CN113817413A - High-performance glass cover plate polishing solution - Google Patents
High-performance glass cover plate polishing solution Download PDFInfo
- Publication number
- CN113817413A CN113817413A CN202111160765.8A CN202111160765A CN113817413A CN 113817413 A CN113817413 A CN 113817413A CN 202111160765 A CN202111160765 A CN 202111160765A CN 113817413 A CN113817413 A CN 113817413A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- glass cover
- polishing solution
- plate polishing
- performance glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 30
- 238000007494 plate polishing Methods 0.000 title claims abstract description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 22
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 6
- 239000003381 stabilizer Substances 0.000 claims abstract description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000008367 deionised water Substances 0.000 claims abstract description 5
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 5
- 229940079881 disodium lauroamphodiacetate Drugs 0.000 claims abstract description 5
- ZPRZNBBBOYYGJI-UHFFFAOYSA-L disodium;2-[1-[2-(carboxylatomethoxy)ethyl]-2-undecyl-4,5-dihydroimidazol-1-ium-1-yl]acetate;hydroxide Chemical compound [OH-].[Na+].[Na+].CCCCCCCCCCCC1=NCC[N+]1(CCOCC([O-])=O)CC([O-])=O ZPRZNBBBOYYGJI-UHFFFAOYSA-L 0.000 claims abstract description 5
- 239000003112 inhibitor Substances 0.000 claims abstract description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical group CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 2
- 150000002222 fluorine compounds Chemical group 0.000 claims description 2
- 229940050410 gluconate Drugs 0.000 claims description 2
- 238000005498 polishing Methods 0.000 abstract description 13
- 238000005530 etching Methods 0.000 abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- -1 hydrogen ions Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/18—Other polishing compositions based on non-waxy substances on other substances
Abstract
The invention belongs to the technical field of glass etching, and particularly relates to a high-performance glass cover plate polishing solution which comprises the following components: 1-10 wt% of hydrofluoric acid, 1-10 wt% of nitric acid, 1-10 wt% of sulfuric acid, 0.1-5 wt% of stabilizer, 0.1-2 wt% of corrosion inhibitor, 0.1-2 wt% of disodium lauroamphodiacetate and the balance of deionized water. The invention can ensure that the etching of the glass is efficient and has good flatness, avoids secondary polishing and meets the requirements of the panel industry on the appearance of the glass surface.
Description
Technical Field
The invention relates to the technical field of glass etching, in particular to a high-performance glass cover plate polishing solution.
Background
Etching of glass is a process that utilizes the reaction of hydrofluoric acid with silicon dioxide to thin the glass. A glass cover plate with high flatness requirement is used on the screen of some electronic products, and the glass cover plate can also be chemically polished by polishing solution containing hydrofluoric acid. The common polishing liquid is often added with tiny carborundum to assist grinding to achieve the target smoothness. The prior art only relies on corrosion and can only achieve 3-4 grades of finish after chemical polishing, while the finish required by customers is 8-9 grades, which means that the finish of the glass cover plate is improved by other means after chemical polishing, resulting in reduced production efficiency.
Therefore, the present invention provides a novel glass polishing solution formulation to solve the above problems.
Disclosure of Invention
The invention mainly aims to provide a high-performance glass cover plate polishing solution, which can enable etched glass to have higher smoothness after being etched.
The invention realizes the purpose through the following technical scheme: a high-performance glass cover plate polishing solution comprises the following components in percentage by mass: 1-10 wt% of hydrofluoric acid, 1-10 wt% of nitric acid, 1-10 wt% of sulfuric acid, 0.1-5 wt% of stabilizer, 0.1-2 wt% of disodium lauroamphodiacetate and the balance of deionized water.
In particular, the stabilizer is fluoride.
Further, the fluoride is preferably ammonium fluoride.
Specifically, the corrosion inhibitor is acetate, citrate or gluconate.
The high-performance glass cover plate polishing solution has the beneficial effects that:
the polishing solution can keep the surface flatness of the glass cover plate within 0.4 mu m, meets the requirement of 9-grade smoothness, has higher etching efficiency, avoids secondary grinding, and meets the requirement of the panel industry on the appearance of the glass surface.
Detailed Description
A high-performance glass cover plate polishing solution comprises the following components: 1-10 wt% of hydrofluoric acid, 1-10 wt% of nitric acid, 1-10 wt% of sulfuric acid, 0.1-5 wt% of stabilizer, 0.1-2 wt% of disodium lauroamphodiacetate and the balance of deionized water.
The polishing solution is a pure chemical polishing solution. Wherein hydrofluoric acid is used to react with silicon dioxide. Nitric acid and sulfuric acid are used to provide the hydrogen ions required for the etching reaction. Fluoride is used to provide fluoride ions that, in an acidic environment, are converted to hydrofluoric acid, which can etch glass. The ammonium fluoride is decomposed into hydrofluoric acid and ammonia gas, and the hydrofluoric acid is continuously released after the hydrofluoric acid is consumed so as to continue the reaction. The corrosion inhibitor is salt of organic weak acid, and can be used for absorbing excessive hydrogen ions, keeping the pH value of the system stable and controlling the etching efficiency. The disodium lauroamphodiacetate plays a role in controlling the surface tension of a system and has a decisive role in uniform etching.
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Examples 1 to 6:
the high performance glass cover plate polishing solutions of examples 1-6 were prepared by mixing according to the formulation of table 1:
table 1: unit: wt.%
Note: the part of the content less than 100 wt% is made up by deionized water to make up the balance.
Comparative experiments were conducted with the polishing solutions of examples 1 to 6 using the polishing solution disclosed in CN202011065493.9 as comparative example 1. The experimental method is that a glass cover plate with the thickness of 10cm multiplied by 10cm is vertically immersed into polishing solution, and etching is carried out for 1min, 2min and 3min under the condition of normal temperature. The etch depth (initial thickness-final thickness) and the flatness were measured separately, and the results are shown in Table 2.
Table 2: unit: mum of
As can be seen from Table 2, compared with comparative example 1, the polishing solutions of examples 1 to 6 can keep the surface flatness of the glass cover plate within 0.4 μm, meet the 9-grade finish requirement, have higher etching efficiency, avoid secondary grinding, and meet the requirements of the panel industry on the appearance of the glass surface.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (4)
1. The high-performance glass cover plate polishing solution is characterized by comprising the following components: 1-10 wt% of hydrofluoric acid, 1-10 wt% of nitric acid, 1-10 wt% of sulfuric acid, 0.1-5 wt% of stabilizer, 0.1-2 wt% of corrosion inhibitor, 0.1-2 wt% of disodium lauroamphodiacetate and the balance of deionized water.
2. The high-performance glass cover plate polishing solution according to claim 1, wherein: the stabilizer is fluoride.
3. The high-performance glass cover plate polishing solution according to claim 2, wherein: the fluoride is preferably ammonium fluoride.
4. The high-performance glass cover plate polishing solution according to claim 1, wherein: the corrosion inhibitor is acetate, citrate or gluconate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111160765.8A CN113817413A (en) | 2021-09-30 | 2021-09-30 | High-performance glass cover plate polishing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111160765.8A CN113817413A (en) | 2021-09-30 | 2021-09-30 | High-performance glass cover plate polishing solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113817413A true CN113817413A (en) | 2021-12-21 |
Family
ID=78916043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111160765.8A Pending CN113817413A (en) | 2021-09-30 | 2021-09-30 | High-performance glass cover plate polishing solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113817413A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675182A (en) * | 2007-05-04 | 2010-03-17 | 埃科莱布有限公司 | Comprise the composition of hardness ions and gluconate and use their reduction corrosion and erosive methods |
| CN108034951A (en) * | 2018-01-03 | 2018-05-15 | 江苏理工学院 | A kind of high temperature nitric acid acidwashing corrosion-retarding fog inhibitor and its application |
| CN109929460A (en) * | 2017-12-19 | 2019-06-25 | 蓝思科技（长沙）有限公司 | A kind of glass polishing water base cerium oxide polishing slurry and preparation method thereof |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN110803869A (en) * | 2019-11-25 | 2020-02-18 | 苏州博洋化学股份有限公司 | Glass thinning liquid |
| CN111020590A (en) * | 2019-11-25 | 2020-04-17 | 昆山兰博旺新材料技术服务有限公司 | Environment-friendly aluminum alloy chemical polishing solution |
| CN112209625A (en) * | 2020-09-04 | 2021-01-12 | 翔实光电科技(昆山)有限公司 | AG glass polishing solution and preparation method thereof |
| CN112309849A (en) * | 2020-09-30 | 2021-02-02 | 英利能源（中国）有限公司 | Method for etching and polishing single surface of silicon wafer |
| CN113265660A (en) * | 2021-04-30 | 2021-08-17 | 光华科学技术研究院(广东)有限公司 | Etching solution and application thereof |
| CN113336448A (en) * | 2021-05-18 | 2021-09-03 | 江西欧迈斯微电子有限公司 | Glass etching solution and preparation method thereof, ultrathin glass substrate and etching method thereof |
-
2021
- 2021-09-30 CN CN202111160765.8A patent/CN113817413A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675182A (en) * | 2007-05-04 | 2010-03-17 | 埃科莱布有限公司 | Comprise the composition of hardness ions and gluconate and use their reduction corrosion and erosive methods |
| CN109929460A (en) * | 2017-12-19 | 2019-06-25 | 蓝思科技（长沙）有限公司 | A kind of glass polishing water base cerium oxide polishing slurry and preparation method thereof |
| CN108034951A (en) * | 2018-01-03 | 2018-05-15 | 江苏理工学院 | A kind of high temperature nitric acid acidwashing corrosion-retarding fog inhibitor and its application |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN110803869A (en) * | 2019-11-25 | 2020-02-18 | 苏州博洋化学股份有限公司 | Glass thinning liquid |
| CN111020590A (en) * | 2019-11-25 | 2020-04-17 | 昆山兰博旺新材料技术服务有限公司 | Environment-friendly aluminum alloy chemical polishing solution |
| CN112209625A (en) * | 2020-09-04 | 2021-01-12 | 翔实光电科技(昆山)有限公司 | AG glass polishing solution and preparation method thereof |
| CN112309849A (en) * | 2020-09-30 | 2021-02-02 | 英利能源（中国）有限公司 | Method for etching and polishing single surface of silicon wafer |
| CN113265660A (en) * | 2021-04-30 | 2021-08-17 | 光华科学技术研究院(广东)有限公司 | Etching solution and application thereof |
| CN113336448A (en) * | 2021-05-18 | 2021-09-03 | 江西欧迈斯微电子有限公司 | Glass etching solution and preparation method thereof, ultrathin glass substrate and etching method thereof |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211221 |
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| RJ01 | Rejection of invention patent application after publication |