CN113840059B

CN113840059B - Photosensitive assembly, camera module and electronic equipment

Info

Publication number: CN113840059B
Application number: CN202010588460.6A
Authority: CN
Inventors: 黄桢; 许晨祥; 干洪锋; 栾仲禹; 徐童伟; 李婷花; 戴蓓蓓
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2023-07-25
Anticipated expiration: 2040-06-24
Also published as: CN113840059A; CN115699783A; WO2021258945A1

Abstract

A photosensitive assembly, a camera module and an electronic device are disclosed. The photosensitive assembly includes: the circuit board assembly comprises a circuit board main body and an adjusting layer, wherein the photosensitive chip is arranged on the circuit board main body and is electrically connected with the circuit board main body, and the adjusting layer is formed on the lower surface of the circuit board main body and is provided with structural configuration for adjusting the bending degree of the circuit board main body so as to adjust the bending degree of the photosensitive chip. Thus, the bending degree of the photosensitive chip is adjusted by the adjusting layer so as to be suitable for the field curvature of the optical lens.

Description

Photosensitive assembly, camera module and electronic equipment

Technical Field

The application relates to a camera module, in particular to a photosensitive assembly, a camera module and electronic equipment.

Background

With the popularity of mobile terminal devices, related technologies of camera modules applied to mobile terminal devices for helping users acquire images (e.g., videos or images) have been rapidly developed and advanced. Along with the improvement of consumers to the requirements of making a video recording, the functions of the camera module on the terminal device are more diversified and powerful, such as wide angle, long focus and zooming functions. In order to realize the above functions, the photosensitive chip is gradually developed toward a high pixel and a large chip.

Because the large-size photosensitive chip has the characteristics of large area and small thickness, the photosensitive chip is more easily bent due to external force or temperature change in the assembly process or the reliability test, so that the imaging quality of the camera module is reduced. In order to optimize the imaging quality of the camera shooting module, the prior art thinking is as follows: the bending degree of the photosensitive chip is reduced as much as possible, for example, by reinforcing the bending strength and/or rigidity of the circuit board (for example, attaching a reinforcing plate to the back surface of the circuit board) to prevent the circuit board from bending so as to reduce the bending degree of the photosensitive chip.

However, in practice, the inventors found that: on the one hand, even if the bending degree of the photosensitive chip is reduced to be as low as possible through the reinforcing plate, the actual imaging quality of the camera module is not obviously optimized and the consistency of the actual imaging quality is relatively poor; on the other hand, the use of the reinforcing plate brings about some new technical problems, such as poor grounding performance, poor heat dissipation performance, and the like.

Therefore, the phenomenon of bending of the photosensitive chip needs to be re-examined so as to obtain the camera module with better performance.

Disclosure of Invention

An advantage of the present application is that it provides a photosensitive assembly, a camera module and an electronic device, wherein, the photosensitive assembly is configured with an adjustment layer for adjusting the bending degree of a photosensitive chip through the below of a circuit board, so that the bending degree of the photosensitive chip is adapted to the field curvature of an optical lens through the structural configuration of the adjustment layer, in this way, the camera module has more optimized imaging quality and the consistency of the actual imaging quality is relatively higher.

Another advantage of the present application is to provide a photosensitive assembly, an image capturing module, and an electronic device, wherein a bending degree of the photosensitive chip can be adjusted by a structural configuration of the adjustment layer, so that a curvature of field of the photosensitive chip corresponds to a curvature of field of the optical lens. That is, in the embodiment of the present application, the bending degree of the photosensitive chip is an effective variable for optimizing the actual imaging quality of the imaging module.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and an electronic device, where the bending degree of the photosensitive chip can be adjusted by the adjusting layer, so that a plurality of optical lenses with different field curvature values can also generate a camera module with better field curvature consistency. That is, in the embodiment of the present application, the inconsistency of the field curvature values of the optical lens can be adapted by adjusting the curvature degree of the photosensitive chip, so as to improve the effective utilization rate of the optical lens.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and an electronic device, wherein in an embodiment of the present application, the adjustment layer has a slot penetrating through the adjustment layer to expose at least a portion of a conductive layer formed on a lower surface of the circuit board for grounding, in this way, the grounding performance of the camera module is improved.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and an electronic device, wherein in an embodiment of the present application, the adjustment layer has a slot penetrating through the adjustment layer to expose at least a portion of a lower surface of the circuit board, so that heat dissipation performance of the camera module is improved.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and an electronic device, wherein the adjustment layer covers a first type of conductive via used for communication in the circuit board main body, so as to protect the first type of conductive via from being damaged during manufacturing, transportation, use, and the like of the camera module.

Other advantages and features of the present application will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

To achieve at least one of the above objects or advantages, the present application provides a photosensitive assembly, comprising:

a photosensitive chip; and

the circuit board assembly comprises a circuit board main body and an adjusting layer, wherein the photosensitive chip is arranged on the circuit board main body and is electrically connected with the circuit board main body, and the adjusting layer is provided with a structural configuration for adjusting the bending degree of the photosensitive chip.

In the photosensitive assembly according to the present application, the adjustment layer is formed on the lower surface of the circuit board main body, and the structural configuration of the adjustment layer is configured to adjust the bending degree of the circuit board so as to adjust the bending degree of the photosensitive chip.

In the photosensitive assembly according to the present application, there is a difference between the coefficient of thermal expansion of the adjustment layer and the coefficient of thermal expansion of the wiring board main body.

In the photosensitive assembly according to the present application, the structural configuration includes the adjustment layer having a thickness dimension in a range of 0.1mm to 0.4mm.

In the photosensitive assembly according to the present application, the thickness dimension of the adjustment layer ranges from 0.1mm to 0.2mm.

In the photosensitive assembly according to the present application, the structural configuration includes a thickness dimension of the adjustment layer that is less than or equal to 120% of a thickness dimension of the circuit board body.

In the photosensitive assembly according to the present application, the thickness dimension of the adjustment layer is less than or equal to 110% of the thickness dimension of the circuit board main body.

In the photosensitive assembly according to the application, the thickness dimension of the adjustment layer is smaller than or equal to the thickness dimension of the circuit board main body.

In the photosensitive assembly according to the application, the structural configuration comprises at least one slot concavely formed on the lower surface of the adjusting layer.

In the photosensitive assembly according to the application, the depth dimension of the at least one slot is smaller than or equal to the thickness of the adjustment layer.

In the photosensitive assembly according to the present application, the slot is provided on a central axis set by the circuit board main body.

In the photosensitive assembly according to the present application, the at least one slot includes at least two slots, wherein the at least two slots are symmetrically distributed with respect to a central axis set by the circuit board main body.

In the photosensitive assembly according to the present application, the at least one slot includes at least two slots, wherein the at least two slots are uniformly and alternately arranged with respect to a central axis set by the circuit board body along a circumferential direction of the adjustment layer.

In the photosensitive assembly according to the present application, a distance between the outermost edge of the groove and the peripheral edge of the adjustment layer is 0.1mm or more.

In the photosensitive assembly according to the present application, a distance between the outermost edge of the groove and the peripheral edge of the adjustment layer is 0.3mm or more.

In the photosensitive assembly according to the application, the adjusting layer is integrally formed on the lower surface of the circuit board.

In the photosensitive assembly according to the present application, the adjustment layer is made of a resin material.

In the photosensitive assembly according to the present application, the degree of bending of the circuit board body is such that a height difference between a peripheral region of the circuit board and a middle region of the circuit board body ranges from-25 um to 25um.

In the photosensitive assembly according to the application, the bending degree of the photosensitive chip is that the height difference between the edge area of the photosensitive chip and the middle area of the photosensitive chip ranges from-5 um to 5um.

In the photosensitive assembly according to the present application, the degree of bending of the circuit board body is such that a height difference between a peripheral region of the circuit board and a middle region of the circuit board body ranges from-100 um to 100um.

In the photosensitive assembly according to the present application, the degree of bending of the photosensitive chip is such that a height difference between an edge region of the photosensitive chip and a middle region of the photosensitive chip ranges from-30 um to 30um.

In the photosensitive assembly according to the application, at least one slot of the at least one slot penetrates through the adjustment layer to expose at least a partial area of the lower surface of the circuit board.

In the photosensitive assembly according to the application, the circuit board body comprises a conductive layer formed on the lower surface of the circuit board and used for grounding, and the grooves penetrating through the adjusting layer expose at least part of areas of the conductive layer.

In the photosensitive assembly according to the present application, the slot penetrating the adjustment layer is formed in an edge region of the adjustment layer.

In the photosensitive assembly according to the present application, the wiring board body includes a plurality of wiring layers formed between an upper surface thereof and a lower surface thereof, the plurality of wiring layers being communicably connected by a first type conductive via, wherein a region of the adjustment layer covering the lower surface of the wiring board body includes a region at least a part of the first type conductive via corresponding to the lower surface of the wiring board body.

In the photosensitive assembly according to the present application, the wiring board assembly further includes a second conductive layer electrically connected to the conductive layer.

In the photosensitive assembly according to the present application, the second conductive layer is formed in the groove penetrating the adjustment layer.

In the photosensitive assembly according to the present application, the second conductive layer is further formed on the lower surface of the adjustment layer.

In the photosensitive assembly according to the application, the side wall of the slot penetrating through the adjusting layer is inclined to the lower surface of the circuit board main body.

In the photosensitive assembly according to the present application, the circuit board assembly further includes a flexible connection board electrically connected to the circuit board body and a connector connected to the flexible connection board, wherein a certain gap is provided between the adjustment layer and the flexible connection board.

According to another aspect of the present application, there is further provided a camera module, including:

an optical lens; and

the photosensitive assembly as described above, wherein the optical lens is held on a photosensitive path of the photosensitive assembly.

In the camera module, the field curvature of the optical lens is adapted to the bending degree of the photosensitive chip.

According to still another aspect of the present application, there is also provided an electronic device including

An electronic device main body; and

the camera module assembled on the electronic equipment main body comprises an optical lens and the photosensitive assembly, wherein the optical lens is kept on a photosensitive path of the photosensitive assembly.

In the electronic device according to the present application, the electronic device body includes a ground line having an electrical connection terminal, the electrical connection terminal of the ground line being electrically connected to the conductive layer.

In the electronic device according to the present application, the electronic device body includes a ground line having an electrical connection terminal, and the electrical connection terminal of the ground line is electrically connected to the second conductive layer.

Further objects and advantages of the present application will become fully apparent from the following description and the accompanying drawings.

These and other objects, features, and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings, and the appended claims.

Drawings

The foregoing and other objects, features and advantages of the present application will become more apparent from the following more particular description of embodiments of the present application, as illustrated in the accompanying drawings. The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the application and not constitute a limitation to the application. In the drawings, like reference numerals generally refer to like parts or steps.

Fig. 1 illustrates a schematic diagram of an imaging module according to an embodiment of the present application.

Fig. 2 illustrates a schematic diagram of a photosensitive assembly of the camera module according to an embodiment of the present application.

Fig. 3 illustrates a bending schematic view of a circuit board assembly of the photosensitive assembly according to an embodiment of the present application.

Fig. 4 illustrates a bending schematic diagram of a circuit board assembly and a photosensitive chip of the photosensitive assembly according to an embodiment of the present application.

Fig. 5A illustrates a schematic diagram of an arrangement of the slotting position of the adjustment layer according to an embodiment of the present application.

Fig. 5B illustrates a schematic diagram of another arrangement of the slotting position of the adjustment layer according to an embodiment of the present application.

Fig. 5C illustrates a schematic diagram of yet another arrangement of the slotting position of the adjustment layer according to an embodiment of the present application.

Fig. 5D illustrates a schematic diagram of yet another arrangement of the slotting position of the adjustment layer according to an embodiment of the present application.

Fig. 6 illustrates yet another schematic of the slot positions in the adjustment layer according to an embodiment of the present application.

Fig. 7 illustrates a schematic diagram of the setting position of the adjustment layer according to an embodiment of the present application.

FIG. 8 illustrates a schematic diagram of a variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 9 illustrates a schematic diagram of another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 10 illustrates a schematic view of a circuit board main body of the photosensitive assembly according to an embodiment of the present application.

Fig. 11 illustrates a schematic diagram of a relative positional relationship of the adjustment layer and the circuit board body according to an embodiment of the present application.

Fig. 12 illustrates a schematic diagram of the camera module electrically connected to the electronic device main body according to an embodiment of the present application.

Fig. 13A illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 13B illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 13C illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 13D illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 13E illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 13F illustrates an enlarged schematic layout of a variant implementation of the photosensitive assembly shown in fig. 13E.

Fig. 14 illustrates a schematic diagram of an electronic device according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application and not all of the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, since the large-sized photosensitive chip has the characteristics of large area and small thickness, it is more easily bent by external force or temperature change during the assembly process or the reliability test, resulting in degradation of the imaging quality of the camera module. In order to optimize the imaging quality of the camera shooting module, the prior art thinking is as follows: the bending degree of the photosensitive chip is reduced as much as possible, for example, by reinforcing the bending strength and/or rigidity of the circuit board (for example, attaching a reinforcing plate to the back surface of the circuit board) to prevent the circuit board from bending so as to reduce the bending degree of the photosensitive chip.

For this reason, the inventors found that: the imaging quality of the imaging module is not only influenced by the bending degree of the photosensitive chip (the bending degree of the photosensitive chip influences the field curvature value of the photosensitive chip), but also influenced by the field curvature value of the optical lens. The key to improving the imaging quality of the camera module is to ensure the field curvature of the optical lens to be matched with the field curvature of the photosensitive chip. That is, the bending degree of the photosensitive chip is not a necessary and sufficient condition for the imaging quality of the imaging module, so the conventional technical idea of reducing the bending degree of the photosensitive chip as much as possible is not necessarily capable of improving the imaging quality of the imaging module. Or, the bending degree of the photosensitive chip is not necessarily a negative factor causing the degradation of the imaging quality of the imaging module.

The inventor also found that: different optical lenses often have different field curvature values, and if the field curvature value of the optical lens is too large, the optical lens can be regarded as defective products to be scrapped in actual production occasions, so that the effective utilization rate of the optical lens is not high. The inventors herein have appreciated that: the field curvature of the optical lens is too large, which is a relative concept, and whether the field curvature of the optical lens is too large depends on the field curvature of the photosensitive chip, that is, the field curvature of the optical lens can be adapted by adjusting the field curvature of the photosensitive chip, so that the optical lens which is regarded as defective can be effectively applied.

Based on the above-mentioned cognitive change, the basic idea of the present application is to consider the bending degree of the photosensitive chip as an effective variable affecting the imaging quality of the imaging module, and adjust the bending degree of the photosensitive chip by structural configuration so as to adapt to the field curvature value of the optical lens, so as to improve the consistency of the imaging quality and the imaging quality.

Based on this, this application provides a sensitization subassembly, module and electronic equipment of making a video recording, wherein, sensitization subassembly includes sensitization chip and circuit board subassembly, wherein, circuit board subassembly includes circuit board main part and adjustment layer, sensitization chip set up in on the circuit board main part and electrically connect in the circuit board main part, adjustment layer form in the lower surface of circuit board main part and have be used for adjusting the bending degree of circuit board main part is in order to adjust the structural configuration of the bending degree of sensitization chip. Thus, the bending degree of the photosensitive chip is adjusted by the adjusting layer so as to be suitable for the field curvature of the optical lens.

Having described the basic principles of the present application, various non-limiting embodiments of the present application will now be described in detail with reference to the accompanying drawings.

Exemplary camera Module and photosensitive Assembly

As shown in fig. 1, the camera module according to the embodiment of the present application is illustrated, wherein the camera module 30 includes: a photosensitive assembly 20 and an optical lens 10 held on a photosensitive path of the photosensitive assembly 20. Here, in the image pickup module 30 as illustrated in fig. 1, the image pickup module 30 is implemented as a fixed focus image pickup module 30, that is, the relative positional relationship between the optical lens 10 and the photosensitive member 20 is kept constant.

It should be understood by those skilled in the art that in the embodiment of the present application, the type of the camera module 30 is not limited by the present application. For example, in other examples of the present application, the image capturing module 30 may be implemented as a live focus image capturing module, that is, the image capturing module 30 further includes a driving element (not illustrated in the drawing) disposed on the optical lens 10 and the photosensitive assembly 20, where the driving element is configured to carry and drive the optical lens 10 to move along the photosensitive path so as to change a relative positional relationship between the optical lens 10 and the photosensitive assembly 20. For another example, the image capturing module 30 may be implemented as an anti-shake image capturing module, that is, the image capturing module 30 further includes an anti-shake motor disposed on the optical lens 10 and the photosensitive assembly 20 to implement an anti-shake function through the anti-shake motor. As another example, the camera module 30 may further include a prism, etc., to form a periscope camera module.

Fig. 2 illustrates a schematic view of the photosensitive assembly 20 according to an embodiment of the present application, as shown in fig. 2, in which the photosensitive assembly 20 includes: the circuit board assembly 21, the photosensitive chip 22, the packaging part 23, the filter element 24 and at least one electronic component 25. In the photosensitive assembly 20 illustrated in fig. 2, the photosensitive chip 22 is disposed on the circuit board assembly 21 and is electrically connected to the circuit board assembly 21 through an electrical connection medium such as a lead wire; the at least one electronic component 25 is electrically connected to the circuit board assembly 21 and located in a surrounding area of the photosensitive chip 22; the packaging part 23 packages the at least one electronic component 25 and the photosensitive chip 22 on the circuit board assembly 21, and the packaging part 23 has a light window through which the light passing through the optical lens 10 can be incident into the photosensitive area of the photosensitive chip 22; the filter element 24 is disposed on the photosensitive path of the photosensitive chip 22 to filter the light incident on the photosensitive chip 22.

As shown in fig. 2, in the embodiment of the present application, the circuit board assembly 21 includes a circuit board main body 211, the photosensitive chip 22 is attached to an upper surface of the circuit board main body 211 by an adhesive, and the packaging part 23 is mounted on the upper surface of the circuit board main body 211 so as to package the at least one electronic component 25 and the photosensitive chip 22 on the circuit board main body 211. In particular, in the photosensitive assembly 20 illustrated in fig. 2, the encapsulation portion 23 is implemented as a stand having a separate structure, which may be attached to the upper surface of the circuit board main body 211 by an adhesive. It should be understood that, in other examples of the present application, the encapsulation portion 23 may be formed on the upper surface of the circuit board main body 211 in other manners, for example, it may be integrally formed on the upper surface of the circuit board main body 211 through a molding process such as transfer molding, injection molding, or compression molding, which is not limited to the present application.

In particular, as shown in fig. 2, in the embodiment of the present application, the circuit board assembly 21 further includes an adjustment layer 212, wherein the adjustment layer 212 can act on the circuit board main body 211 to change the bending degree of the circuit board main body 211, so as to controllably adjust the bending degree of the photosensitive chip 22. It should be appreciated that the curvature of the photo-sensing chip 22 affects the field curvature of the photo-sensing chip 22, and accordingly, when the field curvature of the photo-sensing chip 22 is adjusted to match the field curvature of the optical lens 10, the image capturing module 30 has a more optimized and consistent imaging quality.

Further, as shown in fig. 2, in the embodiment of the present application, the adjustment layer 212 is formed on the lower surface of the circuit board main body 211, so that the adjustment layer 212 is structurally associated with the circuit board main body 211. For example, in one possible implementation of the present application, the adjustment layer 212 is integrally coupled to the lower surface of the circuit board body 211 through a process such as injection molding, transfer molding, embossing, etc., so that the adjustment layer 212 can change the stress distribution to which the circuit board body 211 is subjected to adjust the degree of bending of the circuit board body 211. In particular, in the embodiment of the present application, the adjustment layer 212 has a structural configuration for adjusting the bending degree of the circuit board main body 211 to adjust the bending degree of the photosensitive chip 22.

Specifically, in the embodiment of the present application, the structural configuration of the adjustment layer 212 includes that there is a difference between the thermal expansion coefficient of the adjustment layer 212 and the thermal expansion coefficient of the circuit board main body 211. It should be understood that, when there is a difference between the thermal expansion coefficient (or bending modulus) of the material of the adjustment layer 212 and the thermal expansion coefficient (or bending modulus) of the circuit board main body 211, the temperature change may cause the adjustment layer 212 and the circuit board main body 211 to bend to different extents, so that the circuit board main body 211 bends downward to drive the photosensitive chip 22 to bend downward. Experimental tests show that in the embodiment of the present application, by controlling the difference between the thermal expansion coefficient of the adjustment layer 212 and the thermal expansion coefficient of the circuit board main body 211, the bending degree of the circuit board main body 211 can be controlled as follows: the height difference between the peripheral area of the circuit board and the middle area of the circuit board main body 211 ranges from-25 um to 25um, as shown in fig. 3, and the degree of bending of the photosensitive chip 22 can be controlled as follows: the difference in height between the edge region of the photo-sensing chip 22 and the middle region of the photo-sensing chip 22 ranges from-5 um to 5um, as shown in fig. 4.

Further, in the embodiment of the present application, the structural configuration of the adjustment layer 212 further includes a thickness dimension of the adjustment layer 212, more specifically, a relationship between the thickness dimension of the adjustment layer 212 and the thickness dimension of the circuit board main body 211. Specifically, in the embodiment of the present application, the thickness dimension of the adjustment layer 212 may be set to be less than or equal to 120% of the thickness dimension of the circuit board body 211, or the thickness dimension of the adjustment layer 212 may be set to be less than or equal to 110% of the thickness dimension of the circuit board body 211, or the thickness dimension of the adjustment layer 212 may be set to be less than or equal to the thickness dimension of the circuit board body 211. In particular, in the embodiment of the present application, the thickness dimension of the adjustment layer 212 may be set to be in the range of 0.1mm to 0.4mm, and preferably, may be set to be 0.1mm to 0.2mm.

Further, in the embodiment of the present application, the structural configuration of the adjustment layer 212 further includes at least one slot 213 concavely formed on the lower surface of the adjustment layer 212. It should be appreciated that the adjustment layer 212 has different thickness dimensions at the slot 213 and at the slot 213 not so that the adjustment layer 212 has different degrees of bending at the slot 213 and at the slot 213 not so that the degree of bending of the circuit board body 211 can be increased. Experimental tests show that, in the embodiment of the present application, by controlling the configuration of the slot 213, the bending degree of the circuit board main body 211 can be controlled as follows: the height difference between the peripheral area of the circuit board and the middle area of the circuit board main body 211 ranges from-100 um to 100um, that is, in the embodiment of the present application, the height difference between the peripheral area of the circuit board main body 211 and the middle area of the circuit board main body 211 can be controlled to be any value ranging from-100 um to 100um by setting the parameters of the slot 213; and, the bending degree of the photosensitive chip 22 can be controlled as follows: the height difference between the edge area of the photosensitive chip 22 and the middle area of the photosensitive chip 22 ranges from-30 um to 30um, that is, in the embodiment of the present application, the height difference between the edge area of the photosensitive chip 22 and the middle area of the photosensitive chip 22 can be controlled to any value (or, can be controlled to-25 um to 25um, or, can be controlled to-20 um to 20um, or, can be controlled to-15 um to 15 um) by setting the parameters of the slot 213.

It should be noted that, when the adjustable range of the bending degree of the photosensitive chip 22 is enlarged to such a large extent, the photosensitive chip 22 can adapt to more optical lenses 10 with different field curvature values, i.e. the optical lenses 10 with different field curvature values can be utilized to produce the image capturing module 30 with qualified imaging quality, so as to improve the utilization rate of the optical lenses 10 and reduce the cost. In addition, the optical lens 10 of multiple batches with different curvature of field values can produce the image pickup module 30 with better curvature of field consistency.

Further, in the embodiment of the present application, in order to obtain a further adjustment effect, the configuration of the slot 213 is defined, that is, in the embodiment of the present application, the structural configuration of the adjustment layer 212 further includes the configuration of the slot 213.

Specifically, in the embodiment of the present application, the depth dimension of the at least one slot 213 is less than or equal to the thickness of the circuit board main body 211; the shape of the slot 213 is not limited in this application, and may be a rectangular, circular, or annular lamp symmetrical shape, or may be any other suitable asymmetrical shape; the number of slots 213 is not limited in this application, and may be singular or plural.

In particular, in the embodiment of the present application, the formation position of the slot 213 is defined. Specifically, when the number of the slots 213 exceeds two (i.e., the at least one slot 213 includes at least two slots 213), it is preferable that the at least two slots 213 are symmetrically distributed with respect to a central axis set by the circuit board body 211. It should be understood that, when the at least two slots 213 are symmetrically distributed with respect to the central axis set by the circuit board body 211, the circuit board body 211 can be more uniformly and uniformly bent toward the central axis of the circuit board body 211, so that the photosensitive chip 22 can also be more uniformly and uniformly bent toward the central area of the photosensitive chip 22. When the at least one slot 213 includes only one slot 213, it is preferable that the slot 213 is disposed on a central axis defined by the circuit board main body 211.

It is also possible that, in order to control the bending effect of the photosensitive chip 22, in other examples of the present application, when the number of the grooves 213 exceeds two (i.e., the at least one groove 213 includes at least two grooves 213), the at least two grooves 213 are uniformly and at intervals arranged with respect to the center set by the adjustment layer 212 along the circumferential direction of the adjustment layer 212. For example, when the at least two grooves 213 are implemented as 3 grooves 213, they are uniformly and intermittently arranged along the circumferential direction of the adjustment layer 212 at 120 ° with respect to the center set by the adjustment layer 212.

Fig. 5A to 5D illustrate specific examples of the position setting of the slot 213 according to the embodiment of the present application. As shown in fig. 5A to 5C, in these examples, the adjustment layer 212 is provided with at least one indication line for indicating the set position of the slot 213, and in particular, in the examples illustrated in fig. 5A to 5C, the adjustment layer 212 has two diagonal lines thereof, and two axisymmetric lines are indication lines. Specifically, in the example illustrated in fig. 5A, the at least one slot 213 includes four slots 213, which are disposed on two diagonals of the adjustment layer 212, respectively, and the four slots 213 are symmetrically distributed with respect to two symmetry axes of the adjustment layer 212. In the example illustrated in fig. 5B, the at least one slot 213 includes two slots 213, which are disposed on both sides of the transverse symmetry axis of the adjustment layer 212, respectively, and the two slots 213 are symmetrically distributed with respect to the longitudinal symmetry axis of the adjustment layer 212 (likewise, the two slots 213 are symmetrically distributed with respect to the transverse symmetry axis of the adjustment layer 212). In the example illustrated in fig. 5C, the at least one slot 213 includes four slots 213 that are communicated with each other to form a cross shape, which are respectively disposed on two symmetry axes of the adjustment layer 212 and the four slots 213 are symmetrically distributed with respect to the two symmetry axes of the adjustment layer 212. In the example illustrated in fig. 5D, the at least one slot 213 includes only one slot 213, which is disposed in a central region of the adjustment layer 212 and the slots 213 are symmetrically distributed with respect to two symmetry axes of the adjustment layer 212.

It should be understood that, in other examples of the present application, the indication line of the adjustment layer 212 may be determined based on other manners, for example, two diagonal lines, two axisymmetric lines, and an octant line of the adjustment layer 212 are taken as indication lines, which is not limited in the present application. Meanwhile, in other examples of the present application, the position of the at least one slot 213 may be set in other manners, which is not limited to the present application.

It should be noted that, as shown in fig. 6, when a portion of the slots 213 in the at least one slot 213 is adjacently disposed at the edge position of the adjustment layer 212, preferably, in order to prevent the edges of the slots 213 from being broken, a distance c between the outermost edge of the slots 213 adjacently disposed at the edge of the adjustment layer 212 and the periphery of the adjustment layer 212 is greater than or equal to 0.1mm, preferably, greater than or equal to 0.3mm.

It is also worth mentioning that in the embodiment of the present application, the circuit board assembly 21 further includes a flexible connection board 214 electrically connected to the circuit board main body 211 and a connector 215 connected to the flexible connection board 214, as shown in fig. 7. In order to ensure sufficient strength and rigidity between the circuit board main body 211 and the flexible connection board 214, it is preferable in the embodiment of the present application to leave a gap on one side of the circuit board main body 211 and the flexible connection board 214, wherein the gap is not provided in the adjustment layer 212 nor the encapsulation portion 23. That is, in order to ensure sufficient strength and hardness between the circuit board main body 211 and the flexible connection board 214, in the embodiment of the present application, a certain gap is provided between the adjustment layer 212 and the flexible connection board 214, so that the flexible connection board 214 and the circuit board main body 211 have sufficient bonding space to improve bonding strength and hardness therebetween.

Further, in the specific implementation, the present inventors found that: when the adjustment layer 212 completely covers the conductive layer 2115 formed on the lower surface of the circuit board main body 211 and used for realizing grounding (for example, the depth of all the slots 213 is smaller than the thickness of the adjustment layer 212, i.e., all the slots 213 are grooves), the grounding performance of the camera module 30 is poor, which easily causes damage to devices due to too high local position voltage, and has potential safety hazards, and at the same time, may also affect the photographing performance of the camera module 30.

Specifically, as shown in fig. 10, in the embodiment of the present application, the circuit board main body 211 includes a plurality of wiring layers 2111 and a plurality of insulating layers 2112 formed between an upper surface thereof and a lower surface thereof, and a plurality of the wiring layers 2111 and a plurality of the insulating layers 2112 are laminated to be staggered with each other, wherein a portion of the plurality of the wiring layers 2111 formed on the lower surface of the circuit board main body 211 is the conductive layer 2115 (more specifically, in the embodiment of the present application, the conductive layer 2115 is a copper layer), and a plurality of the wiring layers 2111 are connected to each other through conductive vias. More specifically, in the wiring board main body 211, the conductive through holes include two types of conductive through holes: a first type of conductive vias 2113 for signal connection (i.e., to enable communicative connection between the plurality of wiring layers 2111), and a second type of conductive vias 2114 for electromagnetic shielding, heat dissipation, and grounding.

In order to enhance the grounding performance of the photosensitive assembly 20, as shown in fig. 8, in a variant embodiment of the present application, at least one slot 213 of the slots 213 penetrates through the adjustment layer 212 to expose at least a portion of the lower surface of the circuit board, that is, in this variant embodiment, at least one through slot exists in the slots 213. In particular, the position of the slot 213 penetrating the adjustment layer 212 corresponds to the conductive layer 2115, so that at least a part of the conductive layer 2115 is exposed, and in this way, the grounding performance of the camera module 30 can be enhanced, and the heat dissipation performance of the camera module 30 can be enhanced. Fig. 12 illustrates a schematic diagram of the electrical connection between the camera module 30 and the electronic device main body 101 according to the embodiment of the present application, as shown in fig. 12, the ground line 102 of the electronic device main body has an electrical connection terminal 103, and the electrical connection terminal 103 is electrically connected to a portion of the conductive layer 2115 exposed to the slot 213, so as to implement the connection between the camera module 30 and the ground line 102 of the electronic device. Preferably, in the embodiment of the present application, the shape of the electrical connection terminal 103 is adapted to the shape of the slot 213.

Fig. 9 illustrates a schematic diagram of another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. In the modified embodiment as illustrated in fig. 9, the slot 213 (the through slot) penetrating the adjustment layer 212 is formed in an edge region of the adjustment layer 212, that is, the through slot is an edge slot.

In order to make the camera module 30 have better grounding performance and heat dissipation performance, in the embodiment of the present application, the circuit board assembly 21 further includes a second conductive layer 216 electrically connected to the conductive layer 2115, as shown in fig. 13A. Accordingly, the camera module 30 may be grounded through the second conductive layer 216.

In a variant embodiment as illustrated in fig. 13A, the second conductive layer 216 is formed in the slot 213 penetrating the adjustment layer 212, and the second conductive layer 216 may be disposed in the slot 213 penetrating the adjustment layer 212 by spraying, printing, welding, plating, pressing, or the like. In an implementation, the second conductive layer 216 includes, but is not limited to: conductive paste, conductive silver paste, conductive ink, metal foil, metal film, conductive film, etc., wherein the thickness dimension of the second conductive layer 216 may be set to 2um-30um, preferably 4um-20um.

Further, in the modified embodiment as illustrated in fig. 13A, the second conductive layer 216 covers the sidewall of the slot 213 penetrating the adjustment layer 212, the conductive layer 2115 is exposed to the area within the slot 213, and the lower surface of the adjustment layer 212. That is, in a variant implementation as illustrated in fig. 13A, the second conductive layer 216 covers the entire back surface of the adjustment layer 212. Also, the thickness of the second conductive layer 216 may be uniform or non-uniform at every location, which is not limited in this application.

Fig. 13B illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. In a variant implementation as illustrated in fig. 13B, the second conductive layer 216 covers a portion of the conductive layer 2115 exposed within the slot 213 and a portion of the sidewall of the slot 213.

Fig. 13C illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. In a variant embodiment, as illustrated in fig. 13C, the second conductive layer 216 fills the slot 213 through the adjustment layer 212.

Fig. 13D illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. In a variant implementation as illustrated in fig. 13D, the circuit board assembly 21 further includes a conductive member 217 disposed between the conductive layer 2115 and the second conductive layer 216. In particular, in this variant embodiment, the conductive element 217 may be implemented as a metal sheet, the shape and size of which are adapted to the slot 213.

Fig. 13E illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. Fig. 13F illustrates a partially enlarged schematic view of the deformation implementation of the photosensitive member 20 illustrated in fig. 13E. As shown in fig. 13E and 13F, in this modification, in order to reduce the difficulty of the layout of the second conductive layer 216 and to increase the bonding strength between the second conductive layer 216 and the adjustment layer 212, in this modification, the side walls of the slots 213 penetrating through the adjustment layer 212 are inclined to the lower surface of the circuit board main body 211, and an inclination angle exists between the side walls of the slots 213 and the lower surface of the circuit board main body 211. In this variant implementation, the inclination angle may be set between 3 ° and 80 °, further between 5 ° and 60 °, between 5 ° and 30 °, or other reasonable ranges, which are not limiting to the present application.

As described above, in the embodiment of the present application, the circuit board main body 211 includes two types of conductive vias: a first type of conductive vias 2113 for signal connection and a second type of conductive vias 2114 for electromagnetic shielding, heat dissipation and grounding. Also, it should be understood that when the adjustment layer 212 is integrally coupled to the lower surface of the circuit board body 211 through processes such as injection molding, transfer molding, embossing, etc., the grooves 213 of the adjustment layer 212 are pressed by the pressing head of the molding die so that the corresponding positions are not covered by the material of which the adjustment layer 212 is made. Preferably, during the manufacturing process, the pressing head of the forming mold should avoid the first type conductive through hole 2113 as much as possible (as shown in fig. 9), so as to avoid the first type conductive through hole 2113 from being damaged by the pressing head, and damage the conductive performance of the circuit board. That is, preferably, in the embodiment of the present application, the area of the adjustment layer 212 covering the lower surface of the circuit board main body 211 includes an area where at least a part of the first type conductive via 2113 corresponds to the lower surface of the circuit board main body 211.

In summary, the image capturing module 30 and the photosensitive assembly 20 thereof according to the embodiments of the present application are illustrated, in which the adjusting layer 212 for adjusting the bending degree of the photosensitive chip 22 is disposed under the circuit board, so that the bending degree of the photosensitive chip 22 is adapted to the curvature of field of the optical lens 10 through the structural configuration of the adjusting layer 212, and in this way, the image capturing module 30 has more optimized imaging quality and relatively higher consistency of actual imaging quality.

Also, in the embodiment of the present application, the bending degree of the photosensitive chip 22 can be adjusted by the structural configuration of the adjustment layer 212, so that the curvature of field of the photosensitive chip 22 corresponds to the curvature of field of the optical lens 10. That is, in the embodiment of the present application, the bending degree of the photosensitive chip 22 is an effective variable for optimizing the actual imaging quality of the image capturing module 30.

In addition, in the embodiment of the present application, the bending degree of the photosensitive chip 22 can be adjusted and adapted by the adjusting layer 212, so that the plurality of optical lenses 10 with different curvature of field values can also generate the image capturing module 30 with better curvature of field consistency. That is, in the embodiment of the present application, the non-uniformity of the field curvature value of the optical lens 10 can be adapted by adjusting the curvature degree of the photosensitive chip 22, so as to improve the effective utilization rate of the optical lens 10.

In addition, in an embodiment of the present application, the adjustment layer 212 has a slot 213 penetrating through the adjustment layer 212 to expose at least a portion of the conductive layer 2115 formed on the lower surface of the circuit board for grounding, so as to improve the grounding performance of the camera module 30.

In addition, in an embodiment of the present application, the adjustment layer 212 has a slot 213 penetrating through the adjustment layer 212 to expose at least a portion of the lower surface of the circuit board, so as to improve the heat dissipation performance of the camera module 30.

Schematic electronic device

According to yet another aspect of the present application, an electronic device is also provided. Fig. 14 illustrates a schematic diagram of an electronic device according to an embodiment of the present application, and as shown in fig. 14, the electronic device 100 includes an electronic device main body 101 and an image capturing module 30 assembled to the electronic device main body 101. Specifically, the camera module 30 is mounted on the front side of the electronic device main body 101 as a front camera module 30; or mounted on the rear side of the electronic device main body 101, as the rear camera module 30, the present application is not limited thereto.

As shown in fig. 12, in the embodiment of the present application, the electronic device main body 101 includes a ground line 102 having an electrical connection terminal 103, and the electrical connection terminal 103 is electrically connected to a portion of the conductive layer 2115 exposed to the slot 213, so as to connect the camera module 30 with the ground line 102 of the electronic device 100. Preferably, in the embodiment of the present application, the shape of the electrical connection terminal 103 is adapted to the shape of the slot 213. It should be appreciated that, in other examples of the present application, the electrical connection terminal 103 of the ground line 102 may also be electrically connected to the second conductive layer 216, so as to connect the camera module 30 with the ground line 102 of the electronic device 100.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A photosensitive assembly, comprising:

a photosensitive chip; and

the circuit board assembly comprises a circuit board main body and an adjusting layer, wherein the photosensitive chip is arranged above the circuit board main body and is electrically connected with the circuit board main body, and the adjusting layer is provided with a structural configuration for adjusting the bending degree of the photosensitive chip; the adjusting layer is formed on the lower surface of the circuit board main body, and the structural configuration of the adjusting layer is configured to adjust the circuit board main body to bend downwards and adjust the bending degree of the circuit board so as to drive the photosensitive chip to bend downwards and adjust the bending degree of the photosensitive chip;

the structure configuration comprises at least one slot formed on the lower surface of the adjusting layer in a recessed way, so that the adjusting layer has different bending degrees at the slot and the position where the slot is not arranged, and the bending degree of the circuit board main body is increased in such a way;

At least one slot of the at least one slot penetrates through the adjusting layer, the circuit board main body comprises a conductive layer which is formed on the lower surface of the circuit board and used for grounding, and the slot penetrating through the adjusting layer exposes at least part of the area of the conductive layer.

2. The photosensitive assembly of claim 1, wherein the structural configuration comprises a difference between a coefficient of thermal expansion of the adjustment layer and a coefficient of thermal expansion of the circuit board body.

3. The photosensitive assembly of claim 2, wherein the structural configuration comprises a thickness dimension of the adjustment layer in a range of 0.1mm to 0.4mm.

4. A photosensitive assembly according to claim 3, wherein the thickness dimension of the adjustment layer ranges from 0.1mm to 0.2mm.

5. The photosensitive assembly of claim 3, wherein the structural configuration comprises a thickness dimension of the adjustment layer that is less than or equal to 120% of a thickness dimension of the circuit board body.

6. The photosensitive assembly of claim 5, wherein the adjustment layer has a thickness dimension that is less than or equal to 110% of the thickness dimension of the circuit board body.

7. The photosensitive assembly of claim 6, wherein a thickness dimension of the adjustment layer is less than or equal to a thickness dimension of the circuit board body.

8. The photosensitive assembly of claim 1, wherein a depth dimension of the at least one slot is less than or equal to a thickness of the adjustment layer.

9. The photosensitive assembly of claim 1, wherein the slot is disposed on a central axis defined by the circuit board body.

10. The photosensitive assembly of claim 1, wherein the at least one slot comprises at least two slots, wherein the at least two slots are symmetrically distributed with respect to a central axis defined by the circuit board body.

11. The photosensitive assembly of claim 1, wherein the at least one slot comprises at least two slots, wherein the at least two slots are uniformly and spaced apart along a circumferential direction of the adjustment layer relative to a central axis defined by the circuit board body.

12. The photosensitive assembly of claim 1, wherein a distance between an outermost edge of the slot and a peripheral edge of the adjustment layer is greater than or equal to 0.1mm.

13. The photosensitive assembly of claim 12, wherein a distance between an outermost edge of the slot and a periphery of the adjustment layer is greater than or equal to 0.3mm.

14. The photosensitive assembly of claim 1, wherein the adjustment layer is integrally formed on a lower surface of the circuit board.

15. The photosensitive assembly of claim 14, wherein the adjustment layer is made of a resin material.

16. The photosensitive assembly according to claim 2, wherein the degree of bending of the wiring board body is in a range of-25 um to 25um in a height difference between a peripheral region of the wiring board and a middle region of the wiring board body.

17. The photosensitive assembly of claim 16, wherein the extent of curvature of the photosensitive chip is in a range of-5 um to 5um in a height difference between an edge region of the photosensitive chip and a middle region of the photosensitive chip.

18. The photosensitive assembly of claim 1, wherein the degree of bending of the circuit board body is in a range of-100 um to 100um in height difference between a peripheral region of the circuit board and a middle region of the circuit board body.

19. The photosensitive assembly of claim 18, wherein the extent of curvature of the photosensitive chip is in a range of-30 um to 30um in a height difference between an edge region of the photosensitive chip and a middle region of the photosensitive chip.

20. The photosensitive assembly of claim 1, wherein the slot extending through the adjustment layer is formed in an edge region of the adjustment layer.

21. The photosensitive assembly of claim 20, wherein the circuit board body comprises a plurality of wiring layers formed between an upper surface thereof and a lower surface thereof, the plurality of wiring layers being communicably connected by a first type of conductive via, wherein an area of the adjustment layer covering the lower surface of the circuit board body comprises an area of at least a portion of the first type of conductive via corresponding to the lower surface of the circuit board body.

22. The photosensitive assembly of claim 20, further comprising a second conductive layer electrically connected to the conductive layer.

23. The photosensitive assembly of claim 22, wherein the second conductive layer is formed within the slot through the adjustment layer.

24. The photosensitive assembly of claim 23, wherein the second conductive layer is further formed on a lower surface of the adjustment layer.

25. The photosensitive assembly of claim 22, wherein the sidewall of the slot extending through the adjustment layer is inclined to the lower surface of the circuit board body.

26. The photosensitive assembly of claim 1, wherein the wiring board assembly further comprises a flexible connection board electrically connected to the wiring board body and a connector connected to the flexible connection board, wherein a gap is provided between the adjustment layer and the flexible connection board.

27. A camera module, comprising:

an optical lens; and

the photosensitive assembly of any of claims 1-26, wherein the optical lens is retained in a photosensitive path of the photosensitive assembly.

28. The camera module of claim 27, wherein a curvature of field of the optical lens is adapted to a curvature of the light sensitive chip.

29. An electronic device, comprising:

an electronic device main body; and

an image pickup module assembled to the electronic apparatus main body, comprising an optical lens and the photosensitive assembly according to any one of claims 1 to 26, wherein the optical lens is held on a photosensitive path of the photosensitive assembly.

30. The electronic device of claim 29, wherein the electronic device body comprises a ground wire having an electrical connection, the electrical connection of the ground wire being electrically connected to the conductive layer.

31. An electronic device, comprising:

an electronic device body including a ground wire having an electrical connection terminal; and

an image pickup module assembled to the electronic device main body, comprising an optical lens and a photosensitive assembly according to any one of claims 22 to 25, wherein the optical lens is held on a photosensitive path of the photosensitive assembly, and the electrical connection end of the ground wire is electrically connected to the second conductive layer.