CN112788241B - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN112788241B CN112788241B CN202110159345.1A CN202110159345A CN112788241B CN 112788241 B CN112788241 B CN 112788241B CN 202110159345 A CN202110159345 A CN 202110159345A CN 112788241 B CN112788241 B CN 112788241B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The application discloses module and electronic equipment make a video recording relates to the electronic product field. A camera module comprises a lens module; the lens module is arranged on the first substrate; the first substrate is fixed on the circuit board and electrically connected with the circuit board; the second substrate is arranged between the first substrate and the circuit board; the first rolling body is arranged between the first substrate and the second substrate; the second rolling body is arranged between the second substrate and the circuit board; the driving module is connected with the second substrate; the connecting piece is electrically connected with the first substrate and the second substrate; and the photosensitive chip is fixed on the second substrate and is arranged opposite to the lens module, and the photosensitive chip is electrically connected with the second substrate. An electronic device includes a camera module. The application solves the problem that the inclination of the camera affects the shooting effect.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.
Background
With the development and popularization of electronic devices, people have higher and higher requirements on the functions of the electronic devices, and photographing is an important experience function of the electronic devices. When a user holds the electronic equipment for taking a picture, the camera of the electronic equipment is slightly inclined due to hand shake, so that the picture taking effect is influenced.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, which can solve the problem that a camera of the electronic equipment inclines to influence the photographing effect.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a module of making a video recording, this module of making a video recording includes:
a lens module having an optical axis extending in a first direction;
the lens module is arranged on the first substrate;
the first substrate is fixed on the circuit board and is electrically connected with the circuit board;
a second substrate disposed between the first substrate and the circuit board;
a first rolling element disposed between the first substrate and the second substrate;
a second rolling body disposed between the second substrate and the circuit board;
the driving module is at least connected with the second substrate so as to drive the second substrate to move in a first plane, and the first plane is vertical to the first direction;
a connector electrically connecting the first substrate and the second substrate;
and the photosensitive chip is fixed on the second substrate and is arranged opposite to the lens module, and the photosensitive chip is electrically connected with the second substrate.
The embodiment of the application also provides electronic equipment, and the electronic equipment comprises the camera module.
In the embodiment of the application, the second substrate can move relative to the first substrate through the first rolling body, the second substrate can move relative to the circuit board through the second rolling body, and the first rolling body and the second rolling body are matched with each other to play a role in limiting and supporting the second substrate; can drive the second base plate through drive module and remove in the first plane for first base plate to make the relative position that sets up between sensitization chip on the second base plate and the camera lens module change, and then realize the anti-shake effect, further promoted the effect of shooing, meanwhile, be connected through the connecting piece electricity between first base plate and the second base plate, can realize the electric conductance of first base plate and second base plate through the connecting piece and lead to, thereby can be to sensitization chip power supply and signal transmission.
Drawings
Fig. 1 is a disassembled schematic view of a camera module disclosed in the embodiment of the present application;
fig. 2 is a first schematic cross-sectional view of a camera module according to an embodiment of the present disclosure;
fig. 3 is a second schematic cross-sectional view of the camera module according to the embodiment of the present disclosure;
fig. 4 is an assembly diagram of a first substrate, a second substrate and a driving module disclosed in an embodiment of the present application;
fig. 5 is an assembly diagram of a second substrate, a coil and a magnetic inductor according to an embodiment of the disclosure;
fig. 6 is an assembly diagram of the first substrate, the coil and the magnetic inductor according to an embodiment of the disclosure.
Description of reference numerals:
10-a lens module;
20-a zoom motor;
30-a first substrate; 31-a stationary part; 32-an extension;
40-a second substrate;
50-a drive module; 51-a magnet; 52-a coil;
60-a connector;
70-an optical filter;
80-a photosensitive chip;
90-a circuit board;
101-a first rolling body; 102-a second rolling body;
110-conductive adhesive film;
120-a magnetic inductor;
130-gold ball;
140-connector.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 6, an embodiment of the present application discloses a camera module, which includes a lens module 10, a first substrate 30, a circuit board 90, a second substrate 40, a first rolling element 101, a second rolling element 102, a driving module 50, a connecting member 60, and a photosensitive chip 80.
The lens module 10 is a light-transmitting component of the camera module, and the lens module 10 can be an optical component composed of one or more pieces of cambered surface (generally, spherical surface) optical glass or plastic pieces, can receive optical signals and converge the optical signals on the surface of the photosensitive chip 80, is an essential optical element in the camera module, directly affects the quality of imaging, and affects the realization and the effect of an algorithm.
In general, the lens module 10 may be disposed on a zoom motor 20, and the lens module 10 is driven by the zoom motor 20 to move along its optical axis to achieve zooming. Of course, the lens module 10 can also be fixed on the base of the camera module without movement.
The first substrate 30 is a fixing member of the camera module, and the first substrate 30 may be a ring-shaped structure and is fixedly disposed on the circuit board 90. The first substrate 30 may be a ceramic substrate, which is a special process plate in which copper foil is directly bonded to the surface (single or double side) of an alumina or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soft solderability and high adhesion strength, can be etched into various patterns like a Printed Circuit Board (PCB), and has great current carrying capacity. In some alternative embodiments, the lens module 10 may be disposed on the first substrate 30, and of course, the lens module 10 may also be disposed on the zoom motor 20, and the zoom motor 20 is fixed on the first substrate 30, and the zoom motor 20 is connected to the first substrate 30, so that the zoom motor 20 can be conducted with the outside, and an auto-focus function is achieved.
The circuit board 90 is a supporting and signal transmitting member of the camera module, and the circuit board 90 may be a flexible printed circuit board or a printed circuit board. Optionally, the first substrate 30 is fixed on the circuit board 90, the circuit board 90 can carry the first substrate 30, and the circuit board 90 can also perform signal interaction with the light sensing chip 80. In addition, the circuit board 90 is provided with a connector 140, and the connector 140 can be connected with a main board of the electronic device, so that signal interaction between the camera module and the main board of the electronic device is realized.
The second substrate 40 is a moving member of the image pickup module, and the second substrate 40 can be a carrier of a structure such as an induction chip, a magnet 51, a magnetic sensor 120, and the like. The second substrate 40 is disposed between the first substrate 30 and the circuit board 90, and the second substrate 40 may be moved relative to the first substrate 30 and the circuit board 90, respectively, to adjust a relative position between the photosensitive chip 80 and the lens module 10.
The first rolling element 101 is disposed between the first substrate 30 and the second substrate 40, and when the second substrate 40 moves relative to the first substrate 30, the first rolling element 101 can roll between the two, so as to ensure the mutual supporting function between the first substrate 30 and the second substrate 40, facilitate the movement of the second substrate 40, and facilitate the adjustment of the position of the photo chip 80 on the second substrate 40. Alternatively, the first rolling elements 101 may be balls to meet the requirement that the second substrate 40 moves in multiple directions.
The second rolling element 102 is disposed between the second substrate 40 and the circuit board 90, and when the second substrate 40 moves relative to the circuit board 90, the second rolling element 102 can roll therebetween, so as to ensure a mutual supporting effect between the second substrate 40 and the circuit board 90, facilitate the movement of the second substrate 40, and facilitate the adjustment of the position of the photosensitive chip 80 on the second substrate 40. Alternatively, the second rolling elements 102 may be balls to accommodate the need for the second substrate 40 to move in multiple directions.
The driving module 50 is a driving member of the camera module, and provides a driving force for the anti-shake process. Alternatively, the driving module 50 is connected to at least the second substrate 40, and the second substrate 40 can move in a first plane under the driving action of the driving module 50, wherein the first plane is perpendicular to the optical axis direction of the lens module 10. In some embodiments, the driving module 50 may be an electromagnetic driving module, which has a relatively simple structure, occupies a relatively small space, and has a relatively high control precision, so as to meet the driving requirement of the camera module in the anti-shake process.
In order to achieve information interaction with the photosensitive chip 80 and adapt to the photosensitive chip 80 moving along with the second substrate 40, in the embodiment of the present application, the second substrate 40 needs to be electrically connected to the first substrate 30. The connection member 60 is provided between the second substrate 40 and the first substrate 30 in consideration of the movement of the second substrate 40 with respect to the first substrate 30. Alternatively, the connection member 60 has conductivity, and at the same time, may be deformed, so that the requirements of conductivity and relative movement between the first substrate 30 and the second substrate 40 may be satisfied at the same time. In some embodiments, the connector 60 may be a metal wire or the like.
Based on the above arrangement, the second substrate 40 and the photo sensor chip 80 disposed on the second substrate 40 can move, and the relative position between the photo sensor chip 80 and the lens module 10 is changed, so that the shake of the lens can be compensated, and the anti-shake function is realized. By respectively arranging the first rolling body 101 and the second rolling body 102 on two sides of the second substrate 40, the motion resistance between the second substrate 40 and the first substrate 30, and between the second substrate 40 and the circuit board 90 is smaller, thereby facilitating the movement of the second substrate 40 and reducing the energy consumption in the anti-shake process. The light sensing chip 80 is electrically connected with the second substrate 40, the second substrate 40 is electrically connected with the first substrate 30 through the connecting piece 60, the first substrate 30 is electrically connected with the circuit board 90, and can be electrically connected with the main board of the electronic device through the circuit board 90, optionally, the circuit board 90 can be provided with the connector 140, and the connector 140 can be electrically connected with the main board of the electronic device, so that the electrical connection between the sensing chip and the main board of the electronic device is realized, and the signal interaction between the sensing chip and the main board of the electronic device is realized. Compare in the mode that conventional module of making a video recording realized the anti-shake through the motion of drive camera lens, owing to drive sensitization chip 80 removes in the embodiment of this application, make the anti-shake effect more sensitive, thereby can be to the camera lens slope that user's hand shake brought and make the adaptability adjustment to the relative position between response chip and the camera lens module 10, in order to reach the anti-shake effect, reduce the shake to the influence of shooting effect, meanwhile, compare in conventional mode and still reduced the energy consumption of anti-shake in-process, the duration of electronic equipment has been promoted to a certain extent.
In some alternative embodiments, the connecting member 60 is a flexible metal wire, one end of which is connected to the first substrate 30 and the other end of which is connected to the second substrate 40. Alternatively, the connecting member 60 may be a gold wire, which is flexible and has good flexibility. The gold wires are connected between the first substrate 30 and the second substrate 40, and have a certain redundancy, such as arc-shaped segments, bending segments, and the like. Thus, when the second substrate 40 moves relative to the first substrate 30, the gold wires can deform to accommodate the movement of the second substrate 40 without interfering with the movement of the second substrate 40.
Of course, in other embodiments, the connecting element 60 may also be in other structures, such as silver wire, copper wire, etc., and be in a filament shape, and the specific structure and material of the connecting element 60 are not limited in this embodiment as long as the conductive and deformation characteristics are satisfied.
Based on above-mentioned setting, compare in the mode that adopts the rigid-flex board to buckle in order to adapt to sensitization chip 80's removal among the correlation technique, the mode that this application embodiment adopted flexible metal wire is more succinct, is favorable to making a video recording the miniaturized development of module, and the cracked risk of rigid-flex board can not appear to the reliability of the module of making a video recording has been guaranteed.
In some alternative embodiments, the first substrate 30 is a ring-shaped structure that is disposed around the edge of the circuit board 90. Alternatively, the first substrate 30 includes a fixing portion 31 and an extending portion 32, the fixing portion 31 is a ring-shaped structure, one side of the fixing portion 31 is fixed on the circuit board 90, and the zoom motor 20 is fixed on the other side of the fixing portion 31. The extension portion 32 is disposed on an inner sidewall of the fixing portion 31 and extends to protrude inward from the inner sidewall of the fixing portion 31. The extension portion 32 may be an annular plate, and the extension portion 32 is disposed at a middle region of the fixing portion 31 in the optical axis direction of the lens module 10, so that the cross-section of the first substrate 30 composed of the extension portion 32 and the fixing portion 31 has a T-shape. When the fixing portion 31 is fixed on the circuit board 90, the extending portion 32 and the circuit board 90 have a space therebetween, so that the annular extending portion 32, the annular fixing portion 31 and the circuit board 90 together enclose an accommodating space. Since the second substrate 40 is disposed on the circuit board 90, the edge of the second substrate 40 is located in the receiving space. Considering that the second substrate 40 needs to move, the length and width of the accommodating space can be made larger than the length and width of the second substrate 40, so that the second substrate 40 can move in the accommodating space along the length or width direction without being hindered by the side wall of the accommodating space, and the moving requirement of the second substrate 40 can be met.
The first rolling element 101 and the second rolling element 102 are respectively located in the accommodating space, specifically, the first rolling element 101 is disposed between the extension portion 32 and the edge of the second base plate 40, and the second rolling element 102 is disposed between the edge of the second base plate 40 and the circuit board 90, so that the edge of the second base plate 40 is supported from both sides by the first rolling element 101 and the second rolling element 102, respectively, to limit the movement of the second base plate 40 in the optical axis direction of the lens module 10, and at the same time, the second base plate 40 is convenient to move in the first plane perpendicular to the optical axis, and the energy consumption for driving the second base plate 40 to move can be reduced to a certain extent.
In some optional embodiments, the camera module further includes a conductive adhesive film 110, and the conductive adhesive film 110 is connected between the first substrate 30 and the circuit board 90. Specifically, the Conductive Film 110 may be an Anisotropic Conductive Film (ACF) 110, wherein the ACF mainly includes two parts, i.e., a resin adhesive and Conductive particles, which can adhere the first substrate 30 to the circuit board 90 and electrically connect the first substrate 30 to the circuit board 90 through the Conductive particles in the adhesive, so that signal interaction can be performed between the first substrate 30 and the circuit board 90.
In some alternative embodiments, the driving light module includes a magnet 51 and a coil 52, wherein one of the magnet 51 and the coil 52 is fixed on the first substrate 30, the other is fixed on the second substrate 40, and the magnet 51 and the coil 52 interact to drive the second substrate 40 to move relative to the first substrate 30. Alternatively, the magnet 51 is fixed to the second substrate 40 by bonding, the coil 52 is fixed to the first substrate 30, and the coil 52 is disposed to face the magnet 51. Also, the coil 52 is electrically connected to the first substrate 30, so that the coil 52 can be electrically conducted with the outside to supply power to the coil 52, thereby generating a magnetic field. After the coil 52 is energized, an interaction force is generated between the coil and the magnet 51, so that the magnet 51 synchronously drives the second substrate 40 to move, and the second substrate 40 synchronously drives the optical chip 80 to move, thereby achieving the anti-shake effect. Based on the above arrangement, the driving module 50 can be more concise, and more stable driving force can be provided, so that the moving precision of the photosensitive chip 80 is further improved.
Further, a magnetic sensor 120 for detecting a change in a magnetic field around the second substrate 40 is provided on the second substrate 40. Optionally, the magnetic sensor 120 is electrically connected to the second substrate 40 by soldering, so that the magnetic field change around the second substrate 40 can be detected in real time, thereby improving the precision of controlling the movement of the second substrate 40 and the photo sensor chip 80 thereon. Specifically, the magnetic inductor 120 is located near the magnet 51 and the coil 52, and may be soldered or embedded, and the magnetic inductor 120 is electrically connected to the first substrate 30. The magnetic sensor 120 can accurately sense the change of the magnetic field around the second substrate 40, and can accurately feed back the positions of the second substrate 40 and the photosensitive chip 80, so that the moving direction and the moving precision of the photosensitive chip 80 can be controlled.
In some alternative embodiments, the photosensitive chip 80 and the second substrate 40 are connected by gold balls 130. On one hand, the photosensitive chip 80 and the second substrate 40 can be fixedly connected through the gold ball 130, and on the other hand, the photosensitive chip 80 and the second substrate 40 can be electrically conducted through the gold ball 130, so that signal interaction between the photosensitive chip 80 and other electronic components can be realized. Of course, the embodiment of the present application does not limit the specific connection manner between the photosensitive chip 80 and the second substrate 40 as long as fixation and electrical conduction can be achieved.
In other embodiments, in addition to the connection of the gold balls 130 for signal transmission, the photosensitive chip 80 and the second substrate 40 may be reinforced by spraying or dispensing glue around the gold balls 130 (i.e., in the gap between the photosensitive chip 80 and the second substrate 40).
In some optional embodiments, the image capturing module further includes a filter 70, the filter 70 is fixed on the second substrate 40, and the filter 70 is located between the lens module 10 and the photosensitive chip 80. The filter 70 serves to block a specific light, such as an infrared filter 70, etc. Optionally, the optical filter 70 is bonded to the second substrate 40 by glue, and during the movement of the second substrate 40, the optical filter 70 also moves along with the second substrate, so that the light entering through the lens module 10 can be filtered in real time, and the light is prevented from irradiating the photosensitive chip 80 to affect the shooting effect.
In some optional embodiments, the camera module further includes a zoom motor 20, and the zoom motor 20 is a driving structure assembled by a plurality of components. Optionally, the zoom motor 20 is fixed on the first substrate 30 by an adhesive manner, the lens module 10 is connected to the zoom motor 20, and the zoom motor 20 can drive the lens module 10 to displace along the first direction or a direction opposite to the first direction (a direction of bidirectional extension of an optical axis of the lens module 10), so as to achieve auto-focusing of the camera module. Alternatively, the zoom motor 20 is not limited to an open-loop motor, but may be a closed-loop motor or a center motor, and the specific form is not limited.
In the embodiment of the present application, on the light irradiation that gets into via lens module 10 arrived photosensitive chip 80, photosensitive chip 80 turned into the light signal the signal of telecommunication to transmit to second base plate 40 through gold ball 130 on, then transmit to first base plate 30 through flexible metal wire on, then transmit to circuit board 90 through conducting resin membrane 110 again on, transmit to the external world by connector 140 of circuit board 90 at last, like electronic equipment's mainboard etc. and then realize the signal interaction.
The embodiment of the application further discloses electronic equipment which comprises the camera module.
The electronic equipment in the embodiment of the application can be a mobile phone, a tablet computer, an electronic book reader, wearable equipment, vehicle-mounted equipment, unmanned aerial vehicle equipment and the like, and the embodiment of the application does not limit the specific type of the electronic equipment.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a module of making a video recording which characterized in that includes:
a lens module (10), an optical axis of the lens module (10) extending in a first direction;
a first substrate (30), the lens module (10) being disposed on the first substrate (30);
the circuit board (90), the first substrate (30) is fixed on the circuit board (90), and the first substrate (30) is electrically connected with the circuit board (90);
a second substrate (40), the second substrate (40) being disposed between the first substrate (30) and the circuit board (90);
a first rolling body (101), the first rolling body (101) being disposed between the first base plate (30) and the second base plate (40);
a second rolling body (102), the second rolling body (102) being disposed between the second substrate (40) and the circuit board (90);
a driving module (50), wherein the driving module (50) is connected with at least the second substrate (40) to drive the second substrate (40) to move in a first plane, and the first plane is perpendicular to the first direction;
a connector (60), the connector (60) electrically connecting the first substrate (30) and the second substrate (40);
the photosensitive chip (80), photosensitive chip (80) are fixed in second base plate (40), and with lens module (10) sets up relatively, photosensitive chip (80) with second base plate (40) electricity is connected.
2. The camera module according to claim 1, wherein the connecting member (60) is a flexible metal wire, one end of which is connected to the first substrate (30) and the other end of which is connected to the second substrate (40).
3. The camera module according to claim 1, wherein the first substrate (30) includes a fixing portion (31) and an extending portion (32) disposed inside the fixing portion (31), the extending portion (32) protrudes from an inner sidewall of the fixing portion (31), the fixing portion (31) is fixed to the circuit board (90), the extending portion (32) is spaced apart from the circuit board (90), an accommodating space is formed between the extending portion (32) and the circuit board (90), the second substrate (40) is at least partially disposed in the accommodating space, and the first rolling element (101) is disposed between the extending portion (32) and the second substrate (40).
4. The camera module according to claim 1, further comprising a conductive adhesive film (110), wherein the conductive adhesive film (110) connects the first substrate (30) and the circuit board (90).
5. The camera module according to claim 1, characterized in that the drive module (50) comprises a magnet (51) and a coil (52), one of the magnet (51) and the coil (52) being fixed to the first substrate (30) and the other being fixed to the second substrate (40), the magnet (51) interacting with the coil (52) to drive the second substrate (40) in movement with respect to the first substrate (30).
6. The camera module according to claim 5, wherein the second substrate (40) is provided with a magnetic sensor (120) for detecting a change in a magnetic field around the second substrate (40).
7. The camera module according to claim 1, wherein the photosensitive chip (80) and the second substrate (40) are connected by a gold ball (130).
8. The camera module according to claim 1, further comprising an optical filter (70), wherein the optical filter (70) is fixed on the second substrate (40) and is located between the lens module (10) and the photosensitive chip (80).
9. The camera module according to claim 1, further comprising a zoom motor (20), wherein the zoom motor (20) is fixed to the first substrate (30), wherein the lens module (10) is disposed on the zoom motor (20), and wherein the zoom motor (20) is configured to drive the lens module (10) to move in the first direction or a direction opposite to the first direction.
10. An electronic device comprising the camera module of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110159345.1A CN112788241B (en) | 2021-02-05 | 2021-02-05 | Camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110159345.1A CN112788241B (en) | 2021-02-05 | 2021-02-05 | Camera module and electronic equipment |
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| CN112788241A CN112788241A (en) | 2021-05-11 |
| CN112788241B true CN112788241B (en) | 2022-03-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113194241B (en) * | 2021-05-19 | 2022-09-30 | 维沃移动通信（杭州）有限公司 | Camera module and electronic equipment |
| CN113114919A (en) * | 2021-05-19 | 2021-07-13 | 江西晶浩光学有限公司 | Circuit board assembly, camera module and electronic equipment |
| CN113542548B (en) * | 2021-06-04 | 2023-12-26 | 维沃移动通信有限公司 | Camera structure and electronic equipment |
| CN113364962A (en) * | 2021-07-01 | 2021-09-07 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113810583B (en) * | 2021-09-28 | 2023-07-14 | 江西晶浩光学有限公司 | Camera module and electronic equipment |
| CN116156299A (en) * | 2021-11-17 | 2023-05-23 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN116156300A (en) * | 2021-11-17 | 2023-05-23 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104977783A (en) * | 2014-04-11 | 2015-10-14 | 三星电机株式会社 | Camera module |
| CN105137696A (en) * | 2015-09-06 | 2015-12-09 | 南昌欧菲光电技术有限公司 | Anti-shake apparatus of camera module and camera module |
| CN111399311A (en) * | 2020-03-26 | 2020-07-10 | 睿恩光电有限责任公司 | Piezoelectric sheet type optical anti-shake mechanism, camera device, and electronic apparatus |
| CN111565273A (en) * | 2020-05-18 | 2020-08-21 | Oppo（重庆）智能科技有限公司 | Optical anti-shake motor, camera module and electronic equipment thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101378332B1 (en) * | 2007-10-15 | 2014-03-27 | 삼성전자주식회사 | Shake correction module for photographing apparatus |
-
2021
- 2021-02-05 CN CN202110159345.1A patent/CN112788241B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104977783A (en) * | 2014-04-11 | 2015-10-14 | 三星电机株式会社 | Camera module |
| CN105137696A (en) * | 2015-09-06 | 2015-12-09 | 南昌欧菲光电技术有限公司 | Anti-shake apparatus of camera module and camera module |
| CN111399311A (en) * | 2020-03-26 | 2020-07-10 | 睿恩光电有限责任公司 | Piezoelectric sheet type optical anti-shake mechanism, camera device, and electronic apparatus |
| CN111565273A (en) * | 2020-05-18 | 2020-08-21 | Oppo（重庆）智能科技有限公司 | Optical anti-shake motor, camera module and electronic equipment thereof |
Non-Patent Citations (1)
| Title |
|---|
| 主流光学防抖技术简析;色拉;《移动信息》;20070101(第01期);全文 * |
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