CN113809023A - Radiator, packaging structure and electronic equipment - Google Patents
Radiator, packaging structure and electronic equipment Download PDFInfo
- Publication number
- CN113809023A CN113809023A CN202010556379.XA CN202010556379A CN113809023A CN 113809023 A CN113809023 A CN 113809023A CN 202010556379 A CN202010556379 A CN 202010556379A CN 113809023 A CN113809023 A CN 113809023A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat sink
- radiator
- package structure
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000005452 bending Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The application provides a radiator, a packaging structure and an electronic device, and relates to the technical field of heat dissipation. This radiator includes radiator body and wind channel, wherein: the radiator body, including heating panel and found the arm, found the one end of arm and be fixed in the heating panel, found the arm and can be connected with waiting the heat abstractor. The air duct is used for ventilating the radiator body. When the radiator of this application embodiment was used in packaging structure, can realize the radiator through standing the arm with packaging structure in treat radiating device be connected to heat transfer to the radiator body through standing the arm on the messenger device, in order to realize the radiator to the heat dissipation of device. The radiator of the embodiment of the application realizes the radiation of the device in a mode of directly contacting with the device, the thermal resistance between the radiator and the device is small, and the radiating performance is good. In addition, the radiator is simple in structure, and the miniaturization design of the radiator is facilitated.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat radiator, a packaging structure and electronic equipment.
Background
With the development of power electronic converters toward high density and flattening, chip power devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and gallium nitride enhanced power transistors (GaN), are widely used. The power loss can be produced to paster power device, leads to the temperature to rise, consequently needs to have the temperature of corresponding heat dissipation measure to manage and control power device, avoids the high temperature to lead to paster power device to become invalid.
The core heating component of the patch power device is a bare chip, and different packaging forms can lead the heat on the bare chip to be dissipated through different paths. The typical packaging form of the current chip power device includes a bottom heat dissipation form and a top heat dissipation form. Because the top of the patch power device in the top heat dissipation form needs to be provided with a heat radiator during heat dissipation, the heat dissipation capability of the patch power device is good, so that the patch power device with high power consumption is mostly cooled in the top heat dissipation form at present.
However, when using top heat dissipation, a flexible heat conducting material needs to be placed between the heat sink and the chip power device. In order to ensure the dielectric strength of the flexible heat conductive material, the thickness of the flexible heat conductive material is usually set to be large. This introduces a large thermal resistance between the heat sink and the patch power device, which results in that it cannot meet the heat dissipation requirements of the patch power device with high power consumption.
Disclosure of Invention
The application provides a radiator, a packaging structure and electronic equipment to improve the heat dispersion of the radiator, thereby realize the radiator and treat the effective heat dissipation of heat dissipation device.
In a first aspect, embodiments of the present application provide a heat sink that may be used, but not limited to, for dissipating heat from a chip, an igbt, or other common high power semiconductor device. The heat sink may include a heat sink body and an air duct. Wherein: the radiator body comprises a heat dissipation plate and two or more than two vertical arms, wherein the two adjacent vertical arms are arranged at intervals. In addition, one end of the vertical arm is fixed on the heat dissipation plate, and the other end of the vertical arm is used for being connected with a device to be dissipated. And the air duct is used for ventilating the radiator body. When the radiator of this application embodiment is used in packaging structure, can be fixed in the radiating device of treating in packaging structure with the radiator body through the vertical arm on to the heat that makes on the device can conduct to the radiator board through the vertical arm, the radiator body carries out quick heat dissipation under the state that the wind channel ventilates, in order to realize the heat dissipation of radiator to the device. The radiator of the embodiment of the application can realize the heat dissipation of the device in a mode of directly contacting the vertical arm with the device, the thermal resistance between the vertical arm and the device is small, and the heat dissipation performance is good. In addition, the radiator is simple in structure and beneficial to realizing the miniaturization design of the radiator.
In a possible implementation manner of the present application, the heat sink body may further include a connection portion, and the connection portion is disposed at an end of the vertical arm away from the heat dissipation plate. In this embodiment, when two or more vertical arms are provided, the vertical arms can stably support the heat dissipation plate. In addition, because the radiator is contacted with the device through the connecting part arranged on the vertical arm, the vertical arm can be used as a heat conduction channel between the radiator and the device, and the arrangement of the plurality of vertical arms is beneficial to increasing the heat conduction channel between the radiator and the device, thereby improving the heat conduction efficiency between the radiator and the device and accelerating the heat radiation.
In a possible implementation manner of the present application, the connecting portion, the heat dissipation plate, and the vertical arm may be further configured as an integrally formed structure, and the connecting portion is formed by bending one end of the vertical arm away from the heat dissipation plate. This can effectively simplify the structure of the heat sink.
In addition, the connecting part can be arranged as a bonding pad extending from the vertical arm, so that the connecting part can be connected with the metal surface of the device to be cooled in a welding mode, the thermal resistance between the radiator and the device to be cooled can be reduced, and the heat conduction efficiency between the radiator and the device to be cooled is improved.
Since the heat sink deforms when heated, it may generate stress between the heat sink and the device, so as to prevent the stress from acting on the device and causing damage to the device. In a possible implementation manner of the present application, a certain gap may exist between two adjacent vertical arms, so that the stress value between the heat sink and the device is reduced through the deformation of the vertical arms. In addition, an air duct can be formed at the gap between two adjacently arranged vertical arms.
In one possible implementation manner of the present application, when the air duct of the heat sink is formed, the heat sink body may be further configured to be a hollow structure, so that the cavity of the hollow structure may be used as the air duct, thereby further simplifying the structure of the heat sink.
In addition to the arrangement position of the connection portion, in one possible implementation manner of the present application, the connection portion may be arranged on a side surface of the heat dissipation plate away from the upright arm, so as to conduct heat to the upright arm through the heat dissipation plate for heat dissipation.
In one possible implementation manner of the present application, the projection of the connecting portion on the heat dissipation plate may also fall within the outline of the heat dissipation plate. Therefore, the structure of the radiator is compact, and the space occupied by the radiator is favorably reduced.
In addition, in the present application, the heat sink body may be made of, but not limited to, a metal with good thermal conductivity, such as copper, silver, or gold, or an alloy with good thermal conductivity, or a material with a plating layer with good thermal conductivity.
In a second aspect, an embodiment of the present application further provides a package structure, where the package structure may include a device to be heat-dissipated, and the heat spreader of the first aspect, and the heat spreader may be fixedly connected to the device. The device to be cooled in the package structure may be, but is not limited to, a chip, an insulated gate bipolar transistor, or other common high-power semiconductor devices. The structure of the packaging structure of the embodiment of the application is simple, and the packaging structure is beneficial to realizing the miniaturization design. In addition, in the packaging structure of the embodiment of the application, the thermal resistance between the radiator and the device is small, so that the effective heat dissipation of the device can be realized.
In one possible implementation manner of the present application, in order to implement connection between the heat sink and the device, a pad may be disposed on the device, so that the vertical arm of the heat sink and the pad may be welded to implement fixation between the heat sink and the device. In this embodiment, the structure of the package structure can be effectively simplified by soldering the heat spreader to the pads on the device. The heat sink and the device can be welded by any welding process such as reflow soldering, diffusion soldering, ultrasonic soldering or laser soldering, so as to improve the structural stability of the package structure. The radiator and the device are connected in a welding mode, so that the thermal resistance between the radiator and the device can be effectively reduced, and the radiating efficiency of the radiator for radiating the device is improved. In addition, the radiator and the device are connected in a welding mode, the process control difficulty of the radiator and the device can be effectively simplified, the cost is reduced, and a packaging structure formed by the radiator and the device is simplified.
In one possible implementation manner of the present application, when the pad of the device is specifically disposed, the pad may be an integrated structure, so that the connection portion of the heat spreader may be welded to the pad. In other implementation manners of the application, the number of the pads can be the same as that of the vertical arms of the radiator, so that the vertical arms and the pads are welded in a one-to-one correspondence manner, the problem of stress caused by large-area tin connection can be prevented, and the surface tension of soldering tin can be conveniently utilized to align the position of the radiator.
In addition to the above-described connection of the heat spreader to the pads of the device, in another possible implementation of the present application, the device may further include a substrate, and the heat generated by the device may be conducted to the heat spreader through the substrate by connecting the vertical arms of the heat spreader to the substrate. The heat sink may be fixed to the substrate by soldering. In this implementation, since no additional bonding pad is disposed on the device, the structure of the package structure can be effectively simplified.
The number of heat sinks provided on the devices of the package structure may be adjusted according to their specific heat dissipation requirements. In one possible implementation of the present application, only one heat sink may be disposed on the device, and the position of the heat sink may be adjusted according to the portion of the device for connecting with the heat sink, for example, the heat sink may be disposed on one side of the device, and the projection of the heat sink on the device falls within the outline of the device. In addition, the size of the radiator can be increased, so that the projection of the radiator on the device exceeds the outline range of the device, the radiating area of the radiator is increased, and the radiating performance of the radiator is improved.
In another possible implementation manner of the present application, a plurality of heat sinks may be further disposed on the device, and two adjacent heat sinks are disposed at an interval, so that besides the air channels of the two heat sinks, the gap between the two heat sinks may also be used as the air channel, thereby increasing the heat dissipation channels. And through set up two or two above radiators on the device, can make the quantity of the connecting portion that are connected with the device more to can be favorable to the heat to the radiator body transmission of radiator from a plurality of connecting portions fast, in addition, still be favorable to increasing heat radiating area, thereby make the radiating efficiency obtain improving.
When the two or more than two radiators are arranged on the device, the projection of each radiator on the device can fall into the outline range of the device. In other implementation manners, the projection of the partial heat sink on the device can also be made to fall within the outline range of the device, and at least one side of the projection of the partial heat sink on the device exceeds the outline range of the device; or at least one side of the projection of each heat sink on the device exceeds the outline range of the device. This can further increase the heat dissipation area of the heat sink, thereby improving the heat dissipation efficiency.
In a third aspect, an embodiment of the present application further provides an electronic device, which may include a printed circuit board, and the package structure of the second aspect. The packaging structure is electrically connected with the printed circuit board so as to realize the functions of the packaging structure.
In the electronic device of the embodiment of the application, the packaging structure has better heat dissipation performance, so that the heat dissipation performance of the electronic device is better. In addition, the volume of the packaging structure is small, so that the electronic equipment can be favorably miniaturized and designed in a thin mode. In addition, as the packaging structure occupies a smaller space in the electronic equipment, more functional modules can be arranged in the electronic equipment, so that the electronic equipment is beneficial to integrating more functions.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink according to an embodiment of the present disclosure;
fig. 2 is a schematic view illustrating a manufacturing process of a heat sink according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a heat sink according to another embodiment of the present application;
fig. 4 is a schematic view illustrating a manufacturing process of a heat spreader according to another embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a package structure according to an embodiment of the present application;
FIG. 6 is a side view of a device provided by an embodiment of the present application;
FIG. 7 is a top view of a device provided by an embodiment of the present application;
fig. 8 is a top view of a package structure according to an embodiment of the present application;
fig. 9 is a side view of a package structure provided by an embodiment of the present application;
fig. 10 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 11 is a top view of a package structure according to another embodiment of the present application;
fig. 12 is a side view of a package structure according to another embodiment of the present application;
fig. 13 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 14 is a top view of a package structure according to another embodiment of the present application;
fig. 15 is a side view of a package structure according to another embodiment of the present application;
fig. 16 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 17 is a top view of a package structure according to another embodiment of the present application;
fig. 18 is a side view of a package structure according to another embodiment of the present application.
Reference numerals:
1-a radiator; 101-a heat sink body; 1011-a heat sink plate; 1012-vertical arm; 1013-a connecting part; 102-a wind channel; 103-incision; 2-a metal sheet; 201-a bend line; 202-a heat sink area; 203-standing arm area; 204-a connector region;
3-a device; 301-a pad; 4-packaging structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
The terminology used in the following embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in the specification of the present application and the appended claims, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" means one, two or more. The term "and/or" is used to describe an association relationship that associates objects, meaning that three relationships may exist; for example, a and/or B, may represent: a alone, both A and B, and B alone, where A, B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
First, an application scenario of the heat sink will be described. With the development of current electronic devices, there are more and more high power devices in the electronic devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and gallium nitride enhanced power transistors (GaN) chip power devices. Because the patch power device can generate power loss, the temperature is increased, and the requirement on the radiator is higher and higher, a corresponding radiating measure is needed to control the temperature of the power device, and the power device is prevented from being out of work due to overhigh temperature. In addition, as electronic devices are miniaturized and integrated, the space reserved for heat dissipation components is also smaller and smaller, and therefore the heat dissipation capability of a high-power semiconductor device under high power density is in urgent need to be improved.
The core heating component of the power device is a bare chip, and different packaging forms can lead the heat on the bare chip to be dissipated through different paths. The typical packaging form of the current chip power device includes a bottom heat dissipation form and a top heat dissipation form. The thermal resistance of the power device with bottom heat dissipation from the bare chip to the bottom heat dissipation pad is small, after the power device is welded on a Printed Circuit Board (PCB), heat is mainly transferred to the PCB from a bottom heat dissipation channel and then is diffused on the PCB, and temperature reduction is realized depending on the heat dissipation capacity of the PCB. In addition, a welded bus bar or a heat radiator can be added on other positions of the PCB, so that the heat radiation capability of the PCB is enhanced. However, due to the high thermal resistance of the PCB itself, the bottom heat dissipation scheme may be difficult to achieve the temperature management goal under the condition of high heat dissipation of the power device.
The conventional top heat dissipation power device has small thermal resistance from the bare chip to the top heat dissipation pad, and after the power device is soldered on a PCB, a heat sink needs to be added on the top of the power device to help heat dissipation of the power device. Because of the special radiator, the heat dissipation capacity of the radiator can be higher than that of the package with bottom heat dissipation, so that the top heat dissipation is a commonly adopted scheme in the scene of heat dissipation of a high-power semiconductor device.
However, the existing heat sink is generally made of aluminum profile. When the heat sink is arranged on the power device, the flexible heat conduction material needs to be placed between the heat dissipation pad on the top of the power device and the heat sink, then the heat sink and the PCB are fixed through fastening connectors such as screws, and the heat sink is pressed against the flexible heat conduction material. The flexible heat conducting material can be heat conducting silica gel, heat conducting silicone grease, a heat conducting pad, heat conducting gel and the like. Generally, a plurality of power devices are centrally arranged on a PCB, and the power devices all need to dissipate heat, so that an aluminum profile is used as a larger heat sink to directly cover all the power devices. Considering that circuit nodes of a plurality of different power devices with top radiating pads are different, short circuits cannot be formed through an aluminum profile heat sink, and each power device and the heat sink are generally required to be in contact through an insulating flexible heat conduction material. For common insulating flexible heat conducting materials such as heat conducting gel and the like, the insulating strength can be ensured only by the aid of larger material thickness. Meanwhile, in order to absorb the height tolerance of a plurality of power devices and the surface flatness tolerance of the aluminum profile heat radiator, the contact is also required to be realized by a thicker insulating flexible heat conduction material. It is understood that an excessively thick insulating flexible thermal conductive material will introduce a large thermal resistance, resulting in failure to meet the heat dissipation requirements of power devices with high power consumption.
The heat sink provided in the embodiments of the present application is mainly provided for a power device in a top heat dissipation package form, and may be used for dissipating heat for a chip, an Insulated Gate Bipolar Transistor (IGBT), or other common high-power semiconductor devices, and has a better heat dissipation performance. The following describes a heat sink provided in an embodiment of the present application in detail with reference to the accompanying drawings.
Referring to fig. 1, the present embodiment provides a heat sink 1, and the heat sink 1 may include a heat sink body 101 and an air duct 102. The heat sink body 101 may have a heat dissipating plate 1011 and an upright arm 1012, the upright arm 1012 is fixed to the heat dissipating plate 1011, and one end of the upright arm 1012 away from the heat dissipating plate 1011 may be connected to a device to be heat dissipated. The arrangement of the standing arm 1012 on the heat dissipating plate 1011 may be various, and for example, as shown in fig. 1, it is provided in the edge area of the heat dissipating plate 1011; in other possible embodiments, the heat dissipation plate 1011 may be disposed in the middle area thereof, or at any position of the heat dissipation plate 1011 as long as the heat dissipation plate 1011 can be supported. In the embodiment of the present application, the number of the standing arms 1012 is not particularly limited, and the standing arms 1012 may be two, three, four, or more, for example. It can be understood that the upright arm 1012 can be used as a heat transfer channel between the heat sink 1 and the device to be heat-dissipated, the more the upright arm 1012 is arranged, the more the heat transfer channel between the heat sink 1 and the device to be heat-dissipated is, the faster the heat transfer speed is, and the larger the heat dissipation plate 1011 is, so that the heat dissipation performance of the heat sink 1 can be effectively improved, and the heat dissipation effect of the heat sink 1 on the device can be improved.
In addition, a certain gap may be formed between two adjacent vertical arms 1012 to avoid a risk of damage to a device (e.g., a GaN device) sensitive to mechanical stress when the vertical arms 1012 are fixed to the device to be heat-dissipated by soldering, due to stress generated by the device and the vertical arms 1012 being different in material and thermal expansion coefficient.
Specifically, when the air duct 102 is provided, with reference to fig. 1, the heat sink body 101 may be provided as a hollow structure surrounded by the heat dissipating plate 1011 and the upright arm 1012, and a cavity of the hollow structure may be used as the air duct 102. In this embodiment, the vertical arms 1012 may be disposed on two sides of the air duct 102, and the vertical arms 1012 may be disposed at the edge of the heat dissipation plate 1011, so as to make the space of the air duct 102 as large as possible, thereby effectively improving the heat dissipation performance of the heat sink 1. In some possible embodiments of the present application, the air duct 102 may also be formed between the vertical arms 1012 as long as the heat dissipation and ventilation effects of the heat sink 1 are achieved.
In addition to the above structure, in some embodiments of the present application, the heat sink 1 may further include a connection portion 1013, where the connection portion 1013 is disposed at an end of the upright arm 1012 far from the heat dissipation plate 1011. In this embodiment, the heat dissipating plate 1011, the upright arm 1012, and the connecting portion 1013 may be integrally formed, and the connecting portion 1013 is formed by bending one end of the upright arm 1012 away from the heat dissipating plate 1011, so as to effectively simplify the structure of the heat sink 1. In addition, the projection of the connection part 1013 in the direction of the heat dissipation plate 1011 may also be located within the outline of the heat dissipation plate 1011, which is advantageous for realizing a miniaturized design of the heat sink 1.
In addition to the connection part 1013 on the upright arm 1012, in some possible embodiments, the connection part 1013 may be provided on a side surface of the heat dissipation plate 1011 away from the upright arm 1012. So as to conduct the heat generated by the device to be cooled to the upright arm 1012 through the heat dissipating plate 1011 to dissipate the heat.
In other embodiments of the present application, the material of the heat sink 1 is also important to provide the heat sink 1 with good heat dissipation performance. The heat sink 1 of the embodiment of the present application may be made of metal, alloy, or material with a metal plating layer. Exemplarily, the heat sink 1 may be made of copper, which may provide the heat sink 1 with high thermal conductivity and facilitate the soldering of the heat sink 1. In addition, the heat sink 1 may be made of metal such as gold or silver, so as to improve the heat conduction performance of the heat sink 1.
To further understand the structure of the heat sink 1 according to the embodiment of the present application, a method for manufacturing the heat sink 1 according to the embodiment is described next. The method can be as follows: first, referring to fig. 2, a metal sheet 2 (e.g., a copper sheet or the like) is flattened, and the metal sheet 2 is cut to form slits 103, wherein the number of the slits 103 is 1 or more, so that the formed heat sink 1 has two or more standing arms 1012 (see fig. 3).
Then, the metal sheet 2 is bent. According to the requirement of the design size of the heat sink 1, the cut metal sheet 2 is bent to form the heat dissipation plate 1011 and the upright arm 1012 of the heat sink body 101 as shown in fig. 3, and the air duct 102 is formed in the cavity between the heat dissipation plate 1011 and the upright arm 1012. In addition, in the application embodiment, the sectional shape of the heat sink body 101 may be, but is not limited to, a rectangular shape with a notch as shown in fig. 3.
In other embodiments of the present application, the metal sheet 2 may be divided into regions before the metal sheet 2 is cut to form the slits 103. Illustratively, with continued reference to fig. 2, sheet metal 2 is divided along an extension direction thereof (which coincides with the cutting direction of slit 103) into an arm area 203 and a heat sink area 202 by a bending line 201, wherein arm area 203 is located on both sides of heat sink area 202, so that sheet metal 2 can be bent along bending line 201 after being cut.
In addition, after the metal sheet 2 is divided into regions by the bending line 201, the cutting depth of the cut 103 may be set in accordance with the stress sensitivity of the device to be heat-dissipated when the metal sheet 2 is cut. For example, for stress sensitive devices, the incision depth of the incision 103 may be made larger, for example, in the embodiment shown in fig. 2, the incision 103 may be made through the standing arm region 203. In other embodiments, the cut 103 may also be cut into the heat sink area 202. Whereas for stress insensitive devices, the depth of cut 103 can be made smaller with reference to fig. 4.
In some embodiments of the present application, in order to facilitate the connection of the upright arm 1012 to the device to be heat-dissipated, when bending the metal sheet 2, referring to fig. 3, a connecting part 1013 is formed at the end of the upright arm 1012 by bending. It will be appreciated that when sheet metal 2 is area-divided by bend line 201, referring to fig. 2 or 4, the end of upright arm region 203 remote from fin region 202 may be further divided into connecting portion region 204, which may be bent along bend line 201 between upright arm region 203 and connecting portion region 204 to form connecting portion 1013 in fig. 3.
In the present embodiment, when the standing arm 1012 and the connecting portion 1013 are formed by bending, the bending direction of the standing arm region 203 with respect to the heat dissipating plate region 202 can be made to coincide with the bending direction of the connecting portion region 204 with respect to the standing arm region 203. This makes it possible to form the heat sink 1 with a small footprint so as to be easily installed in a small space.
Because the process flow of the heat sink 1 of the above embodiment mainly includes two steps of cutting and bending when being processed, the processing cost is low. In addition, the heat sink 1 is made of a metal sheet 2, and the structure is simple, so that the heat sink 1 has good heat dissipation performance, and meanwhile, the heat sink 1 can be miniaturized to meet the setting requirement of the heat sink in electronic equipment.
It is to be understood that the above embodiments are merely exemplary illustrations of the structure and processing method of the heat sink 1 of the present application. In some embodiments of the present application, the heat sink 1 may also be a block structure, and the heat sink body 101 has a plurality of through holes to serve as the air duct 102, and at this time, the connection portion may be disposed on a side surface of the heat sink body 101 that is not penetrated by the air duct 102. In this embodiment, when the heat sink 1 is formed, metal may be processed by carving or the like to form the air duct 102. Or, in some other embodiments of the present application, the heat sink 1 may also be processed and formed by welding or bonding, and the structure of the formed heat sink 1 is similar, which is not described herein again.
Referring to fig. 5, when the heat sink 1 according to the embodiment of the present invention is mounted on the device 3 to be heat-dissipated to form the package structure 4, the way of mounting the heat sink 1 on the device 3 will be described by taking the heat sink 1 as an example of an arch structure including the heat dissipating plate 1011 and the upright arm 1012. With continued reference to fig. 5, the end of the upright arm 1012 of the heat sink 1 remote from the heat radiating plate 1011 may be fixed to the device 3. The heat sink 1 and the device 3 may be soldered by any soldering process, such as reflow soldering, diffusion soldering, ultrasonic soldering, or laser soldering.
Referring to fig. 6, the device 3 may be generally flat in configuration. Referring also to fig. 7, the device 3 has a pad 301 on a surface thereof on which the heat spreader 1 is provided. When the pad 301 of the device 3 is specifically disposed, the pad 301 may be of an integral structure, so that each of the upright arms 1012 of the heat spreader 1 is soldered to the pad 301. In some embodiments of the present application, the number of the pads 301 may also be the same as the number of the standing arms 1012 of the heat spreader 1, so that the standing arms 1012 and the pads 301 are soldered in a one-to-one correspondence, which may prevent the stress problem caused by the large area of the continuous solder, and facilitate the alignment of the position of the heat spreader by using the surface tension of the solder.
With reference to fig. 5, the heat sink 1 and the device 3 are connected by welding, so that the thermal resistance between the two can be effectively reduced, and the heat dissipation efficiency of the heat sink 1 for dissipating heat of the device 3 can be improved. In addition, the connection between the radiator 1 and the device 3 is realized by welding, the process control difficulty can be effectively simplified, the cost is reduced, and the packaging structure 4 formed by the radiator 1 and the device 3 is simplified.
When the heat sink 1 is specifically provided to the device 3, the position of the heat sink 1 on the device 3 can be adjusted according to the portion of the device 3 for connection with the heat sink 1. Exemplarily, referring to fig. 8 and 9, the heat sink 1 is disposed at one side of the device 3 and falls within the outline of the device 3. In other embodiments, the size of the heat sink 1 may be adjusted to meet the heat dissipation requirements of the device 3. The height, width and length of the radiator 1 can be adjusted, and only one or two dimensions can be adjusted. It will be appreciated that the specific manner of adjusting the size of the heat sink 1 also depends on the constraints of the space in which it is disposed in the electronic device. Illustratively, in one possible embodiment of the present application, referring to fig. 10 and 11, the length and width of the heat spreader 1 may be adjusted, and the edge of the heat spreader 1 may be beyond the edge of the device 3 in the direction of placing the heat spreader 1 on the device 3, referring to fig. 12 as well. Therefore, the radiator 1 has a larger area of the radiating plate 1011, and the radiating performance of the radiator is further improved, so that the radiating requirement of the device 3 with higher power consumption can be met.
In other embodiments of the present invention, a plurality of heat sinks 1 may be disposed on one device 3. Referring to fig. 13, taking the example of placing two heat sinks 1 on the device 3, there may be a certain gap between the two heat sinks 1, so that besides the arched air channels 102 of the two heat sinks 1, the gap between the two heat sinks 1 may also be used as an air channel, thereby increasing the heat dissipation channels thereof. In addition, by providing two or more heat sinks 1 on the device 3, the number of the upright arms 1012 connected to the device 3 can be increased, which is advantageous for the rapid transfer of heat from the plurality of upright arms 1012 to the heat dissipating plate 1011 of the heat sink 1, and in addition, is advantageous for the increase of the heat dissipating area, thereby improving the heat dissipating efficiency.
In the embodiment shown in fig. 13 to 15, both heat sinks 1 provided on the device 3 fall within the edge range of the device 3. In other embodiments of the present application, when the space reserved for the heat sink 1 in the electronic device is large, the size of all or part of the heat sink 1 may be increased to improve the heat dissipation performance of the electronic device while two or more heat sinks 1 are disposed on the device 3. Illustratively, referring to fig. 16 to 18, in the embodiment shown in fig. 16 to 18, again taking as an example that two heat sinks 1 are provided on the device 3, when the two heat sinks 1 are provided, each have at least one edge extending beyond the edge of the device 3.
In addition to forming the package structure 4 of the heat spreader 1 and the device 3 by providing the pads 301 on the surface of the device 3 and soldering the heat spreader 1 and the pads 301 as mentioned in the above embodiments, the device 3 may comprise a substrate in other embodiments of the present application. In this embodiment, the heat sink 1 may also be directly connected to the substrate by soldering or the like to form the package structure 4. This allows the structure of the package structure 4 to be simplified, which is advantageous for achieving a miniaturized design of the package structure 4.
An embodiment of the present application provides an electronic device, which may include the package structure in any of the above embodiments, and a printed circuit board. The packaging structure is electrically connected with the printed circuit board so as to realize the functions of the packaging structure.
In the electronic device of the embodiment of the application, the packaging structure has better heat dissipation performance, so that the heat dissipation performance of the electronic device is better. In addition, the volume of the packaging structure is small, so that the electronic equipment can be favorably miniaturized and designed in a thin mode. In addition, as the packaging structure occupies a smaller space in the electronic equipment, more functional modules can be arranged in the electronic equipment, so that the electronic equipment is beneficial to integrating more functions. It can be understood that the electronic device provided in the embodiment of the present application may be, but is not limited to, a terminal device such as a smart phone, a smart television set-top box, a Personal Computer (PC), a wearable device, and an intelligent broadband; or telecommunication devices such as wireless networks, fixed networks, servers, etc., and electronic devices such as chip modules, memories, etc., which are not listed herein.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (14)
1. A heat sink, comprising: radiator body and wind channel, wherein:
the radiator body comprises a radiating plate and two or more than two vertical arms, and two adjacent vertical arms are arranged at intervals; one end of the vertical arm is fixed on the heat dissipation plate, and the other end of the vertical arm is used for being connected with a device to be dissipated and conducting heat generated by the device to the heat dissipation plate;
the air duct is used for ventilating the radiator body.
2. The heat sink as claimed in claim 1, wherein the heat sink body is a hollow structure enclosed by the heat dissipation plate and the upright arm, and a cavity of the hollow structure forms the air duct.
3. The heat sink according to claim 1 or 2, wherein the heat sink further comprises a connecting portion disposed at an end of the upright arm away from the heat dissipating plate.
4. The heat sink as claimed in claim 3, wherein the connecting portion, the heat dissipating plate and the upright arm are integrally formed, and the connecting portion is formed by bending an end of the upright arm away from the heat dissipating plate.
5. The heat sink according to claim 3 or 4, wherein the connecting portion is a pad extending from the upright arm, and the pad is soldered to a metal surface of the device to be heat-dissipated.
6. The heat sink as claimed in any one of claims 2 to 5, wherein the projection of the connecting portion on the heat dissipating plate falls within the outline of the heat dissipating plate.
7. A package structure, comprising: a device and a heat sink as claimed in any one of claims 1 to 6, the upright arms of the heat sink being fixedly connected to the device.
8. The package structure of claim 7, wherein the device has a pad, the standoffs of the heat spreader are soldered to the pad.
9. The package structure of claim 8, wherein the bonding pad is a unitary structure; or the welding pads and the vertical arms are arranged in one-to-one correspondence.
10. The package structure of claim 7, wherein the device has a substrate, and the standoffs are fixedly connected to the substrate.
11. The package structure according to any one of claims 7 to 10, wherein the device is provided with one of the heat sinks, and a projection of the heat sink on the device falls within a contour of the device; or the projection of the heat radiator on the device exceeds the outline range of the device.
12. The package structure according to any one of claims 7 to 10, wherein two or more heat sinks are disposed on the device, and two adjacent heat sinks are disposed at an interval.
13. The package structure of claim 12, wherein the projections of the heat spreader onto the device each fall within a profile of the device; or, the projection of part of the heat sink on the device falls within the outline range of the device, and at least one side of the projection of part of the heat sink on the device exceeds the outline range of the device; or at least one side of the projection of each radiator on the device exceeds the outline range of the device.
14. An electronic device, comprising: a printed circuit board, and a package structure according to any one of claims 7 to 13, wherein the package structure is electrically connected to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010556379.XA CN113809023A (en) | 2020-06-17 | 2020-06-17 | Radiator, packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010556379.XA CN113809023A (en) | 2020-06-17 | 2020-06-17 | Radiator, packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113809023A true CN113809023A (en) | 2021-12-17 |
Family
ID=78892773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010556379.XA Pending CN113809023A (en) | 2020-06-17 | 2020-06-17 | Radiator, packaging structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113809023A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1751829A1 (en) * | 1990-02-08 | 1992-07-30 | Научно-исследовательский институт полупроводникового машиностроения | Apparatus for cooling semiconducting device |
| CN101083231A (en) * | 2006-06-01 | 2007-12-05 | 美国博通公司 | Leadframe ic packages having top and bottom integrated heat spreaders |
| CN201213333Y (en) * | 2008-07-07 | 2009-03-25 | 华为技术有限公司 | Combined apparatus for heat radiating device and circuit board, and communication apparatus |
| CN201830606U (en) * | 2010-10-20 | 2011-05-11 | 康佳集团股份有限公司 | Radiating fin |
| CN204103772U (en) * | 2014-08-29 | 2015-01-14 | 深圳市安邦信电子有限公司 | A kind of mini frequency converter shell and mini frequency converter |
| CN108990362A (en) * | 2017-06-02 | 2018-12-11 | 中兴通讯股份有限公司 | A kind of radiator structure |
-
2020
- 2020-06-17 CN CN202010556379.XA patent/CN113809023A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1751829A1 (en) * | 1990-02-08 | 1992-07-30 | Научно-исследовательский институт полупроводникового машиностроения | Apparatus for cooling semiconducting device |
| CN101083231A (en) * | 2006-06-01 | 2007-12-05 | 美国博通公司 | Leadframe ic packages having top and bottom integrated heat spreaders |
| CN201213333Y (en) * | 2008-07-07 | 2009-03-25 | 华为技术有限公司 | Combined apparatus for heat radiating device and circuit board, and communication apparatus |
| CN201830606U (en) * | 2010-10-20 | 2011-05-11 | 康佳集团股份有限公司 | Radiating fin |
| CN204103772U (en) * | 2014-08-29 | 2015-01-14 | 深圳市安邦信电子有限公司 | A kind of mini frequency converter shell and mini frequency converter |
| CN108990362A (en) * | 2017-06-02 | 2018-12-11 | 中兴通讯股份有限公司 | A kind of radiator structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1632998A1 (en) | High power electronic package with enhanced cooling characteristics | |
| US6841866B2 (en) | Power semiconductor device | |
| KR100973722B1 (en) | Electronic module assembly with heat spreader | |
| JPH0846070A (en) | Integrated circuit package with diamond thermal radiator | |
| JP5446302B2 (en) | Heat sink and module | |
| US7983046B1 (en) | Electronic control module and enclosed power module | |
| CN110996491B (en) | Circuit board device and electronic equipment | |
| JP2002198477A (en) | Semiconductor device | |
| KR20080073736A (en) | Semiconductor package mounting apparatus | |
| JP2003188565A (en) | Heat dissipation structure of surface mount electronic component | |
| JP2000156439A (en) | Power semiconductor module | |
| EP1950805A1 (en) | Electronic element, package having same, and electronic device | |
| US20060274497A1 (en) | Electronic apparatus with thermal module | |
| CN112823416A (en) | Surface-mounted thermal buffer | |
| CN113809023A (en) | Radiator, packaging structure and electronic equipment | |
| JPH08274228A (en) | Semiconductor mounting board, power semiconductor device and electronic circuit device | |
| CN114709185A (en) | Power module and internal electrical connection method thereof | |
| JP2002118215A (en) | Semiconductor device | |
| CN209785918U (en) | SMD triode | |
| CN219778877U (en) | Connection structure of MOS device on printed circuit board | |
| JP2564645Y2 (en) | Hybrid integrated circuit device having heat-generating components | |
| JP6060053B2 (en) | Power semiconductor device | |
| WO2024021794A1 (en) | Circuit board and electronic device | |
| CN220753407U (en) | Power tube assembly and PCB assembly | |
| CN219106156U (en) | Semiconductor integrated module and power electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |