CN110862774B - Modified inorganic adhesive, preparation method and application in production of wood-based panel - Google Patents

Modified inorganic adhesive, preparation method and application in production of wood-based panel Download PDF

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CN110862774B
CN110862774B CN201911243891.2A CN201911243891A CN110862774B CN 110862774 B CN110862774 B CN 110862774B CN 201911243891 A CN201911243891 A CN 201911243891A CN 110862774 B CN110862774 B CN 110862774B
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inorganic adhesive
modified
modified inorganic
formaldehyde resin
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CN110862774A (en
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庞黎禹
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Chengdu Original Wood Based Panel Science And Technology Co ltd
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Chengdu Original Wood Based Panel Science And Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/20—Moulding or pressing characterised by using platen-presses
    • B27N3/203—Moulding or pressing characterised by using platen-presses with heating or cooling means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives

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  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a modified inorganic adhesive, a preparation method and application thereof in wood-based panel production, belonging to the technical field of adhesives, wherein the modified inorganic adhesive is prepared from the following components: modified melamine formaldehyde resin, sodium silicate or potassium silicate, fluosilicate and/or borate and auxiliary materials; wherein the auxiliary material is one or a mixture of more of magnesium oxide, calcium oxide and zinc oxide; the modified inorganic adhesive adopts inorganic sodium silicate or potassium silicate as a main raw material, and is added with modified melamine formaldehyde resin, fluorosilicate and/or borate and auxiliary materials, so that the modified inorganic adhesive has the excellent characteristics of water resistance, moisture resistance, high bonding strength, easiness in hot-pressing production of artificial boards, no toxicity, no pollution, environmental protection, safety and the like; the modified inorganic adhesive can completely replace urea-formaldehyde resin, so that the aim of no formaldehyde release is fulfilled.

Description

Modified inorganic adhesive, preparation method and application in production of wood-based panel
Modified inorganic adhesive, preparation method and application in production of wood-based panel
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a modified inorganic adhesive, a preparation method of the modified inorganic adhesive, and application of the modified inorganic adhesive in production of wood-based panels.
Background
Adhesive (adhesive): natural or synthetic, organic or inorganic substances, which are called adhesives, also called adhesives, and are customarily called adhesives for short, and can connect two or more workpieces or materials together through the actions of interface adhesion, cohesion and the like; most of adhesives used in the existing wood-based panels are urea-formaldehyde resins, and although the adhesives are low in price, the release of formaldehyde is slow, so that the adhesives can last for a long time, and the health of human bodies is affected.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a modified inorganic adhesive.
The technical scheme adopted by the invention is as follows: the modified inorganic adhesive is prepared from the following components: modified melamine formaldehyde resin, sodium silicate or potassium silicate, fluosilicate and/or borate and auxiliary materials;
wherein the auxiliary material is one or a mixture of more of magnesium oxide, calcium oxide and zinc oxide.
The invention has the beneficial effects that: the modified inorganic adhesive adopts inorganic sodium silicate or potassium silicate as a main raw material, and is added with modified melamine formaldehyde resin, fluorosilicate and/or borate and auxiliary materials, so that the modified inorganic adhesive has the excellent characteristics of water resistance, moisture resistance, high bonding strength, easiness in hot-pressing production of artificial boards, no toxicity, no pollution, environmental protection, safety and the like; the modified melamine formaldehyde resin is obtained by modifying silicate and removing formaldehyde by sodium thiosulfate, so that the aim of no formaldehyde release can be achieved.
Further limited, the modified inorganic adhesive is prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 1-5 parts of borate and 2-3 parts of magnesium oxide.
Further limited, the modified inorganic adhesive is prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 1-5 parts of borate and 1-5 parts of zinc oxide.
Further limited, the modified inorganic adhesive is prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 2-3 parts of magnesium oxide and 2-3 parts of zinc oxide.
Further limited, the modified inorganic adhesive is prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-10 parts of fluosilicate, 2-3 parts of magnesium oxide, 0.7-1.3 parts of calcium oxide and 1-10 parts of borate.
Further limited, the modified inorganic adhesive is prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-3 parts of fluosilicate, 2-5 parts of zinc oxide, 0.7-1.3 parts of magnesium oxide and 1-3 parts of calcium oxide.
The invention also provides a preparation method of the modified inorganic adhesive, which comprises the following steps:
preparation of modified Melamine Formaldehyde resin
Adjusting the pH value of formaldehyde to 7.5-8.5 by using a sodium silicate solution, heating to 60-92 ℃, adding melamine for the first time, wherein the molar ratio of formaldehyde to melamine is 1: (2.5-3.0), and the reaction time is 2-20 minutes; subsequently, a second addition of melamine was carried out, the molar ratio of formaldehyde to melamine being 1: (1.2-2.2) adding urea when the glue solution becomes clear, wherein the molar ratio of the total amount of urea and melamine to formaldehyde is 0.98:1, cooling to 60-70 ℃, adding sodium thiosulfate, and continuously adding 2-3 parts by mass of sodium thiosulfate when the content of free formaldehyde is zero to obtain the modified melamine-formaldehyde resin;
the modified melamine formaldehyde resin is uniformly mixed with sodium silicate or potassium silicate, and then fluosilicate and/or borate and auxiliary materials are added and uniformly stirred.
The invention has the beneficial effects that: the preparation method is simple, the prepared modified inorganic adhesive is high in bonding strength and easy for artificial board hot-pressing production, and the raw materials and the preparation method of the modified inorganic adhesive are simple and low in price, so that the modified inorganic adhesive is beneficial to market popularization and use.
The invention also provides application of the modified inorganic adhesive in the production of wood-based panels.
Further, the preparation method of the artificial board comprises the following steps:
drying the flakeboard crushed aggregates or the multilayer plywood to enable the water content to be within the range of 5-20%, and obtaining a pretreatment raw material; adding a modified inorganic adhesive into the pretreated raw materials, and then sequentially carrying out the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 110-220 ℃;
wherein: when the raw material is flakeboard particles, the addition amount of the modified inorganic adhesive is 120-130 kg/m3When the raw material is multilayer plywood, the addition amount of the modified inorganic adhesive is 2.5-3.0 kg/m2。
Further, the preparation method of the artificial board comprises the following steps:
adding a modified inorganic adhesive into the wood fiber, then drying, stopping drying when the water content is within the range of 5-20%, and then sequentially carrying out the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 110-220 ℃;
wherein: the adding amount of the modified inorganic adhesive is 130-220 kg/m3。
The invention has the beneficial effects that: when the water content of the flakeboard crushed aggregates, the multilayer plywood and the wood fibers is controlled within the range of 5-20%, the bonding effect is good; when the water content is lower than 5%, the pre-pressed plate blank is not formed, and the pre-pressed plate blank is cured in advance due to water shortage of the adhesive during hot pressing, so that the hot pressing is difficult to perform; when the moisture content is higher than 20%, the plate blank is stuck to the pressing plate when the moisture content of the plate blank is too high during hot pressing or the plate is exploded due to too high moisture content.
The hot pressing temperature is controlled within the range of 110-220 ℃, the hot pressing temperature lower than 110 ℃ can increase the hot pressing time, cause low energy and low yield and lose the production value, and the hot pressing temperature higher than 220 ℃ can turn the product plate yellow or thicken the pre-cured layer.
The performance of the obtained artificial board meets the requirements of GB17657-2013 physicochemical property test method for artificial boards and decorative artificial boards.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Example 1
A preparation method of a modified inorganic adhesive comprises the following steps:
s1: preparation of modified Melamine Formaldehyde resin
Weighing formaldehyde, pouring the formaldehyde into a reaction kettle, adding a sodium silicate solution to adjust the pH value of the formaldehyde within the range of 7.5-8.5, heating to about 60 ℃, wherein the heating rate is 3-8 ℃, and then adding melamine into the formaldehyde, wherein the molar ratio of the formaldehyde to the melamine is 1: 2.5 for 2 minutes, followed by the addition of melamine again, the molar ratio of formaldehyde to melamine being 1: 1.2, adding urea when the glue solution becomes clear, wherein the molar ratio of the total amount of urea and melamine to formaldehyde is 0.98: 1; cooling to about 60 ℃, adding sodium thiosulfate, and continuing to add 2kg of sodium thiosulfate when the content of free formaldehyde is zero to obtain modified melamine-formaldehyde resin;
s2: 5kg of prepared modified melamine formaldehyde resin, 90kg of sodium silicate, 1kg of fluosilicate, 1kg of borate and 2kg of magnesium oxide are taken;
s3: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the fluosilicate, the borate and the magnesium oxide are added and uniformly stirred.
The embodiment also provides an application of the modified inorganic adhesive in the production of the artificial board, wherein the raw material of the wood artificial board is one of particle board, multilayer plywood or wood fiber;
when the raw material of the wood-based panel is flakeboard particles, firstly drying the flakeboard particles, stopping drying when the water content is within the range of 5-20%, and then adding the modified inorganic adhesive into the flakeboard particles, wherein the adding amount of the modified inorganic adhesive is 120kg/m3Uniformly stirring, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 110 ℃.
When the raw materials of the wood-based panel are moreWhen the plywood is laminated, firstly, drying the multi-layer plywood, stopping drying when the water content is within the range of 5-20%, and then adding a modified inorganic adhesive between the adjacent multi-layer plywood, wherein the adding amount of the modified inorganic adhesive is 2.5kg/m2Then, sequentially carrying out the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 110 ℃.
When the raw material of the wood-based panel is wood fiber, firstly adding modified inorganic adhesive, wherein the adding amount of the modified inorganic adhesive is 160kg/m3Uniformly mixing, drying, stopping drying when the water content is within the range of 5-20%, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 110 ℃.
Example 2
A preparation method of a modified inorganic adhesive comprises the following steps:
s1: preparation of modified Melamine Formaldehyde resin
Weighing formaldehyde, pouring the formaldehyde into a reaction kettle, adding a sodium silicate solution to adjust the pH value of the formaldehyde within the range of 7.5-8.5, heating to about 80 ℃, wherein the heating rate is 3-8 ℃, and then adding melamine into the formaldehyde, wherein the molar ratio of the formaldehyde to the melamine is 1: 2.8 for 10 minutes, followed by the addition of melamine again, the molar ratio of formaldehyde to melamine being 1: 1.7, adding urea when the glue solution becomes clear, wherein the molar ratio of the total amount of urea and melamine to formaldehyde is 0.98: 1; cooling to about 65 ℃, adding sodium thiosulfate, and continuing to add 2.5kg of sodium thiosulfate when the content of free formaldehyde is zero to obtain modified melamine-formaldehyde resin;
s2: 5kg of prepared modified melamine formaldehyde resin, 93kg of sodium silicate, 3kg of fluosilicate, 3kg of borate and 2.5kg of magnesium oxide are taken;
s3: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the fluosilicate, the borate and the magnesium oxide are added and uniformly stirred.
The embodiment also provides an application of the modified inorganic adhesive in the production of the artificial board, wherein the raw material of the wood artificial board is one of particle board, multilayer plywood or wood fiber;
when the raw material of the wood-based panel is flakeboard particles, firstly drying the flakeboard particles, stopping drying when the water content is within the range of 5-20%, and then adding the modified inorganic adhesive into the flakeboard particles, wherein the adding amount of the modified inorganic adhesive is 125kg/m3Uniformly stirring, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 150 ℃.
When the raw materials of the wood-based panel are multilayer plywood, firstly drying the multilayer plywood, stopping drying when the water content is within the range of 5-20%, and then adding a modified inorganic adhesive between the adjacent multilayer plywood, wherein the adding amount of the modified inorganic adhesive is 2.8kg/m2Then, sequentially carrying out the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 160 ℃.
When the raw material of the wood-based panel is wood fiber, firstly adding the modified inorganic adhesive into the wood-based panel, wherein the adding amount of the modified inorganic adhesive is 180kg/m3Uniformly mixing, drying, stopping drying when the water content is within the range of 5-20%, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 176 ℃.
Example 3
A preparation method of a modified inorganic adhesive comprises the following steps:
s1: preparation of modified Melamine Formaldehyde resin
Weighing formaldehyde, pouring the formaldehyde into a reaction kettle, adding a sodium silicate solution to adjust the pH value of the formaldehyde within the range of 7.5-8.5, heating to about 92 ℃, wherein the heating rate is 3-8 ℃, and then adding melamine into the formaldehyde, wherein the molar ratio of the formaldehyde to the melamine is 1: 3.0, reaction time 20 minutes, followed by addition of melamine again, with a formaldehyde to melamine molar ratio of 1: 2.2, adding urea when the glue solution becomes clear, wherein the molar ratio of the total amount of the urea and the melamine to the formaldehyde is 0.98: 1; cooling to about 70 ℃, adding sodium thiosulfate, and continuing to add 3kg of sodium thiosulfate when the content of free formaldehyde is zero to obtain modified melamine-formaldehyde resin;
s2: taking 10kg of prepared modified melamine formaldehyde resin, 95kg of sodium silicate, 5kg of fluosilicate, 5kg of borate and 3kg of magnesium oxide;
s3: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the fluosilicate, the borate and the magnesium oxide are added and uniformly stirred.
The embodiment also provides an application of the modified inorganic adhesive in the production of the artificial board, wherein the raw material of the wood artificial board is one of particle board, multilayer plywood or wood fiber;
when the raw material of the wood artificial board is flakeboard crushed aggregates, firstly drying the flakeboard crushed aggregates, stopping drying when the water content is within the range of 5-20%, and then adding the modified inorganic adhesive into the flakeboard crushed aggregates, wherein the adding amount of the modified inorganic adhesive is 130kg/m3Uniformly stirring, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 220 ℃.
When the raw materials of the wood-based panel are multilayer plywood, firstly drying the multilayer plywood, stopping drying when the water content is within the range of 5-20%, and then adding a modified inorganic adhesive between the adjacent multilayer plywood, wherein the adding amount of the modified inorganic adhesive is 3.0kg/m2Then, sequentially carrying out the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 220 ℃.
When the raw material of the wood-based panel is wood fiber, firstly adding the modified inorganic adhesive into the wood-based panel, wherein the adding amount of the modified inorganic adhesive is 220kg/m3Uniformly mixing, drying, stopping drying when the water content is within the range of 5-20%, and then sequentially performing the working procedures of prepressing, hot pressing and semi-finished product treatment; wherein the hot pressing temperature is 220 ℃.
Example 4
Different from the embodiment 3, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate, 5kg of fluosilicate and 3kg of magnesium oxide;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the fluosilicate and the magnesium oxide are added and uniformly stirred.
Example 5
Different from the embodiment 3, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate, 5kg of borate and 3kg of magnesium oxide;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the borate and the magnesium oxide are added and uniformly stirred.
Example 6
Different from the example 1, the modified inorganic adhesive is prepared from the following raw materials: 5kg of modified melamine formaldehyde resin, 90kg of sodium silicate, 1kg of fluosilicate, 1kg of borate and 1kg of zinc oxide;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine-formaldehyde resin and the sodium silicate are uniformly mixed, and then the fluosilicate, the borate and the zinc oxide are added and uniformly stirred.
Example 7
Different from the embodiment 6, the modified inorganic adhesive is prepared from the following raw materials: 8kg of modified melamine formaldehyde resin, 94kg of sodium silicate, 3kg of fluosilicate, 4kg of borate and 3kg of zinc oxide.
Example 8
Different from the embodiment 6, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate, 5kg of fluosilicate, 5kg of borate and 5kg of zinc oxide.
Example 9
Different from the example 1, the modified inorganic adhesive is prepared from the following raw materials: 5kg of modified melamine formaldehyde resin, 90kg of sodium silicate or 90kg of potassium silicate, 1kg of fluosilicate, 2kg of magnesium oxide and 2kg of zinc oxide;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine formaldehyde resin and potassium silicate or sodium silicate are uniformly mixed, and then fluosilicate, magnesium oxide and zinc oxide are added and uniformly stirred.
Example 10
Different from the embodiment 9, the modified inorganic adhesive is prepared from the following raw materials: 8kg of modified melamine formaldehyde resin, 94kg of sodium silicate or 93kg of potassium silicate, 3kg of fluosilicate, 2.5kg of magnesium oxide and 2.5kg of zinc oxide.
Example 11
Different from the embodiment 9, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate or 95kg of potassium silicate, 5kg of fluosilicate, 3kg of magnesium oxide and 3kg of zinc oxide.
Example 12
Different from the example 1, the modified inorganic adhesive is prepared from the following raw materials: 5kg of modified melamine formaldehyde resin, 90kg of sodium silicate or 90kg of potassium silicate, 1kg of fluosilicate, 2kg of magnesium oxide, 0.7kg of calcium oxide and 1kg of borate;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine formaldehyde resin and potassium silicate or sodium silicate are uniformly mixed, and then fluosilicate, borate, magnesium oxide and calcium oxide are added and uniformly stirred.
Example 13
Different from the embodiment 12, the modified inorganic adhesive is prepared from the following raw materials: 8kg of modified melamine formaldehyde resin, 93kg of sodium silicate or 94kg of potassium silicate, 8kg of fluosilicate, 2.5kg of magnesium oxide, 1.0kg of calcium oxide and 8kg of borate.
Example 14
Different from the embodiment 12, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate or 95kg of potassium silicate, 10kg of fluosilicate, 3kg of magnesium oxide, 1.3kg of calcium oxide and 10kg of borate.
Example 15
Different from the example 1, the modified inorganic adhesive is prepared from the following raw materials: 5kg of modified melamine formaldehyde resin, 90kg of sodium silicate or 90kg of potassium silicate, 1kg of fluosilicate, 2kg of zinc oxide, 0.7kg of magnesium oxide and 1kg of calcium oxide;
in the preparation method of the modified inorganic adhesive, the step S3 is as follows: the modified melamine formaldehyde resin and potassium silicate or sodium silicate are uniformly mixed, and then fluosilicate, zinc oxide, magnesium oxide and calcium oxide are added and uniformly stirred.
Example 16
Different from the embodiment 15, the modified inorganic adhesive is prepared from the following raw materials: 8kg of modified melamine formaldehyde resin, 93kg of sodium silicate or 94kg of potassium silicate, 2kg of fluosilicate, 3kg of zinc oxide, 1.0kg of magnesium oxide and 2kg of calcium oxide.
Example 17
Different from the embodiment 15, the modified inorganic adhesive is prepared from the following raw materials: 10kg of modified melamine formaldehyde resin, 95kg of sodium silicate or 95kg of potassium silicate, 3kg of fluosilicate, 5kg of zinc oxide, 1.3kg of magnesium oxide and 3kg of calcium oxide.
In Table 1, the results obtained when the modified inorganic adhesives obtained in examples 1 to 17 were used for a particle board, respectively.
TABLE 1
Index examples Sizing amount (kg/m 3) Formaldehyde emission (mg/100 g) Static bending strength (MPa) Internal bond Strength (MPa)
1 120 0 25 0.40
2 125 0 28 0.45
3 130 0 29 0.45
4 130 0 23 0.36
5 130 0 27 0.41
6 120 0 29 0.35
7 120 0 23 0.36
8 120 0 25 0.42
9 120 0 27 0.47
10 120 0 22 0.35
11 120 0 25 0.44
12 120 0 28 0.47
13 120 0 23 0.36
14 120 0 26 0.43
15 120 0 28 0.48
16 120 0 24 0.40
17 120 0 26 0.39
In Table 2, the results of using the modified inorganic adhesives obtained in examples 1 to 17 respectively in medium density fiberboard were obtained.
TABLE 2
Index examples Sizing amount (kg/m 3) Formaldehyde emission (mg/100 g) Static bending strength (MPa) Internal bond Strength (MPa)
1 160 0 23 0.81
2 180 0 24 0.84
3 220 0 25 0.87
4 220 0 24 0.82
5 220 0 26 0.84
6 160 0 24 0.83
7 160 0 23 0.82
8 160 0 21 0.79
9 160 0 27 0.89
10 160 0 26 0.88
11 160 0 25 0.92
12 160 0 29 0.86
13 160 0 25 0.83
14 160 0 24 0.94
15 160 0 23 0.87
16 160 0 26 0.85
17 160 0 27 0.86
In Table 3, the results obtained by using the modified inorganic adhesives obtained in examples 1 to 17, respectively, in a multi-ply plywood were shown.
TABLE 3
Index examples Sizing amount (kg/m 2) Formaldehyde emission (mg/100 g) Static bending strength (MPa) Internal bond Strength (MPa)
1 2.5 0 274 0.95
2 2.8 0 286 0.84
3 3.0 0 293 0.82
4 3.0 0 275 0.93
5 3.0 0 285 1.08
6 2.5 0 277 1.05
7 2.5 0 286 0.96
8 2.5 0 297 0.92
9 2.5 0 284 0.83
10 2.5 0 273 0.94
11 2.5 0 288 0.97
12 2.5 0 279 0.88
13 2.5 0 272 0.99
14 2.5 0 295 0.87
15 2.5 0 286 0.96
16 2.5 0 289 0.91
17 2.5 0 291 0.89
The invention is not limited to the above alternative embodiments, and any other various forms of products can be obtained by anyone in the light of the present invention, but any changes in shape or structure thereof, which fall within the scope of the present invention as defined in the claims, fall within the scope of the present invention.

Claims (10)

1. The modified inorganic adhesive is characterized by being prepared from the following components in parts by weight: 5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-10 parts of fluosilicate and/or 1-10 parts of borate and auxiliary materials; wherein the auxiliary material is one or a mixture of more of magnesium oxide, calcium oxide and zinc oxide;
the modified melamine formaldehyde resin is prepared from the following raw materials by the following method:
adjusting the pH value of formaldehyde to 7.5-8.5 by using a sodium silicate solution, heating to 60-92 ℃, adding melamine for the first time, wherein the molar ratio of formaldehyde to melamine is 1: (2.5-3.0), and the reaction time is 2-20 minutes; subsequently, a second addition of melamine was carried out, the molar ratio of formaldehyde to melamine being 1: (1.2-2.2), adding urea when the glue solution becomes clear, wherein the molar ratio of the total amount of urea and melamine to formaldehyde is 0.98:1, cooling to 60-70 ℃, adding sodium thiosulfate, and continuously adding 2-3 parts by mass of sodium thiosulfate when the content of free formaldehyde is zero to obtain the modified melamine-formaldehyde resin.
2. The modified inorganic adhesive according to claim 1, characterized by being prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 1-5 parts of borate and 2-3 parts of magnesium oxide.
3. The modified inorganic adhesive according to claim 1, characterized by being prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 1-5 parts of borate and 1-5 parts of zinc oxide.
4. The modified inorganic adhesive according to claim 1, characterized by being prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-5 parts of fluosilicate, 2-3 parts of magnesium oxide and 2-3 parts of zinc oxide.
5. The modified inorganic adhesive according to claim 1, characterized by being prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-10 parts of fluosilicate, 2-3 parts of magnesium oxide, 0.7-1.3 parts of calcium oxide and 1-10 parts of borate.
6. The modified inorganic adhesive according to claim 1, characterized by being prepared from the following components in parts by mass:
5-10 parts of modified melamine formaldehyde resin, 90-95 parts of sodium silicate or 90-95 parts of potassium silicate, 1-3 parts of fluosilicate, 2-5 parts of zinc oxide, 0.7-1.3 parts of magnesium oxide and 1-3 parts of calcium oxide.
7. The preparation method of the modified inorganic adhesive according to claim 1, comprising the following steps:
the modified melamine formaldehyde resin is uniformly mixed with sodium silicate or potassium silicate, and then fluosilicate and/or borate and auxiliary materials are added and uniformly stirred.
8. Use of the modified inorganic adhesive according to any one of claims 1 to 6 in the production of wood-based panels.
9. The application of claim 8, wherein the method for preparing the wood-based board comprises the following steps:
drying the flakeboard crushed aggregates or the multilayer plywood to enable the water content to be within the range of 5-20%, and obtaining a pretreatment raw material; adding the modified inorganic adhesive as defined in any one of claims 1-6 into the pretreated raw material, and then sequentially carrying out the working procedures of pre-pressing, hot-pressing and semi-finished product treatment; wherein the hot pressing temperature is 110-220 ℃;
wherein: when the raw material is flakeboard particles, the addition amount of the modified inorganic adhesive is 120-130 kg/m3When the raw material is multilayer plywood, the addition amount of the modified inorganic adhesive is 2.5-3.0 kg/m2。
10. The use according to claim 8, wherein the preparation method of the artificial board comprises the following steps:
adding the modified inorganic adhesive of any one of claims 1-6 into wood fibers, drying, stopping drying when the water content is within the range of 5-20%, and sequentially performing pre-pressing, hot-pressing and semi-finished product treatment procedures; wherein the hot pressing temperature is 110-220 ℃;
wherein: the adding amount of the modified inorganic adhesive is 130-220 kg/m3。
CN201911243891.2A 2019-12-06 2019-12-06 Modified inorganic adhesive, preparation method and application in production of wood-based panel Active CN110862774B (en)

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