CN113788453B - Super-slide island pushing device and super-slide island processing method - Google Patents
Super-slide island pushing device and super-slide island processing method Download PDFInfo
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- CN113788453B CN113788453B CN202111073972.XA CN202111073972A CN113788453B CN 113788453 B CN113788453 B CN 113788453B CN 202111073972 A CN202111073972 A CN 202111073972A CN 113788453 B CN113788453 B CN 113788453B
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Abstract
The application discloses super island thrust unit includes: a transparent substrate; the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the super-slide island array to be pushed. Therefore, the super-sliding island pushing device comprises the transparent substrate and the transparent pushing body array, and the pushing body array is consistent with the super-sliding island array to be pushed, so that the pushing bodies in the pushing body array and the super-sliding islands in the super-sliding island array can be in one-to-one correspondence, all the super-sliding islands in the super-sliding island array can move during pushing, the super-sliding islands are prevented from being pushed one by one, the island pushing efficiency is improved, the island pushing time is shortened, the super-sliding island pushing device is transparent, the pushing condition of the super-sliding island array can be clearly observed, and the super-sliding island pushing device is quite simple and convenient. In addition, the application also provides a super-slide island processing method with the advantages.
Description
Technical Field
The application relates to the technical field of structure super-sliding, in particular to a super-sliding island pushing device and a super-sliding island processing method.
Background
The structural super-slip refers to the phenomenon that the friction force between two van der Waals solid surfaces which are smooth at the atomic level and are in non-metric contact is almost zero, and no abrasion exists. The material of the super-slider in the super-slider device can be two-dimensional materials such as graphene, molybdenum disulfide and the like, at present, a super-slider array is obtained by adopting a photoetching mode when the super-slider is prepared, then a probe is used for pushing the super-sliders one by one, and the super-slider with self-restoring capability is transferred onto a target substrate. Because the probes are required to push the ultra-smooth islands one by one, the island pushing process is long, and the island pushing efficiency is low.
Therefore, how to solve the above technical problems should be of great interest to those skilled in the art.
Disclosure of Invention
The purpose of the application is to provide a super-slide island pushing device and a super-slide island processing method so as to improve island pushing efficiency.
For solving the technical problem, the application provides a super-sliding island pushing device, which comprises:
a transparent substrate;
the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the super-slide island array to be pushed.
Optionally, the transparent pusher array is a transparent electrode array.
Optionally, the method further comprises:
and a transparent insulating layer disposed on a surface of each electrode in the transparent electrode array.
Optionally, the method further comprises:
a transparent flexible insulating layer disposed between the transparent substrate and the transparent electrode array.
The application also provides a super-smooth island processing method, which comprises the following steps:
coating a first photoresist on the upper surface of a substrate, and exposing and developing the first photoresist;
preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array to obtain a treatment jig; the pushing body array is the same as the ultra-sliding island array to be pushed; wherein the substrate is a transparent substrate, and the pusher array is a transparent pusher array;
correspondingly contacting the pushing body array with the ultra-sliding island array, applying pressure, and pushing the ultra-sliding island array;
and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island with self-recovery.
Optionally, when the pusher array is a transparent electrode array, after the determining that the self-recovery super-sliding island occurs, the method further includes:
marking the self-replying super-smooth island;
correspondingly contacting the transparent electrode array with the super-slide island array, and applying static electricity to the electrode corresponding to the self-recovered super-slide island, so that the self-recovered super-slide island is adsorbed to the electrode to which the static electricity is applied;
contacting the treatment jig adsorbed with the self-recovered ultra-smooth island with a target substrate and applying pressure;
separating the treatment jig adsorbed with the self-recovered super-slide island from the target substrate, and removing static electricity to enable the self-recovered super-slide island to be adsorbed on the target substrate.
Optionally, a transparent insulating layer is wrapped on the surface of each electrode in the transparent electrode array.
Optionally, when the transparent insulating layer is not a photoresist, coating a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist includes:
sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist;
correspondingly, preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array, wherein the obtaining of the processing jig comprises the following steps:
etching the electrode layer to form the transparent electrode array, and removing the second photoresist;
coating a second sub-insulating layer on the upper surface of the transparent electrode array;
coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist;
and etching the second sub-insulating layer and removing the third photoresist.
Optionally, when the transparent insulating layer is a photoresist insulating layer, coating a first photoresist on an upper surface of the substrate, and exposing and developing the first photoresist includes:
sequentially laminating a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist;
correspondingly, preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array, wherein the obtaining of the processing jig comprises the following steps:
etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist;
and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.
Optionally, before the first photoresist is coated on the upper surface of the substrate and exposed and developed, the method further includes:
and growing a transparent flexible insulating layer on the upper surface of the substrate.
Optionally, the preparing the push layer on the upper surface of the first photoresist after development includes:
and preparing an electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode.
Optionally, before the pushing body array is correspondingly contacted with the ultra-sliding island array and pressure is applied, the method further comprises:
and manufacturing an island cover on the upper surface of each super-slide island in the super-slide island array.
The application provides a super island thrust unit includes: a transparent substrate; the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the super-slide island array to be pushed.
Therefore, the super-sliding island pushing device comprises the transparent substrate and the transparent pushing body array, and the pushing body array is consistent with the super-sliding island array to be pushed, so that the pushing bodies in the pushing body array and the super-sliding islands in the super-sliding island array can be in one-to-one correspondence, all the super-sliding islands in the super-sliding island array can move during pushing, the super-sliding islands are prevented from being pushed one by one, the island pushing efficiency is improved, the island pushing time is shortened, the super-sliding island pushing device is transparent, the pushing condition of the super-sliding island array can be clearly observed, and the super-sliding island pushing device is quite simple and convenient.
In addition, the application also provides a super-slide island processing method with the advantages.
Drawings
For a clearer description of embodiments of the present application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description that follow are only some embodiments of the present application, and that other drawings may be obtained from these drawings by a person of ordinary skill in the art without inventive effort.
Fig. 1 is a schematic structural diagram of an ultra-sliding island pushing device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another super-slide island pushing device according to an embodiment of the present disclosure;
FIG. 3 is a flowchart of a method for processing a super-smooth island according to an embodiment of the present application;
FIG. 4 is a flowchart of another method for processing a super-smooth island according to an embodiment of the present application
FIGS. 5-10 are schematic flow diagrams illustrating the transfer of super-slider islands using transparent electrode arrays in the practice of the present application;
FIGS. 11-16 are process flow diagrams for forming an insulating layer when the insulating layer is not photoresist in the practice of the present application;
FIG. 17 is a schematic diagram of a process tool with a flexible layer contacting an ultra-smooth island array with a rugged surface in an embodiment of the present application.
Detailed Description
In order to provide a better understanding of the present application, those skilled in the art will now make further details of the present application with reference to the drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, currently, ultra-smooth island arrays are obtained by photolithography in the preparation of ultra-smooth members, and then ultra-smooth islands with self-restoring capability are transferred onto a target substrate by pushing the ultra-smooth islands one by one using probes. Because the probes are required to push the ultra-smooth islands one by one, the island pushing process is long, and the island pushing efficiency is low.
In view of this, the present application provides a super-sliding-island pushing device, please refer to fig. 1, fig. 1 is a schematic structural diagram of a super-sliding-island pushing device provided in an embodiment of the present application, which includes:
a transparent substrate 1;
and the transparent pushing body array 2 is positioned on the surface of the transparent substrate 1, and the transparent pushing body array 2 is the same as the ultra-sliding island array to be pushed.
The transparent pushing body array 2 comprises a plurality of pushing bodies, the super-slide island array comprises a plurality of super-slide islands, the transparent pushing body array 2 and the super-slide island array to be pushed are identical in finger, the pushing bodies are identical in size with the super-slide islands, and the distance between the pushing bodies is equal to the distance between the super-slide islands.
It should be noted that whether the transparent pusher array 2 is conductive is not limited in this application, as the case may be. The transparent pusher array 2 may be either a conductive array or a non-conductive array. When the self-recovered super-sliding island needs to be transferred, the transparent pushing body array 2 is a transparent electrode array.
The material of the transparent substrate 1 includes, but is not limited to, glass, quartz, sapphire, etc., and the material of the pushing bodies in the transparent pushing body array 2 includes, but is not limited to, indium tin oxide, fluorine doped tin oxide, etc.
The super-sliding island pushing device comprises a transparent substrate 1 and a transparent pushing body array 2, and the pushing body array is consistent with the super-sliding island array to be pushed, so that pushing bodies in the pushing body array and the super-sliding islands in the super-sliding island array can be in one-to-one correspondence, when pushing, all the super-sliding islands in the super-sliding island array can move, the super-sliding islands are prevented from being pushed one by one, the island pushing efficiency is improved, the island pushing time is shortened, the super-sliding island pushing device is transparent, and the pushing condition of the super-sliding island array can be clearly observed, so that the super-sliding island pushing device is very simple and convenient.
On the basis of the above embodiments, in one embodiment of the present application, please refer to fig. 2, the super-slide island pushing device further includes:
a transparent insulating layer 11 provided on the surface of each electrode in the transparent electrode array.
The transparent insulating layer 11 surrounds all surfaces of the electrodes, and the transparent insulating layer 11 is also provided between the transparent substrate 1 and the electrodes. It should be noted that the material of the transparent insulating layer 11 is not particularly limited in this application, and may be set by itself. For example, the material of the transparent insulating layer 11 may be photoresist, or non-photoresist such as Polydimethylsiloxane (PDMS), silicon nitride, or the like.
In the electrostatic adsorption super-sliding island process, the transparent insulating layer 11 can prevent electrostatic breakdown, can apply larger voltage and electrostatic force, and improves selectivity.
In order to ensure that the transparent electrode array and the ultra-smooth island array can be contacted and operated when the surface of the ultra-smooth island array has high and low fluctuation, the ultra-smooth island pushing device further comprises:
a transparent flexible insulating layer arranged between the transparent substrate 1 and the transparent electrode array.
When the super-sliding island is pushed and transferred, and the transparent insulating layer 11 is wrapped on the surface of the electrode, the transparent flexible insulating layer can not only realize contact and operation of the super-sliding island array with the undulation on the surface, but also serve as a part of the insulating layer wrapping the electrode, and the manufacturing steps of the transparent insulating layer 11 between the transparent electrode array and the transparent substrate are saved.
The application further provides a method for processing a super-smooth island, please refer to fig. 3, fig. 3 is a flowchart of the method for processing a super-smooth island, which includes:
step S101: and coating a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist.
The coating mode of the first photoresist is not particularly limited in this application, and can be selected by itself. For example, a spin-coating method may be used to form a uniform first photoresist.
Step S102: preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array to obtain a treatment jig; the pushing body array is the same as the ultra-sliding island array to be pushed; wherein the substrate is a transparent substrate, and the pusher array is a transparent pusher array.
The pushing body array comprises a plurality of pushing bodies, the super-slide island array comprises a plurality of super-slide islands, the pushing body array and the super-slide island array to be pushed are identical in finger, the pushing bodies are identical in size with the super-slide islands, and the distance between the pushing bodies is identical to the distance between the super-slide islands.
Step S103: and correspondingly contacting the pushing body array with the ultra-sliding island array, applying pressure, and pushing the ultra-sliding island array.
The pushing force can be applied to the treatment jig, and shearing is performed between the super-slide island layers, so that batch pushing of the super-slide islands is realized.
Step S104: and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island with self-recovery.
In this application, whether the pushing body array is conductive is not limited, and the pushing body array is conductive is optional. The pusher array may be either a conductive array or a non-conductive array.
The substrate is a transparent substrate, the pushing body array is a transparent pushing body array, and as the substrate and the pushing body array are transparent, the super-smooth islands which are self-recovered can be observed through the optical mirror, so that the push body array is very convenient.
Materials for the transparent substrate include, but are not limited to, glass, quartz, sapphire, etc., and materials for the pushers in the transparent pusher array include, but are not limited to, indium tin oxide, fluorine doped tin oxide, etc.
In order to increase the friction force between the pushing body array and the ultra-sliding island array, so that the ultra-sliding island slides, before the pushing body array and the ultra-sliding island array are correspondingly contacted and pressure is applied, the method further comprises the following steps:
and manufacturing an island cover on the upper surface of each super-slide island in the super-slide island array.
According to the super-slide island treatment method, the transparent pushing body array is prepared on the upper surface of the substrate, the treatment jig for treating the super-slide islands is obtained, the transparent pushing body array is correspondingly contacted with the super-slide island array, pressure is applied, then the super-slide island array is pushed, after the treatment jig and the super-slide island array are separated, the super-slide islands with self-restoring capability can automatically restore to the original position, and as the transparent pushing body array is consistent with the super-slide island array to be pushed, pushing bodies in the pushing body array are in one-to-one correspondence with the super-slide islands in the super-slide island array, all the super-slide islands in the super-slide island array can move when being pushed, the super-slide islands are prevented from being pushed one by one, the island pushing efficiency is increased, and the island pushing time is shortened.
Referring to fig. 4, fig. 4 is a flowchart of another method for processing a super-slide island according to an embodiment of the present application, where the pusher array is a transparent electrode array, and the method includes:
step S101: and coating a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist.
Step S202: preparing an electrode layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a transparent electrode array to obtain a treatment jig; the transparent electrode array is the same as the ultra-sliding island array to be pushed.
Optionally, as a specific embodiment, the preparing the electrode layer on the upper surface of the first photoresist after development includes: and preparing the electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode. However, the present application is not particularly limited thereto, and the electrode layer may be prepared by a chemical vapor deposition method.
The transparent electrode array includes a plurality of electrodes.
Step S203: and correspondingly contacting the transparent electrode array with the super-slide island array, applying pressure, and pushing the super-slide island array.
The schematic structure of the transparent electrode array 2 pushing the super-slide island array 3 is shown in fig. 5.
Step S204: and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island with self-recovery.
When the processing jig is separated from the super-slide island array 3, as shown in fig. 6, a part of the super-slide islands self-recover, as shown in the dashed frame.
Step S205: marking the self-replying super-sliding island.
Step S206: and correspondingly contacting the transparent electrode array with the super-slide island array, and applying static electricity to the electrode corresponding to the self-recovered super-slide island, so that the self-recovered super-slide island is adsorbed to the electrode to which the static electricity is applied.
In this step, please refer to fig. 7, after electrostatic adsorption, the processing tool is lifted, as shown in fig. 8, and the super-slip island with self-recovery capability is adsorbed to the electrode.
Step S207: and contacting the treatment jig adsorbed with the self-recovered ultra-sliding island with a target substrate and applying pressure.
The super-slip island that undergoes self-recovery is in contact with the target substrate 4 as shown in fig. 9.
Step S208: separating the treatment jig adsorbed with the self-recovered super-slide island from the target substrate, and removing static electricity to enable the self-recovered super-slide island to be adsorbed on the target substrate.
After the static electricity is removed, the self-recovered super-slip islands are adsorbed on the target substrate 4 as shown in fig. 10.
According to the method for processing the super-smooth island, static electricity is applied to the electrode corresponding to the super-smooth island capable of self-recovery after the batch pushing of the super-smooth island array is completed, then the processing jig is contacted with the super-smooth island array again, the self-recovery super-smooth island is generated through static electricity absorption, then the processing jig adsorbed with the self-recovery super-smooth island is contacted with a target substrate, after static electricity is removed, the self-recovery super-smooth island is adsorbed on the target substrate, the transfer of the self-recovery super-smooth island is completed, and when the island is transferred, the transfer of all the self-recovery super-smooth islands is completed at one time, so that the island transfer efficiency is obviously improved.
On the basis of the above embodiments, in one embodiment of the application, a transparent insulating layer is wrapped on the surface of each electrode in the transparent electrode array.
In the electrostatic adsorption super-sliding island process, the transparent insulating layer can prevent electrostatic breakdown, can apply larger voltage and electrostatic force, and improves selectivity.
It should be noted that the material of the transparent insulating layer is not particularly limited in this application, and may be set by itself. For example, the material of the insulating layer may be photoresist, or non-photoresist such as Polydimethylsiloxane (PDMS), silicon nitride, etc.
The process of forming the transparent insulating layer will be described separately according to the difference in material of the transparent insulating layer.
When the transparent insulating layer is not photoresist, the process of forming the transparent insulating layer includes:
step S11: and sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist.
In this step, referring to fig. 11, a first sub-insulating layer 5, an electrode layer 6 and a second photoresist 7 are sequentially laminated on the upper surface of the substrate 1, and the second photoresist is exposed and developed as shown in fig. 12.
Step S12: and etching the electrode layer to form the transparent electrode array, and removing the second photoresist.
In this step, referring to fig. 13, the transparent electrode array 2 is distributed on the first insulating layer 5.
Step S13: and coating a second sub-insulating layer on the upper surface of the transparent electrode array.
In this step, referring to fig. 14, the second sub-insulating layer 8 covers the transparent electrode array 2.
Step S14: and coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist.
The third photoresist 9 of this step is exposed and developed as shown in fig. 15.
Step S15: and etching the second sub-insulating layer and removing the third photoresist.
In this step, referring to fig. 16, after the third photoresist is removed, each electrode is wrapped by the first sub-insulating layer 5 and the second sub-insulating layer 8.
When the transparent insulating layer is a photoresist insulating layer, the process of forming the transparent insulating layer includes:
step S21: sequentially laminating a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist;
step S22: etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist;
step S23: and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.
Because the insulating layer is photoresist, namely the third sub-insulating layer and the fourth sub-insulating layer are photoresist, after the fourth sub-insulating layer is coated, the fourth sub-insulating layer is directly subjected to exposure and development, so that each electrode is wrapped by the third sub-insulating layer and the fourth sub-insulating layer.
It should be noted that the first sub-insulating layer and the second sub-insulating layer may be made of the same material, the third sub-insulating layer and the fourth sub-insulating layer may be made of the same material, and the first, second, third, and fourth layers are formed in order to distinguish the order of formation.
For specific etching and developing processes, please refer to the related art, and detailed descriptions thereof are omitted.
When the surface of the super-slide island array has the height fluctuation, in order to ensure that the transparent electrode array and the super-slide island array can both be contacted and operated, the first photoresist is coated on the upper surface of the substrate, and before the first photoresist is exposed and developed, the method further comprises the steps of:
and growing a transparent flexible insulating layer on the upper surface of the substrate.
When the super-sliding island is pushed and transferred, and the insulating layer is wrapped on the surface of the electrode, the transparent flexible insulating layer can realize the contact and operation of the super-sliding island array with the undulation on the surface, can be used as a part of the transparent insulating layer wrapping the electrode, and saves the manufacturing steps of the transparent insulating layer between the transparent electrode array and the substrate. For example, when the transparent insulating layer is not photoresist, the first sub-insulating layer is replaced by a transparent flexible insulating layer, and when the transparent insulating layer is photoresist, the third sub-insulating layer is replaced by a transparent flexible insulating layer.
The transparent flexible insulating layer may be made of PDMS, and when the electrode is wrapped by the transparent flexible insulating layer 10 and the second sub-insulating layer 8, the schematic diagram of the contact between the treatment jig and the ultra-smooth island array with the surface being rugged is shown in fig. 17, and the ultra-smooth island array is in complete contact with the transparent electrode array.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The super-slide island pushing device and the super-slide island processing method provided by the application are described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. It should be noted that it would be obvious to those skilled in the art that various improvements and modifications can be made to the present application without departing from the principles of the present application, and such improvements and modifications fall within the scope of the claims of the present application.
Claims (10)
1. The super-slide island processing method is characterized by comprising the following steps of: coating a first photoresist on the upper surface of a substrate, and exposing and developing the first photoresist; preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array to obtain a treatment jig; the pushing body array is the same as the ultra-sliding island array to be pushed; wherein the substrate is a transparent substrate, and the pusher array is a transparent electrode array; correspondingly contacting the transparent electrode array with the super-slide island array, applying pressure, and pushing the super-slide island array; separating the processing jig from the ultra-smooth island array and determining the ultra-smooth island with self-recovery;
marking the self-replying super-smooth island; correspondingly contacting the transparent electrode array with the super-slide island array, and applying static electricity to the electrode corresponding to the self-recovered super-slide island, so that the self-recovered super-slide island is adsorbed to the electrode to which the static electricity is applied; contacting the treatment jig adsorbed with the self-recovered ultra-smooth island with a target substrate and applying pressure; separating the treatment jig adsorbed with the self-recovered super-slide island from the target substrate, and removing static electricity to enable the self-recovered super-slide island to be adsorbed on the target substrate.
2. The method of claim 1, wherein the surface of each electrode in the transparent electrode array is coated with a transparent insulating layer.
3. The ultra-smooth island processing method of claim 2, wherein when the transparent insulating layer is not a photoresist, coating a first photoresist on an upper surface of a substrate, and exposing and developing the first photoresist comprises: sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist; correspondingly, preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array, wherein the obtaining of the processing jig comprises the following steps: etching the electrode layer to form the transparent electrode array, and removing the second photoresist; coating a second sub-insulating layer on the upper surface of the transparent electrode array; coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist; and etching the second sub-insulating layer and removing the third photoresist.
4. The ultra-smooth island processing method of claim 2, wherein when the transparent insulating layer is a photoresist insulating layer, coating a first photoresist on an upper surface of a substrate, and exposing and developing the first photoresist comprises: sequentially laminating a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist; correspondingly, preparing a pushing layer on the upper surface of the first photoresist after development, and stripping the first photoresist to form a pushing body array, wherein the obtaining of the processing jig comprises the following steps: etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist; and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.
5. The method of claim 2, wherein the coating the upper surface of the substrate with the first photoresist and exposing and developing the first photoresist further comprises: and growing a transparent flexible insulating layer on the upper surface of the substrate.
6. The method of claim 1, wherein preparing the push layer on the upper surface of the first photoresist after development comprises: and preparing an electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode.
7. The method of any one of claims 1 to 6, further comprising, prior to said bringing the transparent electrode array into corresponding contact with the super-island array and applying pressure: and manufacturing an island cover on the upper surface of each super-slide island in the super-slide island array.
8. A super-slide pushing device used in the super-slide processing method as claimed in any one of claims 1 to 7, comprising:
a transparent substrate for observing the super-slip islands defining self-recovery;
the pushing body array is in corresponding contact with the super-slide island array and pushes the super-slide island array to move, the pushing body array is positioned on the surface of the transparent substrate and is transparent, and the pushing body array is the same as the super-slide island array to be pushed;
the pushing body array is a transparent electrode array, the transparent electrode array and the super-slide island array can be correspondingly contacted, static electricity is applied to the electrode corresponding to the super-slide island with self-recovery, and the self-recovery super-slide island and the electrode with static electricity are enabled to absorb or cancel electrostatic absorption.
9. The ultra-ski lift facility of claim 8, further comprising: and a transparent insulating layer disposed on a surface of each electrode in the transparent electrode array.
10. The ultra-ski lift facility of claim 9, further comprising: a transparent flexible insulating layer disposed between the transparent substrate and the transparent electrode array.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111073972.XA CN113788453B (en) | 2021-09-14 | 2021-09-14 | Super-slide island pushing device and super-slide island processing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111073972.XA CN113788453B (en) | 2021-09-14 | 2021-09-14 | Super-slide island pushing device and super-slide island processing method |
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| Publication Number | Publication Date |
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