CN113889323A - Preparation method of etched circuit ultra-small integrally-formed inductor and inductor - Google Patents
Preparation method of etched circuit ultra-small integrally-formed inductor and inductor Download PDFInfo
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- CN113889323A CN113889323A CN202111166499.XA CN202111166499A CN113889323A CN 113889323 A CN113889323 A CN 113889323A CN 202111166499 A CN202111166499 A CN 202111166499A CN 113889323 A CN113889323 A CN 113889323A
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- Prior art keywords
- path
- magnetic core
- inductor
- copper wire
- circuit
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 239000006247 magnetic powder Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 15
- 238000004512 die casting Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007943 implant Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 15
- 239000010949 copper Substances 0.000 abstract description 15
- 238000004804 winding Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007723 die pressing method Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
Abstract
The invention provides a preparation method of an ultra-small integrally-formed inductor of an etched circuit and the inductor, which relate to the technical field of inductor preparation and comprise the following steps: step S1, preparing a magnetic core seat body; step S2, etching a circuit path on the upper surface of the magnetic core seat; step S3, implanting copper wires on the upper surface of the magnetic core seat along the circuit path; step S4, coating magnetic powder on the upper surface of the magnetic core base and hot-pressing; and step S5, carrying out rolling spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor. The inductor has the beneficial effects that the expansion fracture and short circuit risks of the winding are effectively avoided, and the magnetic core is not required to be additionally prepared, so that the total volume of the integrally formed inductor is smaller, and the space utilization rate is greatly improved.
Description
Technical Field
The invention relates to the technical field of inductor preparation, in particular to a preparation method of an ultra-small integrally-formed inductor of an etched circuit and the inductor.
Background
The integrated inductor is called an integrated inductor, a powder alloy inductor and a die-pressing inductor, the integrated inductor comprises a seat body and a winding, and the seat body is formed by embedding the winding into metal magnetic powder and die-casting. Compare in traditional inductance, integrated into one piece inductance has following advantage: the magnetic shielding structure has a closed magnetic circuit, is strong in electromagnetic interference resistance, has ultralow buzzer and can be installed at high density; low-loss alloy powder is adopted for die casting, so that the impedance is low; the structure is integrally formed, so that the product is firm and firm, and is accurate and durable in rust prevention; the integrated inductor has the advantages that the size is small, the current is high, excellent temperature rise current and saturation current characteristics can be kept at high temperature, and the market puts higher requirements on miniaturization of the integrated inductor along with wide application of the integrated inductor.
Among the present integrated into one piece inductance, the winding is the copper line coiling, has the bulging deformation phenomenon at the die-casting in-process, has copper line fracture and short circuit risk, and need prepare the magnetic core when the inductance is prepared, and the magnetic core possesses certain height usually to the further miniaturization of the total volume of integrated into one piece inductance has been restricted.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a preparation method of an ultra-small integrally-formed inductor of an etched circuit, which comprises the following steps:
step S1, preparing a magnetic core seat body;
step S2, etching a circuit path on the upper surface of the magnetic core base;
step S3, implanting a copper wire on the upper surface of the magnetic core base along the circuit path;
step S4, coating magnetic powder on the upper surface of the magnetic core base body and hot-pressing;
and step S5, performing roll spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.
Preferably, in step S2, a wire groove is etched on the upper surface of the core housing to form the circuit path.
Preferably, in step S3, an automatic implanter is used to implant the copper wire into the wire slot.
Preferably, in the process of implanting the copper wire, the implanting head of the automatic implanting machine heats the copper wire in a pulse heating mode, so that the copper wire is bonded in the wire slot.
Preferably, in step S3, the copper wire is a flat copper wire.
Preferably, the circuit path includes a first path and a second path, a first start end surrounds the first path in a zigzag manner and extends from a first lead-out end to the edge of the magnetic core base body to form the first path, and a second start end passes through the first path surrounding in a zigzag manner with the first start end as a start point and extends from a second lead-out end to the edge of the magnetic core base body to form the second path.
Preferably, in step S1, the magnetic core base is prepared by a baking process after die casting.
The invention also provides an etched circuit ultra-small integrally-formed inductor which is prepared by the preparation method and comprises the following steps:
the magnetic core seat body is etched with a circuit path, and a copper wire is implanted in the circuit path.
Preferably, the copper wire is a flat copper wire.
Preferably, the circuit path includes a first path and a second path, a first start end surrounds the first path in a zigzag manner and extends from a first lead-out end to the edge of the magnetic core base body to form the first path, and a second start end passes through the first path surrounding in a zigzag manner with the first start end as a start point and extends from a second lead-out end to the edge of the magnetic core base body to form the second path.
The technical scheme has the following advantages or beneficial effects: through the mode of etching circuit path and implanting the copper line on the magnetic core pedestal body, replace the winding die-casting and form, effectively avoided winding expansion fracture and short circuit risk, need not to prepare the magnetic core in addition simultaneously for the total volume that the preparation obtained integrated into one piece inductance is littleer, greatly improves space utilization.
Drawings
FIG. 1 is a schematic flow chart of a method for fabricating a super small integrated inductor with etched lines according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an outlet slot etched on the upper surface of the magnetic core base according to the preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a structure of a super small integrated inductor with etched lines according to a preferred embodiment of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present invention is not limited to the embodiment, and other embodiments may be included in the scope of the present invention as long as the gist of the present invention is satisfied.
In a preferred embodiment of the present invention, based on the above problems in the prior art, a method for manufacturing an ultra-small integrated inductor with etched lines is provided, as shown in fig. 1, including:
step S1, preparing a magnetic core seat body;
step S2, etching a circuit path on the upper surface of the magnetic core seat;
step S3, implanting copper wires on the upper surface of the magnetic core seat along the circuit path;
step S4, coating magnetic powder on the upper surface of the magnetic core base and hot-pressing;
and step S5, carrying out rolling spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.
Specifically, in this embodiment, the magnetic core base body is first prepared by die-casting and then baking, as shown in fig. 2, preferably, the cross section of the magnetic core base body 1 is overall rectangular, and one side of the rectangle is provided with a groove, and two sides of the groove are used as outlets of copper wires. Because this magnetic core pedestal is the magnetic powder hot pressing, its self can regard as the magnetic core of implanting the circuit route that the copper line formed, consequently, need not to prepare in addition the protrusion in the magnetic core of magnetic core pedestal 1, and then the volume of the super little integrated into one piece inductance of etching circuit that makes the preparation obtain is miniaturized as far as possible, greatly improves space utilization when using.
Further, etching is to remove the portion of the material not covered by the photoresist (photosensitive film) by etching with a suitable chemical solution to a certain depth of engraving. The etching process changes the mode of machining metal parts, and can machine small parts which are large in area and small enough to be hardly distinguished by eyes, wherein the small parts are large in area and are used by equipment in the traditional industry; the production process has no external force impact, no deformation and good flatness; the production period is short, the strain is fast, and the design and the manufacture of a die are not needed; the product has no burr and no bulge, and both surfaces of the product are as smooth and as flat; processing a metal material product with a plane concave-convex shape according to the figure red, such as: text, numbers and complex patterns; various precision through-hole parts with arbitrary shapes are manufactured. Based on this, this technical scheme adopts the etching mode to form the circuit route, need not to prepare the mould to different circuit routes, when saving the cost, has guaranteed accuracy and production efficiency.
In the preferred embodiment of the present invention, in step S2, as shown in fig. 2, a wire groove 11 is etched on the upper surface of the magnetic core base 1 to form a circuit path.
Specifically, in this embodiment, fig. 2 only shows a partial wiring manner of the wire chase 1, and is not limited thereto.
In the preferred embodiment of the present invention, in step S3, an automatic implanter is used to implant the copper wire into the wire slot 11.
In the preferred embodiment of the present invention, during the process of implanting the copper wire, the implanting head of the automatic implanter heats the copper wire in a pulse heating manner, so that the copper wire is adhered in the wire slot 11.
In the preferred embodiment of the present invention, in step S3, the copper wire is a flat copper wire.
Specifically, in this embodiment, because the wire casing 11 that etches out is the rectangle, the copper line adopts flat copper line can further increase its and the wire casing 11 between area of contact, and then makes the copper line more easily and firmly bond in wire casing 11.
In the preferred embodiment of the present invention, as shown in fig. 3, the circuit path 2 includes a first path 21 and a second path 22, a first start end 211 surrounds in a zigzag manner and extends from a first lead-out end 212 to the edge of the core holder body 1 to form the first path 21, and a second start end 221 extends from a second lead-out end 222 to the edge of the core holder body 1 to form the second path 22 after passing through the first start end 211 as a start point and extending through the first path 21 surrounded in a zigzag manner.
In a preferred embodiment of the present invention, in step S1, the magnetic core base is prepared by a baking process after die casting.
The invention also provides an etched circuit ultra-small integrally-formed inductor, which is prepared by the preparation method, and as shown in fig. 3, the etched circuit ultra-small integrally-formed inductor comprises the following components:
the magnetic core seat body 1 is provided with a circuit path 2 etched on the magnetic core seat body 1, and a copper wire is implanted in the circuit path 2.
Specifically, in this embodiment, as shown in fig. 2, preferably, the cross section of the magnetic core base 1 is rectangular as a whole, and a groove is formed on one side of the rectangle, and two sides of the groove are used as outlets of copper wires. Because this magnetic core pedestal is the magnetic powder hot pressing, its self can regard as the magnetic core of implanting the circuit route that the copper line formed, consequently, need not to prepare in addition the protrusion in the magnetic core of magnetic core pedestal 1, and then the volume of the super little integrated into one piece inductance of etching circuit that makes the preparation obtain is miniaturized as far as possible, greatly improves space utilization when using.
In a preferred embodiment of the present invention, the copper wire is a flat copper wire.
Specifically, in this embodiment, because the wire casing 11 that etches out is the rectangle, the copper line adopts flat copper line can further increase its and the wire casing 11 between area of contact, and then makes the copper line more easily and firmly bond in wire casing 11.
In the preferred embodiment of the present invention, as shown in fig. 3, the circuit path 2 includes a first path 21 and a second path 22, a first start end 211 surrounds in a zigzag manner and extends from a first lead-out end 212 to the edge of the core holder body 1 to form the first path 21, and a second start end 221 extends from a second lead-out end 222 to the edge of the core holder body 1 to form the second path 22 after passing through the first start end 211 as a start point and extending through the first path 21 surrounded in a zigzag manner.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A preparation method of an ultra-small integrally-formed inductor of an etched circuit is characterized by comprising the following steps:
step S1, preparing a magnetic core seat body;
step S2, etching a circuit path on the upper surface of the magnetic core base;
step S3, implanting a copper wire on the upper surface of the magnetic core base along the circuit path;
step S4, coating magnetic powder on the upper surface of the magnetic core base body and hot-pressing;
and step S5, performing roll spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.
2. The method as claimed in claim 1, wherein in step S2, a slot is etched on an upper surface of the core housing to form the circuit path.
3. The method as claimed in claim 2, wherein in step S3, an automatic implanter is used to implant the copper wire into the wire slot.
4. The method for preparing the copper wire, according to claim 3, wherein during the process of implanting the copper wire, an implanting head of the automatic implanter heats the copper wire in a pulse heating mode, so that the copper wire is bonded in the wire slot.
5. The production method according to claim 3 or 4, wherein in the step S3, the copper wire is a flat copper wire.
6. The method of claim 1, wherein the circuit path includes a first path and a second path, a first start end of the first path is formed by extending from a first end to an edge of the core housing after looping back in a zigzag manner, and a second start end of the second path is formed by extending from a second end to an edge of the core housing after passing straight through the first path that loops back in a zigzag manner with the first start end as a starting point.
7. The method as claimed in claim 1, wherein in step S1, step S1, the magnetic core housing is prepared by a baking process after die casting.
8. An etched line ultra-small integrated inductor, which is prepared by the preparation method according to any one of claims 1 to 7, and comprises:
the magnetic core seat body is etched with a circuit path, and a copper wire is implanted in the circuit path.
9. The etched line ultra-small integrated inductor according to claim 8, wherein the copper wire is a flat copper wire.
10. The ultra-small integrated inductor as claimed in claim 8, wherein the circuit path includes a first path and a second path, a first start end is surrounded in a zigzag shape and then extends from a first terminal to an edge of the core housing to form the first path, and a second start end is formed by directly passing through the first path surrounded in a zigzag shape with the first start end as a starting point and then extending from a second terminal to an edge of the core housing to form the second path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111166499.XA CN113889323A (en) | 2021-09-30 | 2021-09-30 | Preparation method of etched circuit ultra-small integrally-formed inductor and inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111166499.XA CN113889323A (en) | 2021-09-30 | 2021-09-30 | Preparation method of etched circuit ultra-small integrally-formed inductor and inductor |
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| Publication Number | Publication Date |
|---|---|
| CN113889323A true CN113889323A (en) | 2022-01-04 |
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|---|---|---|---|
| CN202111166499.XA Pending CN113889323A (en) | 2021-09-30 | 2021-09-30 | Preparation method of etched circuit ultra-small integrally-formed inductor and inductor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547563A (en) * | 1991-08-09 | 1993-02-26 | Tokin Corp | Inductor and manufacture thereof |
| JP2012238736A (en) * | 2011-05-12 | 2012-12-06 | Sumitomo Electric Ind Ltd | Manufacturing method of powder magnetic core, core component and coil component |
| CN110718386A (en) * | 2019-10-21 | 2020-01-21 | 通友智能装备(江苏)有限公司 | Manufacturing process of integrally formed inductor |
| CN112164570A (en) * | 2020-10-19 | 2021-01-01 | 湖南创一电子科技股份有限公司 | Preparation method of metal magnetic powder core integrated chip inductor |
| CN112655060A (en) * | 2020-11-17 | 2021-04-13 | 深圳顺络电子股份有限公司 | Integrally formed inductor and manufacturing method thereof |
-
2021
- 2021-09-30 CN CN202111166499.XA patent/CN113889323A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547563A (en) * | 1991-08-09 | 1993-02-26 | Tokin Corp | Inductor and manufacture thereof |
| JP2012238736A (en) * | 2011-05-12 | 2012-12-06 | Sumitomo Electric Ind Ltd | Manufacturing method of powder magnetic core, core component and coil component |
| CN110718386A (en) * | 2019-10-21 | 2020-01-21 | 通友智能装备(江苏)有限公司 | Manufacturing process of integrally formed inductor |
| CN112164570A (en) * | 2020-10-19 | 2021-01-01 | 湖南创一电子科技股份有限公司 | Preparation method of metal magnetic powder core integrated chip inductor |
| CN112655060A (en) * | 2020-11-17 | 2021-04-13 | 深圳顺络电子股份有限公司 | Integrally formed inductor and manufacturing method thereof |
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