CN103785966A - Aluminum and silicon-based brazing filler metal - Google Patents
Aluminum and silicon-based brazing filler metal Download PDFInfo
- Publication number
- CN103785966A CN103785966A CN201310630616.2A CN201310630616A CN103785966A CN 103785966 A CN103785966 A CN 103785966A CN 201310630616 A CN201310630616 A CN 201310630616A CN 103785966 A CN103785966 A CN 103785966A
- Authority
- CN
- China
- Prior art keywords
- solder
- filler metal
- brazing filler
- silicon
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
- B23K35/288—Al as the principal constituent with Sn or Zn
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention relates to brazing filler metal, in particular to aluminum and silicon-based brazing filler metal. The aluminum and silicon-based brazing filler metal comprises Al, Si, Cu, Zn and Mn. The aluminum and silicon-based brazing filler metal has the advantages of low melting temperature, excellent wettability, flowability, plating property, machinability and performance, low manufacturing cost, high welded joint strength, corrosion resistance and cost performance and good toughness.
Description
Technical field
The present invention relates to a kind of brazing solder, the silica-based solder of especially a kind of aluminium.
Background technology
Al-Si brazing filler metal is that braze ability and mother metal color consistency, plating and corrosion resistance are all splendid, particularly this brazing filler metal processing of can going bad, greatly increase toughness and the buckling performance of solder and weld seam, in addition with low cost, be therefore widely used.But the liquidus curve of this brazing filler metal is 577 ℃ of left and right, and aluminium alloy solidus approaches mostly, can not realize the soldering lower than the aluminium alloy of 610 ℃ of left and right to burning temperature.
Summary of the invention
The present invention is intended to address the above problem, and provides a kind of aluminium silica-based solder, and it has increased copper, zinc, manganese element on the basis of the simple silica-based solder of aluminium, has overcome the silica-based solder fusion temperature of conventional aluminium high, the drawback that intensity is low, and its technical scheme adopting is as follows:
The silica-based solder of a kind of aluminium, is characterized in that, the each composition of described solder by weight percentage (unit: wt%) is followed successively by: Si3.5, Cu20, Zn25, Mn0.3, and surplus is Al; Its fusion temperature is 480～500 ℃, belongs to aluminium soldering high temperature hard solder; Described Si can reduce the fusing point of Al, improves the intensity of weld seam, and because Si can do rotten processing, thereby making the good toughness of weld seam, buckling performance is stronger; Described Cu can reduce the fusing point of Al, improves the mobility of solder, and Cu can form solid solution with Al, thereby makes alloy obtain solution strengthening, improves the intensity of weld seam; Described Zn can form Al-Zn solid solution at the edge of crystal grain, and the solid solution forming between solder and mother metal is combined, thereby improves the ability to function of solder and aluminium, reduces solder fusing point; Described Mn can reduce the temperature of solder, improves spreadability, improves the intensity of solder.
Tool of the present invention has the following advantages: fusion temperature is low, there is good wetability, mobility, plating and machinability, cheap for manufacturing cost, and strength of welded joint is high, good toughness, corrosion resistance are strong, is the silica-based solder of a kind of aluminium functional, that cost performance is high.
The specific embodiment
Below in conjunction with example, the invention will be further described:
The silica-based solder of a kind of aluminium, is characterized in that, the each composition of described solder by weight percentage (unit: wt%) is followed successively by: Si3.5, Cu20, Zn25, Mn0.3, and surplus is Al; Its fusion temperature is 480～500 ℃, belongs to aluminium soldering high temperature hard solder; Described Si can reduce the fusing point of Al, improves the intensity of weld seam, and because Si can do rotten processing, thereby making the good toughness of weld seam, buckling performance is stronger; Described Cu can reduce the fusing point of Al, improves the mobility of solder, and Cu can form solid solution with Al, thereby makes alloy obtain solution strengthening, improves the intensity of weld seam; Described Zn can form Al-Zn solid solution at the edge of crystal grain, and the solid solution forming between solder and mother metal is combined, thereby improves the ability to function of solder and aluminium, reduces solder fusing point; Described Mn can reduce the temperature of solder, improves spreadability, improves the intensity of solder.
Describe the present invention with way of example above, but the invention is not restricted to above-mentioned specific embodiment, all any changes of doing based on the present invention or modification all belong to the scope of protection of present invention.
Claims (2)
1. the silica-based solder of aluminium, is characterized in that, the each composition of described solder by weight percentage (unit: wt%) is followed successively by: Si3.5, Cu20, Zn25, Mn0.3, surplus is Al.
2. the silica-based solder of a kind of aluminium according to claim 1, is characterized in that: described solder fusion temperature is 480～500 ℃, belongs to aluminium soldering high temperature hard solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630616.2A CN103785966A (en) | 2013-12-02 | 2013-12-02 | Aluminum and silicon-based brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630616.2A CN103785966A (en) | 2013-12-02 | 2013-12-02 | Aluminum and silicon-based brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103785966A true CN103785966A (en) | 2014-05-14 |
Family
ID=50662249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310630616.2A Pending CN103785966A (en) | 2013-12-02 | 2013-12-02 | Aluminum and silicon-based brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103785966A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181112A (en) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | A kind of high-performance zinc-aluminium base composite soldering and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09327788A (en) * | 1996-06-13 | 1997-12-22 | Showa Alum Corp | Aluminum brazing filler metal containing flux |
| US20020127135A1 (en) * | 2000-03-10 | 2002-09-12 | Nobuaki Ohara | Method for brazing aluminum alloy-assembled articles within a short period of time and a filler alloy usable at low temperature |
| CN1726114A (en) * | 2002-12-12 | 2006-01-25 | 昭和电工株式会社 | Aluminum alloy brazing material, brazing member, brazed article and brazinh method therefor using said material, brazing heat exchanging tube, heat exchanger and manufacturing method thereof using sai |
| CN1970213A (en) * | 2006-12-30 | 2007-05-30 | 中国航空工业第一集团公司北京航空材料研究院 | Aluminum alloy intermediate temperature solder for braze welding |
| CN101264538A (en) * | 2008-01-25 | 2008-09-17 | 东南大学 | Welding shaping method for foamed aluminium board |
-
2013
- 2013-12-02 CN CN201310630616.2A patent/CN103785966A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09327788A (en) * | 1996-06-13 | 1997-12-22 | Showa Alum Corp | Aluminum brazing filler metal containing flux |
| US20020127135A1 (en) * | 2000-03-10 | 2002-09-12 | Nobuaki Ohara | Method for brazing aluminum alloy-assembled articles within a short period of time and a filler alloy usable at low temperature |
| CN1726114A (en) * | 2002-12-12 | 2006-01-25 | 昭和电工株式会社 | Aluminum alloy brazing material, brazing member, brazed article and brazinh method therefor using said material, brazing heat exchanging tube, heat exchanger and manufacturing method thereof using sai |
| CN1970213A (en) * | 2006-12-30 | 2007-05-30 | 中国航空工业第一集团公司北京航空材料研究院 | Aluminum alloy intermediate temperature solder for braze welding |
| CN101264538A (en) * | 2008-01-25 | 2008-09-17 | 东南大学 | Welding shaping method for foamed aluminium board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181112A (en) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | A kind of high-performance zinc-aluminium base composite soldering and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |