CN1039986A - A kind of copper-based polybasic alloy soldering materials - Google Patents
A kind of copper-based polybasic alloy soldering materials Download PDFInfo
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- CN1039986A CN1039986A CN 89102186 CN89102186A CN1039986A CN 1039986 A CN1039986 A CN 1039986A CN 89102186 CN89102186 CN 89102186 CN 89102186 A CN89102186 A CN 89102186A CN 1039986 A CN1039986 A CN 1039986A
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- copper
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- soldering materials
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- alloy soldering
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Abstract
Copper-based polybasic alloy soldering materials of the present invention begins at present in the soldering of lattice base, successfully substitutes ag-cu solder, and it can be for country saves the silver consumption, and its cost only reaches below 1/3rd of ag-cu solder.This copper-based polybasic alloy soldering materials contains (by weight): 6～7%Sn, 4～6%Zn, 0.2～0.4%P, 0.1～0.15% rare earth element; The preferential composition of selecting is: 6.5%Sn, 5%Zn, 0.3%P, 0.12% rare earth element.
Description
The invention belongs to copper-based polybasic alloy soldering materials, be applicable to that mother metal is the soldering of part in addition of copper and steel, cast iron.
The yellow gold solder is adopted in the soldering of the base of transistor usually, as the material 308(First Machinery Industry Department trade mark), press the alloy ingredient weight percent, contain Ag72%, Cu28%; Material 305 contains Ag50%, Cu50%; The minimum yellow gold solder of silver content is a material 301 at present, contains Ag10%, Cu53%, Zn37%.This class solder is again the direct state distribution material owing to silver, cost an arm and a leg.And existing not argentiferous copper-phosphorus brazing alloy, because the higher and processing difficulties of resistivity; Copper-zinc solder then because to contain Volatile Elements many and physical strength is on the low side, all is difficult to substitute ag-cu solder.
About copper-based filler metal, in the solder standard that American Welding Society (AWS) (AWS) formulates, show copper base solder, copper-zinc solder and copper-phosphorus brazing alloy.Such sorting technique is general substantially in the world.In the scolder trade mark preparation method that Ministry of Metallurgical Industry and First Machinery Industry Department work out respectively in China, show copper-zinc solder and copper-phosphorus brazing alloy.
Purpose of the present invention is to make a kind of physical strength height, and electrical property and engaging force can reach the multicomponent alloy solder by copper, tin, phosphorus, zinc and rare earth element combination of soldering processes requirement, in order to substitute ag-cu solder.
Copper-based polybasic alloy soldering materials provided by the invention contains (by weight): 6～7%Sn, 4～6%Zn, 0.2～0.4%P, 0.1～0.15% rare earth element.The preferential selection: 6.5%Sn, 5%Zn, 0.3%P, 0.12% rare earth element.948 ℃ of this solder fusing points, resistivity＜0.129 Ω mm
2/ M.
Solder of the present invention has the following advantages:
1. this solder has higher physical strength.Tensile strength when rolling thickness is 0.20mm, σ b:40～43kgf/mm
2Reach or a little more than the physical strength of ag-cu solder.Be enough to guarantee the requirement of strength of weld seam.
2. this solder has good plasticity.Unit elongation when rolling thickness is 0.20mm, δ %:37～42%.Can be processed into thickness is the strip material of 0.11～0.12mm, adapts to the brazing filler metal processing requirement of those play movement＜0.13mm.
3. this solder is compared with ag-cu solder, and price only reaches below 1/3rd of the latter, can bring than the large economy benefit for enterprise, and social benefit is bigger, can save the use of silver.
Embodiment:
The present invention is a raw material with electrolytic copper, a tin, No. two zinc, phosphor bronze alloys, and rare-earth element cerium (Ce) is an additive.The preferential composition of alloy (by weight) is: 6.5%Sn, and 5%Zn, 0.3%P, 0.12%Ce, surplus is a copper.Be smelted into ingot casting by this prescription in intermediate frequency (IF) smelting stove or globars electric furnace, take the technology of split rolling method-homogenizing annealing-roughing-process annealing-finish rolling then, being processed into thickness is the solder band of 0.11～0.12mm.Also can be processed into the solder of other shapes and specification according to this.
Claims (3)
1, a kind of copper-based polybasic alloy soldering materials, its feature (by weight) contains 6～7%Sn, 4～6%Zn, 0.2～0.4%P, 0.1～0.15% rare earth element.
2, copper-based polybasic alloy soldering materials according to claim 1 is characterized in that containing (by weight) 6.5%Sn, 5%Zn, 0.3%P, 0.12% rare earth element.
3, copper-based polybasic alloy soldering materials according to claim 1 and 2 is characterized in that rare earth element is a cerium, is additive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102186 CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102186 CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1039986A true CN1039986A (en) | 1990-02-28 |
| CN1010754B CN1010754B (en) | 1990-12-12 |
Family
ID=4854574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89102186 Expired CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1010754B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055882C (en) * | 1997-12-12 | 2000-08-30 | 北京有色金属研究总院 | High-temp solder alloy powder for welding stain-less steel container and its preparation process |
| CN1055883C (en) * | 1997-12-22 | 2000-08-30 | 北京有色金属研究总院 | High-smelting point and low-vapor pressure solder alloy powder for soldering stain-less steel container and its preparation |
| CN1108896C (en) * | 1998-07-01 | 2003-05-21 | 洪若锋 | Special crystalline soldering flux and its manufacture method |
| CN100389215C (en) * | 2005-12-05 | 2008-05-21 | 金李梅 | Multi-element alloy copper-base brazing filler material |
| CN101554687B (en) * | 2009-05-21 | 2011-01-05 | 浙江新锐焊接材料有限公司 | Novel middle-temperature aluminum cored solder wire |
| CN101664864B (en) * | 2009-09-24 | 2011-08-03 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
| CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
| CN103801855A (en) * | 2013-12-02 | 2014-05-21 | 青岛蓝图文化传播有限公司市南分公司 | Novel silver-free copper solder |
| CN114952078A (en) * | 2022-05-25 | 2022-08-30 | 浙江亚通焊材有限公司 | Preparation method of copper-based solder for brazing stainless steel and red copper and copper-based solder |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2843059B1 (en) * | 2002-07-30 | 2005-02-25 | Air Liquide | BRASED COPPER THERMAL EXCHANGERS AND PROCESS FOR THE MANUFACTURE THEREOF |
-
1989
- 1989-04-08 CN CN 89102186 patent/CN1010754B/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055882C (en) * | 1997-12-12 | 2000-08-30 | 北京有色金属研究总院 | High-temp solder alloy powder for welding stain-less steel container and its preparation process |
| CN1055883C (en) * | 1997-12-22 | 2000-08-30 | 北京有色金属研究总院 | High-smelting point and low-vapor pressure solder alloy powder for soldering stain-less steel container and its preparation |
| CN1108896C (en) * | 1998-07-01 | 2003-05-21 | 洪若锋 | Special crystalline soldering flux and its manufacture method |
| CN100389215C (en) * | 2005-12-05 | 2008-05-21 | 金李梅 | Multi-element alloy copper-base brazing filler material |
| CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
| CN101554687B (en) * | 2009-05-21 | 2011-01-05 | 浙江新锐焊接材料有限公司 | Novel middle-temperature aluminum cored solder wire |
| CN101664864B (en) * | 2009-09-24 | 2011-08-03 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
| CN103801855A (en) * | 2013-12-02 | 2014-05-21 | 青岛蓝图文化传播有限公司市南分公司 | Novel silver-free copper solder |
| CN114952078A (en) * | 2022-05-25 | 2022-08-30 | 浙江亚通焊材有限公司 | Preparation method of copper-based solder for brazing stainless steel and red copper and copper-based solder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1010754B (en) | 1990-12-12 |
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