CN113782479A - Repairing method of electrostatic chuck base - Google Patents
Repairing method of electrostatic chuck base Download PDFInfo
- Publication number
- CN113782479A CN113782479A CN202110849574.6A CN202110849574A CN113782479A CN 113782479 A CN113782479 A CN 113782479A CN 202110849574 A CN202110849574 A CN 202110849574A CN 113782479 A CN113782479 A CN 113782479A
- Authority
- CN
- China
- Prior art keywords
- electrostatic chuck
- groove
- chuck base
- repairing
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 14
- 238000005507 spraying Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 16
- 238000003754 machining Methods 0.000 claims description 7
- 229910052734 helium Inorganic materials 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000001788 irregular Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种静电吸盘基座的修复方法，属于静电吸盘技术领域，所述修复方法包括以下步骤：根据静电吸盘基座的表面破损处，以表面破损处为基础将表面破损处加工成形状规则的凹槽；测量所述凹槽的尺寸，将所述尺寸记录备用；根据所述凹槽的尺寸，加工制造用于填补所述凹槽的填块，将所述填块加工到与所述凹槽配合的尺寸；将所述加工好的填块嵌入到所述凹槽中；在所述填块的上表面上喷涂陶瓷层；使用雾化胶喷涂所述陶瓷层，形成表面灰黑的亮色；对所述静电吸盘的各个参数进行检测，判断修复后的静电吸盘是否符合要求。The invention discloses a repairing method for an electrostatic chuck base, belonging to the technical field of electrostatic chucks. The repairing method comprises the following steps: according to the surface damage of the electrostatic chuck base, processing the surface damage into a surface based on the surface damage. grooves with regular shapes; measure the dimensions of the grooves, and record the dimensions for later use; according to the dimensions of the grooves, process and manufacture the filling blocks for filling the grooves, and process the filling blocks to match the size of the grooves. The size of the groove matching; embedding the processed filling block into the groove; spraying a ceramic layer on the upper surface of the filling block; spraying the ceramic layer with atomized glue to form surface gray Black and bright color; each parameter of the electrostatic chuck is tested to determine whether the repaired electrostatic chuck meets the requirements.
Description
Technical Field
The invention relates to the technical field of electrostatic chucks, in particular to a method for repairing an electrostatic chuck base.
Background
Electrostatic chucks are often used in semiconductor processing equipment to support, for example, semiconductor wafers, and may use electrostatic force to attract a substrate during a trip process, thereby holding the substrate in place in the processing equipment
The electrostatic chuck comprises a base, if the base is damaged in the machining and manufacturing process, the electrostatic chuck can be unqualified, the base needs to be scrapped or separated out and then bonded well, manpower and material resources can be wasted by a direct scrapping mode, the base is separated out and then bonded well, the steps are complex, new damage is easily generated to the electrostatic chuck in the process of separating the base, and therefore a repairing method of the electrostatic chuck base is needed, so that the electrostatic chuck base is repaired conveniently.
Disclosure of Invention
The invention aims to provide a method for repairing an electrostatic chuck base, which can repair a damaged part of the electrostatic chuck base.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a method of repairing an electrostatic chuck base, the method comprising the steps of:
processing the surface damage position into a groove with a regular shape based on the surface damage position according to the surface damage position of the electrostatic chuck base;
measuring the size of the groove, and recording the size for later use;
according to the size of the groove, machining and manufacturing a filler block for filling the groove, and machining the filler block to the size matched with the groove;
embedding the processed filler block into the groove;
spraying a ceramic layer on the upper surface of the filling block;
spraying the ceramic layer by using atomized glue to form a bright gray and black surface;
and detecting each parameter of the electrostatic chuck, and judging whether the repaired electrostatic chuck meets the requirements.
Preferably, the groove is a polygonal groove or a cylindrical groove.
Preferably, the dimension comprises a depth of the recess.
Preferably, the height of the filler block is smaller than the depth of the groove.
Preferably, the material of the filler block is the same as the material of the electrostatic chuck base.
Preferably, the machining and manufacturing of the filler block comprises cutting of the filler block and grinding of the surface of the filler block.
Preferably, the parameters detected by the electrostatic chuck include an impedance coefficient, a leakage rate, a helium leakage rate and a heat conduction coefficient.
By adopting the technical scheme, the damaged part of the electrostatic chuck base is processed into the groove with a regular shape, then the groove is filled with the filler which is made of the same material as the electrostatic chuck base, the ceramic layer is sprayed on the filler which is matched with the groove, and atomized glue is used for spraying after the ceramic layer is sprayed.
Detailed Description
The following further describes the embodiments of the present invention. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
A method for repairing an electrostatic chuck base comprises the following steps:
processing the surface damage position into a groove with a regular shape on the basis of the surface damage position according to the surface damage position of the electrostatic chuck base, if the damaged area on the electrostatic chuck base is smaller, processing the damaged area into a cylindrical groove, wherein the cross section area of the groove is circular;
measuring the depth and radius of the cylindrical groove, and recording the depth and radius of the groove for later use;
processing and manufacturing a filling block for filling the groove according to the values of the depth and the radius of the cylindrical groove, processing the filling block to the size matched with the groove, wherein the filling block is cylindrical, cutting a round material which is the same as the material of the base of the electrostatic chuck according to the depth of the groove during processing, and then cutting and grinding the round material according to the radius of the cylindrical groove;
embedding the processed cylindrical filler block into the cylindrical groove;
spraying a ceramic layer on the upper surface of the cylindrical filling block, wherein other surfaces of the cylindrical filling block are matched with the cylindrical groove;
spraying a ceramic layer by using atomized glue to form a bright grey-black surface, wherein the height of the cylindrical filler is smaller than the depth of the groove, so that the surface of the whole electrostatic chuck base is kept flat after the ceramic layer and the atomized glue are sprayed on the upper surface of the cylindrical filler;
detecting the impedance coefficient, the leakage rate, the helium leakage rate and the heat conduction coefficient of the electrostatic chuck, and if the measured impedance coefficient, the leakage rate, the helium leakage rate and the heat conduction coefficient meet the product requirements, the repaired electrostatic chuck is a qualified product;
the electrostatic chuck base is required to be provided with a mounting hole for fixing the electrostatic chuck, if the mounting hole is damaged or has errors during processing, the mounting hole can be processed into a cylindrical groove larger than the mounting hole, then a filling block is manufactured and embedded into the cylindrical groove, and after a ceramic layer and atomized glue are sprayed on the filler, a hole for mounting the electrostatic chuck is processed on the filler;
by adopting the technical scheme, the damaged part of the electrostatic chuck base is processed into the groove with a regular shape, then the groove is filled with the filler which is made of the same material as the electrostatic chuck base, the ceramic layer is sprayed on the filler which is matched with the groove, and atomized glue is used for spraying after the ceramic layer is sprayed.
Example 2
A method for repairing an electrostatic chuck base comprises the following steps:
processing the surface damage position into a groove with a regular shape on the basis of the surface damage position according to the surface damage position of the electrostatic chuck base, if the damaged area on the electrostatic chuck base is larger, processing the damaged area into the groove with a certain shape, wherein the cross section area of the groove can be a regular polygon or an irregular polygon, and the regular polygon or the irregular polygon is determined according to the approximate shape of the damaged area;
measuring the depth of the polygonal groove, the length of the edge and the included angle between the edge and the adjacent edge, and recording the depth of the polygonal groove, the length of the edge and the included angle between the edge and the adjacent edge for later use;
processing and manufacturing a filling block for filling the groove according to the depth of the polygonal groove, the length of the edge and an included angle between the edge and an adjacent edge, processing the filling block to a size matched with the groove, wherein the filling block is a polygonal cylinder matched with the groove, and when the filling block is processed, if the filling block is a regular polygon, each surface can be processed on the basis of a circular material which is the same as the material of the electrostatic chuck base, the circular material is cut according to the depth of the groove, then cutting processing and grinding processing are carried out according to the edge length of the polygonal groove, if the filling block is an irregular polygon, the processing is carried out on the basis of the block-shaped material, and the base of the electrostatic chuck is generally made of aluminum materials, and because the direct welding at a damaged part can influence the electric conduction and heat conduction parameters of the electrostatic chuck base, the filling mode is required;
embedding the machined polygonal filling block into the multi-deformation groove;
spraying a ceramic layer on the upper surface of the polygonal filling block, wherein other surfaces of the polygonal filling block are matched with the polygonal grooves, and the surfaces of the filling block are fitted with the surfaces of the corresponding polygonal grooves;
spraying a ceramic layer by using atomized glue to form a bright grey-black surface, wherein the height of the polygonal filler is smaller than the depth of the polygonal groove, so that the flatness of the surface of the whole electrostatic chuck base is maintained after the ceramic layer and the atomized glue are sprayed on the upper surface of the polygonal filler, and the periphery of the groove needs to be shielded when the ceramic layer and the atomized glue are sprayed on the filler, so that the ceramic layer and the atomized glue layer are formed at the filler;
detecting the impedance coefficient, the leakage rate, the helium leakage rate and the heat conduction coefficient of the electrostatic chuck, and if the measured impedance coefficient, the leakage rate, the helium leakage rate and the heat conduction coefficient meet the product requirements, the repaired electrostatic chuck is a qualified product;
the electrostatic chuck base is required to be provided with a mounting hole for fixing the electrostatic chuck, if the mounting hole is damaged or has errors during processing, the mounting hole can be processed into a regular polygonal groove, then a polygonal filling block is manufactured and embedded into the polygonal groove, and a hole for mounting the electrostatic chuck is processed on the filling after a ceramic layer and atomized glue are sprayed on the filling;
by adopting the technical scheme, the damaged part of the electrostatic chuck base is processed into the groove with a regular shape, then the groove is filled with the filler which is made of the same material as the electrostatic chuck base, the ceramic layer is sprayed on the filler which is matched with the groove, and atomized glue is used for spraying after the ceramic layer is sprayed.
The embodiments of the present invention have been described in detail, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
The embodiments of the present invention have been described in detail, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (7)
1. A method for repairing an electrostatic chuck base is characterized in that: the repairing method comprises the following steps:
processing the surface damage position into a groove with a regular shape based on the surface damage position according to the surface damage position of the electrostatic chuck base;
measuring the size of the groove, and recording the size for later use;
according to the size of the groove, machining and manufacturing a filler block for filling the groove, and machining the filler block to the size matched with the groove;
embedding the processed filler block into the groove;
spraying a ceramic layer on the upper surface of the filling block;
spraying the ceramic layer by using atomized glue to form a bright gray and black surface;
and detecting each parameter of the electrostatic chuck, and judging whether the repaired electrostatic chuck meets the requirements.
2. The method of claim 1, wherein the step of repairing the electrostatic chuck base comprises: the groove is a polygonal groove or a cylindrical groove.
3. The method of claim 1, wherein the step of repairing the electrostatic chuck base comprises: the dimension includes a depth of the groove.
4. The method of claim 3, wherein the step of repairing the electrostatic chuck base comprises: the height of the filler block is smaller than the depth of the groove.
5. The method of claim 1, wherein the step of repairing the electrostatic chuck base comprises: the material of the filler block is the same as the material of the electrostatic chuck base.
6. The method of claim 5, wherein the step of repairing the electrostatic chuck base comprises: the machining and manufacturing of the filling block comprise cutting of the filling block and grinding of the surface of the filling block.
7. The method of claim 1, wherein the step of repairing the electrostatic chuck base comprises: the parameters detected by the electrostatic chuck comprise impedance coefficient, leakage rate, helium leakage rate and heat conduction coefficient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110849574.6A CN113782479A (en) | 2021-07-27 | 2021-07-27 | Repairing method of electrostatic chuck base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110849574.6A CN113782479A (en) | 2021-07-27 | 2021-07-27 | Repairing method of electrostatic chuck base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113782479A true CN113782479A (en) | 2021-12-10 |
Family
ID=78836096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110849574.6A Pending CN113782479A (en) | 2021-07-27 | 2021-07-27 | Repairing method of electrostatic chuck base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113782479A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118763046A (en) * | 2024-05-31 | 2024-10-11 | 君原电子科技(海宁)有限公司 | A repair method for electrostatic chuck metal substrate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100088872A1 (en) * | 2008-10-10 | 2010-04-15 | Hong Shih | Method of refurbishing bipolar electrostatic chuck |
| US20120307412A1 (en) * | 2011-06-02 | 2012-12-06 | Applied Materials, Inc. | Electrostatic chuck aln dielectric repair |
| TW201521133A (en) * | 2013-11-20 | 2015-06-01 | Tian-Yuan Yan | Reclaiming wafer susceptor and method for repairing the same |
| JP2017175076A (en) * | 2016-03-25 | 2017-09-28 | 日本特殊陶業株式会社 | Repair method for substrate support member |
| JP2017193737A (en) * | 2016-04-19 | 2017-10-26 | 日本特殊陶業株式会社 | Repair method for substrate support member |
| CN107680930A (en) * | 2016-08-01 | 2018-02-09 | 韩国艾科科技有限公司 | Electrostatic chuck and repair method |
| CN110036467A (en) * | 2016-12-12 | 2019-07-19 | 应用材料公司 | New-type restorative procedure for electrostatic chuck |
-
2021
- 2021-07-27 CN CN202110849574.6A patent/CN113782479A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100088872A1 (en) * | 2008-10-10 | 2010-04-15 | Hong Shih | Method of refurbishing bipolar electrostatic chuck |
| US20120307412A1 (en) * | 2011-06-02 | 2012-12-06 | Applied Materials, Inc. | Electrostatic chuck aln dielectric repair |
| TW201521133A (en) * | 2013-11-20 | 2015-06-01 | Tian-Yuan Yan | Reclaiming wafer susceptor and method for repairing the same |
| JP2017175076A (en) * | 2016-03-25 | 2017-09-28 | 日本特殊陶業株式会社 | Repair method for substrate support member |
| JP2017193737A (en) * | 2016-04-19 | 2017-10-26 | 日本特殊陶業株式会社 | Repair method for substrate support member |
| CN107680930A (en) * | 2016-08-01 | 2018-02-09 | 韩国艾科科技有限公司 | Electrostatic chuck and repair method |
| CN110036467A (en) * | 2016-12-12 | 2019-07-19 | 应用材料公司 | New-type restorative procedure for electrostatic chuck |
Non-Patent Citations (1)
| Title |
|---|
| 李炳宗等: "硅基集成芯片制造工艺原理", 30 November 2021, 复旦大学出版社, pages: 661 - 662 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118763046A (en) * | 2024-05-31 | 2024-10-11 | 君原电子科技(海宁)有限公司 | A repair method for electrostatic chuck metal substrate |
| CN118763046B (en) * | 2024-05-31 | 2025-02-11 | 君原电子科技(海宁)有限公司 | A repair method for electrostatic chuck metal substrate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211210 |