the sealant 60, so as to seal the liquid crystal layer 30 between the first substrate 10 and the second substrate 20 after the first substrate and the second substrate are paired.

As shown in fig. 20, the compensating conductive structure 40 is disposed on a side of the conductive pad 101 away from the first substrate 10 along a direction Z perpendicular to the plane of the first substrate 10; the compensating conductive structure 40 may be manufactured by a dispensing process, and the process of manufacturing the compensating conductive structure 40 on the side of the conductive pad 101 away from the first substrate 10 may be understood as being similar to the process of manufacturing solder balls or dispensing on a circuit board.

As shown in fig. 1 and 2, a flexible circuit board 50 is attached to a side of the compensation conductive structure 40 away from the first substrate 10; the flexible circuit board 50 includes a plurality of pins 501, and the pins 501 are electrically connected to the conductive pads 101 through the compensating conductive structures 40. In the liquid crystal device 000 manufactured by the manufacturing method of the present embodiment, the height of the compensating conductive structure 40 is equivalent to that of the conductive pad 101 on the first substrate 10, and the width of each conductive pad 101 can be satisfied by providing a step area A2 as narrow as possible near the edge of the first substrate 10, and by manufacturing the compensating conductive structure 40 on one side surface of the first substrate 10 of the conductive pad 101, the compensating conductive structure 40 is used as a connection structure between the flexible circuit board 50 and the conductive pad 101, so that the height of the connecting piece between the conductive pad 101 and the flexible circuit board 50 can be compensated while at least one pin 501 on the flexible circuit board 50 is electrically connected with one conductive pad 101 through one compensating conductive structure 40. In the direction Z perpendicular to the plane of the first substrate 10, the compensation conductive structure 40 with a certain height is arranged, so that the conductive structure (including the conductive pad 101 and the conductive structure formed by the compensation conductive structure 40) of the step area A2 is convex, which can be understood as that the size of the conductive pad 101 in the direction Z perpendicular to the plane of the first substrate 10 is enlarged, and then the flexible circuit board 50 for providing driving signals is bound on the outer side of the compensation conductive structure 40, so that the difficulty of binding the flexible circuit board can be reduced, the purpose of reducing the width of the step area A2 in the direction X is achieved, and the narrow frame effect of the liquid crystal device can be better realized.

In some alternative embodiments, please continue to refer to fig. 1-2 and fig. 15-20, in this embodiment, the compensating conductive structure 40 is disposed on a side of the conductive pad 101 away from the first substrate 10 along a direction Z perpendicular to the plane of the first substrate 10; comprising the following steps: solder balls are manufactured on the conductive pads 101, so that the arrangement direction of the plurality of solder balls is the same as the arrangement direction of the plurality of conductive pads 101, two adjacent solder balls are insulated from each other, and the solder balls are the compensating conductive structures 40.

The specific process of providing the compensating conductive structure 40 on the side of the conductive pad 101 far from the first substrate 10 provided in this embodiment includes manufacturing solder balls on the conductive pad 101, so that the arrangement direction of a plurality of solder balls is the same as the arrangement direction of a plurality of conductive pads 101, gaps exist between two adjacent solder balls to insulate each other, the solder balls are compensating conductive structures 40, and the conductive performance can be met, meanwhile, the compensating conductive structure 40 can also be manufactured by manufacturing solder balls, the process of manufacturing the compensating conductive structure 40 on the side of the conductive pad 101 far from the first substrate 10 can be understood as similar to the process of manufacturing solder balls on a circuit board, and forming the spheroid or spherical or approximately spherical compensating conductive structure 40 on each conductive pad 101 in the step area A2 is beneficial to realizing the forming effect of mutual insulation between two adjacent compensating conductive structures 40, and the conductive stability of the compensating conductive structure 40 can also be ensured. When the compensating conductive structure 40 is in an ellipsoidal or spherical shape or a structure similar to a sphere, at this time, the surface of the compensating conductive structure 40 on the side far away from the first substrate 10 has the highest point M, and in the direction Z perpendicular to the plane of the first substrate 10, the surface of the compensating conductive structure 40 on the side far away from the first substrate 10 may be flush or nearly flush with the second substrate 20, so that the flexible circuit board 50 is attached to the side of the compensating conductive structure 40 far away from the first substrate 10, and is closer to the side attachment binding, which is beneficial to further reducing the width of the step area A2. Alternatively, since the height of the compensating conductive structure 40 in the direction Z perpendicular to the plane of the first substrate 10 is higher, at least a portion of the flexible circuit board 50 may be attached and fixed on the surface of the second substrate 20 on the side away from the first substrate 10 (as can be understood by referring to the structures of fig. 5 and 6 in the above embodiment), so that the binding effect of the flexible circuit board 50 is more firm.

It can be appreciated that the liquid crystal device 000 manufactured by the manufacturing method provided in this embodiment has the beneficial effects of the liquid crystal device 000 in the foregoing embodiments, and specific descriptions of the liquid crystal device 000 in each of the foregoing embodiments may be referred to, which is not repeated herein.

As can be seen from the above embodiments, the liquid crystal device and the manufacturing method thereof provided by the invention at least achieve the following beneficial effects:

While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A liquid crystal device, comprising: a first substrate and a second substrate disposed opposite to each other, and a liquid crystal layer between the first substrate and the second substrate;

The first substrate comprises a first area and a step area which are adjacently arranged along the direction parallel to the plane where the first substrate is positioned, the area of the first substrate beyond the edge of the second substrate is the step area, and the area of the second substrate opposite to the first substrate is the first area;

the first substrate of the step area comprises a plurality of conductive pads;

in the direction perpendicular to the plane where the first substrate is located, one side of the conductive bonding pad far away from the first substrate comprises a compensation conductive structure, and a flexible circuit board is attached to one side of the compensation conductive structure far away from the first substrate;

The flexible circuit board comprises a plurality of pins, and the pins are electrically connected with the conductive pads through the compensation conductive structures;

In the direction perpendicular to the plane where the first substrate is located, the surface of one side of the compensation conductive structure, which is far away from the first substrate, is an arc surface, and the surface of one side of the compensation conductive structure, which is far away from the first substrate, protrudes towards the direction, which is far away from the first substrate, to form the arc surface.

2. The liquid crystal device according to claim 1, wherein the alignment direction of the plurality of compensating conductive structures is the same as the alignment direction of the plurality of conductive pads, and adjacent compensating conductive structures are insulated from each other.

3. The liquid crystal device of claim 1, wherein the compensating conductive structure is disposed in the same material as the conductive pad, and wherein the compensating conductive structure and the conductive pad are integrally formed on the first substrate.

4. The liquid crystal device of claim 1, wherein the material of which the compensating conductive structure is made comprises any one of tin or silver paste.

5. The liquid crystal device according to claim 1, wherein one end of the flexible circuit board is attached to the second substrate.

6. The liquid crystal device of claim 1, wherein the flexible circuit board comprises a signal input region and a signal output region, the pins are located in the signal output region, and the flexible circuit board of the signal output region is attached to the compensating conductive structure.

7. The liquid crystal device of claim 6, wherein the flexible circuit board of the signal input region is folded and attached to a side of the first substrate away from the second substrate.

8. The liquid crystal device of claim 6, wherein the flexible circuit board of the signal input region is folded and attached to a side of the second substrate away from the first substrate.

9. The liquid crystal device of claim 6, further comprising a driver chip electrically connected to the flexible circuit board, the driver chip being affixed to the flexible circuit board in the signal input region.

10. The liquid crystal device of claim 1, wherein the step region comprises a protective glue that covers at least the compensating conductive structure and a portion of the flexible circuit board.

11. The liquid crystal device of claim 1, wherein a side of the first substrate facing the second substrate comprises a plurality of phase shifter structures and a side of the second substrate facing the first substrate comprises a metal formation.

12. The liquid crystal device of claim 11, wherein a side of the second substrate remote from the first substrate comprises a plurality of radiating patches;

The metal formation includes a plurality of through holes, an orthographic projection of the through holes onto the second substrate overlapping an orthographic projection of the radiation patch onto the second substrate.

13. A method of manufacturing a liquid crystal device, characterized in that the method is used to manufacture a liquid crystal device according to any one of claims 1 to 12; the manufacturing method comprises the following steps:

Providing a first substrate; the first substrate comprises a first area and a step area which are adjacently arranged along the direction parallel to the plane where the first substrate is positioned;

Providing a plurality of conductive pads on the first substrate of the step region;

providing a second substrate;

Aligning the first substrate and the second substrate, and disposing a liquid crystal layer so that the liquid crystal layer is located between the first substrate and the second substrate; the area of the first substrate beyond the edge of the second substrate is the step area, and the area of the second substrate opposite to the first substrate is the first area;

a compensation conductive structure is arranged on one side of the conductive bonding pad far away from the first substrate along the direction perpendicular to the plane where the first substrate is located;

Attaching a flexible circuit board to one side of the compensation conductive structure away from the first substrate; the flexible circuit board comprises a plurality of pins, and the pins are electrically connected with the conductive pads through the compensation conductive structure.

14. The method of claim 13, wherein providing the compensating conductive structure on a side of the conductive pad away from the first substrate in a direction perpendicular to the plane of the first substrate comprises:

And manufacturing solder balls on the conductive pads, wherein the arrangement direction of a plurality of solder balls is the same as the arrangement direction of a plurality of conductive pads, two adjacent solder balls are mutually insulated, and the solder balls are of the compensation conductive structure.