CN113758323A - Temperature equalizing plate structure - Google Patents

Temperature equalizing plate structure Download PDF

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Publication number
CN113758323A
CN113758323A CN202010507555.0A CN202010507555A CN113758323A CN 113758323 A CN113758323 A CN 113758323A CN 202010507555 A CN202010507555 A CN 202010507555A CN 113758323 A CN113758323 A CN 113758323A
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CN
China
Prior art keywords
sheet
plate
sheet body
vapor
groove
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Pending
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CN202010507555.0A
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Chinese (zh)
Inventor
洪银树
尹佐国
李明聪
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Sunonwealth Electric Machine Industry Co Ltd
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Sunonwealth Electric Machine Industry Co Ltd
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Publication of CN113758323A publication Critical patent/CN113758323A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a temperature-uniforming plate structure which is used for solving the problem that the existing temperature-uniforming plate structure is still easy to deform when thinned. The method comprises the following steps: a first sheet body; and the first sheet body and the second sheet body are respectively provided with a groove, the periphery of the groove is provided with an annular edge, the first sheet body and the second sheet body are combined to form a cavity by the groove, the groove of the first sheet body and the groove of the second sheet body are respectively provided with at least one supporting rib, two ends of each supporting rib extend between the annular edges at two sides of the groove, and the supporting rib of the first sheet body is abutted with at least one part of the supporting rib of the second sheet body so that the supporting rib of the first sheet body is intersected with the supporting rib of the second sheet body to form an included angle.

Description

Temperature equalizing plate structure
Technical Field
The present invention relates to a heat dissipation device, and more particularly, to a temperature equalization plate structure for dissipating heat of an electronic device.
Background
In an electronic product, an existing temperature equalizing plate is combined on the surface of a heating source, the existing temperature equalizing plate is provided with an upper plate body and a lower plate body, a cavity is arranged between the upper plate body and the lower plate body, the cavity is filled with a working fluid, the heating source can heat the working fluid and vaporize the working fluid, the gaseous working fluid is evaporated to one side far away from the heat source and then is condensed, and therefore the heat away from the heating source can be taken to achieve the purpose of heat dissipation. Generally speaking, the chamber has a plurality of supporting pillars, which respectively abut against the upper plate and the lower plate, thereby preventing the chamber from being squeezed. However, when the conventional vapor chamber is used for a minute electronic component and is thinned, the conventional vapor chamber is still easily deformed to affect the chamber.
In view of the above, there is still a need for improvement of the conventional vapor chamber.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a temperature equalization plate structure, which can improve the structural strength.
All directions or similar expressions such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are mainly referred to the directions of the drawings, and are only used for assisting the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.
The use of the terms a or an for the elements and components described throughout this disclosure are for convenience only and provide a general sense of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The terms "coupled," "combined," and "assembled" as used herein include the separation of components without damaging the components after they are connected, and the separation of components after they are connected, which can be selected by those skilled in the art according to the material and assembly requirements of the components to be connected.
The temperature equalization plate structure of the invention comprises: a first sheet body; and the first sheet body and the second sheet body are respectively provided with a groove, the periphery of the groove is provided with an annular edge, the first sheet body and the second sheet body are combined to form a cavity by the groove, the groove of the first sheet body and the groove of the second sheet body are respectively provided with at least one supporting rib, two ends of each supporting rib extend between the annular edges at two sides of the groove, and the supporting rib of the first sheet body is abutted with at least one part of the supporting rib of the second sheet body so that the supporting rib of the first sheet body is intersected with the supporting rib of the second sheet body to form an included angle.
Therefore, the temperature-uniforming plate structure of the invention can be provided with the supporting ribs through the first sheet body and the second sheet body respectively, and the supporting ribs can extend between the first sheet body and the second sheet body at the annular edges at two sides of the groove to form a supporting structure for the whole deformation resistance of the first sheet body and the second sheet body, thereby realizing the effect of further improving the strength of the temperature-uniforming plate structure.
Wherein both ends of at least one of the support ribs are connected to the annular edges on opposite sides of the groove. Therefore, the structure strength of the temperature-uniforming plate is improved.
Wherein, the both ends of at least one this support rib are connected the ring limit of this groove adjacent both sides. Therefore, the structure strength of the temperature-uniforming plate is improved.
Wherein at least one end of each support rib is not connected with the ring edges at two sides of the groove and has a gap. Therefore, the heat dissipation efficiency of the temperature equalization plate is improved.
Wherein, the supporting rib of the first sheet body is orthogonal to the supporting rib of the second sheet body. Therefore, the structure strength of the temperature-uniforming plate is improved.
Wherein, the supporting rib of the first sheet body is not orthogonal to the supporting rib of the second sheet body. Therefore, the structure strength of the temperature-uniforming plate is improved.
Wherein, the both ends of the support rib of this first lamellar body are connected respectively in the ring limit of the adjacent both sides in this groove, and the both ends of the support rib of this second lamellar body are connected respectively in the ring limit of the relative both sides in this groove. Therefore, the structure strength of the temperature-uniforming plate is improved.
Wherein the chamber is filled with a working fluid. Therefore, the temperature-equalizing plate structure can utilize the working fluid to absorb heat so as to carry out heat transfer, and has the effect of maintaining the heat dissipation efficiency.
Wherein the chamber has a capillary structure. Therefore, the capillary structure can help the condensed working fluid to be gathered again for backflow, and the heat dissipation efficiency is improved.
Wherein, the supporting rib of the first sheet body and the supporting rib of the second sheet body are not overlapped with each other, and the groove surface of the second sheet body and the groove surface of the first sheet body which are opposite can form a channel. Therefore, the working fluid in the cavity can be circulated through the channel and filled in the cavity.
The support rib of the first sheet body and the support rib of the second sheet body are respectively provided with an enlarged part, and the enlarged parts are positioned at the joint of the support rib of the first sheet body and the support rib of the second sheet body. Therefore, when the abutting positions of the support ribs of the first sheet body and the support ribs of the second sheet body are welded, the welding device has the effect of improving the welding convenience.
The temperature equalizing plate structure further comprises a welding part, the welding part is located on the annular edge of the first plate body and the annular edge of the second plate body, the welding part surrounds the cavity, and the welding part is provided with a notch. Therefore, the annular edge of the first sheet body or the annular edge of the second sheet body can be used for forming the injection port of the working fluid, and an additional convex outlet does not need to be formed for injecting the working fluid, so that the cost is saved.
Wherein the width of the notch is less than or equal to 5 mm. Therefore, a small amount of repair welding can be carried out on the notch to seal the notch, and the notch sealing method has the effect of simplifying the notch sealing step.
Wherein, the width of the gap is less than or equal to 1 mm. Therefore, a small amount of repair welding can be carried out on the notch to seal the notch, and the notch sealing device has the effects of further simplifying the step of sealing the notch and reducing the loss of materials.
Wherein, the annular edge of the first sheet body and the annular edge of the second sheet body form a leaning part, and the leaning part is opposite to the notch. Therefore, the first sheet body and the second sheet body can be slightly propped out of a gap by abutting against the abutting part through a tool, and the working fluid can be easily injected into the gap.
Wherein, the abutting part is a hole formed by inwards concave arrangement of the periphery of the first sheet body or the second sheet body. Therefore, the abutting part can form a step difference on the annular edge, and the tool can be easily inserted between the first sheet body and the second sheet body through the abutting part.
Wherein, the abutting part is a flange which is outwards projected from the periphery of the first sheet body or the second sheet body. Therefore, the abutting part can form a step difference on the annular edge, and the tool can be easily inserted between the first sheet body and the second sheet body through the abutting part.
The abutting part is a gap formed by inwards recessing the periphery of the first sheet body or the second sheet body, and a flange outwards protruding from the periphery of the opposite second sheet body or the first sheet body. Therefore, the abutting part can form a step difference on the annular edge, and the tool can be easily inserted between the first sheet body and the second sheet body through the abutting part.
Wherein, the ring edge of the first sheet and the ring edge of the second sheet have a welding seal part, and the welding seal part is aligned to the notch. Thus, the gap can be closed.
Wherein, the welding part is connected with the welding part. Can ensure that no gap is formed between the welding part and the welding part, and has the effect of avoiding the working fluid in the cavity from seeping out.
Wherein, the welding sealing part is connected with the welding part adjacent to the gap. Therefore, only the part adjacent to the notch can be welded, and the effect of saving processing steps is achieved.
Wherein, the welding sealing part is connected with the welding part relatively far away from the gap. Therefore, the gap can not be communicated with the external connector.
Wherein, the welding seal portion surrounds the welding portion. Thus, the working fluid in the chamber is prevented from seeping out.
Drawings
FIG. 1: an exploded perspective view of a first embodiment of the present invention;
FIG. 2: a combination of the first embodiment of the present invention;
FIG. 3: a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4: FIG. 2 is a cross-sectional view of a capillary structure;
FIG. 5: an exploded perspective view of a second embodiment of the present invention;
FIG. 6: a combination of the second embodiment of the present invention;
FIG. 7: an exploded perspective view of a third embodiment of the present invention;
FIG. 8: an exploded perspective view of a fourth embodiment of the present invention;
FIG. 9: fig. 2 shows a partially constructed schematic view of the weld seal closing the gap.
Description of the reference numerals
[ invention ] to provide
1 first sheet
11,21: groove
12,22 ring edge
13,23 support ribs
131,231 enlarged portion
2: the second sheet body
H is the welding part
H1 gap
H2 weld sealing part
S is a chamber
G, abutting part
L working fluid
C is capillary structure
P is the clearance
R is a channel
T is samming plate structure
And theta is the included angle.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below:
referring to fig. 1, a first embodiment of a vapor chamber structure T of the present invention includes a first sheet 1 and a second sheet 2, wherein the first sheet 1 and the second sheet 2 are connected to each other.
Referring to fig. 2 to 4, the temperature equalization plate structure T may be made of a material with high thermal conductivity, such as copper or aluminum, and may be used to directly or indirectly connect a heat source to dissipate heat of the heat source, such as a central processing unit of a mobile phone, a computer or other electrical products, or an electronic component, such as a chip, etc., on a circuit board, which generates heat due to operation. The temperature equalization plate structure T has a cavity for filling a working fluid L, where the working fluid L may be water, alcohol or other liquid with low boiling point, and preferably, the working fluid L may be a non-conductive liquid, so that the working fluid L may absorb heat from a liquid state and evaporate into a gaseous state, and the cavity may not be in a vacuum state, but may also be in a vacuum closed state.
Referring to fig. 1 to 4 again, the first sheet 1 may have a groove 11, and the groove 11 may be configured to accommodate the working fluid L, so that heat can be transferred between the first sheet 1 and the working fluid L, for example, the first sheet 1 may be a heat absorption sheet, and the first sheet 1 may be configured to be connected to the heat source to absorb heat generated by the heat source. The groove 11 can be formed by stamping or die-casting, so that the periphery of the groove 11 has a rim 12, the groove 11 can be formed by bending, or the groove 11 can be formed by etching, for example, dry etching, wet etching or plasma etching, so that the groove 11 can be formed in the first sheet 1 simply.
The second plate 2 may also have a groove 21, the groove 21 may also be formed by stamping, die-casting or the etching process, such that an annular edge 22 is formed at the periphery of the groove 21, the groove 21 of the second plate 2 may be aligned with the groove 11 of the first plate 1, and the groove 21 of the second plate 2 and the groove 11 of the first plate 1 may jointly form a cavity S. The chamber S can be used to contain the working fluid L to achieve the purpose of dissipating heat through the evaporation and condensation cycle of the working fluid L, the second sheet 2 and the working fluid L can transfer heat therebetween, for example, the second sheet 2 can be used as a heat dissipation sheet, so that the heat carried by the working fluid L can be transferred out of the second sheet 2, for example, to the outside for dissipation, or the second sheet 2 can be connected to other members with heat conduction effect, such as fins, heat conduction pipes or fans, to carry heat away from the second sheet 2 to achieve the purpose of dissipating heat. In addition, the chamber S may further have a capillary structure C, the capillary structure C may help the condensed working fluid L to be recollected and flow back to absorb heat of the heat generating source again, the capillary structure C may be a porous mesh structure, a micro-groove structure, or a sintered powder structure to increase the flow of the working fluid L due to capillary phenomenon, the capillary structure C may be made of a powder sintering (powder sintering) process, the powder may be copper powder or other suitable powder, which is not limited by the invention.
Referring to fig. 1 to 8, the slot surface of the first plate 1 may have at least one supporting rib 13, the supporting rib 13 may have an elongated shape and two ends, such that the supporting rib 13 extends between the annular edges 12 at two sides of the slot 11, so that two ends of the supporting rib 13 respectively face the annular edges 12, and the slot surface of the second plate 2 may also have at least one supporting rib 23, the supporting rib 23 also has an elongated shape and two ends, such that it extends between the annular edges 22 at two sides of the slot 21. For example, both ends of the supporting ribs 13,23 may be connected to the annular edges 12,22 at two opposite sides of the slots 11,21 respectively (as shown in fig. 1), or, as in the second embodiment of the present invention, both ends of the supporting ribs 13,23 may be connected to the annular edges 12,22 at two adjacent sides of the slots 11,21 respectively (as shown in fig. 5), or, as in the third embodiment of the present invention, both ends of the supporting rib 13 of the first sheet body 1 may be connected to the annular edges 12 at two adjacent sides of the slot 11 respectively, while both ends of the supporting rib 23 of the second sheet body 2 may be connected to the annular edges 22 at two opposite sides of the slot 21 respectively (as shown in fig. 7), or, as in the fourth embodiment of the present invention, at least one end of the supporting ribs 13,23 may not be connected to the annular edges 12,22 at two sides of the slots 11,21 respectively, but may have a gap P, for example, both ends of the supporting ribs 13,23 are not connected to the annular edges of the slots 11,21, The rims 12 and 22 of both sides of the groove 21, or one end of the support rib 13 and 23 is not connected to the rims 12 and 22 of the groove 11 and 21 (as shown in fig. 8), and the present invention is not limited thereto.
The support rib 13 of the first sheet 1 abuts at least one of the support ribs 23 of the second sheet 2, and preferably, the support rib 13 of the first sheet 1 intersects with the support rib 23 of the second sheet 2 to form an included angle θ, which may be 1 ° to 90 °, for example, the support rib 13 of the first sheet 1 may be orthogonal to the support rib 23 of the second sheet 2 by 90 ° (as shown in fig. 2), or the support rib 13 of the first sheet 1 may be non-orthogonal to the support rib 23 of the second sheet 2 by an acute angle smaller than 90 ° (as shown in fig. 6), which is not limited by the present invention. Thus, the non-overlapped portion of each support rib 13,23 can have a channel R with the opposite groove surface of the second blade 2 and the groove surface of the first blade 1, and the working fluid L in the cavity S can flow through the channel R and fill the cavity S, so as to transfer heat to the first blade 1 and the second blade 2. Therefore, the supporting ribs 13 and 23 can extend between the annular edges 12 and 22 at the two sides of the grooves 11 and 21 to form a supporting structure for the whole body of the first sheet body 1 and the second sheet body 2 to resist deformation, so that the strength of the temperature equalization plate structure T can be further improved, the contact area of the working fluid L is increased, and the effect of improving the heat dissipation efficiency of the temperature equalization plate structure T is achieved. In addition, the supporting rib 13 of the first blade 1 may have an enlarged portion 131, and the supporting rib 23 of the second blade 2 may have an enlarged portion 231, and the enlarged portion 131 of the first blade 1 and the enlarged portion 231 of the second blade 2 are opposite to each other and abut against each other, so that when the abutting portion of the supporting rib 13 of the first blade 1 and the supporting rib 23 of the second blade 2 is welded, the welding convenience is improved.
Referring to fig. 2, 6 and 9, the temperature equalizing plate structure T may further include a welding portion H, the welding portion H may be located at the annular edge 12 of the first plate 1 and at the annular edge 22 of the second plate 2, the welding portion H surrounds the chamber S, so that the first plate 1 and the second plate 2 may be welded together by the welding portion H, for example, by using a laser welding method, to form the chamber S, the welding portion H has a gap H1, the gap H1 is communicated with the chamber S, and the working fluid L may be injected into the chamber S from the gap H1. In detail, the annular edge 12 of the first sheet body 1 and the annular edge 22 of the second sheet body 2 can be welded incompletely, and the gap H1 left unwelded can be left, so that the annular edge 12 of the first sheet body 1 and the annular edge 22 of the second sheet body 2 can be used to form an injection port of the working fluid L, and an additional protruding port is not required to be formed for injecting the working fluid L, and the annular edge 12 of the first sheet body 1 and the annular edge 22 of the second sheet body 2 are not required to be processed, thereby saving the cost. In addition, preferably, the width of the notch H1 is less than or equal to 5mm, and preferably, the width of the notch H1 is 1mm, so that a small amount of repair welding can be performed on the notch H1 to close the notch H1, which has the effect of simplifying the step of closing the notch H1. For example, the annular edge 12 of the first plate 1 and the annular edge 22 of the second plate 2 may have a sealing portion H2, and the sealing portion H2 is located at the notch H1 so as to seal the notch H1, preferably, the sealing portion H2 is connected to the welding portion H so that the notch H1 is not communicated with the outside, for example, the sealing portion H2 may be connected to the welding portion H adjacent to the notch H1 (as shown in fig. 9), or the sealing portion H2 may be connected to the welding portion H relatively far from the notch H1 (as shown in fig. 6), and further, the sealing portion H2 may surround the welding portion H to widely block the notch H1, so as to prevent the working fluid L in the chamber S from seeping out.
Referring to fig. 1 and 2, it should be noted that the annular edge 12 of the first sheet 1 and the annular edge 22 of the second sheet 2 form an abutting portion G, and the abutting portion G is abutted against the abutting portion G through a tool at the gap H1, so as to slightly support a gap between the first sheet 1 and the second sheet 2, thereby facilitating the injection of the working fluid L into the gap H1. For example, the abutting portion G can be a notch formed by inwardly recessing the periphery of the first sheet 1 or the second sheet 2, so that when the first sheet 1 is abutted against the second sheet 2, the abutting portion G can form a step difference between the annular edges 12 and 22, so that a tool can be easily inserted between the first sheet 1 and the second sheet 2 through the abutting portion G.
Referring to fig. 5 and 6, the abutting portion G can be a flange protruding outward from the periphery of the first sheet 1 or the second sheet 2, so that when the first sheet 1 and the second sheet 2 are abutted, a step difference can still be formed between the annular edges 12 and 22 by the abutting portion G, so that a tool can be easily inserted between the first sheet 1 and the second sheet 2 from the abutting portion G. The first sheet 1 and the second sheet 2 may also have the holes and the flanges aligned with each other to form the abutting portion G (as shown in fig. 7), respectively, but the invention is not limited thereto.
In summary, the temperature-equalizing plate structure of the present invention can have the supporting ribs respectively disposed on the first sheet and the second sheet, and the supporting ribs can extend between the first sheet and the second sheet at the annular edges at two sides of the groove to form a supporting structure for the whole of the first sheet and the second sheet to resist deformation, so as to further enhance the strength of the temperature-equalizing plate structure.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (23)

1. A vapor panel structure, comprising:
a first sheet; and
the first sheet body and the second sheet body are respectively provided with a groove, the periphery of the groove is provided with an annular edge, the first sheet body and the second sheet body are combined to form a cavity by the groove, the groove of the first sheet body and the groove of the second sheet body are respectively provided with at least one supporting rib, two ends of each supporting rib extend between the annular edges at two sides of the groove, and the supporting rib of the first sheet body is abutted with at least one position of the supporting rib of the second sheet body so that the supporting rib of the first sheet body is intersected with the supporting rib of the second sheet body to form an included angle.
2. The vapor-deposition plate structure of claim 1, wherein at least one of the support ribs has two ends connected to the annular edges of the opposite sides of the channel.
3. The vapor-deposition plate structure of claim 1, wherein at least one of the support ribs has two ends connected to the annular edges of the adjacent sides of the channel.
4. The vapor-deposition plate structure of claim 1, wherein at least one end of each support rib is not connected to the rim at both sides of the groove and has a gap.
5. The vapor chamber structure of any one of claims 1-4, wherein the support ribs of the first leaf are orthogonal to the support ribs of the second leaf.
6. The vapor chamber structure of any one of claims 1-4, wherein the support ribs of the first sheet are non-orthogonal to the support ribs of the second sheet.
7. The vapor chamber structure of claim 1, wherein the first plate has support ribs with opposite ends connected to the respective rims of the adjacent sides of the channel, and the second plate has support ribs with opposite ends connected to the respective rims of the opposite sides of the channel.
8. The vapor plate structure of claim 1, wherein the chamber is filled with a working fluid.
9. The vapor-deposition plate structure of claim 1, wherein the chamber has a capillary structure.
10. The vapor chamber structure of claim 1, wherein the non-overlapping portions of the support ribs of the first plate and the support ribs of the second plate form a channel with the opposing groove surfaces of the second plate and the first plate.
11. The vapor chamber structure of claim 1, wherein the support rib of the first blade and the support rib of the second blade each have an enlarged portion, and the enlarged portions are located at the positions where the support rib of the first blade abuts against the support rib of the second blade.
12. The temperature equalizing plate structure of claim 8, further comprising a weld disposed around the perimeter of the first piece and around the perimeter of the second piece, the weld having a notch.
13. The vapor chamber structure of claim 12, wherein the annular edge of the first sheet and the annular edge of the second sheet have a solder seal, and the solder seal is aligned with the notch.
14. The vapor-deposition plate structure of claim 12, wherein the gap has a width of less than or equal to 5 mm.
15. The vapor plate structure of claim 14, wherein the width of the gap is less than or equal to 1 mm.
16. The vapor chamber structure of claim 12, wherein the annular edge of the first plate and the annular edge of the second plate form an abutting portion, and the abutting portion is aligned with the notch.
17. The temperature-equalizing plate structure of claim 16, wherein the abutting portion is a hole formed by inward recessing of the periphery of the first sheet or the second sheet.
18. The vapor panel structure of claim 16, wherein the abutting portion is a flange protruding outward from a periphery of the first sheet or the second sheet.
19. The temperature-equalizing plate structure as claimed in claim 16, wherein the abutting portion is a hole formed by inwardly recessing the periphery of the first plate or the second plate, and a flange outwardly protruding from the periphery of the second plate or the first plate.
20. The vapor plate structure of claim 13, wherein said solder seal is connected to said solder portion.
21. The vapor panel structure of claim 13, wherein the solder seal is connected to the solder portion adjacent to the notch.
22. The vapor panel structure of claim 13, wherein the solder seal is connected to the solder portion relatively remote from the gap.
23. The vapor chamber plate structure of claim 13, wherein the solder seal surrounds the solder portion.
CN202010507555.0A 2020-06-01 2020-06-05 Temperature equalizing plate structure Pending CN113758323A (en)

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TW200912237A (en) * 2007-09-13 2009-03-16 Univ Tamkang Thermal spreader with enhancement of support strength and capillarity
JP6509680B2 (en) * 2015-08-24 2019-05-08 東芝ホームテクノ株式会社 Sheet-like heat pipe
KR102561617B1 (en) * 2017-02-24 2023-08-01 다이니폰 인사츠 가부시키가이샤 Vapor chamber, electronic device, metal sheet for vapor chamber, and method for manufacturing vapor chamber
CN209877721U (en) * 2018-12-25 2019-12-31 讯凯国际股份有限公司 Temperature equalizing plate

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