CN113858332B - Method for automatically mounting pins on formed PCB with large typesetting size - Google Patents
Method for automatically mounting pins on formed PCB with large typesetting size Download PDFInfo
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- CN113858332B CN113858332B CN202111234851.9A CN202111234851A CN113858332B CN 113858332 B CN113858332 B CN 113858332B CN 202111234851 A CN202111234851 A CN 202111234851A CN 113858332 B CN113858332 B CN 113858332B
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- pin
- positioning
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- assembly
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 12
- 238000010223 real-time analysis Methods 0.000 claims description 11
- 238000007726 management method Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 238000013459 approach Methods 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000007499 fusion processing Methods 0.000 claims description 3
- 238000013441 quality evaluation Methods 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000004080 punching Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010073 coating (rubber) Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
- B25B27/026—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same fluid driven
Abstract
The invention provides a method for automatically mounting pins on a formed PCB with large typesetting size, which comprises an assembly system, and the specific method comprises the following steps: s1, selecting a positioning program according to the model of a PCB, and drilling a positioning hole on the board surface; s2, selecting the diameter of the pin and conveying the pin; s3, setting a relative position distance, moving the binding position of the electric driving device and the main shaft, and automatically embedding pins into the drilled positioning holes; s4, finishing pin loading operation. The method of the invention realizes the operation mode of oversized large typesetting on the premise of low cost and high efficiency, realizes the scheme of automatic punching and automatic pin matching, and greatly reduces the production management difficulty and the labor cost.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a method for automatically pinning a formed large typesetting size PCB.
Background
Most of the current electronic products are developed towards miniaturization and high precision, and the requirements of line densification, layout centralization and high layering are correspondingly provided for the PCB used by the electronic products. Meanwhile, in order to improve the competitiveness of manufacturing enterprises, the production and manufacture of the PCB are developed towards large jointed boards, high efficiency, low cost and automation. The conventional large-jointed board forming process is restricted in the conventional pin punching mode, the pin punching speed is low, the staff operation is extremely inconvenient, the time is wasted, the efficiency is low, the production and output are seriously affected, the productivity balance output cannot be formed due to the low efficiency, the production automation cannot be realized, the labor is increased, and the management difficulty and the management cost are improved in phase change.
Traditionally the pin means are: program drilling (positioning holes), manually knocking in one by one, and starting up; the specific process flow method comprises the following steps: (1) selecting a positioning program corresponding to the plate, and drilling a positioning hole on the table top; (2) the operator sequentially puts the pin diameters corresponding to the positioning holes into the drilled hole positions (3) and locks the holes with the hammer and the fixed plate to knock firmly, the whole process is completed by manually knocking one by one after the positioning holes are drilled, the efficiency is low, and the maximum size of the operable imposition is 725 x 625mm, so that the operator can stand to bend and stretch into the table top of the machine table.
With the development of enterprises, automatic pushing and operation condition innovation are carried out, the imposition size is continuously enlarged, the operation and efficiency requirements cannot be met by the traditional method, and the automation and high efficiency are required to be upgraded.
Disclosure of Invention
In view of this, the present invention provides a method for automatically pinning a shaped large format size PCB.
The technical scheme of the invention is as follows:
the method for automatically pinning the large typesetting size PCB is characterized by comprising an assembly system, and the specific method comprises the following steps: s1, selecting a positioning program according to the model of a PCB, and drilling a positioning hole on the board surface;
s2, selecting the diameter of the pin and conveying the pin;
s3, setting a relative position distance, moving the binding position of the electric driving device and the main shaft, and automatically embedding pins into the drilled positioning holes;
s4, finishing pin loading operation.
In step S1, the positioning holes are drilled by two hole positioning methods. The two-hole positioning technology can realize the off-machine operation of all preparation works (bottom plate placement, pin punching, aluminum sheet feeding and rubber coating), and the upper plate and the lower plate only need to be sleeved into two positioning holes on a drilling machine, so that the speed is several times faster; the model is also very fast by adopting the two-hole positioning technology, one positioning hole is movable, and different models only need to finely adjust the distance between the two holes. The two-hole positioning technology has the advantages of convenient operation, rapidness and high efficiency.
Further, the assembly system comprises a state sensing module, a real-time analysis module, a material management module, an autonomous decision module and a dynamic control and accurate execution module.
Further, the state sensing module comprises a moment sensor, a size sensor, a distance sensor, a displacement sensor and a CCD sensor.
Furthermore, the state sensing module can monitor and record in real time, and perform fusion processing on the collected multi-source and heterogeneous data, so as to provide an information source foundation for effective real-time analysis.
Furthermore, the real-time analysis module is used for deducing the assembly process and the running state of the equipment.
Furthermore, the autonomous decision module gives out adjustment requirements for the control and execution part according to the real-time analysis result, so that the actual state approaches to the theoretical optimal state as much as possible. The advantages and disadvantages of autonomous decision-making mainly depend on the types of decision rules and the accumulation of knowledge bases, and the decision-making capability can be continuously improved and optimized.
Furthermore, the dynamic control and accurate execution module, the dynamic regulation and control system can provide suggested correction parameters in the execution process according to real-time quality evaluation, so as to realize accurate parameter matching of different individual pins or different batches of pins on a higher order of magnitude of precision; meanwhile, the control of the accurate movement of the execution part is realized, and the accurate positioning of the pin is achieved.
Furthermore, the material management module realizes timely distribution of materials such as raw materials, pins, parts to be assembled and the like, and is a necessary condition for realizing intelligent and automatic assembly of the pins. The precision production is realized by bringing the information of stock of raw materials, the quantity of qualified pins, the number of parts to be assembled, the quantity of finished products and the like into the control of the whole production link.
Further, in step S2, the method includes feeding detection and conveying, where the feeding detection mainly detects whether the diameter of the pin is qualified. When the pin passes through the feeding machine, the diameter is detected by the laser sensor, an image and data of the diameter are transmitted to the computer, if the diameter of the pin is unqualified, the computer system alarms and marks, and unqualified products are removed before the pin is conveyed to the assembly station.
Further, in step S3, the assembly is performed after the mechanical arm grabs the pin at the material preparation station. The system adopts a self-adaptive assembly mode, namely, a mechanical gripper adopts a servo motor to drive a cam disc to rotate to realize translational opening and closing of 2 fingers, the principle is similar to that of an opening and closing nut mechanism of a common lathe, two fingers are guided through a dovetail groove, a groove is formed in the cam disc, a cylindrical pin (a deep groove ball bearing is arranged at the end part of the cylindrical pin) is inserted in the groove of the cam disc, and when the cam disc rotates, a cylinder drives the fingers to move close to or far away from a rotation center (folding). After the finger grasps the target, the cam groove realizes self-locking, and the motor can not be loosened even if the motor is powered off. And measuring equipment such as a CCD camera, a laser range finder and the like is arranged on the paw base body and used for capturing the pose of the paw during capturing and simultaneously carrying out high-precision assembly after centering the center of the pin.
Furthermore, the method is preferably applied to the PCB with the large typesetting size 625 x 1092 mm.
The method of the invention realizes the operation mode of oversized large typesetting on the premise of low cost and high efficiency, realizes the scheme of automatic punching and automatic pin matching, and greatly reduces the production management difficulty and the labor cost.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Examples
The method for automatically pinning the large typesetting size PCB is characterized by comprising an assembly system, and the specific method comprises the following steps: s1, selecting a positioning program according to the model of a PCB, and drilling a positioning hole on the board surface;
s2, selecting the diameter of the pin and conveying the pin;
s3, setting a relative position distance, moving the binding position of the electric driving device and the main shaft, and automatically embedding pins into the drilled positioning holes;
s4, finishing pin loading operation.
In step S1, the positioning holes are drilled by two hole positioning methods. The two-hole positioning technology can realize the off-machine operation of all preparation works (bottom plate placement, pin punching, aluminum sheet feeding and rubber coating), and the upper plate and the lower plate only need to be sleeved into two positioning holes on a drilling machine, so that the speed is several times faster; the model is also very fast by adopting the two-hole positioning technology, one positioning hole is movable, and different models only need to finely adjust the distance between the two holes. The two-hole positioning technology has the advantages of convenient operation, rapidness and high efficiency.
Further, the assembly system comprises a state sensing module, a real-time analysis module, a material management module, an autonomous decision module and a dynamic control and accurate execution module.
Further, the state sensing module comprises a moment sensor, a size sensor, a distance sensor, a displacement sensor and a CCD sensor.
Furthermore, the state sensing module can monitor and record in real time, and perform fusion processing on the collected multi-source and heterogeneous data, so as to provide an information source foundation for effective real-time analysis.
Furthermore, the real-time analysis module is used for deducing the assembly process and the running state of the equipment.
Furthermore, the autonomous decision module gives out adjustment requirements for the control and execution part according to the real-time analysis result, so that the actual state approaches to the theoretical optimal state as much as possible. The advantages and disadvantages of autonomous decision-making mainly depend on the types of decision rules and the accumulation of knowledge bases, and the decision-making capability can be continuously improved and optimized.
Furthermore, the dynamic control and accurate execution module, the dynamic regulation and control system can provide suggested correction parameters in the execution process according to real-time quality evaluation, so as to realize accurate parameter matching of different individual pins or different batches of pins on a higher order of magnitude of precision; meanwhile, the control of the accurate movement of the execution part is realized, and the accurate positioning of the pin is achieved.
Furthermore, the material management module realizes timely distribution of materials such as raw materials, pins, parts to be assembled and the like, and is a necessary condition for realizing intelligent and automatic assembly of the pins. The precision production is realized by bringing the information of stock of raw materials, the quantity of qualified pins, the number of parts to be assembled, the quantity of finished products and the like into the control of the whole production link.
Further, in step S2, the method includes feeding detection and conveying, where the feeding detection mainly detects whether the diameter of the pin is qualified. When the pin passes through the feeding machine, the diameter is detected by the laser sensor, an image and data of the diameter are transmitted to the computer, if the diameter of the pin is unqualified, the computer system alarms and marks, and unqualified products are removed before the pin is conveyed to the assembly station.
Further, in step S3, the assembly is performed after the mechanical arm grabs the pin at the material preparation station. The system adopts a self-adaptive assembly mode, namely, a mechanical gripper adopts a servo motor to drive a cam disc to rotate to realize translational opening and closing of 2 fingers, the principle is similar to that of an opening and closing nut mechanism of a common lathe, two fingers are guided through a dovetail groove, a groove is formed in the cam disc, a cylindrical pin (a deep groove ball bearing is arranged at the end part of the cylindrical pin) is inserted in the groove of the cam disc, and when the cam disc rotates, a cylinder drives the fingers to move close to or far away from a rotation center (folding). After the finger grasps the target, the cam groove realizes self-locking, and the motor can not be loosened even if the motor is powered off. And measuring equipment such as a CCD camera, a laser range finder and the like is arranged on the paw base body and used for capturing the pose of the paw during capturing and simultaneously carrying out high-precision assembly after centering the center of the pin.
Furthermore, the method is preferably applied to the PCB with the large typesetting size 625 x 1092 mm.
The method of the invention realizes the operation mode of oversized large typesetting on the premise of low cost and high efficiency, realizes the scheme of automatic punching and automatic pin matching, and greatly reduces the production management difficulty and the labor cost.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. It should be noted that technical features not described in detail in the present invention may be implemented by any prior art in the field.
Claims (2)
1. The method for automatically pinning the large typesetting size PCB is characterized by comprising an assembly system, and the specific method comprises the following steps:
s1, selecting a positioning program according to the model of a PCB, and drilling a positioning hole on the board surface;
s2, selecting the diameter of the pin and conveying the pin;
s3, setting a relative position distance, moving the binding position of the electric driving device and the main shaft, and automatically embedding pins into the drilled positioning holes;
s4, finishing pin loading operation;
the assembly system comprises a state sensing module, a real-time analysis module, a material management module, an autonomous decision-making module and a dynamic control and accurate execution module;
the state sensing module comprises a moment sensor, a size sensor, a distance sensor, a displacement sensor and a CCD sensor;
the state sensing module can monitor and record in real time and perform fusion processing on the collected multi-source heterogeneous data;
the real-time analysis module is used for deducing the assembly process and the running state of the equipment;
the autonomous decision module gives out adjustment requirements for the control and execution part according to the real-time analysis result, so that the actual state approaches to the theoretical optimal state as much as possible;
the dynamic control and accurate execution module is used for dynamically regulating and controlling the system to provide suggested correction parameters in the execution process according to real-time quality evaluation so as to realize accurate parameter matching of different individual pins or different batches of pins on a higher precision order of magnitude; meanwhile, the control of the accurate movement of the execution part is realized, and the accurate positioning of the pin is achieved;
the material management module is used for timely distributing materials of the raw materials, the pins and the parts to be assembled;
step S2, including feeding detection and conveying, detecting the diameter through a laser sensor when the pin passes through a feeding machine, transmitting images and data of the diameter to a computer, alarming and marking by the computer system if the diameter of the pin is unqualified, and removing unqualified products before conveying to an assembly station;
in the step S3, the assembly is carried out after the mechanical arm grabs the pin at the material preparation station, and the CCD camera and the laser range finder are installed on the mechanical arm and used for positioning the pose of the paw during capturing, and meanwhile, the high-precision assembly is carried out after the pin is centered.
2. The method for automatically pinning a molded large format size PCB according to claim 1, wherein in step S1, two hole positioning is adopted for drilling the positioning holes.
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CN202111234851.9A CN113858332B (en) | 2021-10-22 | 2021-10-22 | Method for automatically mounting pins on formed PCB with large typesetting size |
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EP1237025A2 (en) * | 2001-02-28 | 2002-09-04 | Sumitomo Electric Industries, Ltd. | Opto-electronic module with printed circuit board (PCB) |
CN105555029A (en) * | 2015-12-14 | 2016-05-04 | 谢兴龙 | Drilling hole positioning method of single-sided circuit and double-sided circuit board |
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CN211128421U (en) * | 2019-07-11 | 2020-07-28 | 深圳市乐维机械有限公司 | Full-automatic pin equipment of PCB board |
CN111941342A (en) * | 2020-08-20 | 2020-11-17 | 中国人民解放军第五七二一工厂 | Special tool and method for assembling right-angle rotatable oil nozzle |
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CN105680266B (en) * | 2016-04-11 | 2017-11-03 | 珠海英搏尔电气股份有限公司 | AC motor control, stack bus bar component and preparation method thereof |
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EP1237025A2 (en) * | 2001-02-28 | 2002-09-04 | Sumitomo Electric Industries, Ltd. | Opto-electronic module with printed circuit board (PCB) |
CN105555029A (en) * | 2015-12-14 | 2016-05-04 | 谢兴龙 | Drilling hole positioning method of single-sided circuit and double-sided circuit board |
CN105682381A (en) * | 2016-03-03 | 2016-06-15 | 深圳市景旺电子股份有限公司 | High multi-layer PCB and laminating method thereof |
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CN108838673A (en) * | 2018-07-24 | 2018-11-20 | 山东爱通工业机器人科技有限公司 | Pcb board automatically beats the encapsulated production line of pin |
CN208509386U (en) * | 2018-07-24 | 2019-02-15 | 珠海市同辉电子有限公司 | A kind of flexible PCB automatic nailing machine |
CN208590159U (en) * | 2018-07-24 | 2019-03-08 | 山东爱通工业机器人科技有限公司 | Automatic drilling beats pin apparatuses |
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