CN113845853A - 一种承载膜及其贴合方法 - Google Patents
一种承载膜及其贴合方法 Download PDFInfo
- Publication number
- CN113845853A CN113845853A CN202110905358.9A CN202110905358A CN113845853A CN 113845853 A CN113845853 A CN 113845853A CN 202110905358 A CN202110905358 A CN 202110905358A CN 113845853 A CN113845853 A CN 113845853A
- Authority
- CN
- China
- Prior art keywords
- film
- carrier film
- sided
- carrier
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000010030 laminating Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000012790 adhesive layer Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 10
- 229920002799 BoPET Polymers 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000002216 antistatic agent Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
Abstract
本发明涉及PCB生产技术领域,特别涉及一种承载膜及其贴合方法。其中,承载膜用于将单面基材组合成双面基材并保护双面基材进行线路板生产,承载膜包括:承载层;分别设置于承载层上下表面的粘胶层;以及分别设置于承载层上下表面的粘胶层之上的离型膜。通过本发明提供的技术方案,实现将单面基材组合为双面基材后再进行线路板的生产工艺中,提高了线路板生产工艺设备的利用率和生产效率。
Description
技术领域
本发明涉及PCB生产技术领域,特别涉及一种承载膜及其贴合方法。
背景技术
在线路板生产中,定制结构的单面基材往往较薄,蚀刻及后工序生产过程中容易造成产品折皱,故需在生产过程中在基材PI面增加承载膜,提高产品厚度及强度。如图1、图4,单面基材增加承载膜的过程为:撕离承载膜的离型膜,将单面基材的PI面贴合在承载膜的粘胶层上。
在蚀刻工艺中,蚀刻线往往采用上下喷淋方式生产,从而使得在生产单面板仅有效使用了上下喷淋中的一种,工艺设备的利用率低,生产效率低。
发明内容
本发明的目的在于提供一种承载膜及其贴合方法,能够将两个单面基材贴合于承载膜的两面从而组合成双面基材后再进行蚀刻等后续工艺进行线路板生成,以解决现有技术对工艺设备的利用率低、生产效率低的问题。。
本发明解决其技术问题提供的技术方案如下:
第一方面,本发明提供一种承载膜,用于将单面基材组合成双面基材并保护双面基材进行线路板生产,包括:承载层;分别设置于承载层上下表面的粘胶层;以及分别设置于承载层上下表面的粘胶层之上的离型膜。
优选地,承载层的材料为低收缩PET膜。
优选地,承载层的厚度为50um。
优选地,粘胶层为溶剂型压敏胶,溶济性压敏胶均匀涂敷在承载层上,粘胶层设置有均匀分布的通孔。
优选地,设置有均匀分分布的通孔的粘胶层呈蜂窝状。
优选地,离型膜为PET有机硅离型膜。
优选地,离型膜内设置有抗静电剂。
第二方面,本发明提供第一方面所述承载膜的贴合方法,用于将两个单面基材分别贴合于承载膜的上下两面上组合成双面基材并保护双面基材进行线路板生产,包括步骤:撕离承载膜上下两面上的离型膜;将两个单面基材的PI面分别贴合于上下两面的粘胶层上形成双面基材。
优选地,贴合温度为50℃±5℃,贴合压力为0.1MPa±0.05MPa。
进一步地,承载膜与单面基材采用卷对片式贴合。
本发明的有益效果包括:
第一方面,本发明通过将承载膜由离型膜+粘胶层+承载层结构更改为离型膜+粘胶层+承载层+粘胶层+离型膜的结构,从而实现将两个单面基材贴合于承载膜从而组合为双面基材后进入线路板的生产工艺中,将工艺设备的使用率提高了一倍,实现了提高工艺设备利用率和生产效率。
第二方面,当单面基材组合为双面基材后,其散热效果需要更好,本发明通过将粘胶层涂敷为蜂窝状,利用了蜂窝状结构稳定的同进提高了散热性能。
第三方面,本发明将承载膜中的离型膜选用有机硅离型膜且加入抗静电剂,便于更方便更高质量的完成离型膜的剥离操作。
第四方面,本发明的承载膜采用低收缩PET膜和50um的厚度,结合在承载膜和基材贴合时采用贴合温度为50℃±5℃、贴合压力为0.1MPa±0.05MPa,使在线路板加工完成后剥离承载膜时,粘胶残留少,具有良好的抗污染性。
附图说明
下面结合附图对本发明作进一步说明。
图1是现有技术中的单面承载膜结构示意图。
图2是本发明实施例提供的双面承载膜结构示意图。
图3是本发明实施例提供的蜂窝状粘胶层的结构示意图。
图4是现有技术中的单面承载膜贴合单面基材的结构示意图。
图5是本发明实施例提供的单面承载膜的贴合方法流程图。
图6是本发明实施例提供的双面承载膜贴合两个单面基材形成双面基材的结构示意图。
1-单面承载膜;11-承载层;12-粘胶层;13-离型膜;
2-双面承载膜;22-蜂窝状粘胶层;
3-单面基材;31-PI面;32-AD胶层;33-铜箔层;
4-贴合后的单面基材;
5-贴合后的双面基材。
具体实施方式
下面将结合本发明的附图,对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参考图2,本发明实施例一提供一种承载膜2,用于将单面基材组合成双面基材并保护双面基材进行线路板生产,包括:承载层11;分别设置于承载层11上下表面的粘胶层22;以及分别设置于承载层上下表面的粘胶层之上的离型膜13。
具体地,由于电子产品朝轻薄化的方向发展,定制结构的单面基材比较轻和薄,增加了线路板生产的难度,在轻薄基材的表面增加一层承载膜,以增加材料的厚度和刚性,可以有效改善生产的难度。请参考图1、图4,现有技术的承载膜1由承载层11、粘胶层12和离型膜13组成,在撕开离型膜13后,能将单面基材3的PI面31贴合于粘胶层12上,再进入蚀刻等工艺流程,但单面基材3的蚀刻过程,未能充分利用上下喷淋过程,浪费了材料、未能充分利用设备来提高生产效率。本发明将单面承载基材实现组合后能双面承载,有效利用了工艺设备,提高了设备利用率和生产效率。
进一步地,承载层11的材料为低收缩PET膜。
具体地,承载膜是在基膜表面涂覆一层压敏胶制成,常见的基膜主要有PE膜、CPP膜、PET膜和PI膜等。其中PE和CPP膜价格较低,但耐热性和尺寸稳定性较差,难以用于FPCB领域;PI膜具有优异的耐热性和尺寸稳定性,但价格昂贵,采用PI膜制备承载膜给客户带来显著成本增加,难以接受;PET膜则价格适中,且具有良好的耐热性和尺寸稳定性。其中,低收缩PET膜具有优良的电绝缘性、机械性能和低而稳定的收缩率,适合于为承载层的材料。
进一步地,承载层11的厚度为50um。
进一步地,粘胶层22为溶剂型压敏胶,溶济性压敏胶均匀涂敷在承载层11上,粘胶层12设置有均匀分布的通孔。
具体地,压敏胶是一种对压力非常敏感且可永久黏合的胶粘剂,仅需轻微的手指按压力,便可以粘接不同种类的基材。压敏胶具有优异的耐候性和耐热性。
压敏胶按聚合方法和溶剂类型可以分为乳液型和溶剂型;乳液型压敏胶环保、成本低,但耐热性、剥离强度和内聚强度不如溶剂型敏胶。
优选地,请参考图3,设置有均匀分分布的通孔的粘胶层12呈蜂窝状。
具体地,蜂窝结构具有承受力强,构造精巧、适用而且节省材料的优点。由于将单面基材组合为双面基材后,对于承载膜的散热性能要求更高,将粘胶层采用蜂窝状均匀分布的通孔结构,提高了散热性能,同时不降低承载膜的承受力。
进一步地,离型膜13为PET有机硅离型膜。
具体地,PET有机硅离型膜,是以PET薄膜(聚对苯二甲酸乙二醇酯薄膜的简称)为基材,在其表面涂覆离型物质有机硅,经牵引、涂布、加热固化和防静电处理等工序,制得的具有理想离型效果的薄膜。PET有机硅离型膜具有透明度高、抗拉伸强度大、不易破裂等优点,是理想的离型膜材料。
进一步地,离型膜13内设置有抗静电剂。
具体地,由于静电对离型膜的剥离质量产生影响,本发明中在离型膜中涂敷抗静电溶剂或掺入抗静电粉未,以方便更高质量和效率的撕离离型膜。
请参考图5、图6,本发明实施例二提供如上实施例一所提供承载膜的贴合方法,用于将两个单面基材3分别贴合于承载膜2的上下两面上组合成双面基材5并保护双面基材5进行线路板生产,包括步骤:撕离承载膜2上下两面上的离型膜13;
将两个单面基材3的PI面31分别贴合于上下两面的粘胶层22上,贴合后的两个单面基材4组合成贴合后的双面基材5。贴合后,双面基材5的两个铜箔面33分别朝外。
进一步地,贴合温度为50℃±5℃,贴合压力为0.1MPa±0.05MPa。
具体地,在线路板的加工制程中,承载膜只是作为一种辅料用于改善操作性而存在,因此,线路板加工完成之后,需要将承载膜撕除,且不能对线路板表面产生污染、残留胶粘剂。将贴合承载膜的覆盖膜及在贴合温度为50℃±5℃,贴合压力为0.1MPa±0.05MPa压合,撕掉承载膜后,线路板的尺寸收缩极小,具有优异的抗污染性,满足轻薄性基材的线路板加工需求。
进一步地,承载膜2与单面基材3采用卷对片式贴合。
具体地,本发明的承载膜为双面承载膜2,与单面基材3的贴合可以采用卷对卷,也可以采用卷对片,当通过本发明提供的承载膜,使单面基材组合为双面基材后,采用卷对片的方式贴合更加操作方便。
以上对本发明实施例所提供的技术方案进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想,对于本领域的一般技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,本说明书不应理解为对本发明的限制。
Claims (10)
1.一种承载膜,用于将单面基材组合成双面基材并保护双面基材进行线路板生产,其特征在于,包括:
承载层;
分别设置于承载层上下表面的粘胶层;
以及分别设置于承载层上下表面的粘胶层之上的离型膜。
2.如权利要求1所述承载膜,其特征在于,所述承载层的材料为低收缩PET膜。
3.如权利要求1或2所述承载膜,其特征在于,所述承载层的厚度为50um。
4.如权利要求1所述承载膜,其特征在于,所述粘胶层为溶剂型压敏胶,所述溶济性压敏胶均匀涂敷在承载层上,所述粘胶层设置有均匀分布的通孔。
5.如权利要求4所述承载膜,其特征在于,所述设置有均匀分分布的通孔的粘胶层呈蜂窝状。
6.如权利要求1所述承载膜,其特征在于,所述离型膜为PET有机硅离型膜。
7.如权利要求6所述承载膜,其特征在于,所述离型膜内设置有抗静电剂。
8.一种如权利要求1-7项中任一项所述承载膜的贴合方法,用于将两个单面基材分别贴合于承载膜的上下两面上组合成双面基材并保护双面基材进行线路板生产,其特征在于,包括步骤:
撕离承载膜上下两面上的离型膜;
将两个单面基材的PI面分别贴合于上下两面的粘胶层上形成双面基材。
9.如权利要求8所述承载膜的贴合方法,其特征在于,所述贴合方式为:贴合温度为50±5℃,贴合压力为0.1MPa±0.05MPa。
10.如权利要求8所述承载膜的贴合方法,其特征在于,所述承载膜与所述单面基材采用卷对片式贴合。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110905358.9A CN113845853A (zh) | 2021-08-09 | 2021-08-09 | 一种承载膜及其贴合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110905358.9A CN113845853A (zh) | 2021-08-09 | 2021-08-09 | 一种承载膜及其贴合方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113845853A true CN113845853A (zh) | 2021-12-28 |
Family
ID=78975622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110905358.9A Pending CN113845853A (zh) | 2021-08-09 | 2021-08-09 | 一种承载膜及其贴合方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113845853A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117858362A (zh) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | 一种车用fpc板结构及压膜设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119562A (ja) * | 2005-10-27 | 2007-05-17 | Sun A Kaken Co Ltd | 両面粘着フィルム及び両面粘着フィルムの製造方法 |
CN103702513A (zh) * | 2014-01-17 | 2014-04-02 | 杨秀英 | 适用于单面柔性线路板的承载膜及其制备方法和应用 |
CN207243802U (zh) * | 2017-03-07 | 2018-04-17 | 宁波惠之星新材料科技有限公司 | 一种在线用pet‑ito后制程耐高温承载膜 |
CN110798981A (zh) * | 2019-11-07 | 2020-02-14 | 江苏上达电子有限公司 | 一种改善柔性线路板涨缩的承载膜 |
CN112680135A (zh) * | 2020-12-23 | 2021-04-20 | 苏州赛伍应用技术股份有限公司 | 一种用于oled模组的支撑膜及其制备方法 |
-
2021
- 2021-08-09 CN CN202110905358.9A patent/CN113845853A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119562A (ja) * | 2005-10-27 | 2007-05-17 | Sun A Kaken Co Ltd | 両面粘着フィルム及び両面粘着フィルムの製造方法 |
CN103702513A (zh) * | 2014-01-17 | 2014-04-02 | 杨秀英 | 适用于单面柔性线路板的承载膜及其制备方法和应用 |
CN207243802U (zh) * | 2017-03-07 | 2018-04-17 | 宁波惠之星新材料科技有限公司 | 一种在线用pet‑ito后制程耐高温承载膜 |
CN110798981A (zh) * | 2019-11-07 | 2020-02-14 | 江苏上达电子有限公司 | 一种改善柔性线路板涨缩的承载膜 |
CN112680135A (zh) * | 2020-12-23 | 2021-04-20 | 苏州赛伍应用技术股份有限公司 | 一种用于oled模组的支撑膜及其制备方法 |
Non-Patent Citations (1)
Title |
---|
范浩军等: "《高等学校专业教材 人造革合成革材料及工艺学 第2版》", 28 February 2017 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117858362A (zh) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | 一种车用fpc板结构及压膜设备 |
CN117858362B (zh) * | 2024-03-07 | 2024-05-10 | 厦门源乾电子有限公司 | 一种车用fpc板结构及压膜设备 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6679601B2 (ja) | アレイ基板、フレキシブル表示パネル及び表示装置 | |
JP5820762B2 (ja) | 透明導電性フィルム用表面保護フィルム及びそれを用いた透明導電性フィルム | |
EP2495779A2 (en) | Method for manufacturing thin-film substrate | |
CN210103822U (zh) | 一种抗静电pet网格保护膜 | |
JP2014084458A (ja) | 積層基材、これを利用した基板の製造方法及び基板 | |
KR102604331B1 (ko) | 적층체 및 그 용도 | |
CN113845853A (zh) | 一种承载膜及其贴合方法 | |
JP5376954B2 (ja) | 太陽電池モジュール、積層体及び太陽電池モジュールの製造方法 | |
JP6152796B2 (ja) | 太陽電池モジュール | |
CN111642068A (zh) | Rcc基板及多层叠置软板 | |
TWI754611B (zh) | Fpc用導電性黏著片材及使用此片材之fpc | |
US9554472B2 (en) | Panel with releasable core | |
WO2013030993A1 (ja) | 太陽電池モジュール | |
CN214693988U (zh) | 氟改性离型膜 | |
JP4916057B2 (ja) | Fpc用保護フィルム、fpc用保護フィルム付樹脂導体箔積層体およびそれを用いたフレキシブルプリント配線基板の製造方法 | |
JP2015157396A (ja) | 金属箔パターン積層体及び太陽電池モジュール | |
JP2015063096A (ja) | キャリヤ付き金属箔およびキャリヤ付き金属箔を用いた積層基板の製造方法 | |
JP2011129882A (ja) | 太陽電池モジュール、及び太陽電池モジュール用配線基板 | |
CN214422552U (zh) | 一种耐高电压双面覆盖膜 | |
JP4945829B2 (ja) | フレキシブルプリント配線板およびその製造方法 | |
CN209890542U (zh) | 一种双面硅胶聚酰亚胺胶带 | |
JP2019119820A (ja) | 封止用フィルム、封止用フィルム被覆電子部品搭載基板および再剥離方法 | |
JP2019121719A (ja) | 封止用フィルムおよび封止用フィルム被覆電子部品搭載基板 | |
CN217149047U (zh) | 胶带 | |
CN216687975U (zh) | 一种超厚耐高温导电胶带 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211228 |
|
RJ01 | Rejection of invention patent application after publication |