CN113798152A - 用于具有可熔且沾锡链接物的设备的薄膜涂层封装 - Google Patents
用于具有可熔且沾锡链接物的设备的薄膜涂层封装 Download PDFInfo
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Abstract
公开了用于具有可熔且沾锡链接物的设备的薄膜涂层封装，以及一种用于为具有可熔元件的设备形成介电薄膜涂层的方法。该方法包括将不溶性聚合物和可溶性聚合物以固体形式混合，并将混合物暴露在高温下以形成熔化混合物。然后将熔化混合物溶解在溶剂中以形成悬浊液，然后该悬浊液可以作为薄膜涂层沉积在设备上，以形成内部绝缘层或外部表面。
Description
技术领域
本发明总体上涉及电路保护设备领域，并且特别涉及保险丝、热保护金属氧化物压敏电阻(TMOV)和热切断设备(TCO)。
背景技术
保险丝和TMOV是众所周知的电路保护设备，它们通常安装在电源和电路中需要保护的组件之间。诸如保险丝和TMOV的设备具有可熔链接物，其在过电流或过电压条件下会熔化。此类设备可以是低剖面的或基于晶圆的设备，并且可以覆盖有适合退锡(de-wetting)的介电涂层。然而，目前这种设备的封装由于其相对厚度而难以沉积。因此，目前的介电涂层是昂贵的，并且难以在50μm以下的规模上沉积。
理想情况下，可熔链接物的涂层应满足三个标准。首先，涂层应具有介电特性。特别是，涂层应起到作为绝缘体的作用。第二，涂层应该能够覆盖可熔链接物，同时一旦链接物达到其熔化温度时不限制可熔链接物流动。目前的一些涂层可能会在可熔链接物达到其熔化温度后将链接物保持在适当的位置，从而限制电路断开。第三，覆盖物在溶液阶段时应能够进行沉积，以形成50μm或更小规模的涂层。
目前涂覆这些设备的方法不能满足所有三个标准。例如，当一些聚合物(硅聚酯和聚丙烯)用作涂层时，将满足第一个标准，即具有介电性能，但未满足第二个标准，即覆盖可熔链接物而不限制链接物在熔化之后的流动。目前的设备可以使用聚酰胺族聚合物，该聚合物可以满足前两个标准，但未满足第三个标准，即能够从溶液阶段中沉积，从而形成薄的涂层。
因此，将期望一种用于具有满足所有三个标准的可熔链接物的低剖面和基于晶圆的设备的涂层。
发明内容
一种用于具有可熔链接物的设备的涂层可以通过包括以下步骤的方法形成：将不溶性聚合物与可溶性聚合物进行熔化混合，以及将混合的熔化物暴露在将形成悬浊液的溶剂中，然后可以用任何众所周知的技术(例如，通过旋涂、深涂、滴涂等)进行沉积。根据本发明形成的涂层可以用作内部设备上的绝缘层，也可以用作外部涂层。
因此，在晶圆上制造的设备和/或非常小的设备能够具有薄的介电涂层，从而消除了昂贵的封装。该涂层可以适应受控的退锡，这将允许设备快速打开，也将用于保护设备的任何暴露的金属表面免受腐蚀。
附图说明
图1是具有可熔链接物的设备的现有技术示例的照片描述。
图2是示出了生产和应用本发明涂层的方法步骤的流程图。
图3是具有可熔链接物的设备的示意图，其示出了本发明的覆盖物在该设备上的位置。
具体实施方式
本发明的基于溶液的涂层形成了适合在可熔链接物上使用的薄介电层。涂层用作封装，并为保险丝或TMOV形成低剖面。介电薄膜可适应保险丝的沾锡(wetting)特性，并在50微米的规模上生成封装薄膜。
图1是具有可熔元件的设备的一部分的照片表示。该设备的金属电极102通常由铜制成，并由焊锡球104桥接。焊锡球104的设计目的是在达到一定温度时熔化并断开电路。图1的设备是将受益于本发明涂层的设备的典型类型。
图2是示出了形成本发明的涂层的方法200的步骤的流程图。在步骤202中，将不溶性聚合物和可溶性聚合物结合。不溶性聚合物和可溶性聚合物在市场上是可获得的，并以颗粒或碎片(pellets or chips)的物理形式存在。
在一些实施例中，不溶性聚合物可从包含聚酰胺及其共聚物和接枝材料(例如，热熔胶)的组中选择。在其他实施例中，低温高密度聚乙烯(HDPE)或低密度聚乙烯(LDPE)、低玻璃化转变温度(Tg)PET、可溶性或半可溶性EBA、EMA聚合物族(通用术语称为热熔胶和脂肪酸或木沥青，通常称为松香)可作为不溶性聚合物。在优选的实施例中，所述不溶性聚合物为聚酰胺。不溶性聚合物通常以颗粒的形式存在，尺寸范围从1/8”到1/4”。
许多可溶性聚合物可用于本发明。在一些实施例中，所述可溶性聚合物可以是例如，可溶性聚氨酯或蜡，它们可溶于DMF或芳香族溶剂(诸如二甲苯、甲苯或苯甲醚)，或任何其他可溶性聚合物。在本发明的其他实施例中，所述可溶性聚合物可以是可溶于DMF或NMP的聚酰胺酸或PVDF。一般来说，任何可溶性聚合物都可以使用，只要可溶性聚合物具有低于约130℃的熔点或者低于焊料链接物的熔点，不会限制熔化的焊料并且不更好地抑制电弧即可。在本发明的优选实施例中，使用低熔化温度聚氨酯作为可溶性聚合物。可溶性聚合物通常以碎片的形式存在，尺寸范围从1/2mm到5mm。
不溶性聚合物和可溶性聚合物可以按大约75：25的不溶与可溶比例进行混合，但是在优选实施例中，该比例将在40：60和60：40之间。
在步骤204中，将不溶性聚合物和可溶性聚合物颗粒通过暴露在高温下熔化，以形成熔化混合物。混合物可以由包含加热元件和搅拌叶片的工业机器熔化和混合，或者优选地由挤压机熔化和混合，挤压机能够加热和混合不溶性聚合物和可溶性聚合物来产生熔化混合物，并且随后将熔化混合物挤压成截面相对较小的电线或光纤。
不溶性聚合物和可溶性聚合物的熔化温度取决于对特定聚合物的选择，但一般来说，混合物至少可以被加热到具有较高熔点的材料的温度。在其他实施例中，该混合物可在不溶性聚合物和可溶性聚合物的熔点之间的温度下熔化，其中，混合机的混合叶片在混合物内形成剪切力，旨在提高该混合物的温度。在本发明的一些实施例中，当熔化混合物从挤压机出来时，可将熔化混合物切成托板尺寸的小块，以增加熔化混合物的表面积。
过程的步骤206是一个可选的步骤，其中允许熔化混合物冷却和凝固，并且在可选步骤208中，将凝固的熔化混合物切成碎片或托板尺寸的块，以增加表面积。在本发明的其他实施例中，可以跳过步骤206和208，并且熔化混合物可以被挤出或以熔化形式直接放入溶剂中。
在过程的步骤210中，熔化混合物暴露在溶剂中，并且当混合时，将最终形成悬浊液。通过将熔化混合物切成托板尺寸的块而增加了熔化混合物的表面积，这使形成悬浊液的过程更加容易。所述溶剂可包括例如，二甲苯、甲苯、苯甲醚、二甲基甲酰胺(DMF)或N-甲基吡咯烷酮(NMP)，或任何能够溶解所述可溶性聚合物的溶剂。溶剂的选择在很大程度上取决于可溶性聚合物的选择。熔化混合物和溶剂的混合比例大约是3重量份熔化混合物和7重量份溶剂，但这在很大程度上取决于聚合物和溶剂的选择。所得到的悬浊液的粘度可以在1cps到约10000cps之间。
在步骤212中，一旦形成悬浊液，它可以被非正式地沉积在设备上，作为内部绝缘层或外部涂层。该涂层可通过任何众所周知的方式施加，例如旋涂、深涂、滴涂等。
图3示出了一个典型的设备，其具有由可熔链接物302(通常是焊锡球)接合的铜电极304。本发明的保形涂层如图中的306所示。
按照本文公开的方法制作的涂层满足本发明的背景技术中阐述的所有三个设计标准。该方法形成具有绝缘性能的介电涂层。一旦涂层被保形沉积在可熔元件上，当可熔元件达到其熔点时该涂层允许可熔元件流动。最后，该涂层可以被应用为厚度在50μm范围内的薄膜，因此，其适合与低剖面的TMOV和其他基于晶圆的设备一起使用。
Claims (20)
1.一种形成薄膜涂层的方法，包括：
将不溶性聚合物和可溶性聚合物以固体形式混合；
通过加热所述不溶性聚合物和所述可溶性聚合物并将所述不溶性聚合物和所述可溶性聚合物进行混合，形成所述不溶性聚合物在所述可溶性聚合物中的熔化混合物；
将所述熔化混合物暴露于溶剂中以形成悬浊液；以及
将所述悬浊液沉积在设备上以形成涂层。
2.根据权利要求1所述的方法，其中，所述不溶性聚合物选自包括以下的组：聚酰胺、共聚物、低温高密度聚乙烯、低密度聚乙烯、PET、可溶性或半可溶性EBA和EMA聚合物。
3.根据权利要求1所述的方法，其中，所述不溶性聚合物是聚酰胺。
4.根据权利要求1所述的方法，其中，所述可溶性聚合物选自包括以下的组：可溶性聚氨酯或蜡、聚酰胺酸和PVDF。
5.根据权利要求1所述的方法，其中，所述可溶性聚合物是一种熔化温度低的聚氨酯。
6.根据权利要求1所述的方法，其中，所述溶剂选自包括以下的组：二甲苯、甲苯、苯甲醚、DMF和NMP。
7.根据权利要求1所述的方法，其中，所述不溶性聚合物和所述可溶性聚合物按40：60和60：40之间的比例存在于熔化混合物中。
8.根据权利要求1所述的方法，其中，所述熔化混合物和溶剂按3重量份熔化混合物和7重量份溶剂的比例进行混合。
9.根据权利要求1所述的方法，其中，所述不溶性聚合物和所述可溶性聚合物被加热到具有最高熔化温度的组件的熔化温度。
10.根据权利要求1所述的方法，其中，使用选自包括以下的组的方法将所述悬浊液沉积在所述设备上：旋涂、深涂和滴涂。
11.根据权利要求1所述的方法，其中，所述设备是包括两个电极之间的可熔元件的设备，并且其中所述薄膜涂层至少覆盖所述可熔元件。
12.根据权利要求1所述的方法，其中，所述薄膜涂层具有介电特性。
13.根据权利要求1所述的方法，其中，在所述可熔元件已经达到其熔点之后，所述薄膜涂层允许所述可熔元件从所述电极流出。
14.根据权利要求1所述的方法，其中，所述薄膜涂层的厚度小于50微米。
15.一种设备，包括：
一个或多个电极；
可熔链接物，其与所述一个或多个电极电接合；以及
薄膜涂层，其覆盖所述一个或多个电极和所述可熔链接物；
其中，通过将包含不溶性聚合物和可溶性聚合物的熔化混合物以及溶剂的悬浊液沉积到所述设备上而形成所述薄膜涂层。
16.根据权利要求15所述的设备，其中，使用选自包括以下的组的方法将所述悬浊液沉积在所述设备上：旋涂、深涂和滴涂。
17.根据权利要求15所述的设备，其中，在所述可熔元件已经达到其熔点之后，所述薄膜涂层允许所述可熔元件从所述电极流出。
18.根据权利要求15所述的设备，其中，所述不溶性聚合物选自包括以下的组：聚酰胺、共聚物、低温高密度聚乙烯、低密度聚乙烯、PET、可溶性或半可溶性EBA和EMA聚合物。
19.根据权利要求15所述的设备，其中，所述可溶性聚合物选自包括以下的组：可溶性聚氨酯或蜡、聚酰胺酸和PVDF。
20.根据权利要求15所述的设备，其中，所述溶剂选自包括以下的组：二甲苯、甲苯、苯甲醚、DMF和NMP。
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| US20230383139A1 (en) | 2023-11-30 |
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