CN113809056B - 一种实现夜视兼容的超薄Mini-LED背光模组 - Google Patents
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Abstract
本发明公开了一种实现夜视兼容的超薄Mini‑LED背光模组,其特征在于:包括Mini‑LED背光灯条、反光围坝、导光板、反光膜和光学模组;Mini‑LED背光灯条包括PCB基板、倒装蓝光LED芯片、荧光膜片、三色Mini‑LED芯片和一体化封装胶体;通过倒装蓝光LED芯片和荧光膜片实现白天模式下的背光照明,通过三色Mini‑LED芯片实现夜视兼容模式下的背光照明。本发明优化现有液晶显示模块的重量、功耗,提升显示模块整体性能,同时兼顾夜视兼容功能,提出了一种超薄、新架构、实现夜视兼容的Mini‑LED背光模组。
Description
技术领域
本发明属于机载显示领域,特步涉及了一种Mini-LED背光模组。
背景技术
在机载显示领域,目前普遍采用的是液晶显示技术,其是应用于航空器上的主要显示设备,基本要求是能够显示各种信息,包括图表、地图、传感器等飞行信息或参数,并要求在各种工作环境下均能可靠地工作。
夜视成像系统(NVIS)的工作原理是通过收集近红外光送到图像增强管从而在荧光屏幕上成像,从而实现夜晚可视的目的。对于机载显示设备来说,其最基本的要求是不能干扰NVIS对舱外目标的观测,这就要求显示设备与NVIS相兼容,即夜视兼容功能。而对于机载液晶显示,其主要是要求发光光源具备夜视兼容功能,即背光灯条具备夜视兼容功能。
随着飞机上的各种航电显示设备日益增加,在有限的机载动力资源的情况下,降低显示设备的资源占用显得尤为重要,对显示设备的功耗和重量指标提出了更高的要求,降低显示设备的功耗和重量也越来越迫切。而目前机载显示设备需要兼顾高亮和夜视兼容的要求,背光灯条采用尺寸较大的常规贴片式LED制作形成,由于LED封装形式的限制,导致导光板厚度至少在3mm以上,严重制约了显示模组的厚度以及重量的下降。同时,贴片式LED封装尺寸较大,同等长度的背光灯条,LED排布数量较少,导致在最大亮度下单颗LED工作电流几乎已经达到额定电流,发光效率相对最优电流下的发光效率大为下降,导致显示模组整体光效低下,需要对目前的背光模组进行优化升级。
发明内容
为了解决上述背景技术提到的技术问题,本发明提出了一种实现夜视兼容的超薄Mini-LED背光模组。
为了实现上述技术目的,本发明的技术方案为:
一种实现夜视兼容的超薄Mini-LED背光模组,包括Mini-LED背光灯条、反光围坝、导光板、反光膜和光学模组,所述反光围坝贴附于Mini-LED背光灯条和导光板的上、下两侧,所述反光膜和光学模组分别设于导光板的上、下两侧;所述Mini-LED背光灯条包括PCB基板、倒装蓝光LED芯片、荧光膜片、Mini-LED芯片和一体化封装胶体,所述倒装蓝光LED芯片与Mini-LED芯片周期性间隔排列于PCB基板上,所述Mini-LED芯片包括倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片,所述荧光膜片贴附于倒装蓝光LED芯片,所述一体化封装胶体设置在PCB基板上且将全部的倒装蓝光LED芯片、荧光膜片和Mini-LED芯片包覆于其内部居中位置;通过倒装蓝光LED芯片和荧光膜片实现白天模式下的背光照明,通过倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片实现夜视兼容模式下的背光照明。
基于上述技术方案的优选方案,对倒装蓝光LED芯片和荧光膜片采用CSP封装工艺。
基于上述技术方案的优选方案,将荧光膜片直接粘贴在倒装蓝光LED芯片的衬底上,再切割形成单颗白光芯片,然后转移至PCB基板上。
基于上述技术方案的优选方案,所述倒装蓝光LED芯片横向排布,所述倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片竖向排布。
基于上述技术方案的优选方案,根据均匀性要求和最大亮度要求确定倒装蓝光LED芯片与Mini-LED芯片的周期性间距。
基于上述技术方案的优选方案,所述反光围坝通过透明双面胶带粘贴在Mini-LED背光灯条和导光板的上、下两侧。
基于上述技术方案的优选方案,将反光围坝靠近所述一体化封装胶体一侧的表面做反射处理,对Mini-LED背光灯条大视角发散光进行收束。
基于上述技术方案的优选方案,所述一体化封装胶体的高度与导光板的厚度相同。
采用上述技术方案带来的有益效果:
本发明在满足显示模块夜视兼容功能的前提下,可实现超窄背光灯条,其宽度可至1mm甚至更小,可将导光板厚度降低至1mm甚至更小,能够降低显示模组的厚度和重量。此外,本发明采用无封装支架一体化封装的方式,大大增加LED排布数量,合理优化排布间距,使单颗白光LED的工作电流处于最优光效区间,提升显示模组的整体光效,降低功耗;同时,采用的一体化封装方案,提高了背光灯条在复杂环境条件下可靠性,提升液晶显示模块的整体可靠性。
附图说明
图1是本发明的整体结构示意图;
图2是本发明中Mini-LED背光灯条的结构示意图,其中(a)是侧视图,(b)是正视图。
标号说明:1、Mini-LED背光灯条;2、反光围坝;3、导光板;4、反光膜;5、光学模组;6、PCB基板;7、倒装蓝光LED芯片;8、荧光膜片;9、倒装红光Mini-LED芯片;10、倒装蓝光Mini-LED芯片;11、倒装绿光Mini-LED芯片;12、一体化封装胶体。
具体实施方式
以下将结合附图,对本发明的技术方案进行详细说明。
本发明设计了一种实现夜视兼容的超薄Mini-LED背光模组,如图1所示,包括Mini-LED背光灯条1、反光围坝2、导光板3、反光膜4和光学模组5。反光围坝2贴附于Mini-LED背光灯条1和导光板3的上、下两侧,反光膜4和光学模组5分别设于导光板3的上、下两侧。
如图2中的(a)所示,Mini-LED背光灯条1包括PCB基板6、倒装蓝光LED芯片7、荧光膜片8、倒装红光Mini-LED芯片9、倒装蓝光Mini-LED芯片10、倒装绿光Mini-LED芯片11和一体化封装胶体12。倒装蓝光LED芯片10与三色Mini-LED芯片周期性间隔排列于PCB基板6上。一体化封装胶体12设置在PCB基板6上且将全部的LED芯片包覆于其内部居中位置。
通过倒装蓝光LED芯片7和荧光膜片8实现白天模式下的背光照明。在本实施例中,采用17mil×30mil形式的倒装蓝光芯片和荧光膜片来实现白光,主波长为450nm,采用CSP封装工艺,将荧光膜片8直接粘贴在倒装蓝光LED芯片7的衬底上,再切割形成单颗白光芯片,然后转移至PCB基板6上。可避免传统白光LED封装工艺中荧光粉涂布对三色Mini-LED芯片的影响。
通过倒装红光Mini-LED芯片9、倒装蓝光Mini-LED芯片10和倒装绿光Mini-LED芯片11实现夜视兼容模式下的背光照明,分别采用5mil×9mil、7mil×12mil或其他合理尺寸的Mini-LED芯片通过转移方式直接至PCB基板6。
根据均匀性要求和最大亮度要求合理设置倒装蓝光LED芯片7与三色Mini-LED芯片的周期性间距。在本实施例中,倒装蓝光LED芯片7横向排布,三色Mini-LED芯片竖向排布,如图2中的(b)所示。
所述一体化封装胶体12是待所有LED芯片转移完成、经过回流焊之后,在PCB基板6上制作的一方形胶体。LED芯片居中排布在胶体中间,胶体长度需长于LED排布区域,将各色光全部包覆在胶体中,待胶体固化后即形成一体化封装胶体,提高背光灯条可靠性。
在本实施例中,一体化封装胶体12的高度与导光板3的厚度相同,可至1mm以下,便于反光围坝2的粘贴。将反光围坝2靠近一体化封装胶体12一侧的表面做反射处理,对Mini-LED背光灯条1大视角发散光进行收束,避免大视角发散光的浪费。
实施例仅为说明本发明的技术思想,不能以此限定本发明的保护范围,凡是按照本发明提出的技术思想,在技术方案基础上所做的任何改动,均落入本发明保护范围之内。
Claims (7)
1.一种实现夜视兼容的超薄Mini-LED背光模组,其特征在于:包括Mini-LED背光灯条、反光围坝、导光板、反光膜和光学模组,所述反光围坝贴附于Mini-LED背光灯条和导光板的上、下两侧,所述反光膜和光学模组分别设于导光板的上、下两侧;所述Mini-LED背光灯条包括PCB基板、倒装蓝光LED芯片、荧光膜片、Mini-LED芯片和一体化封装胶体,所述倒装蓝光LED芯片与Mini-LED芯片周期性间隔排列于PCB基板上,所述Mini-LED芯片包括倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片,所述荧光膜片贴附于倒装蓝光LED芯片,所述一体化封装胶体设置在PCB基板上且将全部的倒装蓝光LED芯片、荧光膜片和Mini-LED芯片包覆于其内部居中位置;通过倒装蓝光LED芯片和荧光膜片实现白天模式下的背光照明,通过倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片实现夜视兼容模式下的背光照明;
相对于背光灯条延伸方向,所述倒装蓝光LED芯片横向排布,所述倒装红光Mini-LED芯片、倒装蓝光Mini-LED芯片和倒装绿光Mini-LED芯片竖向排布。
2.根据权利要求1所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:对倒装蓝光LED芯片和荧光膜片采用CSP封装工艺。
3.根据权利要求2所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:将荧光膜片直接粘贴在倒装蓝光LED芯片的衬底上,再切割形成单颗白光芯片,然后转移至PCB基板上。
4.根据权利要求1所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:根据均匀性要求和最大亮度要求确定倒装蓝光LED芯片与Mini-LED芯片的周期性间距。
5.根据权利要求1所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:所述反光围坝通过透明双面胶带粘贴在Mini-LED背光灯条和导光板的上、下两侧。
6.根据权利要求1所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:将反光围坝靠近所述一体化封装胶体一侧的表面做反射处理,对Mini-LED背光灯条大视角发散光进行收束。
7.根据权利要求1所述实现夜视兼容的超薄Mini-LED背光模组,其特征在于:所述一体化封装胶体的宽度与导光板的厚度相同。
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