CN113798787B - Preparation method of all-intermetallic compound joint - Google Patents
Preparation method of all-intermetallic compound joint Download PDFInfo
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- CN113798787B CN113798787B CN202111002983.9A CN202111002983A CN113798787B CN 113798787 B CN113798787 B CN 113798787B CN 202111002983 A CN202111002983 A CN 202111002983A CN 113798787 B CN113798787 B CN 113798787B
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- soldering lug
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- 229910000765 intermetallic Inorganic materials 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 59
- 244000025254 Cannabis sativa Species 0.000 claims abstract description 39
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 claims abstract description 39
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 claims abstract description 39
- 235000009120 camo Nutrition 0.000 claims abstract description 39
- 235000005607 chanvre indien Nutrition 0.000 claims abstract description 39
- 239000011487 hemp Substances 0.000 claims abstract description 39
- 238000004804 winding Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000005096 rolling process Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims abstract description 9
- 238000005098 hot rolling Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000010992 reflux Methods 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention relates to the technical field of metal processing, in particular to a preparation method of a full intermetallic compound joint, which comprises the steps of cutting and cleaning Sn wires and Cu wires, winding the cleaned Sn wires and Cu wires into multi-core hemp threads according to a preset proportion, and winding the multi-core hemp threads again to obtain total hemp threads; heating the obtained total hemp thread to 200 ℃, carrying out hot rolling by adopting a rolling mill to ensure that the thickness of the soldering lug reaches the specified size, and then cutting the large soldering lug into small soldering lugs; the small soldering lug is tinned on the surface by adopting a chemical tinning process; coating scaling powder on two ends of the obtained small tin-plated soldering lug, placing the small tin-plated soldering lug between two Cu substrates, and refluxing for 100s at 260 ℃ to finally form full Cu 6 Sn 5 And Cu 3 The Sn joint solves the problems of low production efficiency, poor quality and small joint height of the all-intermetallic compound joint in the traditional process.
Description
Technical Field
The invention relates to the technical field of metal processing, in particular to a preparation method of an all-intermetallic compound joint.
Background
With the development of semiconductor device materials, the applications of the first generation semiconductor and the second generation semiconductor materials are limited to some extent. However, the service temperature of the third generation wide bandgap semiconductor power device can reach as high as 320 ℃ and even higher. However, the melting points of conventional Sn-based interconnect materials are all around 200 ℃ (SAC 305 melting point 217 ℃ and Sn58Bi melting point 138 ℃) and are no longer suitable as interconnect materials for third generation semiconductor power devices. At present, the nano-silver solder paste is generally adopted in the industry to replace the traditional Sn-based solder as the high-temperature interconnection material of the third-generation semiconductor power device, so that the purposes of low-temperature sintering, high-temperature service and good mechanical property are realized; the price of silver is high, the manufacturing cost of the nano silver soldering paste is higher, so that a full intermetallic compound joint made of two base metals of Cu and Sn is provided, and the manufacturing cost is reduced; sn is a low-melting-point metal, the welding temperature of Sn and Cu is low, usually below 300 ℃, but the intermetallic compound Cu generated by Sn and Cu 6 Sn 5 And Cu 3 The melting point of Sn is extremely high, and the low-temperature welding of a joint can be realizedAnd the high-temperature-resistant rubber has the effect of high-temperature use and is suitable for high-temperature service environment. Intermetallic compound Cu 6 Sn 5 And Cu 3 Sn consumes a large amount of Cu in the forming process, however, the solid solubility of Cu in Sn is low, the mass fraction of Sn-Cu eutectic point Cu is also low, and a large amount of Cu is directly added into molten Sn in the alloy preparation process to easily form bulk Cu 6 Sn 5 And the subsequent welding process of the alloy and the formation of the all-intermetallic compound joint are influenced, so that the production efficiency of the all-intermetallic compound joint is low and the quality of the all-intermetallic compound joint is poor. In addition, although the direction of transient liquid phase diffusion bonding can be used for preparing all-intermetallic compound joints, the thickness of the interlayer alloy used in the transient liquid phase diffusion bonding process is usually too thin, so that the joint height is usually only tens of micrometers.
Disclosure of Invention
The invention aims to provide a preparation method of an all-intermetallic compound joint, and aims to solve the problems of low production efficiency, poor quality and over-small joint height of the all-intermetallic compound joint in the traditional process.
In order to achieve the above object, the present invention provides a method for preparing an all-intermetallic compound joint, comprising:
cutting and cleaning Sn wires and Cu wires, winding the cleaned Sn wires and Cu wires into multi-core hemp threads according to a preset proportion, and winding the multi-core hemp threads again to obtain a total hemp thread;
heating the obtained total hemp thread in a box-type resistance furnace to 200 ℃, carrying out hot rolling by adopting a rolling mill to ensure that the thickness of the soldering lug reaches the specified size, and cutting a large soldering lug into small soldering lugs;
tin is chemically plated on the surface of the small soldering lug;
coating soldering flux on two ends of the obtained small tin-plated soldering lug, placing the small tin-plated soldering lug between two Cu substrates, and refluxing for 100s at 260 ℃ to finally form full Cu 6 Sn 5 And Cu 3 And a terminal of Sn.
The specific mode that the Sn wire and the Cu wire are cut and cleaned, the cut Sn wire and the cut Cu wire are wound into the multi-core hemp thread according to the preset proportion, and then the multi-core hemp thread is wound again to obtain the total hemp thread is as follows: cutting the Sn wire and the Cu wire; cleaning oil stains on the surfaces of the cut Sn wires and Cu wires by using absolute ethyl alcohol; cleaning the absolute ethyl alcohol on the surfaces of the cut Sn wires and Cu wires by using clear water; winding the cleaned Sn wire and the Cu wire into a multi-core hemp wire according to a preset proportion; and winding the multi-core hemp threads again to obtain the total hemp thread.
The Sn wire is a pure Sn wire, and the Cu wire is a pure Cu wire.
The preparation method of the all-intermetallic compound joint comprises the steps of cutting and cleaning Sn wires and Cu wires, winding the cleaned Sn wires and Cu wires into multi-core hemp threads according to a preset proportion, and winding the multi-core hemp threads again to obtain total hemp threads; heating the obtained total hemp thread in a box-type resistance furnace to 200 ℃, carrying out hot rolling for multiple times by adopting a rolling mill to form a large soldering lug, cutting the large soldering lug into small soldering lugs, and chemically plating tin on the surfaces of the small soldering lugs; coating soldering flux on two ends of the obtained small tin-plated soldering lug, placing the small tin-plated soldering lug between two Cu substrates, and refluxing for 100s at 260 ℃ to finally form full Cu 6 Sn 5 And Cu 3 The Sn joint solves the problems of low production efficiency and poor quality of the all-intermetallic compound joint in the traditional process.
The invention has the beneficial effects that: the soldering lug made of Sn wires and Cu wires has low cost; the Sn wire and the Cu wire are made into a twisted wire according to a proportion, so that the Cu and the Sn in the soldering lug are uniformly mixed, and holes are prevented from being formed in the prepared full intermetallic compound joint; and a rolling mill is adopted to compress the twisted wire structure, oxide layers on the surfaces of Sn and Cu are broken, so that the combination of Sn and Cu is tighter, and a full intermetallic compound joint without holes and with large height can be formed quickly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a method of making an all intermetallic joint provided by the present invention;
FIG. 2 is a detailed flowchart of S1;
FIG. 3 is a detailed flowchart of S2;
FIG. 4 is a schematic structural diagram of 2 Sn wires and 1 Cu wire;
FIG. 5 is a schematic view of the construction of the total twine;
FIG. 6 is a schematic structural diagram of a small bonding pad and a Cu substrate.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 5, the present invention provides a method for manufacturing an all-intermetallic compound joint, including:
s1, cutting and cleaning Sn wires and Cu wires, winding the cleaned Sn wires and Cu wires into multi-core hemp threads according to a preset proportion, and winding a plurality of multi-core hemp threads again to obtain a total hemp thread;
the concrete mode is as follows:
s101, cutting the Sn wire and the Cu wire;
the lengths of the Sn wires and the Cu wires obtained by cutting are 12cm.
S102, cleaning oil stains on the surfaces of the cut Sn wires and the cut Cu wires with absolute ethyl alcohol;
and oil stains are prevented from remaining on the Sn wire and the Cu wire, so that the use effect of the finally prepared all-intermetallic compound joint is influenced.
S103, cleaning the surface of the cut Sn and Cu wires with absolute ethyl alcohol by using clear water;
further increasing the cleanliness of the surfaces of the Sn and Cu wires.
S104, winding the cleaned Sn wire and the cleaned Cu wire into a multi-core hemp wire according to a preset proportion;
the preset proportion can be formed by winding 2 Sn wires and 1 Cu wire according to the proportion to form the three-core twist yarn, and can also be correspondingly adjusted according to the use requirement, wherein the Sn wires are pure Sn wires, and the Cu wires are pure Cu wires.
And S105, winding the multi-core hemp threads again to obtain the total hemp threads.
And winding 7 three-core twist yarns again to obtain the total twist yarn, wherein the diameters of the Sn yarn and the Cu yarn are both 0.3mm, and the winding number of the three-core twist yarns can be properly increased or decreased according to the diameter requirement of the total twist yarn.
S2, heating the obtained hemp cut wire to 200 ℃ in a box type resistance furnace to enable the thickness of the soldering lug to reach a specified size, and cutting the large soldering lug into small soldering lugs;
the method comprises the following steps of repeatedly carrying out hot rolling on the obtained total hemp thread by a rolling mill for multiple times to form a large soldering lug, and cutting the large soldering lug into small soldering lugs: the thickness of the large soldering lug is 300 mu m; the specification of the small soldering lug is 2mm multiplied by 0.3mm.
S3, plating tin on the surface of the small soldering lug by adopting a chemical tin plating process;
s4, coating soldering flux on two ends of the obtained small tin-plated soldering lug, placing the small tin-plated soldering lug between two Cu substrates, and refluxing for 100S at 260 ℃ to finally form full Cu 6 Sn 5 And Cu 3 And a terminal of Sn.
The small soldering lug and the Cu substrate form a' Cu/solderThe sandwich structure of the sheet/Cu' is adopted, meanwhile, in order to eliminate air holes formed in a welding joint by volatilization of soldering flux in the welding process, a vacuum reflow furnace is adopted to carry out vacuum reflow for 100s at 260 ℃, and as Cu and Sn in the soldering sheet are tightly combined and uniformly distributed in the soldering sheet under the action of hot rolling, cu and Sn quickly react to generate Cu during reflow 6 Sn 5 While being Cu 6 Sn 5 Reacts with Cu to generate Cu 3 Sn. Realizes that only Cu is formed in a very short time 6 Sn 5 And Cu 3 An all intermetallic compound joint of Sn.
Further, in step S2, the obtained twisted wire is heated to 200 ℃ in a box-type resistance furnace, so that the thickness of the soldering lug reaches a specified size, and the specific mode of cutting the large soldering lug into small soldering lugs is as follows:
s201, placing the radial surface of the twisted wire towards the output end of a rolling mill, and carrying out hot rolling on the twisted wire by the rolling mill;
compressing in the radial direction of the twine threads increases the contact area of the Sn threads and the Cu threads.
S202, when the twist wire is a large soldering lug with the thickness of 300 mu m, the output of the rolling mill is stopped;
the twist wire is hot-rolled by a rolling mill for many times, the thickness of the soldering lug is continuously reduced until the twist wire is a large soldering lug with the thickness of 300 mu m, and the Sn wire and the Cu wire are combined very tightly and mixed uniformly after the twist wire is compressed.
And S203, cutting the large soldering lug into small soldering lugs with the specification of 2mm multiplied by 0.3mm.
The thickness of the large soldering lug is not changed in the cutting process.
Compared with the traditional Sn-based solder, the soldering lug prepared by the invention has higher Cu content and uniform mixing of Cu and Sn, so that Cu and Sn react rapidly to generate Cu in the reflow process 6 Sn 5 And Cu 3 Sn (Cu atoms of the joint of the full intermetallic compound formed by the traditional Sn-based brazing filler metal are diffused from the Cu substrate), so that the requirement on the Cu atoms of the substrate when the joint of the full intermetallic compound is generated is greatly reduced, and the holes generated in the joint of the full intermetallic compound are avoided. Due to the fact thatThe requirement for substrate Cu atoms is reduced when forming the all-intermetallic joint, so that no pores are found at the interface between the intermetallic compound and the Cu substrate after the all-intermetallic joint is finally formed (in the conventional method, pores are inevitably generated at the interface between the intermetallic compound and the Cu substrate due to the migration of substrate Cu atoms).
While the above disclosure describes the preferred embodiment of the method for making the intermetallic compound joint, it is understood that the scope of the present invention is not limited thereto, and that all or a portion of the process flow for implementing the above embodiment may be understood by those skilled in the art and equivalents thereof may be made by the claims of the present invention.
Claims (3)
1. A method of making an all intermetallic joint, comprising:
cutting and cleaning Sn wires and Cu wires, winding the cleaned Sn wires and Cu wires into multi-core hemp wires according to a preset proportion, and winding the multi-core hemp wires again to obtain a total hemp wire;
heating the obtained total hemp thread to 200 ℃, carrying out hot rolling by adopting a rolling mill to ensure that the thickness of the soldering lug reaches the specified size, and cutting the large soldering lug into small soldering lugs;
the small soldering lug is tinned on the surface by adopting a chemical tinning process;
coating scaling powder on two ends of the obtained small tin-plated soldering lug, placing the small tin-plated soldering lug between two Cu substrates, and refluxing for 100s at 260 ℃ to finally form full Cu 6 Sn 5 And Cu 3 A terminal of Sn;
heating the obtained total hemp thread to 200 ℃, carrying out hot rolling by adopting a rolling mill to ensure that the thickness of the soldering lug reaches the specified size, and cutting the large soldering lug into small soldering lugs by the specific mode:
placing the radial surface of the total hemp thread line towards the output end of a rolling mill, and carrying out hot rolling on the total hemp thread line by the rolling mill;
when the total twist wire is a large soldering lug with the thickness of 300 mu m, the output of the rolling mill is stopped;
the large solder fillet is cut into small solder fillets with the specification of 2mm multiplied by 0.3mm.
2. The method of producing an all-intermetallic compound joint according to claim 1,
the specific mode of cutting and cleaning the Sn wires and the Cu wires, winding the cleaned Sn wires and the Cu wires into the multi-core hemp threads according to the preset proportion, and winding the multi-core hemp threads again to obtain the total hemp threads is as follows: cutting the Sn wire and the Cu wire; cleaning oil stains on the surfaces of the cut Sn wires and Cu wires by using absolute ethyl alcohol; cleaning the absolute ethyl alcohol on the surfaces of the cut Sn wires and Cu wires by using clear water; winding the cleaned Sn wire and the Cu wire into a multi-core hemp wire according to a preset proportion; and winding the multi-core hemp threads again to obtain the total hemp thread.
3. The method of producing an all-intermetallic compound joint according to claim 2,
the Sn wire is a pure Sn wire, and the Cu wire is a pure Cu wire.
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| CN202111002983.9A CN113798787B (en) | 2021-08-30 | 2021-08-30 | Preparation method of all-intermetallic compound joint |
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| CN113798787B true CN113798787B (en) | 2022-11-15 |
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Application publication date: 20211217 Assignee: Guilin Qunmei Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2023980044664 Denomination of invention: A preparation method for all metal intermetallic compound joints Granted publication date: 20221115 License type: Common License Record date: 20231031 |
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