CN113829230B - Chip surface grinding system - Google Patents

Chip surface grinding system Download PDF

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Publication number
CN113829230B
CN113829230B CN202111103094.1A CN202111103094A CN113829230B CN 113829230 B CN113829230 B CN 113829230B CN 202111103094 A CN202111103094 A CN 202111103094A CN 113829230 B CN113829230 B CN 113829230B
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China
Prior art keywords
grinding
chip
camera system
piston
rotating mechanism
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CN202111103094.1A
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Chinese (zh)
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CN113829230A (en
Inventor
刘皓挺
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University of Science and Technology Beijing USTB
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University of Science and Technology Beijing USTB
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a chip surface grinding system.A grinding plate device and a chip adjusting device are arranged in a frame body, and the chip adjusting device clamps a chip and automatically grinds the chip on the grinding plate device; grinding the chip once, automatically adjusting the posture of the chip by using a chip adjusting device, and automatically acquiring the grinding state of a grinding area of the chip and analyzing the grinding effect by using a camera system; and in the stage of grinding the chip, the posture of the chip is adjusted by the chip adjusting automatic device, the grinding area of the chip is automatically aligned to the digital holographic camera system, and the digital holographic camera system acquires a high-precision grinding image of the grinding area of the chip and analyzes the grinding effect. The chip surface grinding system can realize mechanical chip grinding, replaces the existing manual grinding, has high grinding work efficiency, and when grinding is carried out once, the grinding state obtained by the camera system is in a chip grinding stage, and the digital holographic camera system shoots a high-precision grinding image to be divided from the grinding effect, so that the grinding coplanarity is good, and the grinding quality is good.

Description

Chip surface grinding system
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a chip surface grinding system.
Background
The grinding process of the chip is commonly existed in the process of packaging, manufacturing and returning to the factory for maintenance of various types of chips. The CCGA packaging technology is based on Ceramic Ball Grid Array (BGA), and adopts the packaging form of using solder Column pins to replace solder Ball pins, the solder columns with high melting point do not melt in the Column planting process and the board-level assembly process, and the eutectic solder is used for realizing welding, so that the high-efficiency welding of large pins larger than 1000 (close to 2000 lines) can be realized. The CCGA packaging technology has excellent performances of high temperature resistance, fatigue resistance, hot flash resistance and the like, and has great practical value in domestic high-end chip manufacturing industry.
At present, the domestic traditional method adopts a manual grinding mode to carry out coplanarity treatment. The end surface leveling process flow comprises the following steps: 1) Observing the end face of the welding column, judging the flatness of the initial end face, and selecting the type of the grinding fluid; 2) Coating grinding fluid on a grinding table, placing one side of the end face of the welding column on the surface of the grinding table for grinding, and adjusting the posture and the angle of the chip according to hand feeling in the grinding process; 3) And (4) placing the ground chip in a microscope with a certain magnification and a planeness measuring instrument for judging the grinding effect, and returning to the previous step if the grinding effect is not good. In the process, an operator is required to repeatedly grind the welding column surface, manually control indexes such as strength and angle, determine one-time grinding time according to the shape of the welding column end surface, and determine how to replace grinding fluid according to the grinding effect.
The existing chip grinding has the following problems:
(1) The CCGA packaging technology field is not mature in China, and the problems of poor coplanarity and low production efficiency exist in the welding cylindrical surface.
(2) The grinding process is complex, high-end chips are mostly multi-variety and small-batch products, various decisions need to be made continuously according to the grinding effect of different products, and manual interpretation and operation cannot be replaced by machines for a long time;
(3) Influenced by the experience of grinding operators, the grinding work efficiency and the quality can not be effectively ensured.
Disclosure of Invention
The invention provides a chip surface grinding system, and the conventional chip grinding has the following problems that the chip is manually ground, the grinding work efficiency and quality are not ensured, the coplanarity of welding cylindrical surfaces is poor, and the production efficiency is low.
To solve the above technical problem, an embodiment of the present invention provides the following solutions:
the embodiment of the invention provides a chip surface grinding system which comprises a frame body, wherein a grinding plate device and a chip adjusting device are arranged in the frame body, and the chip adjusting device clamps a chip and automatically grinds the chip on the grinding plate device;
a camera system and a digital holographic camera system are respectively arranged on two sides of the grinding plate device, the chip is ground once, the chip posture is automatically adjusted by the chip adjusting device, the grinding area of the chip is aligned to the camera system, and the camera system automatically acquires the grinding state of the grinding area of the chip and analyzes the grinding effect; and in the stage of grinding the chip, the posture of the chip is adjusted by the chip adjusting automatic device, the grinding area of the chip is automatically aligned to the digital holographic camera system, and the digital holographic camera system acquires a high-precision grinding image of the grinding area of the chip and analyzes the grinding effect.
Preferably, the chip adjusting device comprises a parallel mechanism, wherein a lifting mechanism is installed on the parallel mechanism, the parallel mechanism can be driven to move in parallel by the lifting mechanism, a rotating mechanism is installed on the lifting mechanism and can be driven to move up and down by the rotating mechanism, a piston mechanism is installed on the rotating mechanism and can be driven to rotate by the rotating mechanism, a rotating mechanism is installed on the piston mechanism and can be driven to move in a stretching manner by the piston mechanism, a clamping jaw is installed on the rotating mechanism and can be driven to rotate by the clamping jaw, and the chip can be clamped by the clamping jaw.
Preferably, the system further comprises a touch operation display panel, and the touch operation display panel can display the grinding state and analysis result of the grinding area of the chip automatically acquired by the camera system in real time, and the high-precision grinding image and analysis result of the grinding area of the chip acquired by the digital holographic camera system.
Preferably, the grinding plate device comprises a grinding plate, and the grinding plate is driven to rotate by a grinding plate driving device.
Preferably, the piston means comprises a plurality of pistons arranged in parallel.
Preferably, a plurality of film pressure sensors are mounted on the rotating mechanism.
Preferably, the system further comprises a touch operation display panel, a piston module capable of controlling the piston mechanism is arranged on the touch operation display panel, a person carries a vibrating data glove, and the piston module is touched and an arc line is drawn to simulate manual operation to control the piston mechanism.
Preferably, the piston means comprises 3 pistons arranged in parallel.
Preferably, the system further comprises a touch operation display panel, and the touch operation display panel can display the data collected by the film pressure sensor in real time.
The scheme of the invention at least comprises the following beneficial effects:
in the above scheme, the chip surface grinding system can realize mechanical chip grinding, replaces the existing manual grinding, has high grinding work efficiency, and once grinding, the camera system automatically acquires the grinding state of the grinding area of the chip, and the chip grinding stage, the digital holographic camera system acquires the high-precision grinding image and the grinding effect analysis of the grinding area of the chip, so that the grinding coplanarity is good, and the grinding quality is ensured.
Drawings
FIG. 1 is a schematic diagram of a system for polishing a surface of a wafer according to the present invention;
FIG. 2 is a schematic view of a wafer conditioner of the wafer surface polishing system of the present invention.
Reference numerals:
1. a frame body; 2. a touch operation display panel; 3. a digital holographic camera system; 4. a chip adjustment device; 41. a parallel mechanism; 42. a lifting mechanism; 43. a rotating mechanism; 44. a piston mechanism; 45. a rotation mechanism; 46. a clamping jaw; 5. a camera system; 6. a lapping plate device.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 to 2, the present embodiment provides a chip surface grinding system, which includes a frame body 1, a grinding plate device 6 and a chip adjusting device 4 are installed in the frame body 1, and the chip adjusting device 4 clamps a chip on the grinding plate device 6 to automatically grind the chip; a camera system 5 and a digital holographic camera system 3 are respectively arranged on two sides of a grinding plate device 6, a chip is ground once, a chip adjusting device 4 automatically adjusts the posture of the chip, the grinding area of the chip is aligned to the camera system 5, the camera system 5 automatically acquires the grinding state of the grinding area of the chip and analyzes the grinding effect to acquire a two-dimensional grinding state, and the camera system 5 can use a visible light camera; and in the stage of grinding the chip, the posture of the chip is adjusted by the chip adjusting automatic device, the grinding area of the chip is automatically aligned to the digital holographic camera system 3, and the digital holographic camera system 3 acquires a high-precision grinding image and a grinding effect analysis of the grinding area of the chip to acquire a three-dimensional grinding state. The chip surface grinding system of this embodiment can realize mechanized chip grinding, replaces current manual grinding, and grinding work efficiency is high, and every grinding, camera system 5 automatic acquisition chip's the grinding state in grinding the region, and chip grinding one stage, digital holography camera system 3 acquire the high accuracy grinding image and the grinding effect analysis in the grinding region of chip, have guaranteed that the grinding coplanarity is good, have guaranteed grinding quality. The camera system 5 of the embodiment can realize the collection, analysis and measurement of two-dimensional images, the precision reaches dozens of micrometers, and the digital holographic camera system 3 can realize the measurement of three-dimensional morphology, and the precision reaches several micrometers or submicron level.
The chip adjusting device 4 of the present embodiment includes a parallel mechanism 41, a lifting mechanism 42 is installed on the parallel mechanism 41, the parallel mechanism 41 can drive the lifting mechanism 42 to move in parallel, a rotating mechanism 43 is installed on the lifting mechanism 42, the lifting mechanism 42 can drive the rotating mechanism 43 to move in a lifting manner, a piston mechanism 44 is installed on the rotating mechanism 43, the rotating mechanism 43 can drive the piston mechanism 44 to rotate, a rotating mechanism 45 is installed on the piston mechanism 44, the piston mechanism 44 can drive the rotating mechanism 45 to move in an extending manner, a clamping jaw 46 is installed on the rotating mechanism 45, the rotating mechanism 45 can drive the clamping jaw 46 to rotate, and the clamping jaw 46 can clamp a chip. The piston mechanism 44 includes a plurality of pistons arranged in parallel, and the piston mechanism 44 includes 3 pistons arranged in parallel. A plurality of film pressure sensors are mounted on the rotation mechanism 45. The chip adjusting device 4 of the embodiment can drive the chip to realize any posture.
The system also comprises a touch operation display panel 2 arranged on the frame body 1, wherein the touch operation display panel 2 can display the grinding state and analysis result of the grinding area of the chip automatically acquired by the camera system 5 in real time, the high-precision grinding image and analysis result of the grinding area of the chip acquired by the digital holographic camera system 3, and can also display the data acquired by the film pressure sensor in real time to form a grinding force distribution diagram. The touch operation display panel 2 is provided with a piston module capable of controlling the piston mechanism 44, a person carries a vibrating data glove with hands, and the piston module is touched and draws an arc line to simulate manual operation to control the piston mechanism 44. The touch operation display panel 2 may be used. The system of the embodiment can display a visual grinding force distribution diagram in real time, the data collected by the film pressure sensor form the grinding force distribution diagram, and can also display a visible light camera shooting image and an analysis result of single grinding in real time, the display camera system 5 automatically acquires the grinding state and the analysis result, namely the visible light camera shooting image of single grinding, the digital holographic camera system 3 acquires a high-precision grinding image and an analysis result of a grinding area of a chip, namely the digital holographic camera shooting image of stage grinding, a friendly visual output interface is established, and the visual and tactile perception capability of an operator is enhanced by the data glove with vibration.
The polishing plate device 6 of the present embodiment includes a polishing plate, and the polishing plate driving device drives the polishing plate to rotate.
The application process of the chip surface grinding system of the invention is as follows:
(1) An operator observes the surface to be ground of the chip, determines the type of the grinding fluid according to experience, uniformly coats the grinding fluid on the surface of the grinding table and fixes the chip on the clamping jaw 46;
(2) The automatic control chip adjusting device 4 and the grinding plate device 6 grind the chip, or the piston module of the touch operation display panel 2 is manually operated, and the grinding chip is manually operated in a remote control mode;
(3) In the grinding process, after the system finishes one grinding operation, the posture of the chip is rotated and adjusted, a camera system 5 is adopted to photograph the grinding surface of the chip and analyze the grinding effect;
(4) After finishing a stage of grinding work, adjusting the posture of the chip, and shooting a high-precision grinding image by the digital holographic camera system 3 and analyzing the grinding effect;
(5) In one stage, the grinding effect meets the requirement of processing quality, the work is stopped, and the chip flow is switched to the next process link; otherwise, repeating the grinding process in the steps (2) to (4).
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (7)

1. A chip surface grinding system is characterized by comprising a frame body, wherein a grinding plate device and a chip adjusting device are arranged in the frame body, and the chip adjusting device clamps a chip and automatically grinds the chip on the grinding plate device;
a camera system and a digital holographic camera system are respectively arranged on two sides of the grinding plate device, the chip is ground once, the chip posture is automatically adjusted by the chip adjusting device, the grinding area of the chip is aligned to the camera system, and the camera system automatically acquires the grinding state of the grinding area of the chip and analyzes the grinding effect; in the stage of grinding the chip, the posture of the chip is adjusted by the chip adjusting automatic device, the grinding area of the chip is automatically aligned to the digital holographic camera system, and the digital holographic camera system acquires a high-precision grinding image of the grinding area of the chip and analyzes the grinding effect;
the chip adjusting device comprises a parallel mechanism, a lifting mechanism is mounted on the parallel mechanism, the parallel mechanism can drive the lifting mechanism to move in parallel, a rotating mechanism is mounted on the lifting mechanism, the lifting mechanism can drive the rotating mechanism to move up and down, a piston mechanism is mounted on the rotating mechanism, the rotating mechanism can drive the piston mechanism to rotate, a rotating mechanism is mounted on the piston mechanism, the piston mechanism can drive the rotating mechanism to move in a stretching mode, a clamping jaw is mounted on the rotating mechanism, the rotating mechanism can drive the clamping jaw to rotate, and the clamping jaw can clamp the chip;
the system also comprises a touch operation display panel, wherein the touch operation display panel can display the grinding state and the analysis result of the grinding area of the chip automatically acquired by the camera system in real time, and the digital holographic camera system acquires the high-precision grinding image and the analysis result of the grinding area of the chip.
2. The system of claim 1, wherein the lapping plate assembly includes a lapping plate, and a lapping plate drive assembly drives the lapping plate to rotate.
3. The system of claim 1, wherein the piston mechanism comprises a plurality of pistons arranged in parallel.
4. The system of claim 1, wherein a plurality of thin film pressure sensors are mounted on the rotating mechanism.
5. The system of claim 1, further comprising a touch-sensitive display panel having a piston module for operating the piston mechanism, wherein the hand carries a vibrating data glove, and wherein the piston module is touched and curved to simulate manual operation of the piston mechanism.
6. The system of claim 3, wherein the piston mechanism comprises 3 pistons arranged in parallel.
7. The system of claim 4, further comprising a touch-sensitive display panel for displaying data collected by the thin film pressure sensor in real time.
CN202111103094.1A 2021-09-18 2021-09-18 Chip surface grinding system Active CN113829230B (en)

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CN202111103094.1A CN113829230B (en) 2021-09-18 2021-09-18 Chip surface grinding system

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CN113829230B true CN113829230B (en) 2023-01-17

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114252319B (en) * 2022-03-01 2022-12-09 江山季丰电子科技有限公司 Fault analysis method of semiconductor laser, preparation method of sample and system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319557A (en) * 2001-04-20 2002-10-31 Nec Corp Semiconductor polishing device
CN101412197A (en) * 2008-12-02 2009-04-22 深圳市翔通光电技术有限公司 Optical fiber ceramic core automatic grinder and automatic grinding method
CN104470681A (en) * 2012-06-21 2015-03-25 国立大学法人鹿儿岛大学 Observation and photography apparatus
CN211491016U (en) * 2020-01-22 2020-09-15 黄石晨信光电股份有限公司 Automatic grinding machine for optical fiber ferrule
CN211785068U (en) * 2020-03-25 2020-10-27 郑州轻工业大学 Machine vision detection device
CN212218159U (en) * 2020-05-26 2020-12-25 东莞高伟光学电子有限公司 Automatic grinding, polishing and detecting equipment
CN112440203A (en) * 2019-09-03 2021-03-05 芯恩（青岛）集成电路有限公司 Wafer grinding system and wafer grinding method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319557A (en) * 2001-04-20 2002-10-31 Nec Corp Semiconductor polishing device
CN101412197A (en) * 2008-12-02 2009-04-22 深圳市翔通光电技术有限公司 Optical fiber ceramic core automatic grinder and automatic grinding method
CN104470681A (en) * 2012-06-21 2015-03-25 国立大学法人鹿儿岛大学 Observation and photography apparatus
CN112440203A (en) * 2019-09-03 2021-03-05 芯恩（青岛）集成电路有限公司 Wafer grinding system and wafer grinding method
CN211491016U (en) * 2020-01-22 2020-09-15 黄石晨信光电股份有限公司 Automatic grinding machine for optical fiber ferrule
CN211785068U (en) * 2020-03-25 2020-10-27 郑州轻工业大学 Machine vision detection device
CN212218159U (en) * 2020-05-26 2020-12-25 东莞高伟光学电子有限公司 Automatic grinding, polishing and detecting equipment

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