CN103801855A - Novel silver-free copper solder - Google Patents
Novel silver-free copper solder Download PDFInfo
- Publication number
- CN103801855A CN103801855A CN201310630662.2A CN201310630662A CN103801855A CN 103801855 A CN103801855 A CN 103801855A CN 201310630662 A CN201310630662 A CN 201310630662A CN 103801855 A CN103801855 A CN 103801855A
- Authority
- CN
- China
- Prior art keywords
- solder
- copper
- brazing
- low
- novel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to brazing solder, particularly to novel silver-free copper solder. The solder comprises the components as follows: Cu, Sn, P and Zn. The solder is low in melting temperature, good in flowability, good in wettability and spreadability, better in mechanical property, reliable in quality, not high in price, thin and firm in welding joint, capable of being applied to brazing of most of copper alloys such as copper, bronze, low brass and the like in cooperation with silver soldering flux, excellent in property and low in cost.
Description
Technical field
The present invention relates to a kind of brazing solder, especially a kind of novel without ag-cu solder.
Background technology
Being of wide application of copper solder brazing technology, can produce for passenger vehicle, the radiator of truck and engineering machinery, warm-air drier, oil cooler, charge air cooler, condenser and evaporimeter etc., especially the application of EGR (EGR) technology on engine in recent years can make whole automobile cooling system change, to the resistance to elevated temperatures of heat exchanger, the requirement of heat dispersion and intensity also significantly improves thereupon, red copper/brazed copper heat exchangers of using the hard pin welding technology of copper to manufacture has now just had the stage of showing one's capabilities, so copper base hard solder just becomes the indispensable brazing material of copper solder brazing.
Summary of the invention
The present invention is intended to address the above problem, and provides a kind of novel without ag-cu solder, and its fusion temperature is lower, and wettability is better, and good fluidity is a kind of desirable copper base solder brazing solder, and its technical scheme adopting is as follows:
A kind of novel without ag-cu solder, it is characterized in that, described comprises without ag-cu solder constituent: Cu, Sn, P, Zn, its each composition by weight percentage (unit: wt%) is followed successively by: Sn 4.5-5.5, P 5.5-7.0, Zn 2.0-3.0, Cu surplus; Described solder fusion temperature is 600～660 ℃, belongs to copper solder brazing low temperature hard solder; Described Sn can reduce the fusing point of Cu, improves the mobility of solder; Described Zn can form solid solution at the edge of crystal grain, and the solid solution forming between solder and mother metal is combined, thereby improves the ability to function of solder and copper, reduces solder fusing point; Described P can be combined with Cu solid solution, improves the intensity of weld seam.
Tool of the present invention has the following advantages: its fusion temperature is low, good fluidity, there is good wetting and spreading property, mechanical property is also better, reliable in quality, price is not high yet, and weld seam is thin, firm, coordinate silver-colored brazing flux can brazed copper, most of copper alloys such as bronze and low brass, be a kind of function admirable, with low cost novel without ag-cu solder.
The specific embodiment
Below in conjunction with example, the invention will be further described:
A kind of novel without ag-cu solder, it is characterized in that, described comprises without ag-cu solder constituent: Cu, Sn, P, Zn, its each composition by weight percentage (unit: wt%) is followed successively by: Sn 4.5-5.5, P 5.5-7.0, Zn 2.0-3.0, Cu surplus; Described solder fusion temperature is 600～660 ℃, belongs to copper solder brazing low temperature hard solder; Described Sn can reduce the fusing point of Cu, improves the mobility of solder; Described Zn can form solid solution at the edge of crystal grain, and the solid solution forming between solder and mother metal is combined, thereby improves the ability to function of solder and copper, reduces solder fusing point; Described P can be combined with Cu solid solution, improves the intensity of weld seam.
Describe the present invention with way of example above, but the invention is not restricted to above-mentioned specific embodiment, all any changes of doing based on the present invention or modification all belong to the scope of protection of present invention.
Claims (2)
1. novel without an ag-cu solder, it is characterized in that, described comprises without ag-cu solder constituent: Cu, Sn, P, Zn, its each composition by weight percentage (unit: wt%) is followed successively by: Sn 4.5-5.5, P 5.5-7.0, Zn 2.0-3.0, Cu surplus.
2. a kind of copper radiator soldering tin-lead solder according to claim 1, is characterized in that: described solder fusion temperature is 600～660 ℃, belongs to copper solder brazing low temperature hard solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630662.2A CN103801855A (en) | 2013-12-02 | 2013-12-02 | Novel silver-free copper solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630662.2A CN103801855A (en) | 2013-12-02 | 2013-12-02 | Novel silver-free copper solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103801855A true CN103801855A (en) | 2014-05-21 |
Family
ID=50699496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310630662.2A Pending CN103801855A (en) | 2013-12-02 | 2013-12-02 | Novel silver-free copper solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103801855A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104353939A (en) * | 2014-11-17 | 2015-02-18 | 安徽瑞研新材料技术研究院有限公司 | Novel lead-free copper alloy new material and processing technology thereof |
| CN106498228A (en) * | 2016-10-11 | 2017-03-15 | 何国良 | Preparation method and new material of a kind of high conductivity without yellow gold |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575836A (en) * | 1980-06-16 | 1982-01-12 | Nippon Mining Co Ltd | High strength copper alloy having excellent heat resistance for use as conductive material |
| CN1039986A (en) * | 1989-04-08 | 1990-02-28 | 浙江大学材料制造厂 | A kind of copper-based polybasic alloy soldering materials |
| US4935076A (en) * | 1988-05-11 | 1990-06-19 | Mitsui Mining & Smelting Co., Ltd. | Copper alloy for use as material of heat exchanger |
| WO2005014870A1 (en) * | 2003-08-04 | 2005-02-17 | Vacuumschmelze Gmbh & Co. Kg | Brazing solder alloy based on copper and method for brazing |
-
2013
- 2013-12-02 CN CN201310630662.2A patent/CN103801855A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575836A (en) * | 1980-06-16 | 1982-01-12 | Nippon Mining Co Ltd | High strength copper alloy having excellent heat resistance for use as conductive material |
| US4935076A (en) * | 1988-05-11 | 1990-06-19 | Mitsui Mining & Smelting Co., Ltd. | Copper alloy for use as material of heat exchanger |
| CN1039986A (en) * | 1989-04-08 | 1990-02-28 | 浙江大学材料制造厂 | A kind of copper-based polybasic alloy soldering materials |
| WO2005014870A1 (en) * | 2003-08-04 | 2005-02-17 | Vacuumschmelze Gmbh & Co. Kg | Brazing solder alloy based on copper and method for brazing |
Non-Patent Citations (1)
| Title |
|---|
| 谭敦吉等: "Cu-Zn-P-Sn钎焊合金研究", 《湖南冶金》, no. 5, 30 September 1988 (1988-09-30) * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104353939A (en) * | 2014-11-17 | 2015-02-18 | 安徽瑞研新材料技术研究院有限公司 | Novel lead-free copper alloy new material and processing technology thereof |
| CN106498228A (en) * | 2016-10-11 | 2017-03-15 | 何国良 | Preparation method and new material of a kind of high conductivity without yellow gold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140521 |