CN215581432U

CN215581432U - Optical anti-shake device and electronic apparatus

Info

Publication number: CN215581432U
Application number: CN202022728076.XU
Authority: CN
Inventors: 杜智勇; 许勇
Original assignee: Galaxycore Shanghai Ltd Corp
Current assignee: Galaxycore Shanghai Ltd Corp
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2022-01-18
Anticipated expiration: 2030-11-23

Abstract

The utility model provides an optical anti-shake device and an electronic apparatus, the optical anti-shake device includes: the image sensor comprises an image sensor chip, a rebound component and a first flexible circuit unit which is electrically connected with the image sensor chip; the image sensor chip moves in the direction X, Y and rotates in a plane under the action of external force to perform motion compensation of optical anti-shake, and the initial position is restored under the action of the rebound component. The optical anti-shake device adopting the moving image sensor chip for motion compensation can better adapt to the trend that digital products with camera modules are increasingly lighter and thinner.

Description

Optical anti-shake device and electronic apparatus

Technical Field

The utility model relates to the technical field of image imaging, in particular to a device and electronic equipment for optical anti-shaking by adopting a moving image sensor chip.

Background

When the handheld portable intelligent device is used for photographing or recording, the interference of human body physiological vibration and external vibration on the handheld portable intelligent device cannot be avoided, the human body physiological vibration cannot be overcome through training, and the external vibration changes along with environmental change, so that the handheld portable intelligent device is inevitably influenced by the factors to generate unnecessary vibration when the handheld portable intelligent device is used for photographing or recording, the image quality is reduced, and the most obvious phenomenon is that the image obtained by photographing or recording is fuzzy and unclear.

The existing handheld portable intelligent equipment uses a lens component which can move in the XY axis direction in a camera module, so that the aim of compensating physiological vibration of a human body and external vibration is fulfilled, and a high-quality image is obtained. However, with the progress of technology and the increasing pursuit of images by consumers, the camera module of the existing handheld portable intelligent device has a proportionally increased and heavier lens due to the increase of the image sensor. Conventional methods of compensating for movement of the lens in the XY-axis direction have made it increasingly difficult to push a heavy lens. And the angle which can be compensated by the method for carrying out motion compensation on the lens in the XY axis direction cannot meet the requirement of a customer on the image quality.

In the prior art, the optical anti-shake method provided by the mobile image sensor chip has a complex structure, is mostly applied to single-lens reflex digital cameras, and is rarely applied to cases of handheld portable intelligent devices.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem, an object of the present invention is to provide an optical anti-shake apparatus for performing motion compensation using a moving image sensor chip, including:

the image sensor comprises an image sensor chip, a rebound component and a first flexible circuit unit which is electrically connected with the image sensor chip;

the image sensor chip moves in the direction X, Y and rotates in a plane under the action of external force to perform motion compensation of optical anti-shake, and the initial position is restored under the action of the rebound component.

Preferably, the image sensor chip is adapted to move in the direction X, Y and to rotate in a plane under the action of the first driving unit.

Preferably, the first driving unit comprises a shape memory alloy wire, and the shape memory alloy wire is suitable for receiving a control signal of the optical anti-shake control unit so as to deform according to the control signal when the control signal changes, so that the image sensor chip generates X, Y-direction displacement or planar rotation.

Preferably, the optical anti-shake apparatus further includes:

a lower substrate positioned below the image sensor chip;

one end of the first driving unit is electrically connected with the lower substrate, and the other end of the first driving unit acts on the image sensor chip.

Preferably, the first driving unit includes a shape memory alloy wire, one end of the shape memory alloy wire is electrically connected to the optical anti-shake control unit through the lower substrate, and the other end of the shape memory alloy wire acts on the image sensor chip.

Preferably, one end of the resilient member is connected to the lower substrate, and the other end of the resilient member acts on the image sensor chip.

Preferably, the resilient member comprises:

a flexure;

the flexure is provided with at least one elastic cantilever, and the image sensor chip is suitable for restoring the initial position under the action of the elastic cantilever.

Preferably, the resilient member further comprises:

an inner frame;

the inner frame is fixedly connected with the image sensor chip, and the periphery of the inner frame is suitable for leading out the bending part.

Preferably, the image sensor device further comprises a carrier plate, the image sensor chip and the carrier plate are fixedly arranged, the carrier plate comprises a logic circuit unit, and the logic circuit unit is used for carrying out circuit combination on pins of the image sensor chip and electrically connected with the first flexible circuit unit.

Preferably, the first driving unit and one end of the image sensor chip are fixed to one corner of the carrier plate.

Preferably, one end of the resilient member is fixedly connected to the bottom surface of the carrier plate.

Preferably, the carrier plate is located above the lower substrate.

Preferably, the carrier plate is provided with capacitors, and the capacitors are arranged in a strip shape and surround the side edge of the image sensor.

Preferably, the lower substrate is provided with an opening or a groove corresponding to the orthographic projection of the image sensor chip, and the image sensor chip is suitable for achieving X, Y-directional movement or rotation in the opening or the groove.

Preferably, the carrier plate is provided with an opening or a groove at a position corresponding to the orthographic projection of the image sensor chip.

Preferably, the first driving unit includes a shape memory alloy wire, one end of the shape memory alloy wire is disposed on the lower substrate and electrically connected to the optical anti-shake control unit through the lower substrate, and the other end of the shape memory alloy wire acts on one corner of the carrier plate.

Preferably, at least two shape memory alloy wires are respectively arranged on the side edge of the carrier plate in the direction X, Y.

Preferably, a support is further disposed on the lower substrate, the support is adapted to leave a gap of a predetermined height between the lower substrate and the image sensor chip, and the support is adapted to roll or slide with the movement of the image sensor chip.

Preferably, the infrabasal plate includes Printed Circuit Board (PCB) and laminates in the reinforcing plate of Printed Circuit Board (PCB) bottom surface, Printed Circuit Board (PCB) is in the image sensor chip orthographic projection corresponds the department and is provided with the trompil, the reinforcing plate is in support piece's orthographic projection department is provided with the recess, support piece set up in the recess.

Preferably, the support is a metal ball or a ceramic ball.

Preferably, the lower substrate is provided with an opening or a groove, and the opening or the groove is suitable for arranging the support.

Preferably, the rolling or sliding direction of at least three of the supporting members, corresponding to at least three sides of the image sensor chip, is X, Y, so as to reduce the moving friction force of the image sensor chip toward X, Y direction and provide the guarantee of flatness of the image sensor.

Preferably, a carrier plate is further provided, the image sensor chip and the carrier plate are fixedly arranged, the carrier plate comprises a logic circuit unit, and the logic circuit unit performs circuit combination on pins of the image sensor chip and is electrically connected with the first flexible circuit unit; the support member is disposed between the carrier plate and the lower substrate.

Preferably, the predetermined height is greater than or equal to 50 micrometers.

Preferably, at least one side of the lower substrate is provided with a second flexible circuit unit.

Preferably, the second flexible circuit unit is disposed opposite to and electrically connected to the first flexible circuit unit.

Preferably, a filter assembly is further included, the filter assembly including a filter over the image sensor chip.

Preferably, the image sensor further comprises an optical filter assembly, wherein the optical filter is arranged in the carrier plate and is positioned above the image sensor chip.

Preferably, a second driving unit adapted to drive the lens unit to move in the Z direction is further included.

Preferably, the second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit, or a piezoelectric ceramic driving unit.

Preferably, the image sensor further comprises a base including an accommodating space and a sidewall, the image sensor chip is located at the center of a lower portion of the accommodating space, and the accommodating space is adapted to accommodate the second driving unit and the lens unit therein.

Preferably, the first flexible circuit unit is disposed outside the sidewall.

Preferably, the first flexible circuit unit includes at least one bent portion to surround the side wall.

Preferably, the flexible circuit board further comprises a housing, and the housing partially covers the outer side of the first flexible circuit unit surrounding the side wall part.

Preferably, the liquid crystal display device further comprises a base, the base comprises an accommodating space and a side wall, the accommodating space is suitable for accommodating a second driving unit and a lens unit, the bottom of the base is fixedly arranged on the lower substrate, at least one side of the lower substrate is provided with a second flexible circuit unit, and the second driving unit is suitable for realizing electrical connection through the second flexible circuit unit.

Preferably, the position of the image sensor chip is fed back and controlled in real time through the resistance value change of the shape memory alloy wire.

Preferably, one end of the first driving unit is powered by the lower substrate, and the other end of the first driving unit is connected to a ground terminal of the carrier plate; or one end of the first driving unit is powered by the carrier plate, and the other end of the first driving unit is connected to the grounding end of the lower substrate.

The technical scheme of the utility model also provides electronic equipment which comprises the optical anti-shake device for performing motion compensation by adopting the moving image sensor.

Compared with the prior art, the optical anti-shake device adopting the moving image sensor chip for motion compensation and the electronic equipment thereof have the following beneficial effects:

compared with the existing design, the optical anti-shake device provided by the utility model adopts the first driving unit to drive the image sensor chip, so that the image sensor chip generates X, Y-direction displacement or plane rotation. The first driving unit can comprise a shape memory alloy wire structure with a small size, so that the formed driving assembly is simple in structure and convenient to operate and control, and the size of the optical anti-shake device can be further reduced.

Furthermore, the optical anti-shake device provided by the utility model is provided with the rebound component, so that the image sensor chip can restore to the initial position, the rebound component is light and compact in structure and convenient to operate and control, and the volume of the optical anti-shake device can be further reduced.

Furthermore, in the optical anti-shake device provided by the present invention, the image sensor chip may be fixedly disposed on the carrier, and the carrier includes a logic circuit unit, and the logic circuit unit performs circuit combination on the pins of the image sensor chip, so as to further reduce the volume of the optical anti-shake device.

Furthermore, the carrier plate is provided with the opening, the image sensor chip can be embedded in the carrier plate, the overall thickness of the optical anti-shake device provided by the utility model can be reduced, namely, the distance between the photosensitive surface of the image sensor chip and the lowest surface of the optical anti-shake device is reduced, the size and the thickness of the optical anti-shake device can be further reduced, and the trend that digital products with camera modules are increasingly thinner and lighter can be better adapted.

Furthermore, in the optical anti-shake device provided by the utility model, the lower substrate is also provided with a hole or a groove, and the image sensor chip and/or the carrier plate can be further close to the lowest surface of the lower substrate, i.e. the distance between the photosensitive surface of the image sensor chip and the lowest surface of the optical anti-shake device is further reduced, so that the trend that digital products with camera modules are increasingly thinner and lighter can be better adapted.

Furthermore, in the optical anti-shake device provided by the utility model, the carrier board is powered by the first flexible circuit unit, and the first flexible circuit unit can be partially bent and arranged between the side wall of the base of the optical anti-shake device and the shell, so that the volume of the optical anti-shake device can be further reduced.

Furthermore, in the optical anti-shake device provided by the utility model, the lower substrate is powered by the second flexible circuit unit, and the first flexible circuit unit and the second flexible circuit unit are oppositely arranged and connected with each other, so that the optical anti-shake device is simple and light in structure.

Furthermore, in the optical anti-shake device provided by the utility model, the lens unit can also be adapted to drive the lens unit to move in the Z direction by the second driving unit, so as to further realize a more precise OIS anti-shake effect.

Drawings

Fig. 1 is an exploded view of an optical anti-shake apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a lower substrate of the optical anti-shake apparatus according to an embodiment of the present invention;

fig. 3 to 5 are schematic structural diagrams of the optical anti-shake apparatus according to an embodiment of the utility model.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.

Next, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, the schematic diagrams are only examples for convenience of description, and the scope of the present invention should not be limited herein.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, an integrated capacitive-gate sensor of the present invention is described in detail below with reference to the accompanying drawings.

Referring to fig. 1, in an embodiment of the present invention, there is provided an optical anti-shake apparatus for performing motion compensation using a moving image sensor chip, including:

the image sensor device comprises an image sensor chip 100, a rebound part 410 and a first flexible circuit unit 120 which is electrically connected with the image sensor chip;

the image sensor chip 100 moves in the direction X, Y and rotates in a plane by an external force to perform motion compensation for optical anti-shake, and returns to an original position by the resilient member 410.

In the present embodiment, the image sensor chip 100 is adapted to move in the direction X, Y and to rotate in a plane by the first driving unit 420.

In this embodiment, the first driving unit 420 includes a shape memory alloy wire, and the shape memory alloy wire is adapted to receive a control signal of the optical anti-shake control unit (not shown), so as to deform according to the control signal when the control signal changes, so that the image sensor chip 100 generates X, Y-directional displacement or planar rotation.

In this embodiment, the optical anti-shake apparatus further includes: a lower substrate 500 and/or a carrier substrate 110.

Referring to fig. 2 in conjunction with fig. 1, the lower substrate 500 is located below the image sensor chip 100; a first driving unit 420 is further disposed between the lower substrate 500 and the image sensor chip 100. Preferably, the optical anti-shake apparatus further includes a resilient member 410.

Specifically, one end of the first driving unit 420 is electrically connected to the lower substrate 500, and the other end of the first driving unit acts on the image sensor chip 100.

In this embodiment, the first driving unit 420 includes a shape memory alloy wire, one end of which is electrically connected to an optical anti-shake control unit (not shown) through the lower substrate 500, and the other end of which acts on the image sensor chip 100.

Specifically, one end of the resilient member 410 is connected to the lower substrate 500, and the other end thereof acts on the image sensor chip 100.

Referring to fig. 3 in conjunction with fig. 1, in the present embodiment, the resilient member 410 includes: the flexure 415; the flexure 415 is provided with at least one elastic cantilever fixedly connected to the image sensor chip 100. The image sensor chip 100 leaves the initial position when driven or pulled by the first driving unit 420, and is adapted to return to the initial position under the action of the elastic cantilever after the first driving unit 420 stops working.

Specifically, in this embodiment, the resilient member 410 further includes: an inner frame 414; the inner frame 414 is fixedly connected to a side of the image sensor chip 100, and the outer periphery of the inner frame 414 is adapted to lead out the flexing portion 415.

In one implementation, the image sensor chip 100 and the carrier plate 110 are fixedly disposed, and the carrier plate 110 includes a logic circuit unit, and the logic circuit unit performs circuit combination on pins of the image sensor chip 100 and is electrically connected to the first flexible circuit unit 120.

One end of the first driving unit 420 acting on the image sensor chip 100 is fixed to the bottom surface of the carrier plate 110. One end of the flexible portion 415 of the resilient member 410 is fixedly connected to the bottom surface of the carrier plate 110.

In one implementation, the first driving unit includes a shape memory alloy wire, one end of the shape memory alloy wire is disposed on the lower substrate 500 and electrically connected to the optical anti-shake control unit through the lower substrate 500, and the other end of the shape memory alloy wire acts on one corner of the carrier 100.

In one embodiment, at least two shape memory alloy wires 420 are disposed on the lateral side of the carrier plate 110 in the direction X, Y.

In one implementation, the carrier 110 is located above the lower substrate 500.

In one implementation, the carrier 110 has capacitors arranged thereon, and the capacitors are arranged in a strip shape and surround the sides of the image sensor.

Further, in one implementation case, the lower substrate 500 is provided with an opening corresponding to the orthographic projection of the carrier 110, the image sensor chip 100 is adapted to be fixedly disposed on the carrier 110, and the carrier 110 moves or rotates in the direction X, Y in the opening.

Further, in one implementation, the carrier board 110 is provided with an opening or a groove corresponding to the orthographic projection of the image sensor chip 100. The image sensor chip 100 is adapted to be embedded in the opening.

Further, in one implementation case, the lower substrate 500 is provided with an opening corresponding to the orthographic projection of the carrier substrate 110, and the carrier substrate 110 is provided with an opening or a groove corresponding to the orthographic projection of the image sensor chip 100. The image sensor chip 100 is adapted to be embedded in the opening of the carrier plate 110 and fixedly connected to the carrier plate 110, and the carrier plate 110 is adapted to move or rotate in the direction X, Y in the opening of the lower substrate 500.

In this embodiment, a support 44 is further disposed on the lower substrate 500, the support 44 is adapted to leave a gap of a predetermined height between the lower substrate 500 and the image sensor chip 100, and the support 44 is adapted to roll or slide along with the movement of the image sensor chip 100.

In one embodiment, the lower substrate 500 includes a Printed Circuit Board (PCB) and a reinforcing plate attached to a bottom surface of the Printed Circuit Board (PCB), the Printed Circuit Board (PCB) is provided with an opening at a position corresponding to an orthographic projection of the image sensor chip, the reinforcing plate is provided with a groove 54 at a position corresponding to an orthographic projection of the supporting member, and the supporting member is disposed in the groove 54.

In this embodiment, the support 44 is a metal ball or a ceramic ball.

In this embodiment, the lower substrate 500 is provided with an opening or a groove 54, and the opening or the groove 54 is suitable for the support 44.

In this embodiment, the rolling or sliding direction of at least three of the supporting members 44, corresponding to at least three sides of the image sensor chip 100, is X, Y, so as to reduce the moving friction force of the image sensor chip 100 in the direction X, Y and provide the flatness assurance of the image sensor chip 100.

In this embodiment, the predetermined height is equal to or greater than 50 micrometers.

In this embodiment, at least one side of the lower substrate 500 is provided with a second flexible circuit unit 520.

Referring to fig. 4, in the present embodiment, the second flexible circuit unit 520 is disposed opposite to and electrically connected to the first flexible circuit unit 120.

Referring to fig. 5, in the present embodiment, the optical anti-shake apparatus further includes an optical filter assembly including an optical filter 170 positioned above the image sensor chip 100.

In one implementation, the optical filter 170 is disposed in the carrier substrate 110 and located above the image sensor chip 100.

In one implementation, the optical anti-shake apparatus further includes a second driving unit (not shown) adapted to drive the lens unit 210 to move in the Z direction.

Further, the second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit or a piezoelectric ceramic driving unit.

With continued reference to fig. 1, the optical anti-shake apparatus further includes a base 300, the base 300 including an accommodating space and a sidewall, the image sensor chip 100 being located at a center of a lower portion of the accommodating space, the accommodating space being adapted to accommodate the second driving unit and the lens unit therein.

In this embodiment, the first flexible circuit unit 120 is disposed outside the sidewall. Specifically, the first flexible circuit unit 120 includes at least one bending portion to surround the sidewall.

In this embodiment, the optical anti-shake apparatus further includes a housing 600, and the housing 600 partially covers the outer side of the first flexible circuit unit 120 surrounding the sidewall portion.

In this embodiment, the bottom of the base 300 is fixedly disposed on the lower substrate 500, at least one side of the lower substrate 500 is disposed with a second flexible circuit unit 120, and the second driving unit is suitable for realizing electrical connection through the second flexible circuit unit 120.

In this embodiment, the position of the image sensor chip 100 is fed back and controlled in real time by the change in the resistance value of the shape memory alloy wire.

In this embodiment, one end of the first driving unit 420 is powered by the lower substrate 500, and the other end is connected to the ground terminal of the carrier board 110; or one end of the first driving unit 420 is powered by the carrier board 110, and the other end is connected to the ground terminal of the lower substrate 500.

Compared with the prior art, the optical anti-shake apparatus provided by the present invention uses the first driving unit 420 to drive the image sensor chip 100, so that the image sensor chip 100 generates X, Y-directional displacement or planar rotation. The first driving unit 420 may include a shape memory alloy wire structure with a small volume, so that the formed driving assembly has a simple structure and is easy to operate, and the volume of the optical anti-shake apparatus may be further reduced.

Furthermore, the optical anti-shake apparatus provided by the present invention is provided with a rebound component, so that the image sensor chip 100 recovers to the initial position, the rebound component 410 is light and compact in structure, and is light and convenient to operate, and the volume of the optical anti-shake apparatus can be further reduced.

Further, in the optical anti-shake apparatus provided by the present invention, the image sensor chip may be fixedly disposed on the carrier, and the carrier 110 includes a logic circuit unit, and the logic circuit unit performs circuit combination on the pins of the image sensor chip 100, so as to further reduce the volume of the optical anti-shake apparatus.

Furthermore, the carrier plate 110 is provided with an opening, and the image sensor chip can be embedded in the carrier plate 110, so that the overall thickness of the optical anti-shake device provided by the utility model can be reduced, that is, the distance between the photosensitive surface of the image sensor chip 100 and the lowest surface of the optical anti-shake device is reduced, the size and thickness of the optical anti-shake device can be further reduced, and the trend that digital products with camera modules are increasingly thinner and lighter can be better adapted.

Furthermore, in the optical anti-shake apparatus provided by the present invention, the lower substrate 500 is also provided with an opening or a groove, and the image sensor chip 100 and/or the carrier plate 110 can be further close to the lowest surface of the lower substrate 500, that is, the distance between the photosensitive surface of the image sensor chip 100 and the lowest surface of the optical anti-shake apparatus is further reduced, which can better adapt to the trend of increasingly thinner digital products with camera modules.

Furthermore, in the optical anti-shake apparatus provided by the present invention, the carrier plate 110 is powered by the first flexible circuit unit 120, and the first flexible circuit unit 120 may be partially bent and disposed between the sidewall of the base of the optical anti-shake apparatus and the housing 600, so as to further reduce the volume of the optical anti-shake apparatus.

Further, in the optical anti-shake device provided by the present invention, the second flexible circuit unit 520 is used for supplying power to the lower substrate 500, and the first flexible circuit unit 120 and the second flexible circuit unit 520 are oppositely disposed and connected to each other, so that the optical anti-shake device has a simple and light structure.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.

Claims

1. An optical anti-shake apparatus which performs motion compensation using a moving image sensor chip, comprising:

2. The optical anti-shake apparatus according to claim 1, wherein the image sensor chip is adapted to move in X, Y directions and to rotate in a plane under the action of the first driving unit.

3. The optical anti-shake apparatus according to claim 2, wherein the first driving unit comprises a shape memory alloy wire, and the shape memory alloy wire is adapted to receive the control signal of the optical anti-shake control unit, so that when the control signal changes, the shape memory alloy wire deforms according to the control signal, and the image sensor chip generates X, Y-directional displacement or planar rotation.

4. The optical anti-shake apparatus according to claim 2, further comprising:

a lower substrate positioned below the image sensor chip;

5. The optical anti-shake apparatus according to claim 4, wherein:

the first driving unit comprises a shape memory alloy wire, one end of the shape memory alloy wire is electrically connected with the optical anti-shake control unit through the lower substrate, and the other end of the shape memory alloy wire acts on the image sensor chip.

6. The optical anti-shake apparatus according to claim 4, wherein the resilient member has one end connected to the lower substrate and the other end acting on the image sensor chip.

7. The optical anti-shake apparatus according to claim 6, wherein the resilient member comprises:

a flexure;

8. The optical anti-shake apparatus according to claim 7, wherein the resilient member further comprises:

an inner frame;

9. The optical anti-shake apparatus according to claim 4, further comprising a carrier board, wherein the image sensor chip is fixed to the carrier board, and the carrier board comprises a logic circuit unit, and the logic circuit unit performs circuit combination on the pins of the image sensor chip and is electrically connected to the first flexible circuit unit.

10. The optical anti-shake apparatus according to claim 9, wherein an end of the first driving unit acting on the image sensor chip is fixed to a corner of the carrier.

11. The optical anti-shake apparatus according to claim 9, wherein one end of the resilient member is fixedly connected to the bottom surface of the carrier.

12. The optical anti-shake apparatus according to claim 9, wherein the carrier is located above the lower substrate.

13. The optical anti-shake apparatus according to claim 9, wherein the carrier has capacitors disposed thereon, and the capacitors are arranged in a stripe shape and around the sides of the image sensor.

14. The optical anti-shake apparatus according to claim 4, wherein the lower substrate is provided with an opening or a groove corresponding to the orthographic projection of the image sensor chip, and the image sensor chip is adapted to move or rotate in X, Y direction in the opening or the groove.

15. The optical anti-shake apparatus according to claim 9, wherein the carrier board is provided with an opening or a groove at a position corresponding to the orthographic projection of the image sensor chip.

16. The optical anti-shake apparatus according to claim 9, wherein:

the first driving unit comprises a shape memory alloy wire, one end of the shape memory alloy wire is arranged on the lower substrate and is electrically connected with the optical anti-shake control unit through the lower substrate, and the other end of the shape memory alloy wire acts on one corner of the carrier plate.

17. The optical anti-shake apparatus according to claim 16, wherein at least two shape memory alloy wires are disposed on the side of the carrier in the direction X, Y.

18. The optical anti-shake apparatus according to claim 4, wherein a support is further provided on the lower substrate, the support is adapted to leave a gap of a predetermined height between the lower substrate and the image sensor chip, and the support is adapted to roll or slide with the movement of the image sensor chip.

19. The optical anti-shake apparatus according to claim 18, wherein the lower substrate comprises a printed circuit board and a reinforcing plate attached to a bottom surface of the printed circuit board, the printed circuit board has an opening corresponding to an orthographic projection of the image sensor chip, the reinforcing plate has a groove corresponding to an orthographic projection of the supporting member, and the supporting member is disposed in the groove.

20. The optical anti-shake apparatus according to claim 18, wherein the support is a metal ball or a ceramic ball.

21. The optical anti-shake apparatus according to claim 18, wherein the lower substrate is provided with an opening or a groove adapted to provide the support.

22. The optical anti-shake apparatus according to claim 18, wherein the at least three supporting members respectively correspond to at least three sides of the image sensor chip, and the rolling or sliding direction is X, Y direction, so as to reduce the moving friction of the image sensor chip to X, Y direction and provide the flatness assurance of the image sensor chip.

23. The optical anti-shake apparatus according to claim 22, further comprising a carrier board, wherein the image sensor chip is fixedly disposed on the carrier board, and the carrier board comprises a logic circuit unit, and the logic circuit unit performs circuit combination on the pins of the image sensor chip and is electrically connected to the first flexible circuit unit; the support member is disposed between the carrier plate and the lower substrate.

24. The optical anti-shake apparatus according to claim 18, wherein the predetermined height is 50 μm or more.

25. The optical anti-shake apparatus according to claim 5, wherein at least one side of the lower substrate is provided with a second flexible circuit unit.

26. The optical anti-shake apparatus according to claim 25, wherein the second flexible circuit unit is disposed opposite to and electrically connected to the first flexible circuit unit.

27. The optical anti-shake apparatus according to claim 1, further comprising an optical filter assembly including an optical filter over the image sensor chip.

28. The optical anti-shake apparatus according to claim 9, further comprising an optical filter assembly, wherein the optical filter is disposed in the carrier and above the image sensor chip.

29. The optical anti-shake apparatus according to claim 25, further comprising a second driving unit adapted to drive the lens unit to move in the Z direction.

30. The optical anti-shake apparatus according to claim 29, wherein the second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit, or a piezoelectric ceramic driving unit.

31. The optical anti-shake apparatus according to claim 29, further comprising a chassis including an accommodating space and a sidewall, the image sensor chip being located at a center of a lower portion of the accommodating space, the accommodating space being adapted to accommodate the second driving unit and the lens unit therein.

32. The optical anti-shake apparatus according to claim 31, wherein the first flexible circuit unit is disposed outside the side wall.

33. The optical anti-shake apparatus according to claim 32, wherein the first flexible circuit unit includes at least one bent portion to surround the side wall.

34. The optical anti-shake apparatus according to claim 32, further comprising a housing that partially covers an outside of the first flexible circuit unit around the sidewall portion.

35. The optical anti-shake apparatus according to claim 29, further comprising a base, the base comprising an accommodating space and a sidewall, the accommodating space being adapted to accommodate a second driving unit and a lens unit therein, a bottom of the base being fixedly disposed on the lower substrate, at least one side of the lower substrate being provided with a second flexible circuit unit, the second driving unit being adapted to be electrically connected through the second flexible circuit unit.

36. The optical anti-shake apparatus according to claim 3, 5, or 16, wherein the position of the image sensor chip is fed back and controlled in real time by a change in resistance value of the shape memory alloy wire.

37. The optical anti-shake apparatus according to claim 9, wherein one end of the first driving unit is powered by the lower substrate, and the other end is connected to a ground terminal of the carrier; or one end of the first driving unit is powered by the carrier plate, and the other end of the first driving unit is connected to the grounding end of the lower substrate.

38. An electronic device characterized by comprising the optical anti-shake apparatus according to claim 1.