CN113946077A

CN113946077A - Display panel and display device

Info

Publication number: CN113946077A
Application number: CN202010682752.6A
Authority: CN
Inventors: 李星; 袁志平; 王旭; 李彤彤; 王勇
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2022-01-18
Anticipated expiration: 2040-07-15
Also published as: CN113946077B

Abstract

The embodiment of the application provides a display panel and a display device. The display panel includes a display area and a non-display area surrounding the display area, and includes: the array substrate comprises a plurality of first pins positioned in a non-display area, the plurality of first pins are arranged in a first direction, one side, close to a display surface of the display panel, of the array substrate is provided with a first cutting angle, and a cutting surface of the first cutting angle exposes the plurality of first pins; the silver paste routing is electrically connected with the first pin, and at least part of line segment of the silver paste routing is positioned on one side, close to the display surface, of the array substrate; the first pins are electrically connected with the data driving chip through silver paste wires respectively. This application can draw forth array substrate's the back or draw forth the terminal surface of the opposite base plate that sets up relatively with array substrate with the binding end on the array substrate, can reduce the length of first pin, reduces the width of lower frame, improves the screen and accounts for the ratio, ensures to bind the reliability of connecting simultaneously.

Description

Display panel and display device

Technical Field

The invention belongs to the technical field of display, and particularly relates to a display panel and a display device.

Background

At present, the display technology is mature, and the display technology is widely applied to terminal products such as mobile phones, computers, televisions, intelligent wearing and the like, and the terminal products also become essential tools in work and life of people. With the development of display technology and the improvement of user requirements, high screen ratio, high color gamut, high frame rate, low power consumption, flexibility, foldability and the like become main selling points of various manufacturers. The display screen is an important specification parameter for the end product. Therefore, narrowing the frame to improve the screen occupation ratio is a technical problem to be solved urgently at present.

Disclosure of Invention

In view of this, the present application provides a display panel and a display device, which solve the technical problem of narrowing the frame to improve the screen ratio.

The embodiment of the application provides a display panel, display panel includes display area and the non-display area who surrounds the display area, and display panel includes: the array substrate comprises a plurality of first pins positioned in a non-display area, the plurality of first pins are arranged in a first direction, one side, close to a display surface of the display panel, of the array substrate is provided with a first cutting angle, and a cutting surface of the first cutting angle exposes the plurality of first pins; the silver paste routing is electrically connected with the first pin, and at least part of line segment of the silver paste routing is positioned on one side, close to the display surface, of the array substrate; and the plurality of first pins are electrically connected with the data driving chip through silver paste wires respectively.

Specifically, the silver paste routing lines cover the cut surface of the first corner cut and extend to one side of the array substrate, which is far away from the display surface, along the surface of the array substrate in the thickness direction of the array substrate.

Furthermore, a second chamfer angle is arranged on one side of the array substrate, which is far away from the display surface, and the second chamfer angle and the first chamfer angle are positioned at the same end of the array substrate; the array substrate comprises a first end face, and the first chamfer angle and the second chamfer angle are connected through the first end face.

In some alternative embodiments, the width of the first corner cut in the second direction is d1, the width of the second corner cut in the second direction is d2, d1> d2, the second direction is perpendicular to the first direction, and the second direction is parallel to the plane of the array substrate.

In one embodiment, one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second chamfer, the silver paste routing comprises a first sub-line segment, and the first sub-line segment is in contact with the horizontal subsection; the display panel is further provided with a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is connected with the plurality of first sub-line sections in a binding mode.

In another embodiment, one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second corner cut, the silver paste routing comprises a first sub-line segment, and the first sub-line segment is in contact with the horizontal subsection; the data driving chip is connected with the first sub-line sections in a binding mode.

In another embodiment, one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second chamfer, the horizontal subsection comprises a plurality of second pins, and the second pins correspond to the first pins one to one; one end of the silver paste routing wire is connected with the first pin, and the other end of the silver paste routing wire is connected with the second pin.

In another embodiment, the display panel further includes a flexible package substrate, the data driving chip is fixed on the flexible package substrate, and the flexible package substrate is connected to the plurality of second pins in a binding manner.

In another embodiment, the array substrate comprises a first sub-substrate and a second sub-substrate which are oppositely arranged, the first sub-substrate and the second sub-substrate are bonded through a first adhesive layer, and the first adhesive layer is located in the non-display area; the first sub-substrate comprises a first chamfer angle and a plurality of first pins, and the second sub-substrate comprises a second chamfer angle and a plurality of second pins.

In another embodiment, the display panel further includes an opposite substrate, the opposite substrate and the array substrate being disposed opposite to each other; one end of the array substrate with a first cutting angle extends out of the opposite substrate to form a step, the part of the array substrate extending out of the opposite substrate forms a step bottom surface, and the end surface of the opposite substrate forms a step slope; wherein the bottom surface of the step exposes the first pin; the silver paste routing is covered on the bottom surface of the step and extends to the slope surface of the step; the display panel also comprises a flexible packaging substrate, and the data driving chip is fixed on the flexible packaging substrate; wherein, the flexible package substrate is bound and connected with the silver paste routing on the slope surface of the step and the silver paste routing on the bottom surface of the step.

The embodiment of the present application further provides a manufacturing method of a display panel, which is used for manufacturing the display panel provided by the above embodiment, and the manufacturing method includes: manufacturing an array substrate, wherein the array substrate comprises a plurality of first pins positioned in a non-display area, and the plurality of first pins are arranged in a first direction; grinding one end of the array substrate to form a first chamfer, wherein a cutting surface of the first chamfer exposes a plurality of first pins, and the first chamfer is positioned on one side of the array substrate, which is close to the display surface of the display panel; coating silver paste and curing to form a plurality of silver paste routing lines, wherein one silver paste routing line is electrically connected with one first pin, and at least part of line segments of the silver paste routing line are positioned on one side, close to the display surface, of the array substrate; and the plurality of first pins are electrically connected with the data driving chip through silver paste routing wires respectively.

Specifically, coating silver thick liquid and solidification form many silver thick liquid and walk the line, include: and coating silver paste on the cut surface of the first cut angle, and continuously coating the silver paste along the thickness direction of the array substrate until the silver paste is coated on the side of the array substrate, which is far away from the display surface.

In one embodiment, before coating and curing the silver paste to form a plurality of silver paste traces, the method further includes: the side, departing from the display surface, of the array substrate is ground to form a second chamfer and a horizontal subsection, wherein the second chamfer and the first chamfer are located at the same end of the array substrate, the horizontal subsection is adjacent to the second chamfer, the array substrate further comprises a first end face, and the first chamfer and the second chamfer are connected through the first end face.

In another embodiment, coating a silver paste and curing to form a plurality of silver paste traces further includes: silver paste is continuously coated on the surfaces of the cut surface of the first cut angle, the first end face, the cut surface of the second cut angle and the horizontal subsection, a plurality of silver paste routing lines are formed after solidification, each silver paste routing line comprises a first sub-line segment, and each first sub-line segment is in contact with the horizontal subsection.

In another embodiment, before grinding one end of the array substrate to form the first chamfer, the method further comprises: manufacturing a plurality of second pins on one side of the array substrate, which is far away from the display surface, wherein the second pins and the first pins are positioned at the same end, and the second pins correspond to the first pins one to one; grind one end of array substrate and form second chamfer and horizontal subsection, still include: the horizontal subsection comprises a plurality of second pins; coating silver thick liquid and solidification form many silver thick liquid and walk the line, still include: one end of the silver paste routing wire is connected with the first pin, and the other end of the silver paste routing wire is connected with the second pin.

In another embodiment, an array substrate is manufactured, the array substrate includes a plurality of first pins located in a non-display area, and the method includes: manufacturing a first sub-substrate, wherein the first sub-substrate comprises a plurality of first pins; grinding one end of the array substrate to form a first chamfer angle, comprising: grinding one end of the first sub-substrate to form a first chamfer; making a plurality of second pins on one side of the array substrate, which is far away from the display surface, wherein the second pins comprise: providing a second sub-substrate, and manufacturing a plurality of second pins on the second sub-substrate; grinding one end of the array substrate to form a second chamfer and a horizontal subsection, comprising: grinding one end of the second sub-substrate to form a second chamfer and a horizontal subsection; the manufacturing method further comprises the following steps: and aligning and attaching the ground first sub-substrate and the ground second sub-substrate through a first adhesive layer.

In another embodiment, before grinding one end of the array substrate to form the first chamfer, the method further comprises: providing an opposite substrate, and aligning and attaching the opposite substrate and an array substrate, wherein one end of the array substrate extends out of the opposite substrate to form a step, the part of the array substrate extending out of the opposite substrate forms a step bottom surface, the end surface of the opposite substrate forms a step slope surface, and the first pin is exposed at the step bottom surface; coating silver thick liquid and solidification form many silver thick liquid and walk the line, include: coating silver paste on the bottom surface of the step and the slope surface of the step and curing to form a plurality of silver paste routing lines, wherein the silver paste routing lines are electrically connected with the first pins and extend to the slope surface of the step; a bound data driver chip comprising: providing a flexible packaging substrate fixed with a data driving chip; the flexible package substrate is bound and connected with the silver paste routing on the slope surface of the step and the silver paste routing on the bottom surface of the step.

The embodiment of the application also provides a display device which comprises the display panel provided by any embodiment of the application.

The application provides a display panel and display device has following beneficial effect: in the embodiment of the application, the first pin is electrically connected with the silver paste routing wire manufactured by the coating process, the first pin is electrically connected with the data driving chip through the silver paste routing wire, and the first pin on the array substrate is not used for binding the data driving chip and is also not used for binding the flexible packaging substrate fixed with the data driving chip. The array substrate is ground to form a first chamfer, the first pin is exposed on the cutting surface of the first chamfer, and the length of the first pin can ensure that the first pin is electrically connected with a signal line in the wiring area and the first pin is electrically connected with a silver paste line. The connection mode of the first pin and the silver paste routing is lower in requirement on the length of the first pin compared with the binding connection mode. This application can reduce the length of first pin to be favorable to reducing the width of lower frame, improve the screen and account for than. In addition, through setting up silver thick liquid line and first pin electricity and being connected, can draw forth the dorsal part of array substrate or draw forth the terminal surface of the opposition base plate that sets up with array substrate relatively with the end of binding to can be in the condition that does not increase lower frame width, increase the effective length of binding the end, ensure to bind the reliability of connecting.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without inventive labor.

FIG. 1 is a schematic diagram of a display panel in the related art;

fig. 2 is a schematic partial top view of a display panel according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view taken along line B-B' of FIG. 2;

FIG. 4 is another schematic cross-sectional view taken along line B-B' of FIG. 2;

FIG. 5 is a schematic cross-sectional view taken along line A-A' of FIG. 2;

FIG. 6 is a flowchart illustrating a method for fabricating the display panel of FIG. 2 according to an embodiment;

fig. 7 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;

fig. 8 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 9 is another schematic view of a display panel according to an embodiment of the present disclosure;

fig. 10 is another schematic view of a display panel according to an embodiment of the present disclosure;

fig. 11 is another schematic view of a display panel according to an embodiment of the present disclosure;

fig. 12 is another schematic view of a display panel provided in an embodiment of the present application;

fig. 13 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 14 is another schematic view of a display panel according to an embodiment of the present application;

fig. 15 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 16 is another schematic view of a display panel according to an embodiment of the present application;

fig. 17 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 18 is a schematic view of a display device according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Fig. 1 is a schematic diagram of a display panel in the related art, and as shown in fig. 1, a display area 1 and a non-display area 2 are shown, the non-display area 2 includes a wiring area 21 and a pin area 22, wherein a plurality of signal lines 211 are disposed in the wiring area 21, and a plurality of bonding pins 221 are disposed in the pin area 22. The bonding pin 221 is used for being bonded with the data driver chip or a flexible package substrate to which the data driver chip is fixed. In the lower frame region of the display panel, the wiring region 21 and the lead region 22 affect the narrowing of the lower frame as an indispensable structure. In a scheme for narrowing the lower frame, a display panel is manufactured by adopting a flexible substrate, a plurality of signal lines and a plurality of binding pins in a non-display area are manufactured on the flexible substrate, and partial line segments binding the pins and the signal lines are bent to the back of the display panel by utilizing the good flexibility of the flexible substrate so as to reduce the width of the lower frame. The scheme has high requirements on technical thresholds and limited product yield, so that the product cost is high, the product quality risk is high, and large-scale popularization and application are not easy to realize.

Based on the problems in the related art, embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, which are used for designing a lower frame structure of the display panel. The array substrate is provided with a first pin, one end of the array substrate, which is provided with the first pin, is ground to form a first chamfer, the first pin is exposed on the cutting surface of the first chamfer, then a silver paste routing wire is formed by adopting a silver paste coating mode, and the silver paste routing wire is correspondingly and electrically connected with the first pin. The data driving chip is designed to be electrically connected with the first pin through the silver paste routing, so that the data driving chip provides a display driving signal for the display panel. In the embodiment of the application, the data driving chip can be bound and connected with the silver paste routing; or the flexible packaging substrate fixed with the data driving chip is bound and connected with the silver paste routing; or a second pin electrically connected with the silver paste routing is arranged, and the data driving chip or the flexible packaging substrate is bound through the second pin. That is to say, in this application embodiment, the first pin is not directly used for binding connection, and then the length of first pin can be reduced to can reduce the width of lower frame, improve the screen and account for the ratio. In an implementation mode, silver thick liquid is walked the line and is corresponded the back of being connected with first pin, set up the silver thick liquid and walk the line in array substrate thickness direction, the back that extends to array substrate along array substrate's surface, then bind data driver chip or bind flexible package substrate at array substrate's back, effective length that can corresponding increase bind at array substrate's back, ensure the reliability of binding, in addition, the design of first corner cut can guarantee that silver thick liquid is walked line and array substrate bonding reliability, silver thick liquid is walked the line and can't effectively bond under the condition of avoiding the right angle. In another embodiment, the length of the silver paste routing is increased by using the end face of the opposite substrate arranged opposite to the array substrate, the flexible packaging substrate fixed with the data driving chip is bound and connected with the silver paste routing, the binding effective length can be increased, and the binding reliability is ensured. Meanwhile, one end of the array substrate is ground to form a first chamfer, and the first chamfer can avoid the defect that the bound flexible packaging substrate is bent at a right angle when being bent to the back of the array substrate. The foregoing is the central idea of the present application, which is described below in terms of specific embodiments.

The embodiment of the application provides a display panel, which comprises a display area and a non-display area surrounding the display area. The embodiment of the application does not limit the type of the display panel, and the display panel can be any one of the display panels in the prior art, such as a liquid crystal display panel, an organic light emitting display panel and the like.

Fig. 2 is a partial top view of a display panel according to an embodiment of the present disclosure, fig. 3 is a schematic cross-sectional view taken along a line B-B ' of fig. 2, fig. 4 is a schematic cross-sectional view taken along a line B-B ' of fig. 2, and fig. 5 is a schematic cross-sectional view taken along a line a-a ' of fig. 2. Fig. 6 is a flowchart of a method for manufacturing the display panel according to the embodiment of fig. 2.

As shown in the partial schematic view of fig. 2, a display area 1 and a non-display area 2 of a display panel are shown. The display panel includes an array substrate 11, and the array substrate 11 includes a substrate and a circuit structure such as a pixel driving circuit, a scanning driving circuit, and the like located above the substrate. Also illustrated in fig. 2 is a structural layer 12 located over the array substrate 11. In the lcd panel, the structural layer 12 at least includes a liquid crystal molecular layer and a color film substrate. In the organic light emitting display panel, the structure layer 12 includes at least a light emitting device layer and an encapsulation layer. In an embodiment, the display panel is a liquid crystal display panel, as shown in fig. 3, the display panel includes an array substrate 11, a liquid crystal molecular layer 14, and a color filter substrate 13, and the array substrate 11 and the color filter substrate 13 are attached by a sealant 41 located in the non-display area 2. Optionally, a touch module 61 is further disposed on the color film substrate 13, the touch module 61 is used for realizing a touch function of the display panel, and a protective layer 62 is further disposed on the touch module 61 and can protect a structural layer inside the display panel. The figure also illustrates a substrate 1101 in the array substrate 11, wherein the substrate 1101 is a rigid substrate. Circuit structures such as a pixel driver circuit and a scan driver circuit are formed over the substrate 1101 and are not shown. In another embodiment, the touch function is integrated in the array substrate. The array substrate comprises a common electrode and a pixel electrode, and when in display, after voltages are respectively applied to the common electrode and the pixel electrode, the generated electric field can control the liquid crystal molecules to deflect, so that the display is realized. For example, the common electrode in the array substrate is divided into a plurality of electrode blocks in a block structure. The electrode blocks can be used as common electrodes in the display stage, and form electric fields for driving liquid crystal molecules to deflect in cooperation with the pixel electrodes. The electrode blocks can be reused as touch electrodes in the touch stage.

In another embodiment, the display panel is an organic light emitting display panel, as shown in fig. 4, the display panel includes an array substrate 11, a light emitting device layer 71 and an encapsulation layer 72, the light emitting device layer 71 includes a plurality of light emitting devices 711, the light emitting devices 711 are shown only in a simplified schematic, and the light emitting devices 711 include an anode, a light emitting layer and a cathode that are sequentially stacked. The light emitting device layer 71 further includes a pixel defining layer (not labeled) for spacing adjacent light emitting devices. The encapsulation layer 72 is used to encapsulate and protect the light emitting device 711, so as to ensure the service life of the light emitting device 711. The encapsulation layer 72 is bonded and fixed to the array substrate 11 by the sealant 42. Optionally, a touch module 73 is further disposed on the encapsulation layer 72, the touch module 73 is used to implement a touch function of the display panel, and a protection layer 74 is further disposed on the touch module 73, so as to protect a structural layer inside the display panel. The figure also illustrates a substrate 1101 in the array substrate 11, wherein the substrate 1101 is a rigid substrate. Circuit structures such as a pixel driver circuit and a scan driver circuit are formed over the substrate 1101 and are not shown.

The film layer structure of the display panel in fig. 3 and 4 is only schematically shown. When the technical scheme is applied, the film layer structure of the display panel is not changed and designed. And mainly through designing the structure of the binding end of the array substrate in the display panel in order to reduce the lower frame, promote the screen to account for, can ensure to bind the reliability of connecting simultaneously.

The array substrate 11 includes a plurality of first leads 23 located in the non-display area 2, and the plurality of first leads 23 are arranged in the first direction x. Referring to the illustration in fig. 5, the array substrate 11 includes a first corner 31, the first corner 31 is located on a side of the array substrate 11 close to the display surface of the display panel, and the cutting surface 311 of the first corner 31 exposes the plurality of first leads 23. The display surface side of the display panel is the side of the display panel displaying the picture. The array substrate is applied to a liquid crystal display panel, and a first chamfer angle is formed at one side of the array substrate close to a color film substrate; the array substrate is applied to an organic light-emitting display panel, and the side, close to the light-emitting device layer, of the array substrate is provided with a first chamfer. In this application embodiment, array substrate's substrate is the rigidity substrate, and the rigidity substrate has certain thickness and has certain rigidity, can use in this application embodiment, realizes the structure preparation of corner cut, can coat silver thick liquid on the section of corner cut and form the silver thick liquid and walk the line to guarantee that the silver thick liquid walks the reliability that bonds with array substrate when extending to array substrate's dorsal part.

A plurality of silver paste traces 24, one silver paste trace 24 is electrically connected to one first pin 23, and at least a part of the line segments of the silver paste trace 24 is located on one side of the array substrate 11 close to the display surface, that is, at least a part of the line segments of the silver paste trace 24 and the first corner 31 are located on the same side of the array substrate 11. The first pins 23 are electrically connected to a data driving chip 25 (not shown in fig. 2) through silver paste traces 24, respectively. The silver paste trace 24 may cover the first lead 23 and be electrically connected to the first lead 23, or the silver paste trace 24 is electrically connected to the first lead 23 on the cut surface 311 of the first chamfer 31. Fig. 2 also illustrates the wiring region 21 located in the non-display region 2, wherein a plurality of signal lines 211 are disposed in the wiring region 21, and the signal lines 211 are electrically connected to data lines or scanning lines in the display panel directly or indirectly to provide signals for displaying on the display panel.

In fig. 5, a specific embodiment of the present application is illustrated, a silver paste trace 24 covers a cut surface 311 of the first corner 31 and extends along the surface of the array substrate 11 to a side of the array substrate 11 away from the display surface in the thickness direction z of the array substrate 11. The data driving chip 25 is bonded to a side of the array substrate 11 away from the display surface, that is, the data driving chip 25 is bonded to the back surface of the array substrate 11. In the embodiments of the present application, a side of the array substrate close to the display surface is defined as a front surface of the array substrate, and a side of the array substrate away from the display surface is defined as a back surface of the array substrate.

The display panel provided in the embodiment of fig. 2 can be manufactured by the following manufacturing method. As shown in fig. 6, the manufacturing method includes:

step S101: and manufacturing an array substrate, wherein the array substrate comprises a plurality of first pins positioned in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S102: one end of the array substrate is ground to form a first chamfer, a cutting surface of the first chamfer exposes the first pins, and the first chamfer is positioned on one side of the display surface of the array substrate, which is close to the display panel. The display panel comprises an array substrate, and the display panel further comprises a process for manufacturing other structural layers on the array substrate after the manufacturing process of the array substrate is completed and before one end of the array substrate is ground. For example, in a liquid crystal display panel, after an array substrate is manufactured, the array substrate and a color film substrate need to be attached, then liquid crystal molecules are filled in a space formed between the array substrate and the color film substrate to form a liquid crystal layer, and after a process of forming the liquid crystal layer, one end of the array substrate is ground. For example, when the array substrate is used in an organic light emitting display panel, after the array substrate is manufactured, at least a light emitting device layer and a packaging layer are sequentially manufactured on the array substrate, and then one end of the array substrate is ground.

Step S103: coating silver paste and curing to form a plurality of silver paste routing lines, wherein one silver paste routing line is electrically connected with one first pin, and at least part of line segments of the silver paste routing line are positioned on one side, close to the display surface, of the array substrate. In the step, the silver paste routing is manufactured by adopting a coating process to be electrically connected with the first pin, the process is simple, and the requirement on the length of the first pin is lower by adopting the connection mode.

Specifically, coating silver paste and curing to form a plurality of silver paste traces includes: and coating silver paste on the cut surface of the first cut angle, and continuously coating the silver paste along the thickness direction of the array substrate until the silver paste is coated on the side of the array substrate, which is far away from the display surface. By adopting the silver paste coating mode, the silver paste routing in the embodiment of fig. 5 can be manufactured, the cured silver paste routing covers the cutting surface of the first corner cut, and extends to one side of the array substrate, which is deviated from the display surface, along the surface of the array substrate in the thickness direction of the array substrate.

Step S104: and the plurality of first pins are electrically connected with the data driving chip through silver paste routing wires respectively. After the silver paste routing process, the data driving chip is bound, and the data driving chip is electrically connected with the first pin through the silver paste routing.

In the related art, pins (refer to pins 221 in fig. 1) disposed on a side of the array substrate close to the display surface are generally used for binding a data driver chip or binding a flexible package substrate, and in order to ensure reliability of binding connection, the pins need to have a certain length. In the embodiment of the application, the array substrate is provided with a first chamfer, and the first pin is exposed on the cutting surface of the first chamfer. At least part of the line segments of the silver paste routing and the first tangent angle are positioned on the same side of the array substrate, and the silver paste routing is correspondingly and electrically connected with the first pins. The first pin is electrically connected with the data driving chip through the silver paste routing, and the first pin on the array substrate is not used for binding the data driving chip and is also not used for binding the flexible packaging substrate fixed with the data driving chip. That is, the first pin is not used for binding connection in the embodiment of the present application. The first pin is arranged to be electrically connected with the silver paste routing wire manufactured through the coating process, and compared with the binding connection mode, the connection mode has lower requirement on the length of the first pin. Through forming first corner cut after grinding array substrate, expose first pin on the section of first corner cut, the length of first pin can guarantee first pin and wiring district in the electric connection between the signal line and first pin and silver thick liquid walk the electric connection between the line can, can reduce the length of first pin to be favorable to reducing the width of lower frame, improve the screen and account for than.

As illustrated in the embodiment of fig. 5, the silver paste trace is electrically connected to the first pin, and the silver paste trace is arranged to extend to the back surface of the array substrate along the thickness direction of the array substrate, which is equivalent to guiding the binding end to the back surface of the array substrate by using the silver paste trace. The data driving chip can be bound on the back surface of the array substrate, or the flexible packaging substrate fixed with the data driving chip is bound, so that the data driving chip is electrically connected with the first pins. After the binding end is arranged on the back surface of the array substrate, the effective length of the binding end can be correspondingly increased, so that the reliability of binding connection is ensured. In addition, the reliability that silver paste routing lines bond with the array substrate when extending to the back side of the array substrate can be guaranteed through the design of the first corner cut on the array substrate, the situation that the silver paste routing lines cannot be effectively bonded under the right-angle condition is avoided, and the process difficulty of the silver paste routing lines is reduced.

Further, as shown in fig. 5, a side of the array substrate 11 facing away from the display surface has a second chamfer 32, and the second chamfer 32 and the first chamfer 31 are located at the same end of the array substrate 11; the array substrate 11 includes a first end surface 33, and the first corner 31 and the second corner 32 are connected by the first end surface 33. The silver paste routing wire 24 covers the cut surface 311 of the first corner 31, extends from the cut surface 311 to the first end surface 33, extends from the first end surface 33 to the cut surface 321 of the second corner 32, and extends from the cut surface 321 of the second corner 32 to the back surface of the array substrate 11. The included angle between the cut surface 311 and the first end surface 33, the included angle between the first end surface 33 and the cut surface 321, and the included angle between the cut surface 321 and the back surface of the array substrate 11 are all non-right angle included angles, and the bonding reliability of the silver paste routing can be further ensured when the silver paste routing extends to the back surface of the array substrate.

In an embodiment, fig. 7 is a schematic cross-sectional view of a display panel provided in the embodiment of the present application, and as shown in fig. 7, the display panel further includes a color filter substrate 13 disposed opposite to the array substrate 11, a liquid crystal layer 14 is disposed between the color filter substrate 13 and the array substrate 11, and the color filter substrate 13 and the array substrate 11 are bonded by a frame sealing adhesive 41. The width of the first corner cut (not labeled) in the second direction y is d1, and the width of the second corner cut (not labeled) in the second direction y is d2, where d1> d2, the second direction y is perpendicular to the first direction x, and the second direction y is parallel to the plane of the array substrate 11. By setting the grinding width of the back side of the array substrate 11 to be smaller than the grinding width of the front side, the bonding reliability of the silver paste routing line when the silver paste routing line extends to the back side of the array substrate can be ensured, and meanwhile, a part which is not ground and cut off in a non-display area of the back side of the array substrate can be ensured to have a certain width (such as the width L in fig. 7). In the embodiment of the present application, the portion adjacent to the second corner on the back surface of the array substrate 11 is defined as a horizontal subsection 34, and as indicated in fig. 7, a width of a portion of the horizontal subsection 34 located in the non-display area 2 is defined as L.

In the embodiment of fig. 7, the display panel is a liquid crystal display panel. When the lcd panel is assembled into a display device, a backlight module needs to be disposed on the back side of the array substrate 11, the backlight module provides a light source for the display panel, and the backlight module and the display panel need to be bonded and fixed by an adhesive tape. According to the embodiment of the application, after the second chamfer is formed by grinding the back side of the array substrate, the part, which is not ground and cut off, of the back side of the array substrate, which is positioned in the non-display area, can be ensured to have a certain width, so that the binding end arranged on the back side of the array substrate can be ensured to have enough length, and the binding reliability is ensured. Meanwhile, the adhesive tape between the backlight module and the display panel can be ensured to have a certain width, and the bonding reliability between the backlight module and the display panel is ensured.

With continued reference to fig. 7, the included angle between the plane of the first end face 33 and the cutting plane 311 of the first chamfer 31 is α 1, and the included angle between the plane of the first end face 33 and the cutting plane 321 of the second chamfer 32 is α 2; wherein α 1> α 2. In the thickness z direction of the array substrate 11, the depth of the first chamfer 31 is h1, and the depth of the second chamfer 32 is h2, wherein h1> h 2. Through the cooperation of contained angle and degree of depth, further ensure that silver thick liquid is walked the flatness that extends the line on the cut surface of first corner cut, first terminal surface and the cut surface of second corner cut, guarantee silver thick liquid and walk line and array substrate surface bonding reliability. Meanwhile, the grinding width of the back side of the array substrate is smaller than that of the front side of the array substrate.

Further, an embodiment of the present application further provides a manufacturing method of a display panel, which can be used for manufacturing a display panel having an array substrate and a first corner cut and a second corner cut at the same time. Fig. 8 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure. As shown in fig. 8, the manufacturing method includes:

step S201: and manufacturing an array substrate, wherein the array substrate comprises a plurality of first pins positioned in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S202: one end of the array substrate is ground to form a first chamfer, a cutting surface of the first chamfer exposes the first pins, and the first chamfer is positioned on one side of the display surface of the array substrate, which is close to the display panel.

Step S203: the array substrate is ground to form a second chamfer and a horizontal subsection, wherein the second chamfer and the first chamfer are located at the same end of the array substrate, the horizontal subsection is adjacent to the second chamfer, the array substrate further comprises a first end face, and the first chamfer and the second chamfer are connected through the first end face.

Step S204: and continuously coating silver paste on the horizontally distributed surfaces along the cut surface of the first chamfer, the first end surface and the cut surface of the second chamfer, and forming a plurality of silver paste routing lines after curing. The silver paste routing comprises a first sub-line segment, and the first sub-line segment is in contact with the horizontal branch portion.

Step S205: and the plurality of first pins are electrically connected with the data driving chip through silver paste routing wires respectively.

The sequence of grinding to form the first chamfer and grinding to form the second chamfer is not limited in this embodiment. The difference between this embodiment and the manufacturing method provided in the embodiment of fig. 6 is that: before coating silver paste and curing to form a plurality of silver paste routing lines, a step of grinding the array substrate to form a second corner cut and a horizontal subsection is added. Correspondingly, after a plurality of silver paste wires are formed by coating and curing the silver paste, the silver paste wires can be covered on the cutting surface of the first corner cut, and extend to one side of the array substrate, deviating from the display surface, along the surface of the array substrate in the thickness direction of the array substrate, so that the bonding reliability of the silver paste wires and the surface of the array substrate is ensured.

In the embodiment of this application, the back that will bind the end and draw to array substrate through setting up of silver thick liquid line carries out structural design to array substrate's back to realize the electricity of data driver chip and first pin and be connected, thereby can reduce the length of the positive first pin of array substrate, reduce the width of lower frame, improve the screen and account for the ratio. The structure of the back surface of the array substrate will be described below in the following embodiments.

In an embodiment, fig. 9 is another schematic view of a display panel provided in an embodiment of the present application. As shown in fig. 9, the side of the array substrate 11 facing away from the display surface includes a horizontal subsection 34 adjacent to the second chamfer 32; the silver paste trace 24 includes a first sub-line segment 241, and the first sub-line segment 241 contacts with the horizontal branch portion 34; the display panel further includes a flexible package substrate 15, the data driving chip 25 is fixed on the flexible package substrate 15, the flexible package substrate 15 is bound and connected with the plurality of first sub-line segments 241, and only one first sub-line segment 241 is illustrated in the cross-sectional schematic diagram of fig. 9. Optionally, the flexible package substrate 15 is electrically connected to the first sub-line segment 241 through an anisotropic conductive adhesive. The display panel provided in this embodiment mode can be manufactured by the manufacturing method provided in the embodiment of fig. 8. The surface of the horizontal branch 34 is coated with silver paste, and the silver paste is cured to form a first sub-line segment 241. The process of binding the data driver chip in step S205 includes: the flexible packaging substrate fixed with the data driving chip is provided, and the flexible packaging substrate is bound and connected with the first sub-line sections, so that the data driving chip is electrically connected with the first pins through silver paste routing. And the flexible packaging substrate has flexibility, can be bent at the back of the array substrate, is applied to a liquid crystal display panel, can realize that the flexible packaging substrate is bent and arranged in a non-display area, and avoids shielding light rays emitted to the display panel by the backlight module through the flexible packaging substrate or the data driving chip when the display device is assembled.

As shown in fig. 9, the display panel further includes a printed circuit board 16, and the printed circuit board 16 is bound to the flexible package substrate 15, so as to electrically connect the printed circuit board 16 and the data driving chip 25. In assembling the display device, the printed circuit board 16 is connected to a system board of the display device.

In another embodiment, fig. 10 is another schematic view of a display panel provided in this embodiment of the present application. As shown in fig. 10, the display panel further includes a flexible circuit board 17, and the flexible circuit board 17 is bound and connected with the flexible package substrate 15, so as to realize electrical connection between the flexible circuit board 17 and the data driving chip 25. In assembling the display device, the flexible circuit board 17 is connected to a system board of the display device. The state of the flexible circuit board 17 in fig. 10 is merely to illustrate that the flexible circuit board 17 has certain flexibility, and is not limited to the state of the flexible circuit board 17 in an actual product.

In another embodiment, fig. 11 is another schematic view of a display panel provided in this embodiment of the present application. As shown in fig. 11, a side of the array substrate 11 facing away from the display surface includes a horizontal branch 34 adjacent to the second corner cut 32, the silver paste trace 24 includes a first sub-line 241, and the first sub-line 241 is in contact with the horizontal branch 34; the data driving chip 25 is connected to the plurality of first sub-line segments 241 in a binding manner. The display panel provided in this embodiment mode can be manufactured by the manufacturing method provided in the embodiment of fig. 8. The surface of the horizontal branch 34 is coated with silver paste, and the silver paste is cured to form a first sub-line segment 241. The process of binding the data driver chip includes: the data driving chip 25 is bound and connected with the plurality of first sub-line segments 241, so that the data driving chip 25 is electrically connected with the first pins 23 through the silver paste routing 24.

Optionally, as shown in fig. 11, pins (not labeled) on one side of the data driving chip 25 are bound and connected to the plurality of first sub-line segments 241, and pins (not labeled) on the other side of the data driving chip 25 are bound and connected to the flexible circuit board 17. The flexible circuit board 17 is illustrated in fig. 11 as being bonded to a side of the data driving chip 25 near the display area.

In another embodiment, fig. 12 is another schematic view of a display panel provided in this embodiment of the present application. Fig. 13 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

As shown in fig. 12, a side of the array substrate 11 facing away from the display surface includes a horizontal subsection 34 adjacent to the second corner cut 32, the horizontal subsection 34 includes a plurality of second leads 26, and the second leads 26 correspond to the first leads 23 one by one; one end of the silver paste trace 24 is connected to the first pin 23, and the other end of the silver paste trace 24 is connected to the second pin 26. The display panel further comprises a flexible packaging substrate 15, the data driving chip 25 is fixed on the flexible packaging substrate 15, and the flexible packaging substrate 15 is connected with the plurality of second pins 26 in a binding manner. The flexible package substrate 15 is then bonded to the printed circuit board or bonded to the flexible circuit board. In fig. 12, it is shown that the cut surface of the second chamfer 32 does not expose the second lead 26, and the silver paste trace 24 extends to the surface of the horizontal branch 34 to be connected with the second lead 26 in a contact manner. In another embodiment, the cut surface of the second chamfer 32 exposes the second lead 26, which is not illustrated in the figures.

The display panel provided in the embodiment of fig. 12 can be manufactured as follows. As shown in fig. 13:

step S301: and manufacturing an array substrate, wherein the array substrate comprises a plurality of first pins positioned in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S302: and manufacturing a plurality of second pins on one side of the array substrate, which is far away from the display surface, wherein the second pins and the first pins are positioned at the same end, and the second pins and the first pins are in one-to-one correspondence. Specifically, a plurality of second pins are manufactured on the back surface of the array substrate by adopting an etching process.

Step S303: one end of the array substrate is ground to form a first chamfer, a cutting surface of the first chamfer exposes the first pins, and the first chamfer is positioned on one side of the display surface of the array substrate, which is close to the display panel.

Step S304: one end of the array substrate is ground to form a second chamfer and a horizontal subsection, the second chamfer and the first chamfer are located at the same end of the array substrate, the horizontal subsection is adjacent to the second chamfer, and the horizontal subsection comprises a plurality of second pins.

Step S305: coating silver paste on the cut surface of the first corner cut, continuously coating the silver paste along the thickness direction of the array substrate until the silver paste is coated on one side of the array substrate, which is deviated from the display surface, and solidifying the silver paste to form a plurality of silver paste routing lines, wherein one end of each silver paste routing line is connected with the first pin, and the other end of each silver paste routing line is connected with the second pin.

Step S306: and providing a flexible packaging substrate fixed with a data driving chip, and binding and connecting the flexible packaging substrate and the plurality of second pins, so that the data driving chip is electrically connected with the first pins through silver paste routing.

After the conventional process of the display panel, the second pins are manufactured on the back surface of the array substrate. For example, in a liquid crystal display panel, an array substrate is firstly manufactured, and a plurality of first pins are formed on the array substrate; then the array substrate and the color film substrate are aligned and attached; then filling liquid crystal molecules between the array substrate and the color film substrate; and then manufacturing a second pin on one side of the array substrate, which is far away from the color film substrate. For example, in an organic light emitting display panel, an array substrate is first manufactured, and a plurality of first pins are formed on the array substrate; and then, at least sequentially manufacturing a light-emitting device layer and a packaging layer on the array substrate, and then manufacturing a second pin on one side of the array substrate, which is far away from the light-emitting device layer. And manufacturing a second pin on the back surface of the array substrate, and realizing the electric connection between the first pin on the front surface and the second pin on the back surface in a silver paste routing coating mode. The alignment marks are arranged on the front face of the array substrate and the back face of the array substrate, double alignment is achieved, the accuracy of silver paste routing manufacturing is guaranteed, and the performance reliability of the display panel is guaranteed.

In another embodiment, one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second chamfer, the horizontal subsection comprises a plurality of second pins, and the second pins correspond to the first pins one to one; one end of the silver paste routing wire is connected with the first pin, and the other end of the silver paste routing wire is connected with the second pin. The difference from the embodiment of fig. 12 is that the data driving chip is directly bonded to the back side of the array substrate, the plurality of pins on one side of the data driving chip are bonded to the plurality of second pins, and the plurality of pins on the other side of the data driving chip are bonded to the flexible circuit board, wherein the flexible circuit board is bonded to one side of the data driving chip close to the display area. Reference may be made to the illustration in fig. 11 described above for the position of the flexible circuit board.

In another embodiment, fig. 14 is another schematic view of a display panel provided in this embodiment of the present application. Fig. 15 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

As shown in fig. 14, the array substrate 11 includes a first sub-substrate 111 and a second sub-substrate 112 oppositely disposed, the first sub-substrate 111 and the second sub-substrate 112 are bonded by a first glue layer 42, and the first glue layer 42 is located in the non-display region; the first sub-substrate 111 includes a first chamfer 31 and a first lead 23, and the second sub-substrate 112 includes a second chamfer 32 and a second lead 26. Fig. 14 also illustrates the flexible package substrate 15, the data driving chip 25 is fixed on the flexible package substrate 15, and the flexible package substrate 15 is bound to the plurality of second pins 26. Further, the flexible package substrate 15 is bound to the printed circuit board or bound to the flexible circuit board. The first sub-substrate 111 is provided with a pixel driving circuit, and the second sub-substrate 112 may be a glass substrate, that is, the first sub-substrate 111 further includes a circuit structure such as a pixel driving circuit.

The display panel provided in the embodiment of fig. 14 can be manufactured as follows. As shown in fig. 15:

step S401: and manufacturing a first sub-substrate, wherein the first sub-substrate comprises a plurality of first pins positioned in the non-display area.

Step S402: one end of the first sub-substrate is ground to form a first chamfer angle, and a cutting surface of the first chamfer angle exposes the first pin.

Step S403: and providing a second sub-substrate, and manufacturing a plurality of second pins on the second sub-substrate.

Step S404: and grinding one end of the second sub-substrate to form a second chamfer and a horizontal subsection, wherein the second pin is positioned in the horizontal subsection.

Step S405: and aligning and attaching the ground first sub-substrate and the ground second sub-substrate through a first adhesive layer. Wherein the first chamfer and the second chamfer are located at the same end.

Step S406: coating silver paste on the cut surface of the first corner cut, continuously coating the silver paste along the thickness direction of the first sub-substrate and the second sub-substrate until the silver paste is coated on one side of the second sub-substrate, which is deviated from the display surface, and curing the silver paste to form a plurality of silver paste routing lines, wherein one ends of the silver paste routing lines are connected with the first pins, and the other ends of the silver paste routing lines are connected with the second pins.

Step S407: and providing a flexible packaging substrate fixed with a data driving chip, and binding and connecting the flexible packaging substrate and the plurality of second pins, so that the data driving chip is electrically connected with the first pins through silver paste routing.

Taking a liquid crystal display panel as an example, when manufacturing, firstly, a first sub-substrate is manufactured, the first sub-substrate is an array substrate, and a plurality of first pins are formed on the first sub-substrate; then the first sub-substrate is aligned and attached to the color film substrate; then filling liquid crystal molecules between the first sub-substrate and the color film substrate; and then grinding the first sub-substrate to form a first chamfer. Providing a second sub-substrate, wherein the second sub-substrate can be a glass substrate, and a plurality of second pins are manufactured on the second sub-substrate by adopting an etching process; the second sub-substrate is then ground to form a second chamfer and corresponding horizontal segments. After the first sub-substrate and the second sub-substrate are both subjected to a grinding process, the first sub-substrate and the second sub-substrate are aligned and attached to form the array substrate. And then manufacturing silver paste coating wiring and binding the data drive chip.

In the embodiment, after the second pins are independently manufactured on the second sub-substrate, the second sub-substrate and the first sub-substrate are attached to form the array substrate, so that the risk that the circuit on the front side of the display panel is scratched in the process due to the fact that the second pins are directly manufactured on the back side of the array substrate (the first sub-substrate) through an etching process is avoided. Meanwhile, a new process line is not required to be developed, and the investment of equipment cost can be reduced.

In another embodiment, fig. 16 is another schematic view of a display panel provided in this embodiment of the present application. Fig. 17 is another flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

As shown in fig. 16, the display panel further includes a counter substrate 18, and the counter substrate 18 and the array substrate 11 are disposed opposite to each other; one end of the array substrate 11 with the first cut angle 31 extends out of the opposite substrate 18 to form a step 50, the part of the array substrate 11 extending out of the opposite substrate 18 forms a step bottom surface, and the end surface of the opposite substrate 18 forms a step slope; wherein the first pin 23 is exposed from the bottom surface of the step; the silver paste routing wire 24 covers the bottom surface of the step and extends to the slope surface of the step; the display panel further comprises a flexible packaging substrate 15, and the data driving chip 25 is fixed on the flexible packaging substrate 15; the flexible package substrate 15 is bonded to the silver paste traces 24 on the slope surface of the step and the silver paste traces 24 on the bottom surface of the step. As illustrated in the drawing, the counter substrate 18 and the array substrate 11 are bonded by the second adhesive layer 43. The array substrate 11 is an array substrate, and the opposite substrate 18 is a color film substrate. In addition, the flexible package substrate may be further bound with a flexible circuit board or a printed circuit board.

The display panel provided in the embodiment of fig. 16 can be manufactured as follows. As shown in figure 17 of the drawings,

step S501: and manufacturing an array substrate, wherein the array substrate comprises a plurality of first pins positioned in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S502: providing an opposite substrate, and aligning and attaching the opposite substrate and the array substrate, wherein one end of the array substrate extends out of the opposite substrate to form a step, the part of the array substrate extending out of the opposite substrate forms a step bottom surface, the end surface of the opposite substrate forms a step slope surface, and the step bottom surface exposes the first pin.

Step S503: one end of the array substrate is ground to form a first chamfer, a cutting surface of the first chamfer exposes the first pins, and the first chamfer is positioned on one side of the display surface of the array substrate, which is close to the display panel.

Step S504: and coating silver paste on the bottom surface of the step and the slope surface of the step, and curing to form a plurality of silver paste routing lines, wherein the silver paste routing lines are electrically connected with the first pins and extend to the slope surface of the step.

Step S505: providing a flexible packaging substrate fixed with a data driving chip; the flexible package substrate is bound and connected with the silver paste routing on the slope surface of the step and the silver paste routing on the bottom surface of the step.

Compared with the prior art, after the opposite substrate is arranged to extend to the position of the first pin of the array substrate in the embodiment, a certain dislocation exists between the opposite substrate and the array substrate at one end of the display panel to form a step, silver paste is coated on at least the bottom surface of the step and the slope surface of the step to form silver paste routing, and the total length of the silver paste routing is longer. Then set up flexible packaging substrate and silver thick liquid and walk the line and bind and be connected, can guarantee to have enough big binding area of contact, guarantee to bind the reliability of connecting. And silver thick liquid is walked line and is had enough big area of contact with flexible packaging substrate, also can reduce contact impedance, when data driver chip provides voltage signal to various function signal lines in to display panel and drives the demonstration, can promote the charging rate of various function signal lines in the display panel. The first pins on the array substrate are not used for directly binding the flexible packaging substrate in the embodiment, so that the length of the first pins can be shortened, and the narrowing of the lower frame is facilitated. After forming first corner through grinding simultaneously, flexible packaging substrate can follow first corner and buckle to display panel's the back, has avoided flexible packaging substrate to carry out the risk that the right angle is buckled and is leaded to the broken string.

Based on the same inventive concept, an embodiment of the present application further provides a display device, fig. 18 is a schematic view of the display device provided in the embodiment of the present application, and as shown in fig. 18, the display device includes the display panel 100 provided in any embodiment of the present application. The specific structure of the display panel 100 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 18 is only a schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, a television, a smart watch, and the like.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel characterized by comprising a display area and a non-display area surrounding the display area, the display panel comprising:

the array substrate comprises a plurality of first pins positioned in the non-display area, the plurality of first pins are arranged in a first direction, a first chamfer is formed on one side, close to the display surface of the display panel, of the array substrate, and a cutting surface of the first chamfer exposes the plurality of first pins;

one silver paste routing wire is electrically connected with one first pin, and at least part of line segment of the silver paste routing wire is positioned on one side, close to the display surface, of the array substrate;

and the plurality of first pins are electrically connected with the data driving chip through the silver paste routing wires respectively.

2. The display panel according to claim 1,

the silver paste routing wires cover the cutting surface of the first corner cut, and extend to one side of the array substrate, which is deviated from the display surface, along the surface of the array substrate in the thickness direction of the array substrate.

3. The display panel according to claim 2,

a second chamfer angle is arranged on one side of the array substrate, which is far away from the display surface, and the second chamfer angle and the first chamfer angle are positioned at the same end of the array substrate;

the array substrate comprises a first end face, and the first chamfer angle and the second chamfer angle are connected through the first end face.

4. The display panel according to claim 3,

the width of the first chamfer in the second direction is d1, the width of the second chamfer in the second direction is d2, wherein d1> d2, the second direction is perpendicular to the first direction, and the second direction is parallel to the plane of the array substrate.

5. The display panel according to claim 3,

one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second corner cut, the silver paste routing comprises a first sub-line segment, and the first sub-line segment is in contact with the horizontal subsection;

the display panel is further provided with a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is bound and connected with the first sub-line sections.

6. The display panel according to claim 3,

one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second corner cut, the silver paste routing comprises a first sub-line segment, and the first sub-line segment is in contact with the horizontal subsection; wherein the content of the first and second substances,

the data driving chip is connected with the first sub-line sections in a binding mode.

7. The display panel according to claim 3,

one side of the array substrate, which is far away from the display surface, comprises a horizontal subsection adjacent to the second chamfer angle, the horizontal subsection comprises a plurality of second pins, and the second pins correspond to the first pins one to one;

one end of the silver paste routing wire is connected with the first pin, and the other end of the silver paste routing wire is connected with the second pin.

8. The display panel according to claim 7,

the display panel further comprises a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is connected with the plurality of second pins in a binding mode.

9. The display panel according to claim 7,

the array substrate comprises a first sub-substrate and a second sub-substrate which are oppositely arranged, the first sub-substrate and the second sub-substrate are bonded through a first adhesive layer, and the first adhesive layer is located in the non-display area; wherein the content of the first and second substances,

the first sub-substrate comprises the first chamfer and a plurality of the first pins, and the second sub-substrate comprises the second chamfer and a plurality of the second pins.

10. The display panel according to claim 1,

the display panel further comprises an opposite substrate, and the opposite substrate and the array substrate are oppositely arranged;

one end of the array substrate, which is provided with the first cutting angle, extends out of the opposite substrate to form a step, the part of the array substrate, which extends out of the opposite substrate, forms a step bottom surface, and the end surface of the opposite substrate forms a step slope; wherein the step bottom surface exposes the first pin;

the silver paste routing wire covers the bottom surface of the step and extends to the step slope surface;

the display panel further comprises a flexible packaging substrate, and the data driving chip is fixed on the flexible packaging substrate; wherein the content of the first and second substances,

the flexible packaging substrate is connected with the silver paste routing on the step slope surface and the silver paste routing on the step bottom surface in a binding mode.

11. A display device characterized by comprising the display panel according to any one of claims 1 to 10.