CN100389215C - Multi-element alloy copper-base brazing filler material - Google Patents
Multi-element alloy copper-base brazing filler material Download PDFInfo
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- CN100389215C CN100389215C CNB2005100618236A CN200510061823A CN100389215C CN 100389215 C CN100389215 C CN 100389215C CN B2005100618236 A CNB2005100618236 A CN B2005100618236A CN 200510061823 A CN200510061823 A CN 200510061823A CN 100389215 C CN100389215 C CN 100389215C
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- copper
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- 238000005219 brazing Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 title claims description 13
- 229910001325 element alloy Inorganic materials 0.000 title claims description 11
- 239000000945 filler Substances 0.000 title claims description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 12
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011574 phosphorus Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 29
- 229910045601 alloy Inorganic materials 0.000 abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 14
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 abstract description 3
- 238000009472 formulation Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000010970 precious metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000005275 alloying Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 241000784732 Lycaena phlaeas Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The present invention relates to a multielement alloy copper-base solder. The formulation of the present invention comprises copper, argentum, phosphorus and antimony; the components has the contents of 1.5% to 4.0% of argentum, 5.8% to 7.8% of phosphorus, 0.1% to 1.0% of antimony, and residual copper and unavoidable impurities. The present invention has the advantages of low price, high joint mechanical strength after the joint is soldered with a copper alloy, good spreadability, low fluid welding ratio, good technological property, smooth surface, stable quality, good consistency, capability of replacing BAg40CuZnSn of noble metal silver solder and capability of fully filling welding seam gaps.
Description
Technical field
The present invention relates to a kind of multi-element alloy copper-base brazing filler material, it is applicable to the soldering of copper and copper alloy device.
Background technology
At present, in intermediate temperature solder, silver solder BAg40CuZnSn and common copper base solder (Cu, P, Ag) salient features and use as follows:
Silver solder BAg40CuZnSn consists of:
Common copper base solder (Cu, P, Ag) consists of:
Contain precious metal silver solder BAg40CuZnSn and be widely used in industries such as refrigeration, motor, machinery, electrical equipment, instrument, valve pipe fitting.Every performance index all reach higher level, but this silver solder need be used precious metal silver about 40%, because present industrial development, resources and energy consumption is increasing.Various raw metals are more and more rare, cost an arm and a leg, and especially precious metal silver brings huge cost pressure for manufacturer and client.
Though and common copper base solder price is low, in the brazing process of copper and copper alloy device, because of the too late silver solder of its characteristic parameter, so can't replace silver solder BAg40CuZnSn.
Summary of the invention
Technical problem to be solved by this invention provide a kind of price low, with the copper alloy soldering after joint mechanical intensity height, spreadability is good, the fluid welding rate is low, processing performance is good, any surface finish, steady quality, high conformity, can replace precious metal silver solder BAg40CuZnSn, can fully fill up the multi-element alloy copper-base brazing filler material of joint gap.
It is this multi-element alloy copper-base brazing filler material that the present invention solves the problems of the technologies described above the technical scheme that is adopted, comprise copper, silver and phosphorus in the prescription, its prescription characteristics are: also comprise antimony in prescription, each components contents is: silver: 1.5%-4.0%, phosphorus: 5.8%-7.8%, antimony: 0.1%-1.0%, surplus is copper and unavoidable impurities.
Also contain nickel in the prescription of the present invention, the content of nickel is 0.01%-0.1%.
The present invention compares with prior art and has the following advantages and effect: 1, the precious metal silver that contains of multi-element alloy copper-base brazing filler material of the present invention is few, reduces silver content about 35% than silver solder BAg40CuZnSn, greatly reduces Costco Wholesale, has saved resource.2, with the copper alloy device soldering after joint mechanical intensity height, low, any surface finish of fluid welding rate.Reflection soldering processes performance is good after the client uses, steady quality, and high conformity can fully fill up the joint gap.Parameter, characteristic, technological standard require with precious metal silver solder BAg40CuZnSn basic identical, can replace silver solder BAg40CuZnSn, and partial parameters, performance requriements also are higher than silver solder.3, the extraordinary multi-element alloy copper-base brazing filler material from the made external diameter 9.4mm silk footpath Φ 1.1mm of the present invention is an example, the made external diameter 9.4mm silk of desirable silver-substituted solder BAg40CuZnSn directly is the weld-ring of Φ 1.2mm, not only on filling a prescription, reduced production cost greatly, and because of the silk footpath of extraordinary multi-element alloy copper-base brazing filler material than the little 0.1mm in silver solder BAg40CuZnSn silk footpath, reduced the consumption of solder.In addition, extraordinary multi-element alloy copper-base brazing filler material joint surface when soldering is brighter than silver solder BAg40CuZnSn, more attractive in appearance.
Embodiment
Embodiment 1:
By the alloying constituent batching, the weight percent of alloy consists of: Ag:2%P:7.1%Sb:0.2%Ni:0.02%, surplus is copper and unavoidable impurities, and the alloy that makes is processed into
1.2 the silk material.With ordinary method copper brazing alloy mother metal, good, the casual good fluidity of its wettability on mother metal, tensile strength reach 450MPa, and wetting angle is at 8 °～10 °.
Embodiment 2:
By the alloying constituent batching, the weight percent of alloy consists of: Ag:3%P:7.2%Sb:0.6%Ni:0.08%, surplus is copper and unavoidable impurities, and the alloy that makes is processed into
2.0 bar.With ordinary method copper brazing alloy mother metal, good, the casual good fluidity of its wettability on mother metal, tensile strength reach 465MPa, and wetting angle is at 7 °～9 °.
Embodiment 3:
By the alloying constituent batching, the weight percent of alloy consists of: Ag:3.5%P:7.5%Sb:1.0%Ni:0.1%, surplus is copper and unavoidable impurities, the alloy that makes is processed into external diameter be
12.8 the silk footpath is
1.2 weld-ring.With ordinary method copper brazing alloy mother metal, good, the casual good fluidity of its wettability on mother metal, tensile strength reach 480MPa, and wetting angle is at 6 °～9 °.
Embodiment 4:
By the alloying constituent batching, the weight percent of alloy consists of: Ag:1.5%P:5.8%Sb:0.5%Ni:0.03%, surplus is copper and unavoidable impurities, and the alloy that makes is processed into
1.0 the silk material, with ordinary method copper brazing alloy mother metal, its wettability on mother metal is good, overflow good fluidity, tensile strength reaches 445MPa, wetting angle is at 9 °～11 °.
From above embodiment as can be seen, in solder, add an amount of antimony and can make solder be difficult for oxidation and good corrosion resistance, can improve wettability and the spreadability of solder when the mother metal soldering, can fully fill up the joint gap.Add an amount of nickel and can improve intensity and thermotolerance when increasing temperature, and the impelling strength when dynamic load, and matchmaker's Jie effect in the middle of solder alloy plays, further improved the soldering processes performance of solder.
Finished product processing performance of the present invention is good, steady quality, and high conformity can fully fill up the joint gap.Parameter, characteristic, technological standard require with precious metal silver solder BAg40CuZnSn basic identical, can replace silver solder BAg40CuZnSn, partial parameters, performance index even also be higher than silver solder.
The present invention can be China and saves a large amount of precious metal silver, has greatly reduced production cost, and price is low, is subjected to numerous clients' welcome deeply, will obtain good economic benefit and social benefit.
Chemical ingredients prescription of the present invention and temperature of fusion are:
Claims (2)
1. a multi-element alloy copper-base brazing filler material comprises copper, silver and phosphorus in the prescription, it is characterized in that: also include antimony in prescription, each components contents is: silver: 1.5%-4.0%, phosphorus: 5.8%-7.8%, antimony: 0.1%-1.0%, surplus is copper and unavoidable impurities.
2. multi-element alloy copper-base brazing filler material according to claim 1 is characterized in that: also be added with nickel in the described prescription, the content of nickel is 0.01%-0.1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100618236A CN100389215C (en) | 2005-12-05 | 2005-12-05 | Multi-element alloy copper-base brazing filler material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100618236A CN100389215C (en) | 2005-12-05 | 2005-12-05 | Multi-element alloy copper-base brazing filler material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1775978A CN1775978A (en) | 2006-05-24 |
| CN100389215C true CN100389215C (en) | 2008-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100618236A Active CN100389215C (en) | 2005-12-05 | 2005-12-05 | Multi-element alloy copper-base brazing filler material |
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| Country | Link |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101347871B (en) * | 2007-07-17 | 2011-11-16 | 上海电气集团上海电机厂有限公司 | Use of low-silver solder in technique for brazing end ring and guide strip of electric machine rotor |
| CN102554501A (en) * | 2010-12-31 | 2012-07-11 | 北京有色金属与稀土应用研究所 | Copper-phosphorus-silver alloyed brazing wire and preparation method thereof |
| CN109865960B (en) * | 2019-03-05 | 2021-11-02 | 苏州昆腾威新材料科技有限公司 | Thixotropic alloy and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1039986A (en) * | 1989-04-08 | 1990-02-28 | 浙江大学材料制造厂 | A kind of copper-based polybasic alloy soldering materials |
| CN1055882C (en) * | 1997-12-12 | 2000-08-30 | 北京有色金属研究总院 | High-temp solder alloy powder for welding stain-less steel container and its preparation process |
| CN1490123A (en) * | 2003-08-08 | 2004-04-21 | 西北有色金属研究院 | Copper based multi-element alloy manual electrodes with low content silver |
| CN1178761C (en) * | 2002-08-29 | 2004-12-08 | 胡仁良 | Braze filler metal copper base alloy powder for diamond braze welding and its preparation method |
-
2005
- 2005-12-05 CN CNB2005100618236A patent/CN100389215C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1039986A (en) * | 1989-04-08 | 1990-02-28 | 浙江大学材料制造厂 | A kind of copper-based polybasic alloy soldering materials |
| CN1055882C (en) * | 1997-12-12 | 2000-08-30 | 北京有色金属研究总院 | High-temp solder alloy powder for welding stain-less steel container and its preparation process |
| CN1178761C (en) * | 2002-08-29 | 2004-12-08 | 胡仁良 | Braze filler metal copper base alloy powder for diamond braze welding and its preparation method |
| CN1490123A (en) * | 2003-08-08 | 2004-04-21 | 西北有色金属研究院 | Copper based multi-element alloy manual electrodes with low content silver |
Non-Patent Citations (2)
| Title |
|---|
| 新型专用低银钎料的研究. 庄祥禄，李德刚，李培祖.焊接技术，第2期. 1999 |
| 新型专用低银钎料的研究. 庄祥禄，李德刚，李培祖.焊接技术，第2期. 1999 * |
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| CN1775978A (en) | 2006-05-24 |
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Application publication date: 20060524 Assignee: Hangzhou Huaguang Welding Materials Co., Ltd. Assignor: Jin Limei| Wang Xiaorong Contract record no.: 2010330000465 Denomination of invention: Multi-element alloy copper-base brazing filler material Granted publication date: 20080521 License type: Exclusive License Record date: 20100412 |
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Denomination of invention: Multi-element alloy copper-base brazing filler material Effective date of registration: 20110805 Granted publication date: 20080521 Pledgee: Societe Generale Bank, Limited by Share Ltd, Hangzhou branch Pledgor: Hangzhou Huaguang Advanced Welding Materials Co., Ltd. Registration number: 2011990000299 |
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