CN113861895A - Aldehyde-free adhesive and manufacturing process of fiber board applied to routing door plate - Google Patents
Aldehyde-free adhesive and manufacturing process of fiber board applied to routing door plate Download PDFInfo
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- CN113861895A CN113861895A CN202111092545.6A CN202111092545A CN113861895A CN 113861895 A CN113861895 A CN 113861895A CN 202111092545 A CN202111092545 A CN 202111092545A CN 113861895 A CN113861895 A CN 113861895A
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- aldehyde
- free adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
- C08F218/02—Esters of monocarboxylic acids
- C08F218/04—Vinyl esters
- C08F218/08—Vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J197/00—Adhesives based on lignin-containing materials
- C09J197/005—Lignin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention belongs to the technical field of adhesives, relates to an aldehyde-free adhesive, and particularly relates to an aldehyde-free adhesive which comprises the following components in parts by weight: 10-30 parts of self-made formaldehyde-free adhesive, 205-15 parts of isocyanate and 610-30 parts of calcium lignosulfonate liquid. The invention also discloses a preparation method of the self-made formaldehyde-free adhesive and a manufacturing process of applying the formaldehyde-free adhesive to the fiber board for the routing door plate. The invention adopts the compounded aldehyde-free adhesive and wood chip pretreatment, compared with the existing PMDI aldehyde-free adhesive, the cost is reduced, the hardness of the aldehyde-free adhesive is reduced after curing, and the toughness is improved. The self-made aldehyde-free adhesive is more uniformly mixed and dispersed with wood fibers, the wood fibers can be fully wrapped, the prepared plate is finer and smoother in routing and engraving, burrs are basically not generated, and the water content of the finished plate is improved by 1-2% compared with that of a common aldehyde-free plate. The invention expands the application field of the formaldehyde-free fiberboard.
Description
Technical Field
The invention belongs to the technical field of adhesives, relates to an aldehyde-free adhesive, and particularly relates to an aldehyde-free adhesive and a manufacturing process of a fiberboard applied to a routing door plate.
Background
The fiberboard is a kind of artificial board made of plant fiber as raw material and is made up through slicing, fiber separation, plate blank formation (mixing with resin glue and additive, spreading) and plasticizing cellulose, hemicellulose and lignin under hot pressing. The engraved fiber board is a door board material with more applications such as cabinet doors, indoor doors and the like, and is popular with consumers due to more modeling and deepening. Along with the continuous enhancement of environmental protection consciousness, people pay more and more attention to the requirement of formaldehyde emission amount of indoor household boards, and the industry provides the environment-friendly boards without formaldehyde addition for meeting the requirements of consumers on low formaldehyde and no formaldehyde of household products. The existing formaldehyde-free fiber board mostly adopts non-urea-formaldehyde resin adhesives such as PMDI and the like, the adhesives have strong reactivity and can react with groups (-OH, -NH) containing active hydrogen in wood2COOH, etc.) to form chemical adhesive bonding, and the prepared plate has high adhesive bonding strength and high hardness. Because the adhesive can react with hydroxyl, the water content of the finished board is lower than that of a urea-formaldehyde resin board. The defects that the engraving and milling efficiency is low, the engraving and milling part is hairy, rough and the like easily occur in the engraving and milling process of the aldehyde-free added plates, and the appearance effect and efficiency of engraving and milling are influenced.
In order to solve the problems of hair, roughness, poor routing effect, low routing efficiency and the like of the existing aldehyde-free routing fiberboard, the invention adopts the composite aldehyde-free adhesive to carry out pretreatment technology on the fiber, optimizes the fiber shape, the glue applying method, the plate forming structure and the hot pressing production process, and manufactures the aldehyde-free fiberboard suitable for routing and carving.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the manufacturing method of the density fiberboard for the formaldehyde-free routing door panel, which solves the problem that the routing processing is not matched by the existing formaldehyde-free glue, improves the routing effect and quality of the formaldehyde-free routing plate, and expands the application field of the formaldehyde-free routing plate.
Technical scheme
An aldehyde-free adhesive comprises the following components in parts by weight:
10-30, preferably 25, of the self-made formaldehyde-free adhesive;
isocyanate CW-205 to 15, preferably 10;
and the calcium lignosulfonate liquid is CF-610-30, preferably 20.
The isocyanate CW-20 was purchased from Wanhua chemical (cigarette bench) sales Co., Ltd and the calcium lignosulfonate liquid CF-6 was purchased from Shandong torch chemical technology Co., Ltd.
The preparation method of the self-made formaldehyde-free adhesive comprises the following steps:
(1) adding polyvinyl alcohol (PVA), Sodium Dodecyl Sulfate (SDS), a non-ionic emulsifier (OP-10), sodium bicarbonate, a defoaming agent and water into a reaction kettle, uniformly stirring, heating to 65 ℃, adding a vinyl acetate (VAc) monomer, and finishing feeding in 15-20 min to obtain a pre-emulsion; wherein the mass ratio of PVA to SDS to OP-10 to sodium bicarbonate to defoamer to water is 1-5: 0.01-5: 0.3-5: 0.2-0.3: 50-80, preferably 5:0.19:2.8:2.5:0.25: 50;
(2) placing a pre-emulsion which accounts for 4/5 of the total mass of the pre-emulsion in a reaction kettle, heating to 75 ℃, dropwise adding Methyl Methacrylate (MMA) and Butyl Acrylate (BA), stirring for 30-40 min, and uniformly mixing to obtain a pre-emulsified mixed monomer, wherein the mass ratio of the pre-emulsion to MMA to BA is 55-75: 5-10: 5-12, and preferably 60:6: 6;
(3) adding the rest of the pre-emulsion into a reaction kettle, heating to 65 ℃, adding an initiator sodium persulfate, and after reacting for 50-60 min, heating a mixture system to 78 ℃, wherein the initiator sodium persulfate accounts for 0.4% of the mass of the rest of the pre-emulsion;
(4) the method comprises the following steps of (1) dropwise adding a pre-emulsified mixed monomer at 78-80 ℃, dropwise adding an initiator once every 10min, controlling the reaction time at this stage to be about 3.5h, consuming 1/5 initiator altogether, then heating to 88-90 ℃, adding the rest of the initiator, and keeping the temperature for 25-30 min; and (3) finishing the reaction, cooling to 38-40 ℃, and discharging, wherein the mass ratio of the mixture system, the pre-emulsified mixed monomer and the initiator is 20-40: 75-150: 5-50, and preferably 30:139: 30.
The initiator sodium persulfate provided by the invention is prepared into a 1.6 wt.% sodium persulfate solution when in use.
In a better disclosed example of the invention, the model of the defoaming agent in the step (1) is DF-2854, Defeng defoaming agent Co., Ltd.
The formaldehyde-free adhesive prepared by the method has the pH value of 4-5, the viscosity of 800-1000 mPa.s, the solid content of 48-50% and the water absorption of 8-12%.
The second purpose of the invention is to disclose the application of the aldehyde-free adhesive in the manufacture of the fiberboard for the aldehyde-free milled door panel.
The specific manufacturing process flow is as follows: wood peeling → chipping → screening → washing → precooking → cooking → defibering, and simultaneously adding a waterproof agent → applying an aldehyde-free adhesive → drying and sorting → paving and forming → prepressing → hot pressing → cooling → sanding → inspection and sorting → packaging and warehousing.
Wherein in the cooking procedure, the pre-cooking temperature is 90 ℃ and the time is about 4 min; adding sodium sulfite under the condition that the cooking pressure is 8-9 bar, wherein the addition amount of the sodium sulfite accounts for 0.5-1% of the oven-dried wood chips, and the cooking time is about 4 min;
in the hot grinding process, the application amount of the waterproof agent is 0.5-1% of the absolute dry fiber, and the addition mass is 6-12 kg/m3；
In the glue mixing and applying process, the addition amount of the compounded aldehyde-free adhesive is 35-60 kg/m3And the temperature is 30-35 ℃ when the coating is applied.
The paving procedure adopts mechanical paving, and the paving pressure is 7.6-7.8 kg/m2；
In the hot pressing procedure, the distance between 0 frame and the frame is controlled to be 15-40 mm; the hot pressing temperature is set at 230-180 ℃, the hot pressing temperature of the first area is increased to 225-230 ℃, the hot pressing pressure is 0-3 MPa, the hot pressing factor is 7.5-8.5 s/mm, the pressure of the first area is reduced to 2.0-2.5 MPa, and the pressure of the third area is reduced to 0.1-0.3 MPa.
The waterproof agent comprises paraffin and an emulsifier GR-200F, wherein the paraffin is 56# semi-refined Kunlun brand and is purchased from China oil and gas Co.Ltd; the emulsifier GR-200F was purchased from Shanghai Gelea Ninghua engineering Co., Ltd.
Its service property and service environment are considered to the no aldehyde routing door plant, and no aldehyde, dampproofing, routing effect, routing processing adaptability are the key, compare with ordinary density board, and its characteristics lie in: 1. finer fiber morphology; 2. the uniformity of the fibers wrapped by the formaldehyde-free adhesive is improved; 3. better moisture resistance and dimensional stability; 4. higher structural distribution of the section of the plate; 5. reduce the hardness of panel, promote panel pliability.
The key points of the invention are as follows: the method comprises the steps of self-making an aldehyde-free adhesive, obtaining a fiber board with good flexibility by a wood chip pretreatment technology and a hot grinding technology, adding a waterproof agent, applying the aldehyde-free adhesive, and obtaining the structural distribution of the board suitable for routing by a proper paving technology, hot pressing pressure and temperature.
The thickness of the formaldehyde-free routing door plate is 6-9 mm generally, the technical index of the door plate meets the following indexes except that the national density fiberboard GB/T11718-2009:
advantageous effects
The invention adopts the compounded aldehyde-free adhesive and wood chip pretreatment, compared with the existing PMDI aldehyde-free adhesive, the cost is reduced, the hardness of the aldehyde-free adhesive is reduced after curing, and the toughness is improved. The self-made aldehyde-free adhesive is more uniformly mixed and dispersed with wood fibers, the wood fibers can be fully wrapped, the prepared plate is finer, smoother and smoother in routing and engraving, no burr is generated basically, and the water content of the finished plate is improved by 1-2% compared with that of a common aldehyde-free plate. The invention expands the application field of the formaldehyde-free fiberboard.
Detailed Description
The present invention will be described in detail below with reference to examples to enable those skilled in the art to better understand the present invention, but the present invention is not limited to the following examples.
Examples
7.8mm does not have aldehyde routing fibreboard manufacturing process for door plant:
1. preparation of water repellent
4000kg of paraffin, 280kg of emulsifier and 2000kg of first water are sequentially added into a reaction kettle, heating is started, and stirring is started after the paraffin is partially melted. Slowly adding a sodium hydroxide aqueous solution with the mass concentration of 30% and the mass of the sodium hydroxide aqueous solution being 0.1-0.3% of that of the paraffin, heating to 95-100 ℃, and reacting for 30-40 min; adding 3720kg of secondary water, keeping the temperature at 70-80 ℃, stirring for 20-25 min, cooling, and cooling to about 40 ℃.
2. Preparation of self-made formaldehyde-free adhesive
(1) Preparing pre-emulsion, namely uniformly stirring a polyvinyl alcohol (PVA) solution (100kg), sodium dodecyl sulfate (0.38 kg)/non-ionic emulsifier (SDS/OP-10) (5.62kg), sodium bicarbonate (5kg) and a proper amount of defoamer (0.5 kg); heating to 65 deg.C, adding VAc monomer (34.5kg), and finishing feeding in 20min to obtain pre-emulsion;
(2) preparation of pre-emulsified mixed monomer: putting 116kg of pre-emulsion into a reaction kettle, heating to 75 ℃, dropwise adding a mixed monomer of methyl methacrylate MMA (11.5kg) and Butyl Acrylate (BA) (11.5kg) for pre-emulsification reaction, keeping the temperature at 75 ℃, and reacting for about 30 min;
(3) adding the rest 29kg of pre-emulsion as a bottom material into a reaction kettle, and starting a stirrer and condensing water; adding an initiator sodium persulfate (7.5kg1.6 wt.%) solution when the temperature rises to 65 ℃, reacting for 60min, and then heating to 78 ℃;
(4) dropwise adding pre-emulsified mixed monomer (139kg) (prepared in the step 2), controlling the temperature at 80 ℃, dropwise adding initiator once every 10min to consume 7.5kg (1.6 wt.%) of sodium persulfate, controlling the reaction time at this stage at about 3.5 hours, and heating to 88-90 ℃; adding 22.7kg (1.6 wt.%) of initiator sodium persulfate, and keeping the temperature for 30 min; and (5) finishing the reaction, cooling to 38 ℃, and discharging.
3. Compound adhesive
Fully and uniformly mixing the self-made formaldehyde-free adhesive, the isocyanate CW-20 and the calcium lignosulfonate liquid CF-6 in proportion, adding the mixture into an intermediate tank, keeping the temperature at 30-35 ℃, adding the compound adhesive to the surface of the fiber through a spray gun at a fiber drying inlet, drying and sorting the mixture, and paving the mixture.
4. The plate making process comprises the following steps: after the adhesive is manufactured, according to the process flow of a common high-density board, wood with different proportions is peeled, then is cut into wood chips with the length of 15-20 mm, the length of 15-20 mm and the thickness of 2-3 mm, the size requirements of the wood chips are ensured through screening treatment, and then the wood chips are washed with water to remove impurities such as silt and the like, so that the cleanness of the wood chips is ensured. Sodium sulfite solution (concentration 30%) was added to the digester in an amount of 0.5% of oven dried chips. The cooking pressure is 8.5bar, and the cooking time is 4 min. The wood chips enter the mill through a belt screw, and a water-proofing agent is added into the mill, wherein the application amount of the water-proofing agent is about 9kg/m3And the grinding disc clearance is within the range of 0-4 mm. Applying a compound formaldehyde-free adhesive at the inlet of the drying pipeline, wherein the adhesive application amount is 55kg/m3And drying and screening the mixture by a drying system, and then paving and forming the mixture. Adjusting the density and the density distribution uniformity of mechanical pavement, wherein the pavement weight is 7.7kg/m2The density of the plate blank is 820kg/m3. In the hot pressing process, the distance between the 0 frame of the starting and pressing section is properly increased by 12mm, the starting and pressing temperature of the first area is reduced by 5 ℃, the hot pressing temperature is 225-180 ℃, and the speed of the press is 580-600 mm/s. And (3) cooling and tempering the base material discharged from the pressing machine for 48 hours by a turning plate, sanding and warehousing.
The prepared 7.8mm formaldehyde-free routing density plate is detected according to the GB/T11718-:
the above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (9)
1. An aldehyde-free adhesive comprises, by mass, 10-30 parts of a self-made formaldehyde-free adhesive, 205-15 parts of isocyanate and 610-30 parts of calcium lignosulfonate liquid; the method is characterized in that:
the preparation method of the self-made formaldehyde-free adhesive comprises the following steps:
(1) adding polyvinyl alcohol (PVA), Sodium Dodecyl Sulfate (SDS), a non-ionic emulsifier (OP-10), sodium bicarbonate, a defoaming agent and water into a reaction kettle, uniformly stirring, heating to 65 ℃, adding a vinyl acetate (VAc) monomer, and finishing feeding in 15-20 min to obtain a pre-emulsion; wherein the mass ratio of PVA to SDS to OP-10 to sodium bicarbonate to defoamer to water is 1-5: 0.01-5: 0.3-5: 0.2-0.3: 50-80;
(2) placing a pre-emulsion which accounts for 4/5 of the total mass of the pre-emulsion in a reaction kettle, heating to 75 ℃, dropwise adding Methyl Methacrylate (MMA) and Butyl Acrylate (BA), stirring for 30-40 min, and uniformly mixing to obtain a pre-emulsified mixed monomer, wherein the mass ratio of the pre-emulsion to MMA to BA is 55-75: 5-10: 5-12;
(3) adding the rest of the pre-emulsion into a reaction kettle, heating to 65 ℃, adding an initiator sodium persulfate, and after reacting for 50-60 min, heating a mixture system to 78 ℃, wherein the initiator sodium persulfate accounts for 0.4% of the mass of the rest of the pre-emulsion;
(4) the method comprises the following steps of (1) dropwise adding a pre-emulsified mixed monomer at 78-80 ℃, dropwise adding an initiator once every 10min, controlling the reaction time at this stage to be about 3.5h, consuming 1/5 initiator altogether, then heating to 88-90 ℃, adding the rest of the initiator, and keeping the temperature for 25-30 min; and (3) finishing the reaction, cooling to 38-40 ℃, and discharging, wherein the mass ratio of the mixture system, the pre-emulsified mixed monomer and the initiator is 20-40: 75-150: 5-50.
2. The aldehyde-free adhesive of claim 1, wherein: 25 parts of the self-made formaldehyde-free adhesive.
3. The aldehyde-free adhesive of claim 1, wherein: CW-2010 parts of the isocyanate.
4. The aldehyde-free adhesive of claim 1, wherein: and CF-620 parts of the calcium lignosulfonate liquid.
5. The aldehyde-free adhesive of claim 1, wherein: the mass ratio of PVA to SDS to OP-10 to sodium bicarbonate to defoamer to water in the step (1) is 5:0.19:2.8:2.5:0.25: 50.
6. The aldehyde-free adhesive of claim 1, wherein: the mass ratio of the pre-emulsion in the step (2) to MMA to BA is 60:6: 6.
7. The aldehyde-free adhesive of claim 1, wherein: the mass ratio of the pre-emulsified mixed monomer to the initiator in the mixture system in the step (4) is 30:139: 30.
8. The aldehyde-free adhesive of claim 1, wherein: the initiator, sodium persulfate, was used as prepared as a 1.6 wt.% solution of sodium persulfate.
9. Use of the aldehyde-free adhesive according to any one of claims 1 to 8, wherein: the method is applied to the manufacture of the fiberboard for the formaldehyde-free routing door plate.
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| CN202111092545.6A CN113861895A (en) | 2021-09-17 | 2021-09-17 | Aldehyde-free adhesive and manufacturing process of fiber board applied to routing door plate |
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| CN202111092545.6A CN113861895A (en) | 2021-09-17 | 2021-09-17 | Aldehyde-free adhesive and manufacturing process of fiber board applied to routing door plate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712484A (en) * | 2004-06-24 | 2005-12-28 | 湖南省浏阳市三星化工实业有限公司 | Binder for production of non-formaldehyde artificial boards |
| CN106433519A (en) * | 2016-09-20 | 2017-02-22 | 中国科学院理化技术研究所 | Single-component non-formaldehyde adhesive for particle boards and application of adhesive |
| CN108641639A (en) * | 2018-05-31 | 2018-10-12 | 江西省林业科学院 | The preparation method of isocyanate-water polymer complex emulsions based Wood Adhesives |
| US20200239750A1 (en) * | 2018-09-14 | 2020-07-30 | Jiangnan University | Thermosetting Starch Adhesive For Wood-based Panel and Preparation Method Therefor |
-
2021
- 2021-09-17 CN CN202111092545.6A patent/CN113861895A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712484A (en) * | 2004-06-24 | 2005-12-28 | 湖南省浏阳市三星化工实业有限公司 | Binder for production of non-formaldehyde artificial boards |
| CN106433519A (en) * | 2016-09-20 | 2017-02-22 | 中国科学院理化技术研究所 | Single-component non-formaldehyde adhesive for particle boards and application of adhesive |
| CN108641639A (en) * | 2018-05-31 | 2018-10-12 | 江西省林业科学院 | The preparation method of isocyanate-water polymer complex emulsions based Wood Adhesives |
| US20200239750A1 (en) * | 2018-09-14 | 2020-07-30 | Jiangnan University | Thermosetting Starch Adhesive For Wood-based Panel and Preparation Method Therefor |
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