CN113815173A - Coating method production process for LCP film - Google Patents
Coating method production process for LCP film Download PDFInfo
- Publication number
- CN113815173A CN113815173A CN202111031983.1A CN202111031983A CN113815173A CN 113815173 A CN113815173 A CN 113815173A CN 202111031983 A CN202111031983 A CN 202111031983A CN 113815173 A CN113815173 A CN 113815173A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- water
- drying
- lcp film
- lcp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
- B29C41/30—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length incorporating preformed parts or layers, e.g. moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/42—Removing articles from moulds, cores or other substrates
- B29C41/44—Articles of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/46—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
Abstract
The invention discloses a coating method production process for LCP films, which comprises an unreeling mechanism, a drying roller set, a drying box, a cooling roller set, a cooling box and a reeling mechanism, and also comprises the following production processes: s101: adding a water-soluble resin to water to obtain a water-soluble resin solution, S102: unreeling the copper foil by using an unreeling mechanism, and then coating the water-soluble resin solution on the surface of the copper foil; according to the invention, the surface of the copper foil is coated with the water-soluble resin film by using a coating process, when the LCP film needs to be peeled, the copper foil with the LCP film is firstly subjected to water or alcohol, and water or alcohol can be dripped into one side of the LCP film, so that the water-soluble resin is dissolved in water or alcohol, the LCP film can be easily peeled off from the copper foil, the DF value of the comprehensive dielectric layer is prevented from being reduced by a layer of thermosetting adhesive with a low DF value, which is attached to the upper surface and the lower surface of the LCP film, the use performance of the LCP film is prevented from being reduced, and the use of the LCP film is prevented from being influenced.
Description
Technical Field
The invention relates to the technical field of LCP films, in particular to a coating method production process for LCP films.
Background
LCP industrialized liquid crystal polymer (LCP for short) was originally developed as lyotropic poly-p-phenylene terephthalamide (Kevlar), and the polymer can only be processed in solution and can not be melted, can only be used as fiber and coating, and is a special engineering plastic raw material.
The method for producing LCP films using the coating method is: the soluble LCP resin is dissolved by a conventional solvent to form an LCP solution, and then coated on a carrier film to obtain an LCP film, or directly coated on a copper foil to obtain FCCL, however, the current coating method production process for LCO films has some disadvantages in use, such as:
in order to improve the peel strength between the LCP film and the copper foil, the prior art respectively attaches a layer of thermosetting adhesive with a low DF value to the upper and lower surfaces of the LCP film, but attaching a layer of thermosetting adhesive with a low DF value to the upper and lower surfaces of the LCP film reduces the DF value of the integrated dielectric layer, reduces the usability of the LCP film, and affects the use of the LCP film.
Disclosure of Invention
The invention aims to provide a coating method production process for LCP films, which aims to solve the technical problem that the LCP films are inconvenient to peel.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a coating method production technology for LCP film, includes unwinding mechanism, stoving roller set, stoving case, cooling roller set, cooler bin and winding mechanism, still includes following production technology:
s101: adding water-soluble resin into water to obtain water-soluble resin solution,
s102: unreeling the copper foil by using an unreeling mechanism, and then coating the water-soluble resin solution on the surface of the copper foil;
s103: drying the copper foil coated with the water-soluble resin in the step S102 through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 40-100 ℃;
s104: the copper foil in the step S103 passes through a cooling box containing at least one group of cooling roller sets, and the cooling temperature of the cooling box is 0-50 ℃;
s105: the copper foil obtained in the step S104 is wound, and is mounted on the unwinding mechanism again after being wound;
s106: carrying out low-temperature atmosphere plasma treatment on the surface of the copper foil obtained in the step S105, rolling, and then installing the copper foil on an unreeling mechanism again;
s107: dissolving soluble LCP resin by a solvent to form an LCP solution;
s108: unwinding the copper foil obtained in the step S106 by using an unwinding mechanism, and coating the LCP solution obtained in the step S107 on the upper surface of the copper foil;
s109: drying the copper foil coated with the LCP solution in the step S108 through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 50-200 ℃;
s110: enabling the copper foil in the step S109 to pass through a cooling box comprising at least one group of cooling roller sets, wherein the cooling temperature of the cooling box is 0-50 ℃;
s111: and winding the copper foil in the step S110 through a winding mechanism.
Preferably, a water-soluble amino resin is added to the water-soluble resin in S101.
Preferably, in the low-temperature plasma treatment step in S106, the non-polymerizable gas in the chamber of the plasma treatment apparatus is nitrogen, the discharge frequency of the applied voltage is 13.75MHz, the power is 100-150W, and the treatment time is 20-50S.
Preferably, the solvent is at least one of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol, propylene glycol and hexylene glycol, and the soluble LCP resin is selected from soluble polyimide ultrafine powder.
Preferably, the solution formed in S101 or S107 is dissolved in a reaction kettle, and a stirring device is installed in the reaction kettle for stirring the solution.
Preferably, in S109, the solvent in the LCP solution is drained from the oven.
Preferably, the unwinding mechanism is used for driving the copper foil to unwind and roll, and the LCP film is positioned on the surface of the copper foil of the support body to form the LCP film with the copper foil on the surface.
Preferably, each drying roller group contains two drying rollers that the symmetry set up, two drying rollers that each drying roller group contained are placed side by side, all have on two drying rollers of drying roller group the copper foil that unwinding mechanism discharged.
Preferably, each cooling roller set contains two cooling rollers that the symmetry set up, two cooling rollers that each cooling roller set contained place side by side, all have on two cooling rollers of cooling roller set the copper foil that unwinding mechanism discharged.
Preferably, the LCP film obtained in S111 is peeled off with water at room temperature, dried and cooled again, and then wound.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the surface of the copper foil is coated with the water-soluble resin film by using a coating process, when the LCP film needs to be peeled, the copper foil with the LCP film is firstly subjected to water or alcohol, and water or alcohol can be dripped into one side of the LCP film, so that the water-soluble resin is dissolved in water or alcohol, the LCP film can be easily peeled off from the copper foil, the DF value of the comprehensive dielectric layer is prevented from being reduced by a layer of thermosetting adhesive with a low DF value, which is attached to the upper surface and the lower surface of the LCP film, the use performance of the LCP film is prevented from being reduced, and the use of the LCP film is prevented from being influenced.
2. According to the invention, the surface of the copper foil obtained in the step 5 is subjected to plasma treatment in a low-temperature atmosphere, so that the viscosity and the hydrophilicity of the water-soluble resin can be increased, the adhesion between the water-soluble resin and the copper foil can be increased, the adhesion between the water-soluble resin and the LCP film can also be increased, the LCP film is firmly fixed during production, and the water absorption of the water-soluble resin can be increased when the LCP film is peeled from the copper foil by increasing the hydrophilicity of the water-soluble resin, so that the LCP film can be more easily peeled from the copper foil.
Drawings
FIG. 1 is a flow chart of a production process in the background art provided by the present invention;
FIG. 2 is a flow chart of the coating process of the present invention.
In the figure: 1-a reaction kettle; 2-a stirring device; 3, an unwinding mechanism; 4-drying the roller set; 5-copper foil; 6-drying box; 7-a cooling box; 8-cooling the roller set; 9-a winding mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a coating method production technology for LCP film, includes unwinding mechanism 3, stoving roller set 4, stoving case 6, cooling roller set 8, cooling box 7 and winding mechanism 9, still includes following production technology:
s101: adding water-soluble resin into water to obtain water-soluble resin solution,
s102: unreeling the copper foil by using an unreeling mechanism 3, and then coating a water-soluble resin solution on the surface of the copper foil;
s103: and (2) drying the copper foil coated with the water-soluble resin in the step (S102) through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 40-100 ℃, and specifically, in the invention, a plurality of parallel drying roller sets 4 which are arranged at intervals are arranged in the drying box 6 to form a supporting surface for supporting and drying the copper foil coated with the water-soluble resin.
The temperature of the drying box 6 is 40-100 ℃, a temperature controller is arranged on the drying box, the drying of the drying box is divided into three sections, the drying temperature of each section can be controlled through the temperature controller, the drying temperature range of the first section is 40-60 ℃, the drying temperature range of the second section is 60-80 ℃, the drying temperature range of the third section is 80-100 ℃, in the actual production process, the drying temperature of the first section is 50 ℃, the drying temperature of the second section is 70 ℃, the drying temperature of the third section is 90 ℃, the baking zone length of the drying box is 30 meters, the baking zone length of the first section is 5 meters, the baking zone length of the second section is 10 meters, and the baking zone length of the third section is 15 meters and the drying temperature of the third section passes through the drying box at the speed of 6 meters/minute;
s104: the copper foil in the step S103 passes through a cooling box comprising at least one group of cooling roller sets, the cooling temperature of the cooling box is 0-50 ℃, a temperature controller is arranged on the cooling box, the cooling of the cooling box is divided into three sections, the cooling temperature of each section can be controlled by the temperature controller, the cooling temperature of the first section is 40-50 ℃, the cooling temperature of the second section is 20-40 ℃, the cooling temperature of the third section is 0-20 ℃, in actual production, the cooling temperature of the first section is 40 ℃, the cooling temperature of the second section is 25 ℃, the cooling temperature of the third section is 10 ℃, the baking zone of the drying box is 10 meters in length, the baking zone of the first section is 2 meters in length, the baking zone of the second section is 3 meters in length, the baking zone of the third section is 5 meters in length, and the cooling temperature of the third section passes through the drying box at the rate of 3 meters per minute;
s105: the copper foil obtained in the step S104 is wound, and is mounted on the unwinding mechanism again after being wound;
the method comprises the steps of S101 to S105, wherein a layer of water-soluble resin is coated on the surface of a copper foil by a coating process, when the LCP film needs to be stripped, the copper foil with the LCP film is subjected to water or alcohol, or water or alcohol can be dripped into one side of the LCP film, and the water-soluble resin is dissolved in the water or alcohol, so that the LCP film can be easily stripped from the copper foil, the problem that the DF value of a comprehensive dielectric layer is reduced by a layer of thermosetting adhesive with a low DF value, which is attached to the upper surface and the lower surface of the LCP film, is avoided, the use performance of the LCP film is avoided being reduced, and the use of the LCP film is prevented from being influenced.
S106: carrying out low-temperature atmosphere plasma treatment on the surface of the copper foil obtained in the step S105, rolling, and then installing the copper foil on the unwinding mechanism 3 again;
the surface of the copper foil obtained in the step S105 is subjected to plasma treatment in a low-temperature atmosphere, so that the viscosity and the hydrophilicity of the water-soluble resin can be increased, the adhesion between the water-soluble resin and the copper foil can be increased, the adhesion between the water-soluble resin and the LCP film can be increased, the LCP film is firmly fixed during production, and the water absorption of the water-soluble resin can be increased when the LCP film is peeled off from the copper foil by increasing the hydrophilicity of the water-soluble resin, so that the LCP film can be more easily peeled off from the copper foil.
S107: dissolving soluble LCP resin by a solvent to form an LCP solution;
s108: unwinding the copper foil obtained in the step S106 by using an unwinding mechanism 3, and simultaneously coating the LCP solution obtained in the step S107 on the upper surface of the copper foil;
s109: drying the copper foil coated with the LCP solution in S108 through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 50-200 ℃, the drying temperature of the first section is 50-100 ℃, the drying temperature of the second section is 100-150 ℃, the drying temperature of the third section is 150-200 ℃, and during actual production, the drying temperature of the first section is 80 ℃, the drying temperature of the second section is 150 ℃, the drying temperature of the third section is 180 ℃, the baking zone of the drying box is 30 meters, the baking zone of the first section is 5 meters, the baking zone of the second section is 10 meters, and the baking zone of the third section is 15 meters and passes through the drying box at the speed of 6 meters/minute;
s110: the copper foil in the step S109 passes through a cooling box comprising at least one group of cooling roller sets, the cooling temperature of the cooling box is 0-50 ℃, the cooling temperature of the first section is 40-50 ℃, the cooling temperature of the second section is 20-40 ℃, the cooling temperature of the third section is 0-20 ℃, during actual production, the cooling temperature of the first section is 40 ℃, the cooling temperature of the second section is 20 ℃, the cooling temperature of the third section is 10 ℃, the baking zone of the drying box is 10 meters, the baking zone of the first section is 2 meters, the baking zone of the second section is 3 meters, the baking zone of the third section is 5 meters, and the copper foil passes through the cooling box at the speed of 3 meters/minute;
s111: and winding the copper foil in the step S110 through a winding mechanism 9.
In S101, a water-soluble amino resin is added to the water-soluble resin to prevent shrinkage and wrinkle, thereby improving the flatness of the water-soluble resin on the surface of the copper foil.
In the low-temperature plasma treatment step in S106, the non-polymerizable gas in the cavity of the plasma treatment device is nitrogen, the applied voltage discharge frequency is 13.75MHz, the power is 100-150W, the treatment time is 20-50S, the power is 100W and the treatment time is 30S in actual production.
Wherein the solvent is at least one of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol, propylene glycol and hexylene glycol.
Wherein, dissolve the solution that forms in S101 or S107 in reation kettle 1, and install agitating unit 2 in reation kettle 1 and put for stirring the solution, avoid LCP solution or water-soluble resin solution to appear precipitating.
Wherein, in S109, the solvent in the LCP solution is discharged from the drying box 6.
The unwinding mechanism 3 is used for driving the copper foil to unwind and roll, and the LCP film is located on the surface of the copper foil of the support body to form the LCP film with the copper foil on the surface.
Wherein, each stoving roller set 4 contains two stoving rollers that the symmetry set up, two stoving rollers that each stoving roller set 4 contained are placed side by side, all have on two stoving rollers of stoving roller set 4 the copper foil that unwinding mechanism 3 discharged.
Wherein, each cooling roller set 8 contains two chill rolls of symmetry setting, two chill rolls that each cooling roller set 8 contained are placed side by side, all have on two chill rolls of cooling roller set the copper foil that unwinding mechanism 3 released for the transmission of copper foil.
And peeling the LCP film obtained in the step S111 by water at normal temperature, drying and cooling again, and then rolling.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a coating method production technology for LCP film which characterized in that, includes unwinding mechanism, stoving roller set, stoving case, cooling roller set, cooler bin and winding mechanism, still includes following production technology:
s101: adding water-soluble resin into water to obtain a water-soluble resin solution;
s102: unreeling the copper foil by using an unreeling mechanism, and then coating the water-soluble resin solution on the surface of the copper foil;
s103: drying the copper foil coated with the water-soluble resin in the step S102 through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 40-100 ℃;
s104: the copper foil in the step S103 passes through a cooling box containing at least one group of cooling roller sets, and the cooling temperature of the cooling box is 0-50 ℃;
s105: the copper foil obtained in the step S104 is wound, and is mounted on the unwinding mechanism again after being wound;
s106: carrying out low-temperature atmosphere plasma treatment on the surface of the copper foil obtained in the step S105, rolling, and then installing the copper foil on an unreeling mechanism again;
s107: dissolving soluble LCP resin by a solvent to form an LCP solution;
s108: unwinding the copper foil obtained in the step S106 by using an unwinding mechanism, and coating the LCP solution obtained in the step S107 on the upper surface of the copper foil;
s109: drying the copper foil coated with the LCP solution in the step S108 through a drying box comprising at least one group of drying roller sets, wherein the temperature of the drying box is 50-200 ℃;
s110: enabling the copper foil in the step S109 to pass through a cooling box comprising at least one group of cooling roller sets, wherein the cooling temperature of the cooling box is 0-50 ℃;
s111: and winding the copper foil in the step S110 through a winding mechanism.
2. A coating process for producing LCP film according to claim 1, wherein: to the water-soluble resin in S101, a water-soluble amino resin is added.
3. A coating process for producing LCP film according to claim 1, wherein: in the low-temperature plasma treatment process in S106, the non-polymerizable gas in the cavity of the plasma treatment device is nitrogen, the applied voltage discharge frequency is 13.75MHz, the power is 100-150W, and the treatment time is 20-50S.
4. A coating process for producing LCP film according to claim 1, wherein: the solvent is at least one of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol, propylene glycol and hexanediol.
5. A coating process for producing LCP film according to claim 1, wherein: the solution formed in S101 or S107 is dissolved in a reaction kettle, and a stirring device is installed in the reaction kettle for stirring the solution.
6. A coating process for producing LCP film according to claim 1, wherein: in S109, the solvent in the LCP solution is drained from the oven.
7. A coating process for producing LCP film according to claim 1, wherein: the unwinding mechanism is used for driving the copper foil to unwind and roll, and the LCP film is positioned on the surface of the copper foil of the support body to form the LCP film with the copper foil on the surface.
8. A coating process for producing LCP film according to claim 1, wherein: each drying roller group contains two drying rollers that the symmetry set up, two drying rollers that each drying roller group contained place side by side, all have on two drying rollers of drying roller group the copper foil that unwinding mechanism discharged.
9. A coating process for producing LCP film according to claim 1, wherein: each the chill roll group contains two chill rolls that the symmetry set up, two chill rolls that each chill roll group contains are placed side by side, all have on two chill rolls of chill roll group the copper foil that unwinding mechanism discharged.
10. A coating process for producing LCP film according to claim 1, wherein: and (3) peeling the LCP film obtained in the step (S111) by water at normal temperature, drying and cooling again, and then rolling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111031983.1A CN113815173A (en) | 2021-09-03 | 2021-09-03 | Coating method production process for LCP film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111031983.1A CN113815173A (en) | 2021-09-03 | 2021-09-03 | Coating method production process for LCP film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113815173A true CN113815173A (en) | 2021-12-21 |
Family
ID=78914038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111031983.1A Pending CN113815173A (en) | 2021-09-03 | 2021-09-03 | Coating method production process for LCP film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113815173A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4448622A (en) * | 1982-04-26 | 1984-05-15 | The United States Of America As Represented By The United States Department Of Energy | Composite polymeric film and method for its use in installing a very thin polymeric film in a device |
| JP2007144638A (en) * | 2005-11-24 | 2007-06-14 | Nippon Steel Chem Co Ltd | Manufacturing method of polyimide resin film |
| CN102030913A (en) * | 2009-09-29 | 2011-04-27 | 中国科学院理化技术研究所 | Method for preparing novel epoxy resin film |
| CN102277699A (en) * | 2010-06-08 | 2011-12-14 | 上海纳尔数码喷印材料股份有限公司 | Novel production process for mesh fabric |
| CN104626433A (en) * | 2013-11-08 | 2015-05-20 | 纳米新能源（唐山）有限责任公司 | Polydimethylsiloxane membrane, preparation method thereof, and friction electric generator using same |
| CN105121163A (en) * | 2013-03-15 | 2015-12-02 | 东丽株式会社 | Laminate film using polylactic acid resin |
| CN106182837A (en) * | 2016-07-08 | 2016-12-07 | 安徽省光学膜材料工程研究院有限公司 | A kind of cellulose triacetate film production technology and the equipment of production |
| CN207042777U (en) * | 2017-07-24 | 2018-02-27 | 德阳天赐塑胶有限责任公司 | A kind of film coated compounding machine |
| CN108568394A (en) * | 2017-03-13 | 2018-09-25 | 佛山市正包装材料有限公司 | A kind of PVDC coated thin films and its manufacturing method |
| CN111694472A (en) * | 2020-06-10 | 2020-09-22 | 苏州登石新材科技有限公司 | Water-soluble release agent, conductive film and preparation method thereof |
-
2021
- 2021-09-03 CN CN202111031983.1A patent/CN113815173A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4448622A (en) * | 1982-04-26 | 1984-05-15 | The United States Of America As Represented By The United States Department Of Energy | Composite polymeric film and method for its use in installing a very thin polymeric film in a device |
| JP2007144638A (en) * | 2005-11-24 | 2007-06-14 | Nippon Steel Chem Co Ltd | Manufacturing method of polyimide resin film |
| CN102030913A (en) * | 2009-09-29 | 2011-04-27 | 中国科学院理化技术研究所 | Method for preparing novel epoxy resin film |
| CN102277699A (en) * | 2010-06-08 | 2011-12-14 | 上海纳尔数码喷印材料股份有限公司 | Novel production process for mesh fabric |
| CN105121163A (en) * | 2013-03-15 | 2015-12-02 | 东丽株式会社 | Laminate film using polylactic acid resin |
| CN104626433A (en) * | 2013-11-08 | 2015-05-20 | 纳米新能源（唐山）有限责任公司 | Polydimethylsiloxane membrane, preparation method thereof, and friction electric generator using same |
| CN106182837A (en) * | 2016-07-08 | 2016-12-07 | 安徽省光学膜材料工程研究院有限公司 | A kind of cellulose triacetate film production technology and the equipment of production |
| CN108568394A (en) * | 2017-03-13 | 2018-09-25 | 佛山市正包装材料有限公司 | A kind of PVDC coated thin films and its manufacturing method |
| CN207042777U (en) * | 2017-07-24 | 2018-02-27 | 德阳天赐塑胶有限责任公司 | A kind of film coated compounding machine |
| CN111694472A (en) * | 2020-06-10 | 2020-09-22 | 苏州登石新材科技有限公司 | Water-soluble release agent, conductive film and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 刘程 米裕民: "《表面活性剂性质理论与应用》", 30 June 2003, 北京工业大学出版社 * |
| 高学敏 黄世德 李全 谢上礼: "《粘接和粘接技术手册》", 28 February 1990, 四川科学技术出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI487730B (en) | Polyimide film for metallizing, method for producing thereof and metal laminated polyimide film | |
| US20150084825A1 (en) | Electromagnetic wave shielding sheet, manufacturing method thereof, and built-in antenna having the same | |
| US20040094512A1 (en) | Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process | |
| CN113580690A (en) | Metal-clad laminated board | |
| CN109808259B (en) | High-frequency double-sided copper-clad plate and preparation method and application thereof | |
| JP6164378B2 (en) | Plating primer composition, substrate to be plated, composite of insulating substrate and metal layer, method of manufacturing substrate to be plated, and method of manufacturing composite of insulating substrate and metal layer | |
| TWI333895B (en) | ||
| CN112853408B (en) | Preparation method of ultrathin carrier-attached copper foil easy to peel and pure in interface | |
| JP4963628B2 (en) | Polymer film laminate, method for producing the same, and flexible wiring board using polymer film laminate. | |
| CN101808791A (en) | Polyimide film and wiring board | |
| TW200808537A (en) | Method for producing laminate comprising liquid-crystalline polyester layer | |
| CN113815173A (en) | Coating method production process for LCP film | |
| CN111775543A (en) | Method and equipment for manufacturing flexible copper-clad plate | |
| CN110677980A (en) | Method for preparing microneedle piercing type electromagnetic wave shielding film by magnetron sputtering method and without conductive particles | |
| CN111619173A (en) | Copper-clad plate and preparation method thereof | |
| JP5087314B2 (en) | Polymer film laminate, method for producing the same, and flexible wiring board using polymer film laminate. | |
| CN217797144U (en) | Film electrode coating device | |
| CN201857424U (en) | Novel vacuum coating machine | |
| JPH0484488A (en) | Manufacture of board for flexible printed wiring board | |
| CN213830694U (en) | Metal foil-clad laminated board, production system thereof and printed circuit board | |
| CN100572045C (en) | Flexible Manufacturing Methods of Build-up PCB | |
| US20120126460A1 (en) | Apparatus and method for manufacturing board for production of metal flake | |
| TW200537996A (en) | Method for producing substrate for flexible printed wiring board | |
| JPH05347461A (en) | Polyamic acid film and manufacture thereof | |
| JP6929555B2 (en) | Manufacturing method of metal-clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211221 |