CN113840051A - Optical anti-shake device and electronic device - Google Patents
Optical anti-shake device and electronic device Download PDFInfo
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- CN113840051A CN113840051A CN202010578217.6A CN202010578217A CN113840051A CN 113840051 A CN113840051 A CN 113840051A CN 202010578217 A CN202010578217 A CN 202010578217A CN 113840051 A CN113840051 A CN 113840051A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 37
- 230000033001 locomotion Effects 0.000 claims abstract description 50
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 45
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- 230000008878 coupling Effects 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims abstract description 9
- 238000005859 coupling reaction Methods 0.000 claims abstract description 9
- 230000008054 signal transmission Effects 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000003990 capacitor Substances 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 230000008602 contraction Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- Engineering & Computer Science (AREA)
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- Signal Processing (AREA)
- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The invention provides an optical anti-shake device and electronic equipment which adopt a mobile image sensor chip for motion compensation, wherein the optical anti-shake device adopts the mobile image sensor chip for motion compensation, the image sensor chip is fixedly arranged on a carrier plate, and the carrier plate is connected with an external circuit of the lower substrate in a capacitive coupling mode through the elastic conductive piece and realizes electric conduction and signal transmission; the image sensor chip moves in X, Y direction and rotates in plane under the drive of the shape memory alloy drive component to perform motion compensation. The optical anti-shake device and the electronic equipment thereof provided by the invention have the advantages of simple structure and simple manufacturing process, and can reduce the product yield, reduce the manufacturing cost, improve the reliability and improve the image quality.
Description
Technical Field
The invention relates to the technical field of image imaging, in particular to an optical anti-shake device and an electronic device which adopt a moving image sensor chip to perform motion compensation.
Background
When the portable handheld intelligent device shoots, physiological vibration of a human body cannot be avoided, the physiological vibration cannot be overcome through training, the portable handheld intelligent device inevitably shakes along with the human body when the portable handheld intelligent device shoots, image quality is reduced, and the most obvious image is fuzzy and unclear.
The existing handheld portable intelligent equipment uses a lens component which can move in the XY axis direction in a camera module, so that the aim of compensating physiological vibration of a human body is fulfilled, and a high-quality image is obtained. However, with the progress of technology and the increasing pursuit of images by consumers, the camera module of the existing handheld portable intelligent device has a proportionally increased and heavier lens due to the increase of the image sensor. Conventional methods of compensating for movement of the lens in the XY-axis direction have made it increasingly difficult to push a heavy lens. And the angle which can be compensated by the method for carrying out motion compensation on the lens in the XY axis direction cannot meet the requirement of a customer on the image quality.
In the prior art, the optical anti-shake method provided by the movable photosensitive element has a complex structure, is mostly applied to single-lens reflex digital cameras, and is rarely applied to cases of handheld portable intelligent devices.
Disclosure of Invention
The invention aims to provide an optical anti-shake device for motion compensation by adopting a moving image sensor chip, which solves the technical problems that in the prior art, a lens is subjected to motion compensation in XY axis directions, the lens is difficult to push and has a large volume due to heavy weight, the compensation of certain angles is difficult to meet, and the high image quality requirement is not met.
In order to solve the above technical problem, the present invention provides an optical anti-shake apparatus for performing motion compensation using a moving image sensor chip, comprising:
the image sensor comprises an image sensor chip, a carrier plate, an elastic conductive piece, a lower substrate and a shape memory alloy driving assembly, wherein the image sensor chip is fixedly arranged on the carrier plate, and the carrier plate is connected with an external circuit of the lower substrate in a capacitive coupling mode through the elastic conductive piece to realize electrical conduction and signal transmission;
the image sensor chip moves in X, Y direction and rotates in plane under the drive of the shape memory alloy drive component to perform motion compensation.
Preferably, the carrier plate is further provided with: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection of the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip.
Preferably, the shape memory alloy driving component is suitable for deforming under the condition of electrifying so as to drive the image sensor chip to move in the direction X, Y and rotate in a plane for motion compensation;
the elastic conductive piece is suitable for driving the image sensor chip to recover the original position through resilience force under the condition that the shape memory alloy driving assembly is powered off, and is also suitable for transmitting power signals and control signals of the image sensor.
Preferably, the elastic conductive member is a plurality of groups of L-shaped metal wires, a first end of each L-shaped metal wire is connected to one corner of one side of the carrier plate, and a second end of each L-shaped metal wire is connected to the lower substrate of the non-corresponding side of the carrier plate.
Preferably, the shape memory alloy drive assembly comprises: one end of the shape memory alloy wire is electrically connected with the carrier plate, and the other end of the shape memory alloy wire is electrically connected with the lower substrate below the image sensor chip so as to be electrically communicated with an external circuit; at least two shape memory alloy wires are arranged.
Preferably, the shape memory alloy wire is adapted to be disposed on two or four sides of the image sensor chip.
Preferably, the carrier plate is further provided with: a resistance unit, a capacitance unit and a circuit wiring unit;
the circuit wiring unit is suitable for providing a pin of the image sensor chip and a conductive path of the elastic conductive piece so as to be electrically connected to a circuit on the lower substrate;
the resistance unit and the capacitance unit are communicated with the circuit wiring unit.
Preferably, the circuit wiring unit is further provided with an upper plate unit, the lower substrate is further provided with a lower plate unit, the upper plate unit and the lower plate unit correspond to each other, and the high-speed image data signals of the image sensor chip are transmitted in an alternating current coupling mode.
Preferably, the upper plate unit is a metal plate disposed on the lower surface of the carrier plate, and the metal plate is uniformly distributed on four sides of the carrier plate.
Preferably, the capacitor unit is disposed around the chip.
Preferably, the capacitor unit includes a plurality of capacitors arranged in a stripe shape and disposed on both sides of the chip.
Preferably, the image sensor chip is electrically connected to the carrier board by a wire bonding or Flip chip bonding (Flip chip).
Preferably, an outer fixing frame is further provided, which is suitable for limiting the movement of the image sensor chip in a certain space; the outer fixing frame is arranged on the lower base plate.
Preferably, the displacement of the image sensor chip is fed back through the change of the resistance of the shape memory alloy wire after the shape memory alloy wire is electrified.
Compared with the prior art, the optical anti-shake device adopting the moving image sensor chip to perform motion compensation has the following beneficial effects:
in the optical anti-shake device adopting the moving image sensor chip for motion compensation, which is provided by the technical scheme of the invention, the image sensor chip is adopted for motion compensation, and the image sensor chip is electrically communicated with an external circuit in a metal bonding and/or flip bonding mode, so that the optical anti-shake device has a simple structure and a simple manufacturing process, can reduce the product yield, reduce the manufacturing cost, improve the reliability and improve the image quality.
Furthermore, in the technical solution provided by the present invention, the image sensor chip is disposed and electrically connected to the carrier board, and the connection ports between the image sensor chip and the external circuit are simplified by combining the image sensor chip with the carrier board through the circuit, so that the circuit between the carrier board and the lower substrate is reduced, the movement resistance of the carrier board (including the image sensor chip) is reduced, and the flexibility of the movement of the carrier board is increased.
Furthermore, in the technical scheme provided by the invention, the carrier plate and the lower substrate are electrically connected and elastically contacted by adopting the elastic conductor with the metal (thick) wire structure, so that the whole structure is simple, and the flexibility of the movement of the carrier plate is increased.
Furthermore, in the technical scheme provided by the invention, the image signals are transmitted in an alternating current coupling mode through the capacitor formed by the corresponding electrodes on the lower surface of the carrier plate and the upper surface of the lower substrate, so that the whole structure is simple, and the flexibility of the movement of the carrier plate is increased.
Furthermore, in the technical scheme provided by the invention, the shape memory alloy wire is adopted to provide the driving force, the elastic deflection part provides the restoring force, and the structure is light and simple, the volume is small, and the cost is low.
Furthermore, in the technical scheme provided by the invention, the resistance value change of the shape memory alloy wire in the deformation process can reflect the displacement condition of the chip, a Hall feedback loop is not required to be arranged to feed back the displacement condition, and the shape memory alloy wire has the advantages of simple structure, small volume and low cost.
Drawings
Fig. 1 to 2 are schematic structural diagrams of an optical anti-shake apparatus for performing motion compensation by using a moving image sensor chip according to an embodiment of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.
Next, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, the schematic diagrams are only examples for convenience of description, and the scope of the present invention should not be limited herein.
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, an optical anti-shake apparatus for motion compensation using a moving image sensor chip according to the present invention is described in detail below with reference to the accompanying drawings.
The technical scheme of the invention provides an optical anti-shake device, which achieves the purpose of optical anti-shake compensation by utilizing the translation of an image sensor chip in an XY axis and the rotation around a chip optical axis.
Specifically, the embodiments of the present disclosure are specifically described below with reference to fig. 1 to 2.
Specifically, the present embodiment provides an optical anti-shake apparatus using a moving image sensor chip for motion compensation, including:
the image sensor comprises an image sensor chip 111, a carrier plate 100 for bearing the image sensor chip 111 and a lower substrate 200, wherein the carrier plate is electrically communicated with an external circuit of the lower substrate and transmits signals in an elastic conductive piece and capacitive coupling mode. A shape memory alloy driving assembly 300 and a resilient member are further disposed between the carrier plate 100 and the lower substrate 200. The image sensor chip 111 and the carrier 100 are driven by the shape memory alloy driving assembly 300 to move in the direction X, Y and rotate in a plane for motion compensation.
Further, in this embodiment, an outer fixing frame 500 is further provided, and the outer fixing frame 500 is disposed on the lower substrate 200 and is adapted to limit the movement of the image sensor chip 111 in a certain space.
Specifically, the image sensor chip 111 is fixedly disposed on the carrier board 100, and the carrier board 100 is connected to the lower substrate 200 through the elastic conductive member 340 and the capacitive coupling, so that the image sensor chip 111 is electrically connected to an external circuit (not shown) and transmits signals.
Specifically, in this embodiment, the carrier plate 100 further includes: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip; in this embodiment, the circuit wiring unit on the carrier board 100 combines the pins of the image sensor chip 111 by wires, which simplifies the external circuit of the chip and reduces the connection points between the carrier board 100 and the circuit on the lower substrate 200.
The circuit wiring unit is further provided with an upper plate unit, the lower substrate 200 is further provided with a lower plate unit, the upper plate unit and the lower plate unit correspond to each other, and high-speed image data signals of the image sensor chip are transmitted in an alternating current coupling mode.
The upper plate unit is a metal plate disposed on the lower surface of the carrier plate 100, and the metal plate is uniformly distributed on the lower surface of the carrier plate 100.
Then, the carrier board 100 is electrically connected to the lower substrate 200 by using the elastic conductive member 340. With such a design, the number of gold wires between the carrier 100 and the lower substrate 200 is reduced, and thus the motion resistance of the carrier 100 carrying the image sensor chip 111 in the motion compensation required for anti-shake is reduced, which increases flexibility.
Specifically, in this embodiment, the capacitor unit 330 is disposed around the chip. Preferably, the capacitor unit 330 includes a plurality of capacitors arranged in a stripe shape and disposed on two sides of the image sensor chip 111.
Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 by a Flip chip bonding (Flip chip) or a metal wire bonding.
In particular, with reference to fig. 2, in the present embodiment, the shape memory alloy driving assembly 300 includes: a shape memory alloy wire 301, wherein one end of the shape memory alloy wire 301 is electrically connected to the carrier board 100, and the other end of the shape memory alloy wire 301 is electrically connected to the lower substrate 200 below the image sensor chip 111 to electrically communicate with an external circuit; at least two shape memory alloy wires 301 are distributed on two opposite sides of the carrier plate 100 to keep the motion balance of the carrier plate. Preferably, the number of the shape memory alloy wires 301 is four, and the four shape memory alloy wires are uniformly distributed on four sides of the carrier plate 100.
The shape memory alloy driving assembly 300 is adapted to deform when energized to drive the image sensor chip 111 to move in direction X, Y and to rotate in a plane for motion compensation.
In addition, as shown in fig. 1, in this embodiment, the carrier board 100 further includes: a resilient conductive member 340;
the elastic conductive member is adapted to drive the image sensor chip 111 to recover to the original position by a resilient force when the shape memory alloy driving assembly 300 is powered off, and is further adapted to transmit a power signal and a control signal of the image sensor.
Specifically, in this embodiment, the elastic conductive member 340 has at least one bending portion, and partially surrounds the image sensor chip.
Specifically, the elastic conductive members 340 are a plurality of groups of L-shaped metal wires, a first end of each L-shaped metal wire is connected to one corner of one side of the carrier board 100, and a second end of each L-shaped metal wire is connected to the lower substrate 200 on the non-corresponding side of the carrier board 100.
At least two elastic conductive pieces are arranged in sequence in an end-to-end connection mode according to the same direction and mode.
And the two mounting ends of the elastic conductive member 340 are not in a horizontal plane, so that the elastic conductive member has an elastic pre-stress in the-Z direction in the Z-axis direction. Therefore, the carrier plate can be stably positioned on the lower substrate.
Specifically, in this embodiment, the shape memory alloy wire 301 is adapted to be disposed around the image sensor chip 111, corresponding to the elastic conductive member.
Specifically, the resilience of the elastic conductive member is opposite to the direction of the traction force generated by the contraction of the shape memory alloy wire 301 when the shape memory alloy wire 301 is powered on, so that when the shape memory alloy wire 301 is powered off and returns to the original state, the resilience provided by the elastic conductive member can rapidly drive the carrier plate to return to the original position, so as to ensure that the position of the image sensor chip 111 is rapidly returned to the original position.
Further, in the technical solution provided by the present invention, the shape memory alloy wire 301 and the elastic conductive member are mutually matched and disposed between the carrier board 100 and the lower substrate 200, so that the carrier board 100 can drive the image sensor chip 111 to move to complete the anti-shake position compensation function through the shape memory alloy wire 301 when the power is turned on, and can also rapidly drive the image sensor chip 111 to recover to the original position under the action of the resilience force of the elastic conductive member when the power is turned off.
The shape memory alloy wire 301 and the elastic conductive member are both slender components and are arranged on two sides or the periphery of the carrier plate 100 in a mutually matched manner, so that excessive space of the whole optical anti-shake device for performing motion compensation by adopting a mobile image sensor chip is not occupied, and the whole volume of the optical anti-shake device for performing motion compensation by adopting the mobile image sensor chip can be saved.
Specifically, in this embodiment, the displacement of the image sensor chip is fed back by the change in resistance of the shape memory alloy wire after energization. Therefore, in the technical scheme provided by the invention, the displacement condition of the image sensor chip 111 can be reflected through the resistance value of the shape memory alloy wire, a Hall feedback ring is not required to be arranged to feed back the displacement condition, and the image sensor chip is simple in structure, small in size and low in cost.
In addition, the embodiment provided by the invention further comprises an electronic device, which comprises the optical anti-shake device for performing motion compensation by adopting the moving image sensor chip.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (16)
1. An optical anti-shake apparatus for performing motion compensation using a moving image sensor chip, comprising:
the image sensor comprises an image sensor chip, a carrier plate, an elastic conductive piece, a lower substrate and a shape memory alloy driving assembly, wherein the image sensor chip is fixedly arranged on the carrier plate, and the carrier plate is connected with an external circuit of the lower substrate in a capacitive coupling mode through the elastic conductive piece to realize electrical conduction and signal transmission;
the image sensor chip moves in X, Y direction and rotates in plane under the drive of the shape memory alloy drive component to perform motion compensation.
2. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1, wherein the carrier board further comprises: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection of the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip.
3. The optical anti-shake apparatus for motion compensation using a moving image sensor chip of claim 1, wherein the shape memory alloy driving component is adapted to deform when powered on to drive the image sensor chip to move in X, Y direction and rotate in plane for motion compensation;
the elastic conductive piece is suitable for driving the image sensor chip to recover the original position through resilience force under the condition that the shape memory alloy driving assembly is powered off, and is also suitable for transmitting power signals and control signals of the image sensor.
4. The optical anti-shake apparatus for motion compensation using a moving image sensor chip as claimed in claim 2, wherein the elastic conductive member has at least one bending portion, and the bending portion surrounds the image sensor chip.
5. The optical anti-shake apparatus for motion compensation using a moving image sensor chip as claimed in claim 1, wherein the elastic conductive member is a plurality of L-shaped metal wires, a first end of each L-shaped metal wire is connected to one corner of one side of the carrier board, and a second end of each L-shaped metal wire is connected to a lower substrate of a non-corresponding side of the carrier board.
6. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 2, wherein the shape memory alloy driving assembly comprises: one end of the shape memory alloy wire is electrically connected with the carrier plate, and the other end of the shape memory alloy wire is electrically connected with the lower substrate below the image sensor chip so as to be electrically communicated with an external circuit; at least two shape memory alloy wires are arranged.
7. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 5, wherein the shape memory alloy wire is adapted to be disposed on two or four sides of the image sensor chip.
8. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1, wherein the carrier board further comprises: a resistance unit, a capacitance unit and a circuit wiring unit;
the circuit wiring unit is suitable for providing a pin of the image sensor chip and a conductive path of the elastic conductive piece so as to be electrically connected to a circuit on the lower substrate;
the resistance unit and the capacitance unit are communicated with the circuit wiring unit.
9. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 8, wherein the circuit wiring unit further comprises an upper plate unit, the lower plate unit further comprises a lower plate unit, the upper plate unit and the lower plate unit correspond to each other, and high-speed image data signals of the image sensor chip are transmitted by ac coupling.
10. The optical anti-shake apparatus for motion compensation using a moving image sensor chip of claim 9, wherein the upper plate unit is a metal plate disposed on the lower surface of the carrier plate, and the metal plate is uniformly distributed on four sides of the carrier plate.
11. The optical anti-shake apparatus for motion compensation using a moving image sensor chip of claim 8, wherein the capacitive unit is disposed around the chip.
12. The optical anti-shake apparatus for motion compensation using a moving image sensor chip as claimed in claim 11, wherein the capacitor unit comprises a plurality of capacitors arranged in a bar shape on both sides of the chip.
13. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1, wherein the image sensor chip is electrically connected to the carrier board by wire bonding or Flip chip bonding (Flip chip).
14. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1, further comprising an outer fixing frame adapted to limit the movement of the image sensor chip in a space; the outer fixing frame is arranged on the lower base plate.
15. The optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1, wherein the displacement of the image sensor chip is fed back by the change in resistance after the shape memory alloy wire is energized.
16. An electronic device comprising the optical anti-shake apparatus for motion compensation using a moving image sensor chip according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010578217.6A CN113840051A (en) | 2020-06-23 | 2020-06-23 | Optical anti-shake device and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010578217.6A CN113840051A (en) | 2020-06-23 | 2020-06-23 | Optical anti-shake device and electronic device |
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| CN113840051A true CN113840051A (en) | 2021-12-24 |
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| CN202010578217.6A Pending CN113840051A (en) | 2020-06-23 | 2020-06-23 | Optical anti-shake device and electronic device |
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| CN102971670A (en) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | Image capture device |
| CN105022204A (en) * | 2015-08-07 | 2015-11-04 | 深圳市世尊科技有限公司 | Camera module for mobile terminal and mobile terminal |
| CN205987122U (en) * | 2016-08-25 | 2017-02-22 | 东莞市亚登电子有限公司 | Miniature optical anti -vibration camera module |
| US20180227513A1 (en) * | 2017-02-03 | 2018-08-09 | SmartSens Technology (U.S.), Inc. | Stacked image sensor pixel cell with selectable shutter modes and in-pixel cds |
| CN110049235A (en) * | 2019-03-06 | 2019-07-23 | 杭州电子科技大学 | A kind of optical anti-vibration MEMS actuator |
| CN111225130A (en) * | 2018-11-23 | 2020-06-02 | 华为机器有限公司 | Imaging device and terminal equipment |
| CN213484951U (en) * | 2020-06-23 | 2021-06-18 | 格科微电子（上海）有限公司 | Optical anti-shake device and electronic device |
-
2020
- 2020-06-23 CN CN202010578217.6A patent/CN113840051A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102971670A (en) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | Image capture device |
| CN105022204A (en) * | 2015-08-07 | 2015-11-04 | 深圳市世尊科技有限公司 | Camera module for mobile terminal and mobile terminal |
| CN205987122U (en) * | 2016-08-25 | 2017-02-22 | 东莞市亚登电子有限公司 | Miniature optical anti -vibration camera module |
| US20180227513A1 (en) * | 2017-02-03 | 2018-08-09 | SmartSens Technology (U.S.), Inc. | Stacked image sensor pixel cell with selectable shutter modes and in-pixel cds |
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