CN213522034U - Optical anti-shake device and electronic apparatus - Google Patents
Optical anti-shake device and electronic apparatus Download PDFInfo
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- CN213522034U CN213522034U CN202021177358.9U CN202021177358U CN213522034U CN 213522034 U CN213522034 U CN 213522034U CN 202021177358 U CN202021177358 U CN 202021177358U CN 213522034 U CN213522034 U CN 213522034U
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Abstract
The utility model provides an adopt and move image sensor chip and carry out motion compensation's optics anti-shake device, electronic equipment, wherein, adopt and move image sensor chip and carry out motion compensation's optics anti-shake device, include: the image sensor comprises an image sensor chip, a carrier plate, a lower substrate and a shape memory alloy driving component; the image sensor chip is fixedly arranged on the carrier plate, and the carrier plate is connected with the lower substrate through a metal wire so that the image sensor chip is electrically communicated with an external circuit; the image sensor chip and the carrier plate move in the direction X, Y and rotate in a plane under the drive of the shape memory alloy drive component, so as to perform the motion compensation of optical anti-shake. The utility model provides a technical scheme adopts the image sensor chip to do motion compensation, the image sensor chip is through the mode and the external circuit electricity intercommunication of metal bonding and/or flip-chip bonding, and simple structure can improve image quality.
Description
Technical Field
The utility model relates to an image imaging technology field especially relates to an optical anti-shake device, electronic equipment that adopt moving image sensor chip to carry out motion compensation.
Background
When the portable handheld intelligent device shoots, physiological vibration of a human body cannot be avoided, the physiological vibration cannot be overcome through training, the portable handheld intelligent device inevitably shakes along with the human body when the portable handheld intelligent device shoots, image quality is reduced, and the most obvious image is fuzzy and unclear.
The existing handheld portable intelligent equipment uses a lens component which can move in the XY axis direction in a camera module, so that the aim of compensating physiological vibration of a human body is fulfilled, and a high-quality image is obtained. However, with the progress of technology and the increasing pursuit of images by consumers, the camera module of the existing handheld portable intelligent device has a proportionally increased and heavier lens due to the increase of the image sensor. Conventional methods of compensating for movement of the lens in the XY-axis direction have made it increasingly difficult to push a heavy lens. And the angle which can be compensated by the method for carrying out motion compensation on the lens in the XY axis direction cannot meet the requirement of a customer on the image quality.
In the prior art, the optical anti-shake method provided by the mobile image sensor chip has a complex structure, is mostly applied to single-lens reflex digital cameras, and is rarely applied to cases of handheld portable intelligent devices.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical anti-shake device, electronic equipment that adopt moving image sensor chip to carry out motion compensation makes the camera lens carry out motion compensation in XY axle direction among the solution conventional art, because the weight of camera lens is heavier, is difficult to promote and the volume is great, is difficult to satisfy the compensation of certain angle, because be not enough to satisfy the technical problem of higher image quality requirement.
In order to solve the technical problem, the utility model provides an adopt and move image sensor chip and carry out motion compensation's optics anti-shake device, include:
the image sensor comprises an image sensor chip, a carrier plate, a lower substrate and a shape memory alloy driving component;
the image sensor chip is fixedly arranged on the carrier plate, and the carrier plate is connected with the lower substrate through a metal wire so that the image sensor chip is electrically communicated with an external circuit;
the image sensor chip and the carrier plate move in the direction X, Y and rotate in a plane under the drive of the shape memory alloy drive component, so as to perform the motion compensation of optical anti-shake.
Preferably, the metal wire connects the carrier plate and the lower substrate by bonding and/or welding.
Preferably, the carrier plate is further provided with: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip;
the number of the metal lines is less than the number of pads of the image sensor chip.
Preferably, the carrier plate is further provided with: a resilient member;
the shape memory alloy driving component is suitable for deforming under the condition of electrifying so as to drive the image sensor chip to move in the direction X, Y and rotate in a plane for motion compensation;
the rebound component is suitable for driving the image sensor chip to recover to the original position through rebound force under the condition that the shape memory alloy driving assembly is powered off.
Preferably, the shape memory alloy drive assembly comprises: one end of the shape memory alloy wire is electrically connected with the carrier plate, and the other end of the shape memory alloy wire is electrically connected with the lower substrate below the image sensor chip so as to be electrically communicated with an external circuit; at least two shape memory alloy wires are arranged.
Preferably, the resilient member comprises: an inner mounting frame and a flexure;
the inner mounting frame is fixedly connected to the carrier plate, and the outer ring of the inner mounting frame is suitable for leading out the bending part;
the image sensor chip is suitable for restoring to an initial position under the action of the elastic cantilevers.
Preferably, the elastic cantilever has at least one bent portion, and semi-surrounds the inner mounting frame.
Preferably, the shape memory alloy wire is adapted to be disposed around the image sensor chip, corresponding to the flexure.
Preferably, the material of the metal wire is any one of gold, copper, silver and aluminum.
Preferably, the length of the wire is greater than 1 mm.
Preferably, the capacitor unit is disposed around the chip.
Preferably, the capacitor unit includes a plurality of capacitors arranged in a stripe shape and disposed on both sides of the chip.
Preferably, the image sensor chip is electrically connected to the carrier board by a Flip chip bonding method or a metal wire bonding method.
Preferably, the outer fixing frame is disposed on the lower substrate and adapted to limit the movement of the image sensor chip in a certain space.
Preferably, the optical anti-shake apparatus for performing motion compensation by using a moving image sensor chip further comprises a feedback unit for feeding back a displacement of the image sensor chip through a change in resistance of the shape memory alloy wire after energization.
The utility model also provides an electronic equipment, include: an imaging device comprising an optical anti-shake device as described above that employs a moving image sensor chip for motion compensation.
Compared with the prior art, the utility model discloses an adopt the optical anti-shake device that moves image sensor chip and carry out motion compensation and electronic equipment thereof has following beneficial effect:
the utility model provides an among the technical scheme, adopt the image sensor chip to do motion compensation, wherein the image sensor chip passes through the mode and the external circuit electricity intercommunication of metal bonding and/or flip-chip bonding for overall structure is simple, the preparation technology is also simple, can improve the product yield, reduces manufacturing cost, improves the reliability, improves image quality.
Further, the utility model provides an among the technical scheme, image sensor chip sets up and the electricity connect in on the support plate, merge through the circuit in the support plate to realize the support plate in the electric connection of infrabasal plate through metal (metal) line bonding. By the design, the circuit outside the chip can be reduced, so that the number of gold wires between the carrier plate and the lower substrate is reduced, and the motion resistance of the carrier plate (including the chip) is reduced.
Further, the utility model provides a the support plate with the length that the infrabasal plate carries out electric connection's metal (metal) line exceeds 1 millimeter for the flexibility of support plate activity increases.
Furthermore, the utility model provides an among the technical scheme, adopt shape memory alloy silk to provide drive power, elastic deflection portion provides the restoring force, and the structure is light simple, and is small, with low costs.
Further, the utility model provides an among the technical scheme, the resistance value of shape memory alloy silk in deformation process changes the condition that can reflect the chip displacement, need not set up hall feedback loop and feeds back the displacement condition, simple structure, and is small, with low costs.
Drawings
Fig. 1 to fig. 4 are schematic structural diagrams of the optical anti-shake apparatus for performing motion compensation by using a moving image sensor chip according to the embodiment of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be implemented in many different ways than those herein described and one skilled in the art can do so without departing from the spirit and scope of the present invention, which is not limited to the specific implementations disclosed below.
Secondly, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, for convenience of illustration, the schematic diagrams are only examples, and the present invention should not be limited herein.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention provides a method for preventing image sensor from shaking in detail with reference to the accompanying drawings.
The technical scheme of the utility model provide an optics anti-shake device, adopt the image sensor chip to carry out the translation at XY axle and reach the purpose of optics anti-shake compensation around the rotation of chip light axle.
Specifically, the embodiments of the present disclosure are specifically described below with reference to fig. 1 to 4.
In this embodiment, referring to fig. 1 and fig. 2, in particular, this embodiment provides an optical anti-shake apparatus for performing motion compensation by using a moving image sensor chip, including:
the image sensor device includes an image sensor chip 111, a carrier board 100 carrying the image sensor chip 111, a lower substrate 200, and a metal line 120 connecting the carrier board 100 and the lower substrate 200. A shape memory alloy driving assembly 300 and a resilient member are further disposed between the carrier plate 100 and the lower substrate 200. The image sensor chip 111 and the carrier 100 are driven by the shape memory alloy driving assembly 300 to move in the direction X, Y and rotate in a plane for motion compensation. The springback component is suitable for driving the image sensor chip 111 to return to the original position through the springback force when the shape memory alloy driving assembly 300 is powered off.
Further, in this embodiment, an outer fixing frame 500 is further provided, and the outer fixing frame 500 is disposed on the lower substrate 200 and is adapted to limit the movement of the image sensor chip 111 in a certain space.
Specifically, the image sensor chip 111 is fixedly disposed on the carrier board 100, and the carrier board 100 is connected to the lower substrate 200 through the metal wire 120, so that the image sensor chip 111 is electrically connected to an external circuit (not shown). The image sensor chip 111 and the carrier 100 are driven by the shape memory alloy driving component to move in the direction X, Y and rotate in a plane for motion compensation.
Specifically, in this embodiment, the metal wires 120 connect the carrier board 100 and the lower substrate 200 by bonding and/or welding.
Specifically, in this embodiment, the carrier plate 100 further includes: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip; in this embodiment, the circuit wiring unit on the carrier board 100 combines the pins of the image sensor chip 111 by wires, which simplifies the external circuit of the chip, reduces the connection points between the carrier board 100 and the circuit on the lower substrate 200, so that the number of the metal wires 120 required to connect between the carrier board 100 and the lower substrate 200 is less than the number of the pads of the image sensor chip 111.
And then, the carrier board 100 is electrically connected to the lower substrate 200 by using metal (metal) wire bonding. With such a design, the number of gold wires between the carrier 100 and the lower substrate 200 is reduced, and thus the motion resistance of the carrier 100 carrying the image sensor chip 111 in the motion compensation required for anti-shake is reduced, which increases flexibility.
Specifically, in this embodiment, the capacitor unit 330 is disposed around the chip. Preferably, the capacitor unit 330 includes a plurality of capacitors arranged in a stripe shape and disposed on two sides of the image sensor chip 111.
Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 by a Flip chip bonding (Flip chip) or a metal wire bonding.
Specifically, in this embodiment, the material of the metal line is any one of gold, copper, silver, and aluminum.
Specifically, in this embodiment, the length of the metal line connecting the carrier board 100 and the lower substrate 200 is greater than 1 mm. The flexibility of the carrier plate 100 during movement is ensured, the reliability of the gold wire is improved, and the gold wire is prevented from generating plastic deformation;
referring to fig. 4 in conjunction with fig. 2, in particular, in the present embodiment, the shape memory alloy driving assembly 300 includes: a shape memory alloy wire 301, wherein one end of the shape memory alloy wire 301 is electrically connected to the carrier board 100, and the other end of the shape memory alloy wire 301 is electrically connected to the lower substrate 200 below the image sensor chip 111 to electrically communicate with an external circuit; at least two shape memory alloy wires 301 are distributed on two opposite sides of the carrier plate 100 to keep the motion balance of the carrier plate. Preferably, the number of the shape memory alloy wires 301 is four, and the four shape memory alloy wires are uniformly distributed on four sides of the carrier plate 100.
The shape memory alloy driving assembly 300 is adapted to deform when energized to drive the image sensor chip 111 to move in direction X, Y and to rotate in a plane for motion compensation.
In addition, as shown in fig. 1, in this embodiment, the carrier board 100 further includes: a resilient member;
the springback component is suitable for driving the image sensor chip 111 to return to the original position through the springback force when the shape memory alloy driving assembly 300 is powered off.
Specifically, in this embodiment, the resilient member includes: an inner mounting frame 240 and a flexure 241;
the inner mounting frame 240 is fixedly connected to the carrier plate 100, and an outer ring of the inner mounting frame 240 is adapted to lead out the flexing portion 241;
the flexure 241 is provided with a plurality of elastic cantilevers, the elastic cantilevers are fixedly connected with the outer fixing frame 500, and the image sensor chip is adapted to restore to an initial position under the action of the elastic cantilevers. In this embodiment, the elastic cantilever is L-shaped, and semi-surrounds the inner mounting frame 240. One end of one of the elastic cantilevers is connected to one side of the inner mounting frame in the Y direction, and the other end of the one of the elastic cantilevers is connected to one side of the outer fixing frame 500 in the Y direction. At least two elastic cantilevers are arranged in sequence end to end according to the same direction and mode.
And the two mounting ends of the elastic cantilever are not in a horizontal plane, so that an elastic pre-pressure that the flexure 241 has a downward direction (the (-Z direction) in the Z-axis direction is applied on the carrier plate 100, so that the carrier plate 100 is mounted on the lower substrate 200 more stably.
Specifically, in this embodiment, the elastic cantilever has at least one bending portion, and partially surrounds the inner mounting frame 240.
Specifically, in this embodiment, the shape memory alloy wire 301 is adapted to be disposed around the image sensor chip 111, corresponding to the flexure 241.
Specifically, the resilience of the bending portion 241 is opposite to the direction of the traction force generated by the contraction of the shape memory alloy wire 301 when the shape memory alloy wire 301 is powered on, so that when the shape memory alloy wire 301 is powered off and returns to the original state, the resilience provided by the bending portion 241 can rapidly drive the carrier plate 100 to return to the original state, so as to ensure that the position of the image sensor chip 111 is rapidly returned to the original state.
Further, in the technical solution provided in the present invention, the bending portion 241 of the shape memory alloy wire 301 and the springback component is mutually matched with the support plate 100 and the lower substrate 200, so as to ensure that the support plate 100 can be driven by the shape memory alloy wire 301 when being powered on, the image sensor chip 111 is moved to complete the function of the anti-shake position compensation, and also can be driven rapidly to restore the original position of the image sensor chip 111 when being powered off under the action of the springback force of the bending portion 241.
And the shape memory alloy wire 301 and the bending part 241 of the springback component are both slender components and are arranged on two sides or the periphery of the carrier plate 100 in a mutually matched manner, so that excessive space of the whole optical anti-shake device for performing motion compensation by adopting a moving image sensor chip is not occupied, and the whole volume of the optical anti-shake device for performing motion compensation by adopting the moving image sensor chip can be saved.
Specifically, in this embodiment, the optical anti-shake apparatus for performing motion compensation by using a moving image sensor chip further includes: and feeding back the displacement of the image sensor chip through the change of the resistance of the shape memory alloy wire after being electrified. Therefore, the utility model provides an adopt and move the image sensor chip and carry out motion compensation's optical anti-shake device in, just can reflect the condition of image sensor chip 111 displacement through shape memory alloy wire resistance value, need not set up hall feedback loop and come the feedback displacement condition, simple structure, small, it is with low costs.
In addition, the present invention provides an embodiment of an electronic device, which comprises a device for performing optical anti-shake by using the mobile image sensor chip.
Although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can use the above-mentioned method and technical contents to make possible changes and modifications to the technical solution of the present invention without departing from the spirit and scope of the present invention, therefore, any simple modification, equivalent changes and modifications made to the above embodiments by the technical substance of the present invention all belong to the protection scope of the technical solution of the present invention.
Claims (16)
1. An optical anti-shake apparatus which performs motion compensation using a moving image sensor chip, comprising:
the image sensor comprises an image sensor chip, a carrier plate, a lower substrate and a shape memory alloy driving component;
the image sensor chip is fixedly arranged on the carrier plate, and the carrier plate is connected with the lower substrate through a metal wire so that the image sensor chip is electrically communicated with an external circuit;
the image sensor chip and the carrier plate move in the direction X, Y and rotate in a plane under the drive of the shape memory alloy drive component, so as to perform the motion compensation of optical anti-shake.
2. The optical anti-shake apparatus according to claim 1, wherein the metal wires connect the carrier board and the lower substrate by bonding and/or soldering.
3. The optical anti-shake apparatus according to claim 2, wherein the carrier board further comprises: a capacitor unit and/or a resistor unit and/or an inductor unit and/or an auxiliary chip, and a circuit wiring unit;
the circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitance unit and/or the resistance unit and/or the inductance unit and/or the auxiliary chip;
the number of the metal lines is less than the number of pads of the image sensor chip.
4. The optical anti-shake apparatus according to claim 1, wherein the carrier board further comprises: a resilient member;
the shape memory alloy driving component is suitable for deforming under the condition of electrifying so as to drive the image sensor chip to move in the direction X, Y and rotate in a plane for motion compensation;
the rebound component is suitable for driving the image sensor chip to recover to the original position through rebound force under the condition that the shape memory alloy driving assembly is powered off.
5. The optical anti-shake apparatus according to claim 2, wherein the shape memory alloy drive assembly comprises: one end of the shape memory alloy wire is electrically connected with the carrier plate, and the other end of the shape memory alloy wire is electrically connected with the lower substrate below the image sensor chip so as to be electrically communicated with an external circuit; at least two shape memory alloy wires are arranged.
6. The optical anti-shake apparatus according to claim 4, wherein the resilient member comprises: an inner mounting frame and a flexure;
the inner mounting frame is fixedly connected to the carrier plate, and the outer ring of the inner mounting frame is suitable for leading out the bending part;
the image sensor chip is suitable for restoring to an initial position under the action of the elastic cantilevers.
7. The optical anti-shake apparatus according to claim 6, wherein the elastic cantilever has at least one bent portion, and semi-surrounds the inner mounting frame.
8. The optical anti-shake apparatus according to claim 6, wherein the shape memory alloy driving component is adapted to be disposed around the image sensor chip, corresponding to the flexure.
9. The optical anti-shake apparatus according to claim 1, wherein the metal wire is made of any one of gold, copper, silver, and aluminum.
10. The optical anti-shake apparatus according to claim 1, wherein the length of the metal wire is greater than 1 mm.
11. The optical anti-shake apparatus according to claim 3, wherein the capacitor unit is disposed around the chip.
12. The optical anti-shake apparatus according to claim 11, wherein the capacitor unit comprises a plurality of capacitors arranged in a stripe shape and disposed on two sides of the image sensor chip.
13. The optical anti-shake apparatus according to claim 1, wherein the image sensor chip is electrically connected to the carrier by flip-chip bonding or wire bonding.
14. The optical anti-shake apparatus according to claim 6, wherein the external fixing frame is disposed on the lower substrate and adapted to limit the movement of the image sensor chip within a certain space.
15. The optical anti-shake apparatus according to claim 1, wherein the displacement of the image sensor chip is fed back by a change in resistance of the shape memory alloy wire after energization.
16. An electronic device characterized by comprising the optical anti-shake apparatus according to claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021177358.9U CN213522034U (en) | 2020-06-23 | 2020-06-23 | Optical anti-shake device and electronic apparatus |
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| CN202021177358.9U CN213522034U (en) | 2020-06-23 | 2020-06-23 | Optical anti-shake device and electronic apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917698A (en) * | 2021-10-21 | 2022-01-11 | 深圳市火乐科技发展有限公司 | Diffusion sheet assembly, light source device, and projector |
| CN114007007A (en) * | 2021-11-30 | 2022-02-01 | 广东海德亚科技有限公司 | Optical anti-shake motor device and camera module |
| CN114125282A (en) * | 2021-11-16 | 2022-03-01 | 信利光电股份有限公司 | Anti-shake module and manufacturing method |
| WO2023036304A1 (en) * | 2021-09-13 | 2023-03-16 | 格科微电子（上海）有限公司 | Optical anti-shake apparatus and camera module |
-
2020
- 2020-06-23 CN CN202021177358.9U patent/CN213522034U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023036304A1 (en) * | 2021-09-13 | 2023-03-16 | 格科微电子（上海）有限公司 | Optical anti-shake apparatus and camera module |
| CN113917698A (en) * | 2021-10-21 | 2022-01-11 | 深圳市火乐科技发展有限公司 | Diffusion sheet assembly, light source device, and projector |
| CN114125282A (en) * | 2021-11-16 | 2022-03-01 | 信利光电股份有限公司 | Anti-shake module and manufacturing method |
| CN114125282B (en) * | 2021-11-16 | 2023-11-28 | 信利光电股份有限公司 | Anti-shake module and manufacturing method |
| CN114007007A (en) * | 2021-11-30 | 2022-02-01 | 广东海德亚科技有限公司 | Optical anti-shake motor device and camera module |
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