CN111775543A - Method and equipment for manufacturing flexible copper-clad plate - Google Patents

Method and equipment for manufacturing flexible copper-clad plate Download PDF

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Publication number
CN111775543A
CN111775543A CN202010651106.3A CN202010651106A CN111775543A CN 111775543 A CN111775543 A CN 111775543A CN 202010651106 A CN202010651106 A CN 202010651106A CN 111775543 A CN111775543 A CN 111775543A
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film
copper
finished product
attached
preheating
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CN202010651106.3A
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CN111775543B (en
Inventor
霍雷
王和志
潘瑞
吴高高
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Jiangsu Jicui Zhongyi Technology Industry Development Co ltd
AAC Module Technologies Changzhou Co Ltd
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Ruisheng Precision Manufacturing Technology Changzhou Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00Layout of apparatus or plants, e.g. modular laminating systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a flexible copper clad laminate manufacturing device and a method thereof. The manufacturing method of the copper-clad plate comprises the steps of providing a liquid crystal polymer film, and feeding the liquid crystal polymer film into a drying tunnel for preheating to obtain a preheated film; the unreeled copper foil is attached to the preheating film, and the copper foil and the preheating film are simultaneously fed into a heating roller for hot press molding to obtain a copper-clad film; cutting the copper-clad film by using cutting equipment to obtain a semi-finished product; and sequentially carrying out baking treatment on the semi-finished product by a high-temperature tunnel furnace and flattening treatment by a low-temperature hot pressing disc to obtain a finished product of the flexible copper-clad plate. The manufacturing method of the flexible copper-clad plate has simple process and lower equipment cost, and the peeling force, the thickness uniformity and the appearance of the produced copper-clad plate are greatly improved compared with the prior art.

Description

Method and equipment for manufacturing flexible copper-clad plate
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of printed circuit boards, in particular to a method and equipment for manufacturing a flexible copper-clad plate.
[ background of the invention ]
In recent years, with the rapid development of the electronic industry, Printed Circuit boards (PCBs for short) have played a key role in connecting and supporting electronic components as basic materials, and Copper Clad Laminates (CCLs) are basic materials for Circuit boards, so the Copper Clad Laminates (CCLs) have been widely used in many electronic products.
According to the difference of base materials in the copper clad laminate, the copper clad laminate can be generally divided into a rigid copper clad laminate which is not easy to bend and a bendable flexible copper clad laminate, wherein the bendable flexible copper clad laminate has the outstanding advantage of reducing the volume and the weight of equipment.
Wearable and portable intelligent equipment in daily life of people becomes indispensable necessities, such as smart phones, watches, tablet computers and the like, and the equipment is increasingly pursued to be short, light, thin, multifunctional and high-speed in signal transmission, so that under the condition of rapid development of the applications, the requirement on a flexible copper-clad plate is increasingly greater.
Polyimide (PI), Polyester (PET), Polynaphthalene Ester (PEN) and the like are mainly used in flexible radio frequency antenna circuit board materials in the market at present, the PET and the PEN are poor in heat resistance and high in PI water absorption rate, the defects can cause curling of a substrate film and reduction of peeling strength of a copper foil, and simultaneously, dielectric properties can be reduced, and transmission of electric signals is influenced finally.
The Liquid Crystal Polymer (LCP) material is used as a thermoplastic resin, has good mechanical properties and heat resistance, high dimensional stability, low thermal expansion coefficient, low dielectric constant, low loss, and other properties, can completely avoid the above disadvantages, and is especially applicable to fifth-generation communication devices.
For a thermoplastic liquid crystal polymer flexible copper clad laminate, a common production mode is a Roll-to-Roll (Roll toroll) production process, the method can realize continuous production, and the processing window of the liquid crystal polymer is narrow, so that the precision requirement on a hot roller is high, mainly embodied in the temperature and the parallelism of a heating roller, and the equipment price is quite high; another roll-to-roll continuous process produces laminates that may exhibit poor appearance.
[ summary of the invention ]
The invention aims to provide a method and equipment for manufacturing a flexible copper clad laminate with smooth appearance and low equipment cost.
The technical scheme of the invention is as follows:
the invention discloses a method for manufacturing a flexible copper-clad plate, which comprises the following steps:
preheating a drying tunnel: providing a liquid crystal polymer film, and feeding the liquid crystal polymer film into a drying channel for preheating to obtain a preheated film;
hot-press molding: the unreeled copper foil is attached to the preheating film, and the copper foil and the preheating film are simultaneously fed into a heating roller for hot press molding to obtain a copper-clad film;
cutting the semi-finished product: cutting the copper-clad film by using cutting equipment to obtain a semi-finished product;
baking and flattening: and sequentially carrying out baking treatment on the semi-finished product by a high-temperature tunnel furnace and flattening treatment by a low-temperature hot pressing disc to obtain a finished product of the flexible copper-clad plate.
Preferably, in the hot press forming process, the method further includes:
unreeling a first protective film to be attached to the preheated film, and simultaneously feeding the first protective film, the copper foil and the preheated film into a heating roller for hot press molding to obtain an intermediate hot-pressed film;
and moving the intermediate hot-pressing film out of the heating roller, and recovering the first protective film to obtain the copper-clad film.
Preferably, the unwinding first protection film is attached to the preheating film, and includes:
unreeling a first upper surface protective film attached to the upper surface of the preheating film and unreeling a first lower surface protective film attached to the lower surface of the preheating film.
Preferably, the unreeling copper foil is attached to the preheating film, and includes:
and the unreeling upper surface copper foil is attached to the upper surface of the preheating film, wherein the upper surface copper foil is attached between the first upper surface protective film and the upper surface of the preheating film.
Preferably, the unreeling copper foil is attached to the preheating film, and includes:
unreel the upper surface copper foil attached in the upper surface of preheating the film and unreel the lower surface copper foil attached in the lower surface of preheating the film, wherein the upper surface copper foil attached in first upper surface protection film with preheat between the upper surface of film, the lower surface copper foil attached in first lower surface protection film with preheat between the lower surface of film.
Preferably, during the baking and flattening process, the method further comprises:
unreeling a second protective film to be attached to the semi-finished product, and sequentially carrying out baking treatment on the second protective film and the semi-finished product through a high-temperature tunnel furnace and flattening treatment through a low-temperature heating disc to obtain an intermediate copper-clad plate;
and recovering the second protective film to obtain a finished product of the flexible copper-clad plate.
Preferably, the unreeling second protective film is attached to the semi-finished product, and includes:
and the unreeling second upper surface protective film is attached to the upper surface of the semi-finished product, and the unreeling second lower surface protective film is attached to the lower surface of the semi-finished product.
The invention also discloses a flexible copper clad laminate manufacturing device, which comprises:
the first feeding and winding roller is used for outputting the liquid crystal polymer film;
the second roll feeding roller is used for outputting the copper foil;
the drying channel is arranged between the first roll feeding roller and the second roll feeding roller and is used for heating the liquid crystal polymer film;
the heating roller is arranged behind the second roll feeding roller and is used for hot-pressing the liquid crystal polymer film and the copper foil;
the cutting device is arranged behind the heating roller and used for cutting the semi-finished product output by the heating roller;
the high-temperature tunnel furnace is arranged behind the cutting device and used for baking the semi-finished product;
and the low-temperature thermal pressing disc is arranged behind the high-temperature tunnel furnace and is used for flattening the semi-finished product to obtain a finished product of the flexible copper-clad plate.
Preferably, the apparatus further comprises:
the third roll feeding roller is used for outputting the first protection film;
the first winding roller and the third winding roller are symmetrically arranged at two ends of the heating roller and are used for recovering the first protection film;
the fourth roll feeding roller is arranged between the cutting device and the high-temperature tunnel furnace and used for outputting a second protective film;
and the second winding roller is arranged behind the low-temperature thermal pressing disc and is used for recovering the second protective film.
Preferably, the roller spacing of the heating roller is equal to the thickness of the liquid crystal polymer film plus the copper foil (10-100 μm).
The invention has the beneficial effects that:
the manufacturing method of the flexible copper-clad plate has simple process and lower equipment cost, and the peeling force, the thickness uniformity and the appearance of the produced copper-clad plate are greatly improved compared with the prior art.
[ description of the drawings ]
FIG. 1 is a first simple structural schematic diagram of the flexible copper clad laminate manufacturing equipment of the invention;
FIG. 2 is a schematic diagram of a simple structure of the manufacturing method of the flexible copper clad laminate of the invention;
FIG. 3 is a schematic flow diagram of the manufacturing method of the flexible copper clad laminate of the invention.
[ detailed description ] embodiments
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1-2, the present invention discloses a manufacturing apparatus of a sheet-to-sheet semi-continuous copper clad laminate, which comprises a semi-finished product preparation part apparatus (as shown in fig. 1) and a finished product preparation part apparatus (as shown in fig. 2), wherein the semi-finished product preparation part apparatus comprises:
a first feeding roller 1 for feeding out the liquid crystal polymer film 2, a second feeding roller 4 for feeding out the copper foil 5, a third feeding roller 6 for feeding out the first protective film 11; the first winding rollers 15 are symmetrically arranged at two ends of the heating roller 7 with the third winding feeding roller 6 and are used for recovering the first protection film 11; the unwinding speeds of the first winding delivery roller 1, the second winding delivery roller 4, the third winding delivery roller 6, the heating roller 7 and the first winding roller 15 are the same, and the roller speed is 10-30 m/min, so that the copper foil 5, the first protection film 11 and the liquid crystal polymer film 2 can be uniformly fed; the first protective film 11 may be made of aluminum foil, copper foil, PI (polyimide resin), or PTFE (polytetrafluoroethylene), and the addition of the first protective film may protect the surface of the copper foil to a certain extent.
The drying channel 3 is arranged between the first winding delivery roller 1 and the second winding delivery roller 4 and is used for heating the liquid crystal polymer film 2; the temperature of the drying tunnel is 100-150 ℃;
a heating roller 7 arranged behind the second winding roller 4 and used for hot-pressing the liquid crystal polymer film 2 and the copper foil 5, wherein the heating temperature of the heating roller 7 is 150-240 ℃;
the thickness of the liquid crystal polymer film 2 in the scheme is less than 200 μm, such as 25 μm, 50 μm, 75 μm, 100um and the like; the copper foil can be selected from rolled copper (RA) and electrolytic copper (ED), the thickness is less than 35 μm, preferably 18 μm, more preferably 12 μm, the roughness of the copper foil is: preferably Rz <2.0 μm; the roll gap between the heating rolls is equal to the thickness of the liquid crystal polymer film plus the thickness of the copper foil (10 to 100 μm).
The cutting device 8 is arranged behind the heating roller 7 and is used for cutting the semi-finished product 9 output by the heating roller 7, and the semi-finished product 9 with a proper size can be cut according to the specific size requirement of the product.
The finished product preparation part equipment comprises:
a high-temperature tunnel furnace 13 arranged behind the cutting device 8 and used for baking the semi-finished product 9; the temperature of the high-temperature tunnel furnace 13 is 290-330 ℃, and the high-temperature baking time is 10-300 s.
The low-temperature hot pressing plate 14 is arranged behind the high-temperature tunnel furnace 13 and is used for flattening the semi-finished product 9 to obtain a flexible copper-clad plate finished product 16, and the appearance of a sample is easily wrinkled after passing through the high-temperature tunnel furnace 13, so that the appearance problem is solved by low-temperature hot pressing; the temperature of the low-temperature hot pressing plate is 200-260 ℃, the pressure is 5-20 MPa, and the time of low-temperature hot pressing is 30-180 s.
The fourth roll feeding roller 10 is arranged between the cutting device 8 and the high-temperature tunnel furnace 13 and is used for outputting a second protective film 17; and a second take-up roll 12 disposed behind the low-temperature heat platen 14 for recovering the second protective film 17. The second protective film 17 may be made of aluminum foil, copper foil, PI (polyimide resin) or PTFE (polytetrafluoroethylene), the roll speed of the fourth winding roll 10 and the second winding roll 12 may be determined according to the specific hot pressing time, and the recovered second protective film 17 may be reused.
Referring to fig. 3, the method for manufacturing a single-sided copper-clad flexible copper-clad plate according to the present invention includes:
s100, preheating a drying tunnel: providing a liquid crystal polymer film, and sending the liquid crystal polymer film into a drying channel at 100-150 ℃ for preheating to obtain a preheated film.
S200, hot press forming: and attaching the unreeled copper foil to the preheating film, and simultaneously feeding the copper foil and the preheating film into a heating roller at the temperature of 150-240 ℃ for hot press molding to obtain the copper-clad film.
Specifically, S210, unreeling a first upper surface protection film attached to the upper surface of the preheating film and unreeling a first lower surface protection film attached to the lower surface of the preheating film, unreeling an upper surface copper foil attached to the upper surface of the preheating film, wherein the upper surface copper foil is attached between the first upper surface protection film and the upper surface of the preheating film.
S220, simultaneously feeding the first upper surface protective film, the first lower surface protective film, the copper foil and the preheated film into a heating roller for hot press forming to obtain an intermediate hot-pressed film.
And S230, moving the intermediate hot-pressed film out of the heating roller, and recovering the first upper surface protective film and the first lower surface protective film to obtain the copper-clad film.
The first upper surface protective film, the first lower surface protective film, the copper foil and the preheated film are fed into the heating roller at the same roller speed, and the roller speed is 10-30 m/min.
S300, cutting a semi-finished product: and cutting the copper-clad film by using a cutting device to obtain a semi-finished product.
S400, baking and flattening: and (3) sequentially baking the semi-finished product for 10-300 s by a 290-330 ℃ high-temperature tunnel furnace, and then flattening the semi-finished product for 30-180 s by a low-temperature hot-pressing plate at the temperature of 200-260 ℃ and the pressure of 5-20 MPa to obtain a finished product of the flexible copper-clad plate.
Specifically, unreel the second upper surface protection film attached in semi-manufactured goods upper surface and unreel the second lower surface protection film attached in semi-manufactured goods lower surface, and will second upper surface protection film, second lower surface protection film and semi-manufactured goods are in proper order through high temperature tunnel furnace baking treatment and low temperature heating plate flattening treatment, obtain middle copper-clad plate.
The invention discloses a method for manufacturing a flexible copper clad laminate with copper coated on both sides, which comprises the following steps:
s100, preheating a drying tunnel: providing a liquid crystal polymer film, and feeding the liquid crystal polymer film into a drying channel at 100-150 ℃ for preheating to obtain a preheated film;
s200, hot press forming: and attaching the unreeled copper foil to the preheating film, and simultaneously feeding the copper foil and the preheating film into a heating roller at the temperature of 150-240 ℃ for hot press molding to obtain the copper-clad film.
Specifically, S210, unreel first upper surface protection film attached in preheat the upper surface of film and unreel first surface protection film attached in preheat the lower surface of film, unreel upper surface copper foil attached in preheat the upper surface of film and unreel lower surface copper foil attached in preheat the lower surface of film, wherein upper surface copper foil attached in first upper surface protection film with preheat between the upper surface of film, lower surface copper foil attached in first surface protection film with preheat between the lower surface of film.
S220, simultaneously feeding the first upper surface protective film, the first lower surface protective film, the copper foil and the preheated film into a heating roller for hot press forming to obtain an intermediate hot-pressed film.
And S230, moving the intermediate hot-pressed film out of the heating roller, and recovering the first upper surface protective film and the first lower surface protective film to obtain the copper-clad film.
The first upper surface protective film, the first lower surface protective film, the copper foil and the preheated film are fed into the heating roller at the same roller speed, and the roller speed is 10-30 m/min.
S300, cutting a semi-finished product: and cutting the copper-clad film by using a cutting device to obtain a semi-finished product.
S400, baking and flattening: and (3) sequentially baking the semi-finished product for 10-300 s by a 290-330 ℃ high-temperature tunnel furnace, and then flattening the semi-finished product for 30-180 s by a low-temperature hot-pressing plate at the temperature of 200-260 ℃ and the pressure of 5-20 MPa to obtain a finished product of the flexible copper-clad plate.
Specifically, unreel the second upper surface protection film attached in semi-manufactured goods upper surface and unreel the second lower surface protection film attached in semi-manufactured goods lower surface, and will second upper surface protection film, second lower surface protection film and semi-manufactured goods are in proper order through high temperature tunnel furnace baking treatment and low temperature heating plate flattening treatment, obtain middle copper-clad plate.
Taking the temperature of a drying tunnel, the roller speed of a heating roller, the roller temperature of the heating roller, the baking temperature in a high-temperature tunnel furnace, the baking time in the high-temperature tunnel furnace, the flattening temperature of a low-temperature hot pressing plate, the flattening pressure of a low-temperature hot pressing plate and the flattening time of the low-temperature hot pressing plate as variables, and taking the melting point of a liquid crystal polymer film of 310 Tm/DEG C, the thickness of the film of 100 mu m, the type of a copper foil of ED, the thickness of 12 mu m and the surface roughness of the copper foil of 0.8 as quantification, specific test data are shown in the following table one:
watch 1
Figure BDA0002575003410000071
Figure BDA0002575003410000081
As shown in table 1 above, the peel strength of the flexible copper clad laminate described in examples 1 to 9 is not less than 0.66N/mm, the thickness uniformity is not less than 0.8%, the appearance flatness is good, and the contrast group is a copper clad laminate that is not subjected to low-temperature thermal platen pressing and flattening treatment, and the appearance flatness is obviously poor, which further proves that the manufacturing method of the flexible copper clad laminate of the present invention is greatly improved in appearance.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.

Claims (10)

1. A method for manufacturing a flexible copper-clad plate is characterized by comprising the following steps:
preheating a drying tunnel: providing a liquid crystal polymer film, and feeding the liquid crystal polymer film into a drying channel for preheating to obtain a preheated film;
hot-press molding: the unreeled copper foil is attached to the preheating film, and the copper foil and the preheating film are simultaneously fed into a heating roller for hot press molding to obtain a copper-clad film;
cutting the semi-finished product: cutting the copper-clad film by using cutting equipment to obtain a semi-finished product;
baking and flattening: and sequentially carrying out baking treatment on the semi-finished product by a high-temperature tunnel furnace and flattening treatment by a low-temperature hot pressing disc to obtain a finished product of the flexible copper-clad plate.
2. The manufacturing method of the flexible copper clad laminate according to claim 1, wherein in the hot press molding process, the method further comprises:
unreeling a first protective film to be attached to the preheated film, and simultaneously feeding the first protective film, the copper foil and the preheated film into a heating roller for hot press molding to obtain an intermediate hot-pressed film;
and moving the intermediate hot-pressing film out of the heating roller, and recovering the first protective film to obtain the copper-clad film.
3. The manufacturing method of the flexible copper clad laminate according to claim 2, wherein the unreeling first protective film is attached to the preheating film, comprising:
unreeling a first upper surface protective film attached to the upper surface of the preheating film and unreeling a first lower surface protective film attached to the lower surface of the preheating film.
4. The manufacturing method of the flexible copper clad laminate according to claim 3, wherein the unreeled copper foil is attached to the preheating film, comprising:
and the unreeling upper surface copper foil is attached to the upper surface of the preheating film, wherein the upper surface copper foil is attached between the first upper surface protective film and the upper surface of the preheating film.
5. The manufacturing method of the flexible copper clad laminate according to claim 3, wherein the unreeled copper foil is attached to the preheating film, comprising:
unreel the upper surface copper foil attached in the upper surface of preheating the film and unreel the lower surface copper foil attached in the lower surface of preheating the film, wherein the upper surface copper foil attached in first upper surface protection film with preheat between the upper surface of film, the lower surface copper foil attached in first lower surface protection film with preheat between the lower surface of film.
6. The manufacturing method of the flexible copper clad laminate according to claim 1, wherein in the baking and flattening process, the method further comprises:
unreeling a second protective film to be attached to the semi-finished product, and sequentially carrying out baking treatment on the second protective film and the semi-finished product by a high-temperature tunnel furnace and flattening treatment by a low-temperature heating disc to obtain an intermediate copper-clad plate;
and recovering the second protective film to obtain a finished product of the flexible copper-clad plate.
7. The manufacturing method of the flexible copper clad laminate according to claim 6, wherein the unreeling second protective film is attached to the semi-finished product, comprising:
and the unreeling second upper surface protective film is attached to the upper surface of the semi-finished product, and the unreeling second lower surface protective film is attached to the lower surface of the semi-finished product.
8. The utility model provides a flexible copper-clad plate manufacture equipment which characterized in that includes:
the first feeding and winding roller is used for outputting the liquid crystal polymer film;
the second roll feeding roller is used for outputting the copper foil;
the drying channel is arranged between the first roll feeding roller and the second roll feeding roller and is used for heating the liquid crystal polymer film;
the heating roller is arranged behind the second roll feeding roller and is used for hot-pressing the liquid crystal polymer film and the copper foil;
the cutting device is arranged behind the heating roller and used for cutting the semi-finished product output by the heating roller;
the high-temperature tunnel furnace is arranged behind the cutting device and used for baking the semi-finished product;
and the low-temperature thermal pressing disc is arranged behind the high-temperature tunnel furnace and is used for flattening the semi-finished product to obtain a finished product of the flexible copper-clad plate.
9. The manufacturing equipment of the flexible copper clad laminate according to claim 8, wherein the equipment further comprises:
the third roll feeding roller is used for outputting the first protection film;
the first winding roller and the third winding roller are symmetrically arranged at two ends of the heating roller and are used for recovering the first protection film;
the fourth roll feeding roller is arranged between the cutting device and the high-temperature tunnel furnace and used for outputting a second protective film;
and the second winding roller is arranged behind the low-temperature thermal pressing disc and is used for recovering the second protective film.
10. The manufacturing equipment of the flexible copper clad laminate according to claim 8, wherein the roller distance between the heating rollers is (liquid crystal polymer film + copper foil thickness) (10-100 μm).
CN202010651106.3A 2020-07-08 2020-07-08 Method and equipment for manufacturing flexible copper-clad plate Active CN111775543B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113352591A (en) * 2021-06-21 2021-09-07 南京贝迪新材料科技股份有限公司 Liquid crystal polymer copper-clad plate lamination control method and system
CN113386416A (en) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 Heat-conducting double-sided copper-clad plate and preparation method thereof
CN113438830A (en) * 2021-07-08 2021-09-24 江西柔顺科技有限公司 Circuit board and preparation method thereof
CN115179638A (en) * 2022-06-29 2022-10-14 厦门爱谱生电子科技有限公司 Manufacturing method of flexible copper-clad plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011068142A (en) * 2010-12-24 2011-04-07 Mitsui Mining & Smelting Co Ltd Method for correcting curl of composite foil
CN111251692A (en) * 2020-01-21 2020-06-09 上海联净电子科技有限公司 Production process and equipment of high-frequency high-speed LCP copper-clad plate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202986287U (en) * 2012-12-27 2013-06-12 广东生益科技股份有限公司 High-temperature roller press
CN106793526A (en) * 2016-11-28 2017-05-31 珠海亚泰电子科技有限公司 Manufacturing process of heat-resistant and flame-resistant copper-clad plate
CN109808259B (en) * 2019-02-02 2021-04-30 江阴骏驰新材料科技有限公司 High-frequency double-sided copper-clad plate and preparation method and application thereof
CN110126422B (en) * 2019-05-06 2022-02-22 深圳市信维通信股份有限公司 Preparation method of double-sided copper-clad LCP (liquid Crystal Polymer) plate
CN110691469A (en) * 2019-08-23 2020-01-14 李龙凯 Coating forming method of novel material layer structure of high-frequency circuit board and product thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011068142A (en) * 2010-12-24 2011-04-07 Mitsui Mining & Smelting Co Ltd Method for correcting curl of composite foil
CN111251692A (en) * 2020-01-21 2020-06-09 上海联净电子科技有限公司 Production process and equipment of high-frequency high-speed LCP copper-clad plate

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CN113352591A (en) * 2021-06-21 2021-09-07 南京贝迪新材料科技股份有限公司 Liquid crystal polymer copper-clad plate lamination control method and system
CN113386416A (en) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 Heat-conducting double-sided copper-clad plate and preparation method thereof
CN113438830A (en) * 2021-07-08 2021-09-24 江西柔顺科技有限公司 Circuit board and preparation method thereof
CN115179638A (en) * 2022-06-29 2022-10-14 厦门爱谱生电子科技有限公司 Manufacturing method of flexible copper-clad plate
CN115179638B (en) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 Manufacturing method of flexible copper-clad plate

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