CN113764886B - 4G LTE broadband omnidirectional antenna and bandwidth adjusting method thereof - Google Patents
4G LTE broadband omnidirectional antenna and bandwidth adjusting method thereof Download PDFInfo
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Abstract
本发明提供一种4G LTE宽带全向天线及其带宽调节方法,包括:金属地板、介质基板、馈电SMA,介质基板远离金属地板一侧表面设置有与馈电SMA中心探针同心焊接的圆形金属贴片,沿圆形贴片的周向布置上弧形微带线;介质基板另一侧表面设有环形金属贴片,环形金属贴片与馈电SMA的中心探针同心设置,沿环形金属贴片周向布置有下弧形微带线,下弧形微带线与环形金属贴片之间通过连接枝节连接,且下弧形微带线间隔介质基板与上弧形微带线的位置相对应。多个等效电感和等效电容分别构成两个谐振点,两个谐振频点的谐振频率可以分别单独调谐,通过调整天线物理结构参数可以控制谐振频率的大小,使两个谐振频率分别位于通带的低端和高端,从而覆盖目标带宽。
The present invention provides a 4G LTE broadband omnidirectional antenna and its bandwidth adjustment method, comprising: a metal floor, a dielectric substrate, and a feed SMA. Shaped metal patch, the arc-shaped microstrip line is arranged along the circumference of the circular patch; the other side of the dielectric substrate is provided with a ring-shaped metal patch, and the ring-shaped metal patch is set concentrically with the center probe of the feeding SMA, along the The circular metal patch is circumferentially arranged with a lower arc-shaped microstrip line, and the lower arc-shaped microstrip line and the annular metal patch are connected by connecting branches, and the lower arc-shaped microstrip line is separated from the dielectric substrate and the upper arc-shaped microstrip line corresponding to the position. A plurality of equivalent inductances and equivalent capacitances respectively constitute two resonance points, and the resonance frequencies of the two resonance frequency points can be tuned separately. By adjusting the physical structure parameters of the antenna, the size of the resonance frequency can be controlled, so that the two resonance frequencies are respectively located at the low and high end of the band to cover the target bandwidth.
Description
技术领域technical field
本发明涉及天线技术领域,尤其是一种4G LTE全向天线。The invention relates to the technical field of antennas, in particular to a 4G LTE omnidirectional antenna.
背景技术Background technique
随着信息技术的快速发展,无线通信数据流量激增,这对无线基站也提出了更高的要求,天线作为发射和接收无线电信号的设备,在无线通信系统中有着举足轻重的地位。With the rapid development of information technology, the data traffic of wireless communication has increased sharply, which also puts forward higher requirements for wireless base stations. Antennas, as devices for transmitting and receiving radio signals, play a pivotal role in wireless communication systems.
一方面,基站天线需要能够覆盖足够大的阻抗带宽,例如1.7-2.7GHz包含了很多常用频段,如DCS1800(1710-1880MHz),PCS1900(1850-1990MHz),UMTS(1920-2170MHz),LTE2300(2305-2400MHz),LTE2500(2500-2690MHz)等,采用多天线或者频率可重构天线来覆盖这些频段,这样势必会带来耦合或者寄生等问题,增加系统的复杂度,而一个可以同时覆盖这些频段的天线显然是更优的解决方案。On the one hand, the base station antenna needs to be able to cover a sufficiently large impedance bandwidth. For example, 1.7-2.7GHz contains many common frequency bands, such as DCS1800 (1710-1880MHz), PCS1900 (1850-1990MHz), UMTS (1920-2170MHz), LTE2300 (2305MHz -2400MHz), LTE2500 (2500-2690MHz), etc., use multiple antennas or frequency reconfigurable antennas to cover these frequency bands, which will inevitably lead to problems such as coupling or parasitic, increasing the complexity of the system, and one can cover these frequency bands at the same time The antenna is obviously a better solution.
另一方面,全向天线因为可以在某个方位面上实现信号的360°全覆盖,在无线通信基站尤其是室内通信基站中有很大的需求。因此,研究宽带全向天线具有重要的现实意义。On the other hand, omnidirectional antennas are in great demand in wireless communication base stations, especially indoor communication base stations, because they can achieve 360° full coverage of signals on a certain azimuth plane. Therefore, it is of great practical significance to study broadband omnidirectional antennas.
发明内容Contents of the invention
为了解决上述问题,本发明采用的技术方案是:In order to solve the above problems, the technical solution adopted in the present invention is:
一种4G LTE宽带全向天线,包括:金属地板、介质基板、馈电SMA,A 4G LTE broadband omnidirectional antenna, including: metal floor, dielectric substrate, feed SMA,
所述金属地板与所述介质基板之间通过金属柱进行支撑连接,The metal floor and the dielectric substrate are supported and connected by metal columns,
所述馈电SMA的中心探针穿过所述介质基板,所述介质基板远离所述金属地板一侧表面设置有与所述馈电SMA中心探针同心焊接的圆形金属贴片,沿所述圆形贴片的周向布置上弧形微带线;The central probe of the feeding SMA passes through the dielectric substrate, and the surface of the dielectric substrate away from the metal floor is provided with a circular metal patch concentrically welded with the central probe of the feeding SMA. Arrange arc-shaped microstrip lines in the circumferential direction of the circular patch;
所述介质基板另一侧表面设有环形金属贴片,所述环形金属贴片与所述馈电SMA的中心探针同心设置,沿所述环形金属贴片周向布置有下弧形微带线,所述下弧形微带线与所述环形金属贴片之间通过所述连接枝节连接,且所述下弧形微带线间隔介质基板与所述上弧形微带线的位置相对应;The other side surface of the dielectric substrate is provided with a ring-shaped metal patch, the ring-shaped metal patch is arranged concentrically with the central probe of the feeding SMA, and a lower arc-shaped microstrip is arranged along the circumference of the ring-shaped metal patch line, the lower arc-shaped microstrip line and the ring-shaped metal patch are connected through the connecting branch, and the position of the lower arc-shaped microstrip line between the dielectric substrate and the upper arc-shaped microstrip line is the same correspond;
所述圆形金属贴片与所述环形金属贴片在馈电SMA中心探针延伸方向部分重叠;The circular metal patch partially overlaps with the annular metal patch in the extending direction of the feeding SMA center probe;
所述金属柱穿过介质基板并与所述上弧形微带线末端相连接。The metal post passes through the dielectric substrate and is connected to the end of the upper arc-shaped microstrip line.
进一步地,所述上弧形微带线的数量为多个,多个所述上弧形微带线绕馈电SMA中心探针圆形等距阵列;Further, the number of the upper arc-shaped microstrip lines is multiple, and the number of the upper arc-shaped microstrip lines is a circular equidistant array around the center probe of the feeding SMA;
所述下弧形微带线的数量与所述上弧形微带线相同;The number of the lower arc microstrip lines is the same as that of the upper arc microstrip lines;
所述金属柱的数量与所述上弧形微带线相同。The number of the metal pillars is the same as that of the upper arc-shaped microstrip lines.
进一步地,所述上弧形微带线的数量为三个。Further, the number of the upper arc-shaped microstrip lines is three.
进一步地,所述环形金属贴片内环直径大于馈电SMA中心探针的直径。Further, the diameter of the inner ring of the annular metal patch is larger than the diameter of the central probe of the feeding SMA.
进一步地,所述介质基板为圆形介质基板。Further, the dielectric substrate is a circular dielectric substrate.
进一步地,所述金属地板为圆形,所述金属地板开设有中心孔,所述馈电SMA的探针穿过中心孔,所述中心孔的周围还开设有固定孔,固定螺栓穿过固定孔,将馈电SMA固定在金属地板上。Further, the metal floor is circular, and the metal floor is provided with a central hole, the probe of the feeding SMA passes through the central hole, and there are fixing holes around the central hole, and the fixing bolts pass through the fixing hole. holes to secure the feed SMA to the metal floor.
进一步地,所述金属柱和金属地板垂直连接,所述地板和介质基板互相平行,所述金属地板与所述介质基板之间具有间隙。Further, the metal column is vertically connected to the metal floor, the floor and the dielectric substrate are parallel to each other, and there is a gap between the metal floor and the dielectric substrate.
进一步地,所述下弧形微带线的靠近所述金属柱一端与所述金属柱不相交。Further, the end of the lower arc microstrip line close to the metal pillar does not intersect the metal pillar.
本申请还提供一种4G LTE宽带全向天线的带宽调节方法,用于对上述的4GLTE宽带全向天线的宽带频率进行调节,带宽调节方法包括:The present application also provides a bandwidth adjustment method of a 4G LTE broadband omnidirectional antenna, which is used to adjust the broadband frequency of the above-mentioned 4GLTE broadband omnidirectional antenna. The bandwidth adjustment method includes:
分别调节低端带通的谐振频率和高端带通的谐振频率,并使低端带通频率和高端带通频率组合,覆盖较宽的谐振频段。The resonance frequency of the low-end bandpass and the resonance frequency of the high-end bandpass are adjusted separately, and the combination of the low-end bandpass frequency and the high-end bandpass frequency covers a wide resonance frequency band.
进一步地,调节低端带通谐振频率包括:通过调节所述圆形金属贴片与所述弧形金属贴片的重叠面积、调整馈电SMA中心探针的粗细,来调节低端带通谐振频率,同时通过调整上弧形微带线与下弧形微带线的重叠面积、调整金属柱的粗细,来调节高端带通谐振频率;Further, adjusting the low-end bandpass resonance frequency includes: adjusting the overlapping area of the circular metal patch and the arc-shaped metal patch, and adjusting the thickness of the feeding SMA center probe to adjust the low-end bandpass resonance At the same time, adjust the high-end bandpass resonant frequency by adjusting the overlapping area of the upper arc microstrip line and the lower arc microstrip line, and adjusting the thickness of the metal pillar;
或,or,
通过调整上弧形微带线与下弧形微带线的重叠面积、调整金属柱的粗细,来调节低端带通谐振频率,同时通过调节所述圆形金属贴片与所述弧形金属贴片的重叠面积、调整馈电SMA中心探针的粗细,来调节高端带通谐振频率。By adjusting the overlapping area of the upper arc-shaped microstrip line and the lower arc-shaped microstrip line, and adjusting the thickness of the metal pillars, the low-end bandpass resonant frequency can be adjusted. At the same time, by adjusting the circular metal patch and the arc-shaped metal The overlapping area of the patch and the thickness of the central probe of the feeding SMA are adjusted to adjust the high-end bandpass resonant frequency.
本发明的有益效果体现在:The beneficial effects of the present invention are reflected in:
馈电SMA中心探针等效而成的电感,圆形金属贴片与环形贴片等效而成的电容,构成的串联谐振回路形成第一谐振频点;设置在介质基板上下表面的上弧形微带线和下弧形微带线构成的等效电容,与上弧形微带线末端相连接的金属柱等效而成电感,构成的串联谐振回路形成第二谐振频点。两个谐振频点的谐振频率可以分别单独调谐,通过调整天线物理结构参数可以控制谐振频率的大小,使两个谐振频率分别位于通带的低端和高端,从而覆盖目标带宽。在使天线拥有更宽的带宽的同时不增加天线的数量以及复杂程度,无需对天线进行可重构设置。The inductance equivalent to the central probe of the feeding SMA, the capacitance equivalent to the circular metal patch and the ring patch, and the series resonant circuit formed form the first resonance frequency point; the upper arc set on the upper and lower surfaces of the dielectric substrate The equivalent capacitance formed by the arc-shaped microstrip line and the lower arc-shaped microstrip line is equivalent to the metal column connected to the end of the upper arc-shaped microstrip line to form an inductance, and the series resonant circuit formed forms the second resonance frequency point. The resonant frequencies of the two resonant frequency points can be tuned separately, and the size of the resonant frequency can be controlled by adjusting the physical structure parameters of the antenna, so that the two resonant frequencies are respectively located at the low end and high end of the passband, thereby covering the target bandwidth. While making the antenna have a wider bandwidth, the number and complexity of the antenna are not increased, and there is no need to perform reconfigurable settings on the antenna.
上弧形微带线和下弧形微带线沿馈电SMA的周向布置使发出的电磁波能够沿中心SMA的中心探针周向发出,实现中心探针周向的360°信号覆盖。The upper arc-shaped microstrip line and the lower arc-shaped microstrip line are arranged along the circumference of the feed SMA so that the emitted electromagnetic waves can be emitted along the circumference of the center probe of the central SMA, realizing 360° signal coverage of the center probe circumference.
附图说明Description of drawings
图1为本发明实施例中天线爆炸结构示意图;Fig. 1 is a schematic diagram of an antenna explosion structure in an embodiment of the present invention;
图2为本发明实施例中天线的介质基板俯视图;Fig. 2 is a top view of the dielectric substrate of the antenna in the embodiment of the present invention;
图3为本发明实施例中天线的介质基板仰视图;Fig. 3 is a bottom view of the dielectric substrate of the antenna in the embodiment of the present invention;
图4为本发明实施例中天线的主视图;Fig. 4 is the front view of the antenna in the embodiment of the present invention;
图5为本发明实施例中天线的等效电路图;Fig. 5 is the equivalent circuit diagram of the antenna in the embodiment of the present invention;
图6为本发明实施例中天线的实测反射系数图;FIG. 6 is a diagram of the measured reflection coefficient of the antenna in the embodiment of the present invention;
图7为本发明实施例中天线的辐射方向图;Fig. 7 is the radiation pattern diagram of the antenna in the embodiment of the present invention;
附图标记:Reference signs:
金属地板-10、中心孔-11、固定孔-12;Metal floor-10, center hole-11, fixing hole-12;
介质基板-20;Dielectric Substrate-20;
馈电SMA-30、中心探针-31、固定螺栓-32;Feed SMA-30, center probe-31, fixing bolt-32;
圆形金属贴片-51、环形金属贴片-52、上弧形微带线-53、下弧形微带线-54、连接枝节-55、金属柱-56。Circular metal patch-51, circular metal patch-52, upper arc-shaped microstrip line-53, lower arc-shaped microstrip line-54, connection branch-55, metal column-56.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。若未特别指明,实施例中所用的技术手段为本领域技术人员所熟知的常规手段。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Unless otherwise specified, the technical means used in the embodiments are conventional means well known to those skilled in the art.
如图1到图7所示,本发明提供一种4G LTE宽带全向天线,包括:金属地板10、介质基板20、馈电SMA30,所述金属地板10与所述介质基板20之间通过金属柱56进行支撑连接,As shown in Figures 1 to 7, the present invention provides a 4G LTE broadband omnidirectional antenna, including: a
所述馈电SMA30的中心探针31穿过所述介质基板20,所述介质基板20远离所述金属地板10一侧表面设置有与所述馈电SMA30中心探针31同心焊接的圆形金属贴片51,沿所述圆形贴片的周向布置上弧形微带线53;The
所述介质基板20另一侧表面设有环形金属贴片52,所述环形金属贴片52与所述馈电SMA30的中心探针31同心设置,沿所述环形金属贴片52周向布置有下弧形微带线54,所述下弧形微带线54与所述环形金属贴片52之间通过所述连接枝节55连接,且所述下弧形微带线54间隔介质基板20与所述上弧形微带线53的位置相对应;The other side surface of the
所述圆形金属贴片51与所述环形金属贴片52在馈电SMA30中心探针31延伸方向部分重叠;所述金属柱56穿过介质基板20并与所述上弧形微带线53末端相连接。The
现有的能够覆盖足够大的阻抗带宽的天线,一般是通过多天线结构或是频率可重构天线来覆盖这些频段,这样势必会带来耦合或者寄生问题,并且还会增加天线和/或功放系统的复杂度,造成制造难度以及制造成本的增加。Existing antennas that can cover a sufficiently large impedance bandwidth generally use multi-antenna structures or frequency reconfigurable antennas to cover these frequency bands, which will inevitably cause coupling or parasitic problems, and will also increase antennas and/or power amplifiers The complexity of the system increases manufacturing difficulty and manufacturing cost.
本发明所提供的技术方案通过馈电SMA30中心探针31等效而成的电感,圆形金属贴片51与环形贴片等效而成的电容,构成的串联谐振回路形成第一谐振频点;设置在介质基板20上下表面的上弧形微带线53和下弧形微带线54构成的等效电容,与上弧形微带线53末端相连接的金属柱56等效而成电感,构成的串联谐振回路形成第二谐振频点。两个谐振频点的谐振频率可以分别单独调谐,通过调整天线物理结构参数可以控制谐振频率的大小,使两个谐振频率分别位于通带的低端和高端,从而覆盖目标带宽1.7-2.7GHz。在使天线拥有更宽的带宽的同时不增加天线的数量以及复杂程度,无需对天线进行可重构设置。The technical solution provided by the present invention forms the inductance equivalent to the
需要说明的是,上述的两个谐振频点的馈电方式为,馈电SMA30的接口与信号线相连接,高频振荡电流由馈电SMA30的接口进入,到馈电SMA30的中心探针31处,圆形金属贴片51的中心与馈电SMA30的中心探针31相焊接,圆形金属贴片51与环形金属贴片52在馈电SMA30的中心探针31延伸方向部分重叠,中间间隔介质基板20,此时其重叠部分与重叠部分之间的介质基板20共同构成平板电容;相应的,上弧形微带线53和下弧形微带线54的位置隔介质基板20相对应,即上弧形微带线53与下弧形微带线54隔介质基板20相重合,使上弧形微带线53、介质基板20、下弧形微带线54共同构成了另外一个平板电容,由下弧形微带线54向上弧形微带线53进行馈电,上弧形微带线53通过金属柱56进行接地,并形成等效电感。最终所输入的高频振荡电流由金属柱56处产生电磁波向外辐射。It should be noted that the feeding method of the above two resonant frequency points is that the interface of the feeding SMA30 is connected to the signal line, and the high-frequency oscillating current enters through the interface of the feeding SMA30, and then reaches the
图5左侧所示为本发明的等效电容和等效电感的示意图,其中馈电SMA30的中心探针31等效成电感L1,圆形金属贴片51和环形金属贴片52的重叠部分等效成电容C1;上弧形微带线53和下弧形微带线54等效成电容C2,金属柱56等效成电感L2。电路图如图5右侧所示,L1和C1构成串联谐振回路形成第一谐振频点、L2和C2构成串联谐振回路形成第一谐振频点。The left side of Fig. 5 shows the schematic diagram of equivalent capacitance and equivalent inductance of the present invention, wherein the
圆形金属贴片51和环形金属贴片52之间、上弧形微带天线和下弧形微带天线之间所形成的等效电容均为平板电容,相比于直接连接电容器,采用等效形成的平板电容,简化了天线的安装结构,并且可以覆盖足够大的整段带宽。The equivalent capacitance formed between the
进一步地,上弧形微带线53的数量为多个,多个上弧形微带线53绕馈电SMA30中心探针31圆形等距阵列;Further, the number of upper arc-shaped
下弧形微带线54的数量与上弧形微带线53相同;The number of the lower
金属柱56的数量与上弧形微带线53相同。The number of
需要说明的下弧形微带线54和金属柱56的数量、阵列角度,均与上弧形微带线相同,则每一个上弧形微带线都有一个分别与其一一对应的下弧形微带线和金属柱。The numbers and array angles of the lower
金属柱56处产生的电磁波向外辐射,每一组上弧形微带线53和上弧形微带线53所构成的平板电容连接一个金属柱56,多个上弧形微带线53饶馈电SMA30等中心探针31圆形等距阵列,使得金属柱56等距的围绕布置在馈电SMA30的中心探针31周围,均匀的进行布置,这多个金属柱56所产生的电磁波具有较好的对称性分布,从而得到对称性较好的电磁场,使天线具有更好的全向辐射性能。The electromagnetic waves generated at the
进一步地,上弧形微带线53的数量为三个。Further, the number of the upper arc-shaped
如图1所示,当上弧形微带线53的数量为三个时,下弧形微带线54、金属柱56的数量也分别为三个,此时所产生的电磁场具有较好的对称性,并且数量为三个在电磁场对称性和天线的生产成本之间可以得到很好的均衡。As shown in Figure 1, when the number of the upper arc-shaped
图6所示为金属柱56的数量为三个时,天线的实测反射系数图,本申请所提供的4GLTE宽带全向天线在1.7-2.7GHz频段的反射系数均小于-10dp,符合天线的设计要求。Figure 6 shows the measured reflection coefficient diagram of the antenna when the number of
图7所示为金属柱56的数量为三个时,1.7-2.7GHz频段的天线辐射方向图,由附图中可以清楚的看出本发明所提供的4GLTE宽带全向天线对1.7-2.7GHz频段的信号进行发射时所产生的电磁场对称性较好,使得天线具有更好地全向辐射性能。Figure 7 shows that when the number of
进一步地,环形金属贴片52内环直径大于馈电SMA30中心探针31的直径。Further, the diameter of the inner ring of the
使环形金属贴片52与馈电SMA30的中心探针31之间具有一定间隙,馈电SMA30的中心探针31利用电容耦合的方式馈电,可以提高天线的阻抗匹配效果。There is a certain gap between the
进一步地,介质基板20为圆形介质基板20。Further, the
馈电SMA30中心探针31穿设过圆形的介质基板20的中心,上弧形微带线53和下弧形微带线54布置在圆形介。The
进一步地,金属地板10为圆形,金属地板10开设有中心孔11,馈电SMA30的探针穿过中心孔11,中心孔11的周围还开设有固定孔12,固定螺栓32穿过固定孔12,将馈电SMA30固定在金属地板10上。馈电SMA30通过固定螺栓32和固定孔12进行安装固定,馈电SMA30的中心探针31穿过中心孔11再延伸至介质基板20处,对介质基板20上的弧形微带线进行馈电。Further, the
进一步地,金属柱56和金属地板10垂直连接,地板和介质基板20互相平行,金属地板10与介质基板20之间具有间隙。Further, the
金属地板10与介质基板20之间的间隙中以空气为介质,进一步拓展天线的阻抗带宽。Air is used as the medium in the gap between the
进一步地,下弧形微带线54的靠近金属柱56一端与金属柱56不相交。即靠近金属柱56一端的下弧形微带线54的长度要短于上弧形微带线53的长度,上弧形微带线53多出来的一段与金属柱56连接,仅有上弧形微带线53与金属柱56连接产生等效电感与平板电容共同形成谐振回路,高频振荡电流先经过上弧微带线和下弧形微带线54等效成的电容后,再进入金属柱56,在金属柱56处产生向空气中辐射的电磁场。Further, the end of the lower
本申请还提供一种4G LTE宽带全向天线的带宽调节方法,用于对上述的4GLTE宽带全向天线的宽带频率进行调节,带宽调节方法包括:The present application also provides a bandwidth adjustment method of a 4G LTE broadband omnidirectional antenna, which is used to adjust the broadband frequency of the above-mentioned 4GLTE broadband omnidirectional antenna. The bandwidth adjustment method includes:
分别调节低端带通的谐振频率和高端带通的谐振频率,并使低端带通频率和高端带通频率组合,覆盖较宽的谐振频段。The resonance frequency of the low-end bandpass and the resonance frequency of the high-end bandpass are adjusted separately, and the combination of the low-end bandpass frequency and the high-end bandpass frequency covers a wide resonance frequency band.
本发明的一个目的在于提供一种宽带的天线,以替代现有的通过多天线或是可重构方式实现的宽带天线,简化宽带天线的结构,避免出现不必要的耦合和寄生等问题。通过设置两个谐振回路分别形成的第一谐振点和第二谐振点,两个谐振频点的谐振频率可以分别单独调谐,通过调整天线物理结构参数可以控制谐振频率的大小,使两个谐振频率分别位于通带的低端和高端,从而覆盖目标带宽1.7-2.7GHz。也即在进行调整时若第一谐振点调整为低端带通频率,则第二谐振点调整为高端带通频率;若第一谐振点调整为高端带通频率,则第二谐振点调整为低端带通频率。An object of the present invention is to provide a broadband antenna to replace existing broadband antennas realized by multiple antennas or reconfigurable methods, simplify the structure of the broadband antenna, and avoid unnecessary coupling and parasitic problems. By setting the first resonant point and the second resonant point formed by the two resonant circuits, the resonant frequencies of the two resonant frequency points can be tuned separately, and the resonant frequency can be controlled by adjusting the physical structure parameters of the antenna, so that the two resonant frequencies They are respectively located at the low end and high end of the passband, thus covering the target bandwidth of 1.7-2.7GHz. That is to say, if the first resonance point is adjusted to the low-end band-pass frequency during adjustment, the second resonance point is adjusted to the high-end band-pass frequency; if the first resonance point is adjusted to the high-end band-pass frequency, the second resonance point is adjusted to Low end bandpass frequency.
使高端带通频率和低端带通频率组合,共同覆盖目标带宽频段,无需多条天线组合或是对天线进行可重构,只用一条天线即可实现宽带天线。Combining the high-end band-pass frequency and the low-end band-pass frequency to jointly cover the target bandwidth frequency band does not require the combination of multiple antennas or reconfigurable antennas, and only one antenna can be used to realize the broadband antenna.
进一步地,调节低端带通谐振频率包括:通过调节所述圆形金属贴片与所述弧形金属贴片的重叠面积、调整馈电SMA中心探针的粗细,来调节低端带通谐振频率,同时通过调整上弧形微带线与下弧形微带线的重叠面积、调整金属柱的粗细,来调节高端带通谐振频率;Further, adjusting the low-end bandpass resonance frequency includes: adjusting the overlapping area of the circular metal patch and the arc-shaped metal patch, and adjusting the thickness of the feeding SMA center probe to adjust the low-end bandpass resonance At the same time, adjust the high-end bandpass resonant frequency by adjusting the overlapping area of the upper arc microstrip line and the lower arc microstrip line, and adjusting the thickness of the metal pillar;
或,or,
通过调整上弧形微带线与下弧形微带线的重叠面积、调整金属柱的粗细,来调节低端带通谐振频率,同时通过调节所述圆形金属贴片与所述弧形金属贴片的重叠面积、调整馈电SMA中心探针的粗细,来调节高端带通谐振频率。By adjusting the overlapping area of the upper arc-shaped microstrip line and the lower arc-shaped microstrip line, and adjusting the thickness of the metal pillars, the low-end bandpass resonant frequency can be adjusted. At the same time, by adjusting the circular metal patch and the arc-shaped metal The overlapping area of the patch and the thickness of the central probe of the feeding SMA are adjusted to adjust the high-end bandpass resonant frequency.
具体地,增加圆形贴片的大小或者减小环形贴片内环直径大小,可以使得圆形贴片和环形贴片的重叠面积增大,进而增加二者构成的电容L1的容值,从而使得第一个谐振频率向低频移动,反之亦然。另外一方面,减小上弧形微带线53和/或下弧形微带线54的长度可以减小上弧形微带线53和下弧形微带线54的重叠面积,进而减小基板上下表面弧形微带线之间形成的电容的容值,从而使得第二个谐振频率向高频方向移动,反之亦然。Specifically, increasing the size of the circular patch or reducing the diameter of the inner ring of the circular patch can increase the overlapping area of the circular patch and the circular patch, thereby increasing the capacitance of the capacitor L1 formed by the two, thereby This shifts the first resonant frequency towards lower frequencies and vice versa. On the other hand, reducing the length of the upper arc-shaped
再者,馈电SMA30的中心探针31以及金属柱56的粗细影响到电感的感值,具体地,馈电SMA30的中心探针31或金属柱56越细,电感的感值越大,第一个谐振频率或第二谐振评率越低。Furthermore, the thickness of the
将第一谐振点或第二谐振点分别调整为低端带通或高端带通,使天线的带宽可以覆盖更宽的频段。Adjusting the first resonance point or the second resonance point to low-end band-pass or high-end band-pass respectively enables the bandwidth of the antenna to cover a wider frequency band.
在本发明的实施例的描述中,需要理解的是,术语“上”、“下”、“前”、“后”、“左”、“右”、“坚直”、“水平”、“中心”、“顶”、“底”、“顶部”、“底部”、“内”、“外”、“内侧”、“外侧”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了使于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。其中,“里侧”是指内部或围起来的区域或空间。“外围”是指某特定部件或特定区域的周围的区域。In describing the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "straight", "horizontal", " Orientations or positional relationships indicated by "center", "top", "bottom", "top", "bottom", "inner", "outer", "inner", "outer", etc. are based on the orientation or position shown in the drawings The positional relationship is only for the purpose of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Wherein, "inside" refers to an internal or enclosed area or space. "Periphery" refers to the area around a particular component or a particular area.
在本发明的实施例的描述中,术语“第一”、“第二”、“第三”、“第四”仅用以描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”、“第三”、“第四”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。In the description of the embodiments of the present invention, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implying The number of technical characteristics indicated. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
在本发明的实施例的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“组装”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", "connection", and "assembly" should be understood in a broad sense, for example, it may be fixed The connection can also be a detachable connection or an integral connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.
在本发明的实施例的描述中,具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of the embodiments of the present invention, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.
在本发明的实施例的描述中,需要理解的是,“-”和“~”表示的是两个数值之同的范围,并且该范围包括端点。例如:“A-B”表示大于或等于A,且小于或等于B的范围。“A~B”表示大于或等于A,且小于或等于B的范围。In the description of the embodiments of the present invention, it should be understood that "-" and "~" indicate the same range of two numerical values, and the range includes the endpoint. For example: "A-B" means greater than or equal to A, and less than or equal to the range of B. "A to B" means a range that is greater than or equal to A and less than or equal to B.
在本发明的实施例的描述中,本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。In the description of the embodiments of the present invention, the term "and/or" herein is only an association relationship describing associated objects, which means that there may be three relationships, for example, A and/or B, which can mean: exist alone A, A and B exist at the same time, and B exists alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents.
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