CN113811094B - Transfer substrate, transfer device, and transfer method - Google Patents

Abstract

The application discloses a transfer printing substrate, a transfer printing device and a transfer printing method, wherein the transfer printing substrate is provided with at least one slurry tank and at least one concave structure formed on the inner bottom surface of the slurry tank; the slurry tank is used for accommodating slurry to form a slurry layer, the slurry layer is formed with a convex structure corresponding to the concave structure, and the slurry layer can be transferred onto an outer bending surface of a transferred substrate to obtain a target film layer on the outer bending surface; the raised structures of the slurry layer correspond to the positions where the slurry layer contacts the bending structures of the outer bending surfaces. The application provides a transfer printing substrate, a transfer printing device and a transfer printing method, which can overcome the structural defect of a transferred substrate and solve the problem of poor uniformity of silver paste transfer printing film thickness.

Description

Transfer substrate, transfer device, and transfer method

Technical Field

The application relates to the technical field of display, in particular to a transfer printing substrate, a transfer printing device and a transfer printing method.

Background

The large screen display splicing technology is mainly formed by splicing a plurality of display boxes, such as a MiniLED display wall, an LCD rear projection display wall and a plasma display wall. The splicing technology inevitably has splicing gaps, but with the improvement of the living standard of people and the development of technology, a seamless splicing technology becomes the main stream, and the display peripheral circuits need to be made very small for truly and completely seamless splicing. At this time, the side wiring technique has been developed.

The side wire technology realizes side binding or back binding by printing silver wires on the side surface of the display screen or the substrate, reduces the frame of the display area on the front surface of the display screen or the substrate, and reduces the front edge joint. For example, bonding (Bonding) lines and Fanout (Fanout) lines to the sides and/or back of the substrate would greatly reduce the peripheral line width, enabling seamless stitching.

The core process in the side wire technology is silver paste transfer printing. However, before the silver paste transfer printing process, it is generally required to grind the display screen or the substrate laterally, so that a chamfer structure exists at the edge of the display screen or the substrate, and the chamfer structure forms a bending structure with the front or side of the display screen or the substrate, so that the problem that the silver paste is easily broken or thinner in silver wire thickness during the transfer printing process. That is, the side-face wire technique has a technical problem that the silver paste transfer technique causes uneven thickness of the silver wire to be formed.

Fig. 1 is a schematic diagram of a conventional substrate with transfer leads formed thereon. As shown in fig. 1, at the bending structures a and B of the substrate 901, the transfer wire 902 is partially broken.

Accordingly, there is a need to provide a transfer substrate, a transfer device and a transfer method for solving the above-mentioned technical problems.

Disclosure of Invention

In order to solve the technical problems, the application provides a transfer printing substrate, a transfer printing device and a transfer printing method, which can overcome the structural defect of a transferred substrate and solve the problem of poor uniformity of silver paste transfer printing film thickness.

In order to achieve the above object, the transfer substrate, the transfer device and the transfer method described in the present application adopt the following technical solutions.

The application provides a transfer printing substrate, which is provided with at least one slurry tank and at least one concave structure formed on the inner bottom surface of the slurry tank;

the slurry tank is used for accommodating slurry to form a slurry layer, the slurry layer is formed with a convex structure corresponding to the concave structure, and the slurry layer can be transferred onto an outer bending surface of a transferred substrate to obtain a target film layer on the outer bending surface;

the raised structures of the slurry layer correspond to the positions where the slurry layer contacts the bending structures of the outer bending surfaces.

Optionally, in some embodiments, the slurry tank corresponds to a shape of the flattened state of the target film layer.

Optionally, in some embodiments, the slurry tank has a tank depth equal to the thickness of the target film layer.

Optionally, in some embodiments, the cross-sectional shape of the recessed features is at least one of wedge-shaped, semi-circular, rectangular, or trapezoidal.

Optionally, in some embodiments, the inner bottom surface of the slurry tank forms two concave structures, and the two concave structures respectively correspond to the two bending structures, wherein the bending structures are bending lines.

Optionally, in some embodiments, the material of the transfer substrate is steel.

Correspondingly, the application also provides a transfer printing device, which comprises the transfer printing substrate and the transfer printing rubber head.

Correspondingly, the application also provides a transfer printing method, which comprises the following steps:

preparing a transfer substrate described herein; the method comprises the steps of,

injecting sizing agent into the sizing agent groove of the transfer printing substrate, and transferring the sizing agent layer in the sizing agent to the outer bending surface of the transferred printing substrate to obtain a target film layer.

Optionally, in some embodiments, the step of preparing the transfer substrate includes the steps of:

manufacturing a slurry tank according to the shape of the flattened state of the target film layer; the method comprises the steps of,

deepening the depth of the inner bottom surface of the slurry tank at a partial area corresponding to the contact position of the slurry and the bending structure.

Optionally, in some embodiments, the bottom surface in the slurry tank is deepened by laser engraving.

Compared with the prior art, the transfer printing substrate, the transfer printing device and the transfer printing method have the advantages that the concave structure is formed at the specific position of the inner bottom surface of the slurry tank, so that the thickness of the contact part of the slurry layer and the bending structure of the transferred substrate is increased, and the problem that the thickness of the transferred film layer is uneven or is easy to break due to structural defects of the transferred film layer is solved.

Drawings

Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic view of a conventional substrate having a transfer film layer formed thereon.

Fig. 2 is a schematic diagram of a transfer substrate according to an embodiment of the present application.

Fig. 3 is a schematic view of the slurry tank of fig. 2 after the slurry is injected.

Fig. 4 is a flow chart of the production of the transfer substrate of the present application.

Fig. 5 to 7 are process flow diagrams of the transfer printing method of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.

Fig. 2 is a schematic diagram of a transfer substrate 100 according to an embodiment of the present application. Fig. 3 is a schematic view of the slurry tank 110 of fig. 2 after the slurry layer 1 is injected. As shown in fig. 2 and 3, the present application provides a transfer substrate 100, where the transfer substrate 100 includes at least one slurry tank 110, and at least one concave structure 120 formed on an inner bottom surface 111 of the slurry tank 110. The paste tank 110 is used for accommodating paste to form a paste layer 1, and the paste layer 1 can be transferred onto an outer bending surface of a transferred substrate 20 to obtain a target film layer 1a on the outer bending surface. The concave structures 120 correspond to the positions of the slurry layer 1 in contact with the bending structures of the outer bending surface.

Obviously, during the injection of the slurry into the slurry tank 110, the area of the inner bottom surface of the slurry tank 110 having such a recessed structure 120 is also in contact with the slurry, and thus the slurry flows into the recessed structure 120. Thus, once the slurry layer 1 is taken out of the slurry tank 110, the protrusions 11 having substantially complementary shapes to the recessed structures 120 are formed on the surface of the slurry layer 1. That is, the thickness of the region of the slurry layer 1 corresponding to the concave structures 120 may be greater than the thickness of the slurry layer 1 corresponding to the inner bottom surface portion of the slurry tank 110.

Accordingly, the convex portion 11 is located at a position where the slurry layer 1 contacts the bending structure of the outer bending surface. That is, the convex portion 11 correspondingly contacts the bending structure. That is, the thickness of the region of the paste layer 1 corresponding to the bending structure may be greater than the thickness of the paste layer 1 corresponding to the planar portion.

In the present application, the outer bending surface "refers to a non-flat surface that is bent or folded, for example, may be a curved arc surface or may be a surface that is folded into several segments. Correspondingly, the bent structure refers to a part of the outer bending surface, which is bent or bent. The bending structure may be a linear or curved bending line.

Fig. 6 and 7 schematically show the structure of the transferred substrate 20. Referring to fig. 6 and 7, the transferred substrate 20 has a front surface 21 and a back surface 22 disposed opposite to each other, a side surface 23 intersecting the front surface 21, and a first chamfer surface 24 disposed between the front surface 21 and the side surface 23, and the first chamfer surface 24 is connected to the front surface 21 and the side surface 23.

In this embodiment, the outer curved surface includes an edge region of the front surface 21 adjacent to the first chamfer surface 24, and an edge region of the side surface 23 adjacent to the first chamfer surface 24.

Referring to fig. 6 and 7, the first chamfer 24 forms a bending structure with the front surface 21, and the first chamfer 24 forms another bending structure with the side surface 23. At this time, the outer bending surface has two concave structures 120.

However, the structure of the transferred substrate 20 and the outer bending surface are not limited thereto. For example, in some embodiments, the transferred substrate 20 further includes a second chamfer between the back surface 22 and the side surface 23. The second chamfer is located between the side surface 23 and the back surface 22 and connects the side surface 23 and the back surface 22, respectively. Similar to the first chamfer 24, the second chamfer forms a bent structure with the back 22 and the second chamfer forms another bent structure with the side 23.

In other embodiments, the outer fold surface is the edge region of the front surface 21 proximate the first chamfer surface 24, and the side surface 23, the second chamfer surface, and the edge region of the back surface 22 proximate the second chamfer surface. At this time, the outer bending surface has four concave structures 120.

In the present embodiment, the transfer substrate 20 is described as a glass substrate, and the glass substrate may be a blank glass substrate or a glass substrate provided with electronic components in the process of manufacturing a panel, and is not particularly limited herein.

Specifically, the slurry is a material for manufacturing the target film layer 1a. In this embodiment, the target film layer 1a may be a trace or an electrode, and the paste is a conductive paste layer. In a preferred manner, the target film layer 1a is a trace, and the paste is conductive silver paste.

Specifically, the transfer substrate 100 has a plurality of slurry tanks 110. The slurry tanks 110 are uniformly arranged in a row, the slurry tanks 110 are all rectangular, and the size of the slurry tanks 110 is identical.

Specifically, the slurry tank 110 is formed on the surface of the transfer substrate 100 in a recessed manner.

Specifically, the slurry tank 110 has a uniform shape corresponding to the flattened state of the target film layer 1a that is preset to be formed. In other words, the shape of the slurry tank 110 coincides with the planar shape of the target film layer 1a. More specifically, the planar shape of the slurry tank 110 is identical to the planar shape of the target film layer 1a, and the tank depth of the slurry tank 110 is identical to the thickness of the target film layer 1a.

Specifically, the concave structure 120 is formed on the inner bottom surface of the slurry tank 110 and is implemented in the form of a recess.

Referring to fig. 2, 3, 6 and 7, the outer bending surface of the transferred substrate 20 includes two bending structures. Accordingly, as shown in fig. 2, the inner bottom 111 of the slurry tank 110 is formed with two concave structures 120a,120b, and further, the surface of the slurry layer 1 is formed with two protrusions 11a,11b, respectively.

Specifically, the shape of the concave structure 120 is wedge-shaped. In other embodiments, the shape of the concave structures 120 may be rectangular, trapezoidal, or semicircular. That is, the shape of the recess 120 is not limited in the present application.

Specifically, the transfer substrate 100 is formed of steel. The steel has high melting point, high hardness and relatively low price, and can reduce the manufacturing cost of the silver paste pad printing template.

Based on the same inventive concept, the present application also provides a transfer device including the transfer substrate 100 of the present application and the transfer tape head 200. The structure and the implementation of the transfer substrate 100 are referred to above, and are not repeated here. The transfer head 200 is configured to transfer the paste layer 1 on the transfer substrate 100 onto the transferred substrate 20.

Specifically, the transfer printing rubber head 200 is an elastic rubber head. In specific implementation, the material of the transfer printing glue head 200 may be selected according to actual needs, for example, a film material such as PET, PP, PA may be used.

Thus, by using the transfer tape head 200, the carrier body for pattern transfer can be expanded from a flat surface to an outer bending surface, even the aforementioned outer bending surface including the side surface of the glass substrate. The pattern transfer method solves the problems of electrode and/or wire breakage, transfer slip, positioning, low efficiency and the like in the transfer printing process of the side surface of the glass substrate, can ensure the printing precision of patterns printed on the outer bending surface, has less use limit on materials, can meet the use of most of craft products, can realize continuous production, reduces the process cost and improves the production efficiency.

As shown in fig. 4 to 6, the present application also provides a transfer method including the steps of:

s100, preparing a transfer printing substrate 100; the method comprises the steps of,

and S200, injecting sizing agent into the sizing agent groove 110, and then transferring the sizing agent layer 1 in the sizing agent groove 110 onto a transferred object.

In the solution of the present application, by forming the concave structure 120 on the inner bottom surface 111 of the slurry tank 110, the depth of the specific area of the slurry tank 110 is deepened, so that the thickness of the portion of the slurry layer 1 in contact with the bending structure is thicker than the thickness of the portion of the slurry layer 1 in contact with the planar area, thereby solving the problem of uneven film layer caused by the bending structure, and obtaining a target film layer 1a with uniform film thickness.

The transfer method of the present invention can transfer the paste layer 1 onto the outer bending surface, and can form the target film layer 1a with uniform film thickness on the outer bending surface.

As shown in fig. 4, the present application also provides a method of preparing the transfer substrate 100. Specifically, the method for preparing the transfer substrate 100 includes the steps of:

s110, forming the slurry tank 110 according to the shape of a target film layer 1a which is formed in a preset and flattened state; the method comprises the steps of,

and S120, deepening the groove depth of the inner bottom surface of the slurry groove 110 corresponding to the bending structure according to the contact position of the slurry layer 1 and the bending structure of the outer bending surface.

In the solution of the present application, the recess structure 120 is further formed at a specific position of the inner bottom surface of the slurry tank 110, so that the thickness of the slurry tank 110 can be deepened, so that the thickness of the slurry layer 1 corresponding to the bending structure of the slurry layer 1 is thicker than the thickness of the slurry layer 1 corresponding to the planar area, thereby compensating the slurry layer 1 at the bending structure, preventing the target film layer 1a from being thinner or broken at the position corresponding to the bending structure, and enabling the thickness of the target film layer 1a to be uniform and the surface to be flat.

In the step S120, a recess structure 120 is formed on the inner bottom surface 111 of the slurry tank 110 correspondingly by deepening the groove depth of the partial region of the inner bottom surface 111 of the slurry tank 110. That is, a concave structure 120 is formed at the inner bottom surface of the slurry tank 110 according to the position of the slurry layer 1 contacting the bending structure of the outer bending surface.

Specifically, the number of the concave structures 120 is the same as the number of the bending structures of the outer bending surface. With continued reference to fig. 4, two concave structures 120a,120b are provided in the slurry tank 110 of the present application.

Specifically, the groove depth of the inner bottom surface of the slurry groove 110 may be deepened by a laser engraving method.

As shown in fig. 5 to 7, the method of preparing the target film layer 1a includes the steps of:

s210, injecting a slurry layer 1 into the slurry tank 110, and transferring the slurry layer 1 in the slurry tank 110 to a transfer printing rubber head 200;

s220, transferring the slurry layer 1 borne on the transfer printing glue head 200 onto the outer bending surface of the transferred substrate 20; the method comprises the steps of,

and S230, curing the slurry layer 1 carried on the outer bending surface of the transferred substrate 20.

In step S210, before the primary transfer, in order to improve the adhesion of the transfer head 200 to the slurry layer 1, the transferred head 200 may be subjected to a surface treatment such as a plasma treatment, chemical grafting, or excimer vacuum ultraviolet irradiation.

In the step S220, a transferred substrate 20 is provided before the second transfer. The structure of the transferred substrate 20 is referred to above, and will not be described herein.

As shown in fig. 6, the paste layer 1 and the transferred substrate 20 on the transfer head 200 are made to face each other, and the paste layer 1 pattern and the outer bent surface of the transfer substrate 100 are made to be aligned with each other. With continued reference to the figure, the surface of the pattern of the paste layer 1 with the protruding portion 11 faces the transferred substrate 20, and the protruding portions 11a and 11b of the pattern of the paste layer 1 are respectively located on the two bending structures in the transferred outer bending surface, and the specific correspondence is shown by the arrow in fig. 6.

After the alignment is completed, the paste layer 1 pattern and the transferred substrate 20 are brought into press contact, thereby transferring the paste layer 1 pattern to the outer bend surface of the substrate 20 to be printed.

Specifically, in order to further improve the adhesion of the transferred substrate 20 to the slurry layer 1, the outer bending surface of the transferred substrate 20 may also be subjected to a surface treatment such as a plasma treatment, chemical grafting, or excimer vacuum ultraviolet irradiation.

As shown in fig. 7, in step S230, the slurry layer 1 carried on the outer bending surface of the transferred substrate 20 is cured by a curing device to form a target film layer 1a.

The curing device is, for example, a UV curing device, a laser curing device, or the like. The UV curing device may be selected for UV curing when the conductive silver paste ink contains a photosensitive resin-based material, and the laser curing device may be selected for laser curing when the conductive silver paste ink contains a heat-sensitive resin-based material. When laser curing is employed, the curing time is, for example, 5 to 7 seconds.

The foregoing has described in detail a transfer substrate, a transfer device and a transfer method according to embodiments of the present application, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, where the foregoing examples are provided to assist in understanding the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (9)

1. The transfer printing substrate is characterized by comprising at least one slurry tank and a concave structure formed on the inner bottom surface of the slurry tank;

the slurry tank is used for accommodating slurry to form a slurry layer, the slurry layer is formed with a convex structure corresponding to the concave structure, and the slurry layer can be transferred onto an outer bending surface of a transferred substrate to obtain a target film layer on the outer bending surface;

the convex structure of the slurry layer corresponds to the contact position of the slurry layer and the bending structure of the outer bending surface;

the inner bottom surface of the slurry tank is provided with two concave structures, the two concave structures respectively correspond to the two bending structures, and the bending structures are bending lines.

2. The transfer substrate of claim 1, wherein the slurry tank corresponds to a shape of the target film layer in a flattened state.

3. The transfer substrate of claim 2, wherein the slurry tank has a tank depth equal to the thickness of the target film layer.

4. The transfer substrate of claim 1, wherein the recessed features have a cross-sectional shape that is at least one of wedge-shaped, semi-circular, rectangular, or trapezoidal.

5. The transfer substrate of claim 1, wherein the material of the transfer substrate is steel.

6. A transfer device comprising the transfer substrate according to any one of claims 1 to 5 and a transfer head.

7. A transfer method, characterized in that the transfer method comprises the steps of:

preparing the transfer substrate according to any one of claims 1 to 5; the method comprises the steps of,

injecting sizing agent into the sizing agent groove of the transfer printing substrate, and transferring the sizing agent layer to the outer bending surface of the transferred printing substrate to obtain a target film layer.

8. The transfer method of claim 7, wherein the step of preparing the transfer substrate comprises the steps of:

manufacturing a slurry tank according to the shape of the flattened state of the target film layer; the method comprises the steps of,

deepening the depth of the inner bottom surface of the slurry tank at a partial area corresponding to the contact position of the slurry and the bending structure.

9. The transfer method of claim 8, wherein the bottom surface of the slurry tank is deepened by laser engraving.