CN113798118A

CN113798118A - Immersion processing apparatus and method for manufacturing electronic component using the same

Info

Publication number: CN113798118A
Application number: CN202110658171.3A
Authority: CN
Inventors: 青山宽之; 竹野干雄; 田中淳也
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2020-06-17
Filing date: 2021-06-11
Publication date: 2021-12-17
Anticipated expiration: 2041-06-11
Also published as: JP7405011B2; CN113798118B; JP2021197508A

Abstract

The invention provides a dipping treatment device which is not easy to generate pores in a paste sintered body and a manufacturing method of an electronic component using the same. The immersion processing device (101) is provided with: a container (2) for storing the paste (1); a holder (51) capable of holding the component (10); and a drive unit (4) which can displace the holder (51) so that the member (10) held by the holder (51) can move forward and backward relative to the liquid surface (1u) of the paste (1). The holder (51) can hold the member (10) in a state in which the lower end surface of the member (10) is inclined with respect to the liquid surface (1 u).

Description

Immersion processing apparatus and method for manufacturing electronic component using the same

Technical Field

The present invention relates to a dipping treatment apparatus and a method for manufacturing an electronic component using the same.

Background

For example, in the case of manufacturing a chip-like electronic component provided with external electrodes, there is a case where a conductive material to be an external electrode is prepared in advance as paste (paste), and the paste is attached to a part of the surface of the component by immersing the component on which the external electrode is not formed in the paste. After the paste is attached by immersion, the member is fired to cure the paste, thereby forming the external electrode.

Japanese patent publication No. 7-79067 (patent document 1) describes a case where a chip component is held and lowered toward a paste tank and immersed in a paste.

Prior art documents

Patent document

Patent document 1: japanese examined patent publication No. 7-79067

When the member is lowered to enter the paste and when the member is raised to be pulled out of the paste, air bubbles may enter the liquid paste. If there are air bubbles in the paste attached to the external electrode as a component, when the component is fired, minute voids, that is, voids, may be generated in the external electrode due to the air bubbles. A state where such pores exist in the external electrode should be avoided.

Disclosure of Invention

Problems to be solved by the invention

Accordingly, an object of the present invention is to provide a dipping treatment apparatus in which voids are not easily generated in a fired paste, and a method for manufacturing an electronic component using the same.

Means for solving the problems

In order to achieve the above object, an immersion processing apparatus according to the present invention includes: a container for storing the paste; a holder capable of holding the component; and a driving unit capable of displacing the holder so that the member held by the holder can move forward and backward relative to the liquid surface of the paste. The holder can hold the member in a state in which a lower end surface of the member is inclined with respect to the liquid surface.

Effects of the invention

According to the present invention, the member is gradually moved into and out of the liquid surface by the inclined surface, and bubbles are less likely to be generated in the paste. Therefore, the dipping treatment apparatus can be obtained in which voids are less likely to be generated in the fired paste.

Drawings

Fig. 1 is a conceptual diagram of an immersion treatment apparatus according to embodiment 1 of the present invention.

Fig. 2 is a cross-sectional view of a holder provided in an immersion treatment apparatus according to embodiment 2 of the present invention.

Fig. 3 is a conceptual diagram of an immersion treatment apparatus according to embodiment 2 of the present invention.

Fig. 4 is a conceptual diagram of an immersion treatment apparatus according to embodiment 3 of the present invention.

Fig. 5 is a plan view of a state of use of the immersion treatment apparatus according to embodiment 3 of the present invention.

Fig. 6 is an explanatory diagram of a state in which a member to be held is tilted in the immersion processing apparatus according to embodiment 3 of the present invention.

Fig. 7 is a plan view of a state in which a member to be held is tilted in the immersion processing apparatus according to embodiment 3 of the present invention.

Fig. 8 is a conceptual diagram of an immersion treatment apparatus according to embodiment 4 of the present invention.

Fig. 9 is an explanatory diagram of a state in which a member to be held is tilted in the immersion processing apparatus according to embodiment 4 of the present invention.

Fig. 10 is a conceptual diagram of an immersion treatment apparatus according to embodiment 5 of the present invention.

Fig. 11 is an explanatory diagram of a state in which a member to be held is tilted in the immersion processing apparatus according to embodiment 5 of the present invention.

Fig. 12 is a flowchart of a method for manufacturing an electronic component according to embodiment 6 of the present invention.

Description of the reference numerals

1: paste, 1 u: liquid level, 2: a container, 4: drive unit, 5: through-hole, 6: metal plate, 7: inner wall, 8: bearing surface, 9: adhesion member, 10: component, 11: contact surface, 31: 1 st jig, 32, 33, 34: no. 2 clamp, 32 a: opening, 51, 52, 53, 54, 55: holder, 91, 92, 93, 94: arrow, 101, 102, 103, 104, 105: an immersion processing device.

Detailed Description

The size ratio shown in the drawings is not necessarily faithfully represented as it is, and is sometimes exaggeratedly shown for convenience of explanation. In the following description, when a concept of "up" or "down" is referred to, the concept may mean not only absolute "up" or "down" but also relative "up" or "down" in the illustrated posture.

(embodiment mode 1)

(Structure)

An immersion processing apparatus according to embodiment 1 of the present invention will be described with reference to fig. 1.

The immersion processing apparatus 101 in the present embodiment includes: a container 2 for storing the paste 1; a holder 51 capable of holding the component 10; and a driving unit 4 capable of displacing the holder 51 so that the member 10 held by the holder 51 can advance and retreat relative to the liquid surface 1u of the paste 1. The holder 51 can hold the member 10 in a state where the lower end surface of the member 10 is inclined with respect to the liquid surface 1 u. In the example shown here, the lower end surface of the member 10 is inclined at an angle θ with respect to the liquid surface 1 u. When the member 10 is immersed in the paste, the holder 51 is relatively moved as indicated by an arrow 91 by the action of the driving unit 4. Since this is a movement performed "relatively", the holder 51 may be moved, and the container 2 may be moved. When the holder 51 approaches the container 2 to some extent or more, the member 10 comes into contact with the liquid surface 1u and enters the paste 1. Thereafter, if the holder 51 is retracted by the driving portion 4, the member 10 is separated from the liquid surface 1 u. At this point in time, a certain amount of paste is deposited on the member 10. Here, although the holder 51 holds the component 10 for convenience of explanation, the component 10 is not a part of the holder 51.

The retainer 51 has a through hole 5 provided obliquely to the vertical direction. The holder 51 includes a metal plate 6 disposed horizontally. The inner wall 7 of the through hole 5 is inclined at a predetermined angle θ with respect to the vertical direction. The through-hole 5 may be a hole formed directly in the metal plate 6, or may be a hole formed by fitting another cylindrical member to the metal plate 6. In the example shown here, the plate material is formed of an elastic body such as rubber so that the metal plate 6 is enclosed therein. The metal plate 6 is provided with an opening through which the inner wall 7 is arranged to pass, thereby forming the through-hole 5. The member 10 is inserted into the through hole 5, and is held in an inclined state. The lower surface of the member 10 thus held forms an angle θ with respect to the liquid surface 1 u.

(action, Effect)

In the present embodiment, since the member 10 is held in a state in which the lower end surface of the member 10 is inclined at the angle θ with respect to the liquid surface 1u of the paste 1, and the member 10 can relatively advance and retreat by the action of the driving unit 4 in this state, the member 10 gradually advances and retreats with respect to the liquid surface 1u by the inclined surface, and thus air bubbles are less likely to be generated in the paste 1. Therefore, according to the present embodiment, it is possible to provide an immersion processing apparatus in which voids are less likely to be generated in a fired body of a paste.

Although one through hole 5 and its vicinity are shown in detail in fig. 1, one retainer 51 may actually have a plurality of through holes 5. If a plurality of components 10 are held by a plurality of through-holes 5 at the same time and are collectively subjected to the dipping step for the paste 1, the treatment can be efficiently advanced. Alternatively, the holder 51 may hold only one component 10.

The holder may hold only one member 10, or may hold a plurality of members 10 at the same time, which is the same for the holders shown in the following embodiments.

The angle θ at which the lower end surface of the member 10 is inclined with respect to the horizontal plane by the retainer is preferably 0.5 ° or more and 15 ° or less. When the member 10 is inclined at an angle within this range, the dipping step can be stably performed while suppressing the generation of bubbles in the paste 1 with a high probability. This is also applicable to the following embodiments. The angle at which the lower end surface of the member 10 is inclined with respect to the horizontal plane is preferably adjustable every time.

The angle θ at which the lower end surface of the member 10 is inclined with respect to the horizontal plane by the retainer is more preferably 1 ° or more and 10 ° or less. The angle θ at which the lower end surface of the member 10 is inclined with respect to the horizontal plane by the retainer is more preferably 1 ° or more and 5 ° or less. When the member 10 is inclined at an angle within this range, the dipping step can be performed more stably while suppressing the generation of bubbles in the paste 1 with a higher probability.

(embodiment mode 2)

(Structure)

An immersion processing apparatus according to embodiment 2 of the present invention will be described with reference to fig. 2 to 3.

The immersion processing apparatus according to the present embodiment includes a holder 52 shown in fig. 2 instead of the holder 51 described in embodiment 1. The holder 52 comprises an adhesive member 9 having an inclined bearing surface 8. The adhesion member 9 is disposed on the lower surface of the metal plate 6.

The immersion processing apparatus according to the present embodiment has a configuration as shown in fig. 3 as a whole. The configuration of the immersion processing apparatus 102 other than the holder 52 is the same as that of the immersion processing apparatus 101 described in embodiment 1. The holder 52 can advance and retreat relative to the liquid surface 1u of the paste 1 by the action of the driving portion 4. When the vehicle moves forward, the vehicle moves relatively as indicated by arrow 91.

(action, Effect)

In the present embodiment, since the adhesive member 9 having the inclined receiving surface 8 is provided, the component 10 can be held in a posture inclined at a desired angle by placing the component 10 on the receiving surface 8. As a result, the present embodiment can also obtain the effects as described in embodiment 1.

(embodiment mode 3)

(Structure)

An immersion processing apparatus according to embodiment 3 of the present invention will be described with reference to fig. 4 to 7. The immersion processing apparatus 103 includes a holder 53 as shown in fig. 4. When viewed in plan view, this is as shown in fig. 5. The holder 53 includes: a 1 st jig 31 having a through hole 5 for vertically penetrating and holding the member 10; and a 2 nd jig 32 for pushing the part of the member 10 exposed from the through-hole 5 to the side. The 1 st jig 31 has a plate shape. The 2 nd jig 32 is also plate-shaped. The 2 nd jig 32 is arranged to overlap the 1 st jig 31. The 2 nd jig 32 has an opening 32 a. The 2 nd jig 32 can be moved in parallel laterally relative to the 1 st jig 31.

Fig. 6 shows a state where the 2 nd jig 32 pushes the component 10 to the side. The 2 nd jig 32 moves as indicated by an arrow 92, whereby the edge of the opening 32a abuts against the component 10, and the component 10 is pushed. By being pushed in this manner, the member 10 assumes an inclined posture. The 1 st jig 31 is formed of, for example, a material having elasticity. The 1 st jig 31 can continuously hold the member 10 in such an inclined posture without dropping.

When the 2 nd jig 32 is viewed in a plan view with the component 10 tilted, it is as shown in fig. 7. As can be seen by comparing fig. 5 and 7, the relative positional relationship between the through-hole 5 and the opening 32a changes. Although the through-hole 5 is illustrated as being circular and the opening 32a as being square, the formation thereof is merely illustrated as an example, and the shape in plan view is not limited thereto.

As shown in fig. 6, the holder 53 is relatively moved as indicated by an arrow 91 by the action of the driving unit 4. The driving section 4 moves the 2 nd jig 32 in the direction of the arrow 92 and moves the entire holder 53 in the direction of the arrow 91. The driving section 4 also moves the 2 nd jig 32 in the direction opposite to the arrow 92 and moves the entire holder 53 in the direction opposite to the arrow 91. The relative movement of the 2 nd jig 32 with respect to the 1 st jig 31 may be performed by a unit different from the driving section 4.

(action, Effect)

In the present embodiment, since the holder 53 includes the 2 nd jig 32 for pushing the portion of the component 10 exposed from the through hole 5 to the side in addition to the 1 st jig 31, the posture of the component 10 held by the 1 st jig 31 can be tilted by the 2 nd jig 32. As a result, the present embodiment can also obtain the effects as described in embodiment 1.

(embodiment mode 4)

(Structure)

An immersion processing apparatus according to embodiment 4 of the present invention will be described with reference to fig. 8 to 9. The immersion processing apparatus 104 includes the holder 54 shown in fig. 8. The holder 54 includes: a 1 st jig 31 having a through hole 5 for vertically penetrating and holding the member 10; and a 2 nd jig 33 for inclining the member 10 held by the 1 st jig 31 by locally pressing and deforming the 1 st jig 31 in the vertical direction in the vicinity of the member 10. The 1 st jig 31 has a plate shape. The 2 nd jig 33 is placed on the 1 st jig 31. The 2 nd jig 33 may include an aggregate of pins, or may include an aggregate of plate materials. The 2 nd jig 33 is relatively movable in parallel in the vertical direction with respect to the 1 st jig 31.

Fig. 9 shows a state where the 2 nd jig 33 locally presses the 1 st jig 31 in the vertical direction. The 2 nd gripper 33 presses the 1 st gripper 31 in the direction of the arrow 93. The 1 st jig 31 is partially pressed by the 2 nd jig 33 and is elastically deformed. As a result, the member 10 assumes an inclined posture. The 1 st jig 31 is formed of, for example, a material having elasticity. The 1 st jig 31 can continuously hold the member 10 in such an inclined posture without dropping.

(action, Effect)

In the present embodiment, the effects as described in embodiment 1 can be obtained. The relative movement of the 2 nd jig 33 with respect to the 1 st jig 31 in the present embodiment may be performed by the driving unit 4, or may be performed by a unit different from the driving unit 4.

(embodiment 5)

(Structure)

An immersion processing apparatus according to embodiment 5 of the present invention will be described with reference to fig. 10 to 11. The immersion processing apparatus 105 includes a holder 55 shown in fig. 10. The holder 55 includes: a 1 st jig 31 having a through hole 5 for vertically penetrating and holding the member 10; and a 2 nd jig 34 for tilting the component 10 by abutting the upper end of the component 10 held by the 1 st jig 31. The 2 nd jig 34 has an inclined abutment surface 11. The contact surface 11 may be a bottom surface of a groove extending in the direction of the inside and outside of the paper surface, or may be a bottom surface of a recess provided corresponding to each member 10. As shown in fig. 11, the member 10 is pressed in the direction of the arrow 94 by the 2 nd jig 34, whereby the member 10 is tilted. Even if the 2 nd jig 34 abuts on the upper end of the member 10 by another shape instead of the inclined abutment surface 11, the member 10 can be inclined. However, as shown in the present embodiment, the 2 nd jig 34 preferably has an inclined abutment surface 11. This is because, with this configuration, the 2 nd jig 34 can be stably brought into contact with the component 10, and the inclination angle of the component 10 can be easily set to a desired value.

(action, Effect)

In the present embodiment, the effects as described in embodiment 1 can be obtained. The relative movement of the 2 nd jig 34 with respect to the 1 st jig 31 in the present embodiment may be performed by the driving unit 4, or may be performed by a unit different from the driving unit 4.

(embodiment mode 6)

(production method)

A method for manufacturing an electronic component according to embodiment 6 of the present invention will be described with reference to fig. 12. Fig. 12 shows a flow chart of the manufacturing method. The manufacturing method comprises the following steps: a step S1 of preparing the immersion treatment apparatus described in any of the previous embodiments; and a step S2 of attaching the paste 1 to the member 10 by the immersion processing apparatus.

(action, Effect)

In the present embodiment, since the paste 1 is attached to the member 10 by the dipping treatment apparatus described above, bubbles are less likely to be generated in the paste 1. Therefore, in this production method, the member to which the paste has been attached by the dipping treatment is less likely to have voids even when the member is subsequently fired.

In addition, although only steps S1 and S2 are described in the present embodiment, the manufacturing method may further include a step of firing the member to which the paste has adhered after step S2. By firing, the paste is cured.

In the above embodiments, the member 10 has been described as having a shape close to a rectangular parallelepiped, but the member 10 is not limited to this. The component 10 may also have other shapes.

The paste 1 may be, for example, a conductive paste. The external electrodes of the component 10 may also be formed by dipping the paste 1. The external electrode can be formed by adhering the conductive paste to the member 10 and firing the paste. Alternatively, the paste 1 may be a paste other than the conductive paste.

A plurality of the above embodiments may be appropriately combined and employed.

The above-described embodiments disclosed herein are illustrative in all respects, and not restrictive. The scope of the present invention is defined by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. An immersion treatment apparatus includes:

a container for storing the paste;

a holder capable of holding the component; and

a driving section capable of displacing the holder so that the member held by the holder can relatively advance and retreat with respect to a liquid surface of the paste,

the holder can hold the member in a state in which a lower end surface of the member is inclined with respect to the liquid surface.

2. The impregnation treatment apparatus according to claim 1,

the holder has: and a through hole inclined with respect to the vertical direction.

3. The impregnation treatment apparatus according to claim 1,

the holder includes: the adhering member is provided with an inclined bearing surface.

4. The impregnation treatment apparatus according to claim 1,

the holder includes:

a 1 st jig having a through hole for vertically penetrating and holding the member; and

and a 2 nd jig for pushing a portion of the member exposed from the through hole to a side.

5. The impregnation treatment apparatus according to claim 1,

the holder includes:

and a 2 nd jig for inclining the member held by the 1 st jig by locally pressing and deforming the 1 st jig in a vertical direction in the vicinity of the member.

6. The impregnation treatment apparatus according to claim 1,

the holder includes:

and a 2 nd jig for tilting the member by abutting the upper end of the member held by the 1 st jig.

7. The impregnation treatment apparatus according to claim 6,

the 2 nd clamp has an inclined abutment surface.

8. The impregnation treatment device according to any one of claims 1 to 7,

the lower end surface of the member is inclined by the retainer at an angle of 0.5 ° or more and 15 ° or less with respect to a horizontal plane.

9. The impregnation treatment apparatus according to claim 8,

the lower end surface of the member is inclined by the retainer at an angle of 1 ° or more and 10 ° or less with respect to a horizontal plane.

10. The impregnation treatment apparatus according to claim 9,

the lower end surface of the member is inclined by the retainer at an angle of 1 ° or more and 5 ° or less with respect to a horizontal plane.

11. A method of manufacturing an electronic component, comprising:

preparing the immersion treatment apparatus according to any one of claims 1 to 10; and

and a step of attaching the paste to the member by using the immersion processing apparatus.