CN113840471B - Method for preparing flexible electronic and flexible electronic - Google Patents
Method for preparing flexible electronic and flexible electronic Download PDFInfo
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- CN113840471B CN113840471B CN202010579800.9A CN202010579800A CN113840471B CN 113840471 B CN113840471 B CN 113840471B CN 202010579800 A CN202010579800 A CN 202010579800A CN 113840471 B CN113840471 B CN 113840471B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
The invention provides a method for preparing flexible electronic, which comprises the following steps: s1, pouring liquid GaIn liquid metal or liquid GaInSn liquid metal into a silicone tube by using a negative pressure method; s2, storing the silicone tube filled with the liquid metal in a low-temperature environment until crystallization and solidification are carried out; s3, taking out the crystallized and solidified liquid metal from the silica gel tube to obtain a metal wire; s4, constructing a circuit pattern by using metal wires to obtain a target circuit; s5, packaging the target circuit by using liquid silica gel; and S6, heating after the liquid silica gel is solidified, so that the solid metal wire is melted into a liquid state, and the flexible electronic is obtained. The invention also provides a flexible electronic. The beneficial effects of the invention are as follows: the manufacturing process for preparing the flexible electronic by the liquid metal can be simplified, the yield is improved, and the cost is reduced.
Description
Technical Field
The present invention relates to flexible electronic devices, and more particularly, to a method for manufacturing a flexible electronic device and a flexible electronic device.
Background
Gallium-based liquid metal is the only material with metal conductivity and fluidity at room temperature at present, and the deformation capability of flexible electrons prepared based on the liquid metal is limited by elastic packaging materials in theory, so the liquid metal is widely applied to flexible electron manufacturing at present.
The method for preparing the flexible electronic based on the liquid metal at the present stage mainly comprises the following steps: (1) photolithography: the photoetching method can not directly prepare liquid metal flexible electrons, but can prepare a circuit template through photoetching, and construct a circuit by combining the following methods of imprinting or selective wetting and the like; (2) microchannel injection method: the microchannel method mainly utilizes the characteristics of low viscosity and good fluidity of liquid metal, firstly utilizes photoetching and other methods to construct a microchannel with a certain shape in the elastomer, then uses an injector to inject the liquid metal into the microchannel, and the pressure required by injecting the microchannel is inversely proportional to the diameter of the channel; (3) additive manufacturing method: additive manufacturing refers to a method of depositing liquid metal only at the required position of a circuit, and ink-jet printing is one of additive manufacturing, but printing is difficult to directly perform by a traditional printing method due to the relatively large surface tension of the liquid metal; (4) material reduction method: the subtractive method is a method of removing a part of a material in a liquid metal thin film and leaving only a desired line pattern, and mainly includes laser etching and electrochemical oxidation-reduction.
Photolithography, additive manufacturing, and subtractive methods do not build circuits within the elastomer, and thus the liquid metal flex electrons produced do not have the ability to develop large strains. The flexible electronic prepared by the micro-channel injection method can bear larger strain due to the fact that liquid metal is packaged in the elastomer, but the method needs to construct a channel by using a photoetching process, so that the process is complicated, the cost is high, air is easy to inject into the channel in the injection process, and meanwhile, the right angle of the channel cannot be completely filled due to large surface tension of the liquid metal, so that the yield is low, and the popularization of commercial application of the flexible electronic is limited.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a method for preparing flexible electrons based on liquid metal liquid-solid conversion characteristics and the flexible electrons.
The invention provides a method for preparing flexible electrons based on liquid metal liquid-solid conversion characteristics, which comprises the following steps:
s1, pouring liquid GaIn liquid metal or liquid GaInSn liquid metal into a silicone tube by using a negative pressure method;
s2, storing the silicone tube filled with the liquid metal in a low-temperature environment until crystallization and solidification are carried out;
s3, taking out the crystallized and solidified liquid metal from the silica gel tube to obtain a metal wire;
s4, constructing a circuit pattern by using metal wires to obtain a target circuit;
s5, packaging the target circuit by using liquid silica gel;
and S6, heating after the liquid silica gel is solidified, so that the solid metal wire is melted into a liquid state, and the flexible electronic is obtained.
As a further improvement of the invention, in step S1, the weight percentage of In of the GaIn liquid metal is between 0 and 10%, the weight percentage of In of the GaInSn liquid metal is between 0 and 12%, and the weight percentage of Sn of the GaInSn liquid metal is between 0 and 12%.
As a further improvement of the invention, in the step S2, the silicone tube filled with the liquid metal is stored for 1-30 minutes at the temperature of 0-196 ℃.
As a further improvement of the present invention, in step S3, the liquid metal in a solidified state is taken out of the silicone tube in an environment having a temperature lower than 16.8 ℃, and the taking-out method includes directly taking out the liquid metal in a solidified state from the silicone tube or splitting the silicone tube using a cutter.
As a further improvement of the present invention, in step S4, the wire is bent in an environment with a temperature lower than 15 ℃ to construct a desired circuit pattern, both ends of the wire are heated to 30-200 ℃ and kept for 5-10S, both ends of the wire are melted for 1-5 mm in length, and then one end of a copper wire with a length of 20-50 mm is inserted into the melted liquid metal, and the wire is left to stand for 2-10 min until solidification.
As a further improvement of the invention, in step S5, the target circuit is placed over the solid silicone layer and encapsulated with a corresponding liquid silicone gel.
As a further improvement of the invention, in the step S6, after the silica gel is solidified, the target circuit is heated to 30-200 ℃ and kept for 1-5 min, so that the solid metal wire is melted into a liquid state.
As a further improvement of the present invention, in step S1, a liquid GaIn liquid metal or a liquid GaInSn liquid metal is poured into the silicone tube using a syringe.
The invention also provides a flexible electronic which is prepared by adopting the method for preparing the flexible electronic.
The beneficial effects of the invention are as follows: through the scheme, the liquid metal has high supercooling degree, the liquid-solid conversion method is adopted, the micro-channel is not required to be constructed in the elastomer by using technologies such as photoetching, the liquid metal circuit channel does not have the defects of air holes and the like caused by micro-channel injection, and the filling rate is high; the flexible electronic prepared by the invention has strong adaptability to deformation and high stability of electrical performance in the service process; the invention can simplify the manufacturing process of preparing the flexible electronic by the liquid metal, improve the yield and reduce the cost.
Detailed Description
The invention is further described in connection with the following detailed description.
The invention aims to develop a method for preparing flexible electrons through liquid metal liquid-solid conversion by utilizing the characteristic of larger supercooling degree of liquid metal. The liquid metal is converted into a solid state, and flexible electronic manufacturing is performed under the solid state condition. The method can encapsulate the conductive circuit inside the elastomer without using photolithography and other processes to construct the micro-channel.
A method for preparing flexible electronic based on liquid metal liquid-solid conversion characteristics comprises the following specific processes:
1. and pouring GaIn (0-10 wt%) or GaInSn (0-12% In, 0-12% Sn) liquid metal into the silicone tube whose diameter is 0.05-20 mm by means of negative pressure method of syringe extraction.
2. Preserving the low-temperature environment (0 ℃ to minus 196 ℃) of the silica gel tube filled with the liquid metal for 1 to 30 minutes until crystallization and solidification are carried out, and taking out;
3. since the melting temperature of the GaIn eutectic second phase is 16.8 ℃, the solidified liquid metal needs to be taken out of the silica gel tube in an environment with the temperature lower than 16.8 ℃; the extraction method comprises directly extracting the solidified liquid metal wire from the silica gel tube, or splitting the silica gel tube with a cutter; the direct extraction method is simple, convenient and quick, but when the length of the solidified liquid metal wire is more than 100mm, the structure of the metal wire can be damaged due to larger friction force in the extraction process. Therefore, when the length of the solidified liquid metal wire is more than 100mm, the cutter is used for disassembly, and when the length of the solidified liquid metal wire is less than 100mm, the metal wire is directly drawn out of the silica gel tube.
4. Bending the liquid metal wire in an environment with the temperature lower than 15 ℃ to construct a required circuit pattern, heating the two ends of the lead at 30-200 ℃ for 5-10 s to melt the lead for 1-5 mm in length, inserting one end of the copper lead with the length of 20-50 mm into the melted liquid metal, and waiting for 2-10 min until solidification;
5. placing a liquid metal circuit above a solid PDMS/Ecoflex and other silica gel layers and packaging by using corresponding liquid silica gel;
6. and heating the flexible device for 1-5 min at the temperature of 30-200 ℃ after the silica gel is solidified, so that the solid metal wire is melted into a liquid state.
The invention also provides a flexible electronic (such as a flexible circuit, a flexible device and the like) prepared by the method for preparing the flexible electronic.
The invention utilizes the large supercooling degree of the liquid metal and adopts a liquid-solid conversion method, the method does not need to use technologies such as photolithography and the like to construct micro-channels in the elastomer, and the liquid metal circuit channels can not have defects such as air holes and the like caused by micro-channel injection, and the filling rate can reach about 100 percent. The flexible electronic prepared by the method has strong adaptability to deformation and high stability of electrical performance in the service process. The invention can simplify the manufacturing process of preparing the flexible electronic by the liquid metal, improve the yield and reduce the cost.
The invention relates to a method for preparing flexible electronic based on liquid metal liquid-solid conversion characteristic, which can package liquid metal in an elastomer without constructing a micro-channel in the elastomer. The method has larger competitive advantages in preparing liquid metal flexible wires, flexible sensors (sensors of pressure, angle, strain and the like), flexible antennas and the like, and can be widely applied to the fields of wearable electronic equipment, intelligent robots, medical appliances and the like.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (9)
1. A method of making a flexible electronic comprising the steps of:
s1, pouring liquid GaIn liquid metal or liquid GaInSn liquid metal into a silicone tube by using a negative pressure method;
s2, storing the silicone tube filled with the liquid metal at the temperature of between 0 and minus 196 ℃ until crystallization and solidification are carried out;
s3, taking out the crystallized and solidified liquid metal from the silica gel tube to obtain a metal wire;
s4, constructing a circuit pattern by using metal wires to obtain a target circuit;
s5, packaging the target circuit by using liquid silica gel;
and S6, heating after the liquid silica gel is solidified, so that the solid metal wire is melted into a liquid state, and the flexible electronic is obtained.
2. The method of preparing a flexible electronic according to claim 1, wherein: in step S1, the weight percentage of In of the GaIn liquid metal is between 0 and 10%, the weight percentage of In of the GaInSn liquid metal is between 0 and 12%, and the weight percentage of Sn of the GaInSn liquid metal is between 0 and 12%.
3. The method of preparing a flexible electronic according to claim 1, wherein: in the step S2, the silicone tube filled with the liquid metal is stored for 1 to 30 minutes at the temperature of between 0 and minus 196 ℃.
4. The method of preparing a flexible electronic according to claim 1, wherein: in step S3, the solidified liquid metal is removed from the silicone tube in an environment having a temperature lower than 16.8 ℃, and the removal method includes directly withdrawing the solidified liquid metal from the silicone tube or splitting the silicone tube using a cutter.
5. The method of preparing a flexible electronic according to claim 1, wherein: in step S4, the metal wire is bent in an environment with the temperature lower than 15 ℃ to construct a required circuit pattern, the two ends of the metal wire are heated to 30-200 ℃ and kept for 5-10S, the two ends of the metal wire are melted for 1-5 mm in length, and then one end of a copper wire with the length of 20-50 mm is inserted into the melted liquid metal, and the copper wire is waited for 2-10 min until solidification.
6. The method of preparing a flexible electronic according to claim 1, wherein: in step S5, the target circuit is placed over the solid silica gel layer and encapsulated with a corresponding liquid silica gel.
7. The method of preparing a flexible electronic according to claim 1, wherein: in step S6, after the silica gel is solidified, the target circuit is heated to 30-200 ℃ and kept for 1-5 min, so that the solid metal wire is melted into a liquid state.
8. The method of preparing a flexible electronic according to claim 1, wherein: in step S1, a liquid GaIn liquid metal or a liquid GaInSn liquid metal is poured into a silicone tube using a syringe.
9. A flexible electronic device, characterized by: prepared by the method of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010579800.9A CN113840471B (en) | 2020-06-23 | 2020-06-23 | Method for preparing flexible electronic and flexible electronic |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010579800.9A CN113840471B (en) | 2020-06-23 | 2020-06-23 | Method for preparing flexible electronic and flexible electronic |
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| Publication Number | Publication Date |
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| CN113840471A CN113840471A (en) | 2021-12-24 |
| CN113840471B true CN113840471B (en) | 2023-05-09 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0502802A1 (en) * | 1991-03-05 | 1992-09-09 | UNIMETAL, Société Anonyme | Method and apparatus for continuous casting of thin wire from a metal melt |
| US5524704A (en) * | 1994-02-14 | 1996-06-11 | Unimetal, Societe Francaise Des Aciers Longs | Process and device for the continuous casting of very small-diameter wires directly from liquid metal |
| CN105934105A (en) * | 2016-04-29 | 2016-09-07 | 北京梦之墨科技有限公司 | Method of light-cured resin packaging liquid-state metal printed circuit |
| CN106982516A (en) * | 2017-04-21 | 2017-07-25 | 深圳大学 | A kind of liquid metal printing process applied to flexible electronic |
| CN107887100A (en) * | 2017-10-31 | 2018-04-06 | 深圳大学 | A kind of flexible liquid metal inductance coil and preparation method and application |
| CN107907146A (en) * | 2017-10-31 | 2018-04-13 | 深圳大学 | The preparation method of liquid metal electrode, feeler and gesture identification gloves |
-
2020
- 2020-06-23 CN CN202010579800.9A patent/CN113840471B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0502802A1 (en) * | 1991-03-05 | 1992-09-09 | UNIMETAL, Société Anonyme | Method and apparatus for continuous casting of thin wire from a metal melt |
| US5524704A (en) * | 1994-02-14 | 1996-06-11 | Unimetal, Societe Francaise Des Aciers Longs | Process and device for the continuous casting of very small-diameter wires directly from liquid metal |
| CN105934105A (en) * | 2016-04-29 | 2016-09-07 | 北京梦之墨科技有限公司 | Method of light-cured resin packaging liquid-state metal printed circuit |
| CN106982516A (en) * | 2017-04-21 | 2017-07-25 | 深圳大学 | A kind of liquid metal printing process applied to flexible electronic |
| CN107887100A (en) * | 2017-10-31 | 2018-04-06 | 深圳大学 | A kind of flexible liquid metal inductance coil and preparation method and application |
| CN107907146A (en) * | 2017-10-31 | 2018-04-13 | 深圳大学 | The preparation method of liquid metal electrode, feeler and gesture identification gloves |
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| CN113840471A (en) | 2021-12-24 |
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