CN113745246B - 基板及显示面板 - Google Patents
基板及显示面板 Download PDFInfo
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- CN113745246B CN113745246B CN202110936401.8A CN202110936401A CN113745246B CN 113745246 B CN113745246 B CN 113745246B CN 202110936401 A CN202110936401 A CN 202110936401A CN 113745246 B CN113745246 B CN 113745246B
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- 239000000758 substrate Substances 0.000 title claims abstract description 89
- 230000004888 barrier function Effects 0.000 claims abstract description 94
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000010409 thin film Substances 0.000 claims abstract description 27
- 239000001301 oxygen Substances 0.000 claims abstract description 22
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910001868 water Inorganic materials 0.000 claims abstract description 12
- 230000000903 blocking effect Effects 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 295
- 239000000463 material Substances 0.000 claims description 21
- 229910044991 metal oxide Inorganic materials 0.000 claims description 14
- 150000004706 metal oxides Chemical class 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 13
- 239000001257 hydrogen Substances 0.000 abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract description 7
- 238000012876 topography Methods 0.000 abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 239000004054 semiconductor nanocrystal Substances 0.000 description 6
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- UHXOHPVVEHBKKT-UHFFFAOYSA-N 1-(2,2-diphenylethenyl)-4-[4-(2,2-diphenylethenyl)phenyl]benzene Chemical compound C=1C=C(C=2C=CC(C=C(C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)C=CC=1C=C(C=1C=CC=CC=1)C1=CC=CC=C1 UHXOHPVVEHBKKT-UHFFFAOYSA-N 0.000 description 1
- OBAJPWYDYFEBTF-UHFFFAOYSA-N 2-tert-butyl-9,10-dinaphthalen-2-ylanthracene Chemical compound C1=CC=CC2=CC(C3=C4C=CC=CC4=C(C=4C=C5C=CC=CC5=CC=4)C4=CC=C(C=C43)C(C)(C)C)=CC=C21 OBAJPWYDYFEBTF-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical class C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229920001621 AMOLED Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical class [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical class [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 1
- FRLJSGOEGLARCA-UHFFFAOYSA-N cadmium sulfide Chemical class [S-2].[Cd+2] FRLJSGOEGLARCA-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical class [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000002290 germanium Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical class [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical class [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
- GTLQJUQHDTWYJC-UHFFFAOYSA-N zinc;selenium(2-) Chemical class [Zn+2].[Se-2] GTLQJUQHDTWYJC-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本申请实施例公开了一种基板及显示面板,其中薄膜晶体管包括栅极、有源层和源漏金属层。有源层与栅极异层设置,有源层与栅极重叠设置;阻隔层至少覆盖有源层和栅极,阻隔层用于阻隔水氧。平坦层覆盖在阻隔层;源漏金属层设置在平坦层上。源漏金属层包括源极和漏极,源极和漏极分别连接于有源层。本申请采用阻隔层至少覆盖薄膜晶体管的栅极和有源层,以阻隔外界的氢、氧和水汽等侵入栅极和有源层,且采用平坦层平坦有源层和栅极的堆叠结构,从而降低源漏金属层及以上的膜层受复杂地形影响的风险。
Description
技术领域
本申请涉及显示技术领域,具体涉及一种基板及显示面板。
背景技术
相比传统的液晶面板,有源矩阵有机发光二极管面板具有响应速度快、对比度高、视角较广、能耗低等特点,因而广受欢迎,正在逐步取代液晶显示面板成为下一代主流显示面板。
在对现有技术的研究和实践过程中,本申请的发明人发现,无论是液晶面板还是有机发光二极管面板都面临一个难题,就是有源层容易受外界侵入的氢、水和氧等因素的影响,从而引起薄膜晶体管的电性偏移,最终降低面板可靠性的表现。
发明内容
本申请实施例提供一种基板及显示面板,可以降低氢、水和氧侵入有源层的风险。
本申请实施例提供一种基板,其包括:
衬底;以及
多个薄膜晶体管,所述薄膜晶体管设置在所述衬底上;
所述薄膜晶体管包括:
栅极,所述栅极设置在所述衬底上;
有源层,所述有源层设置在所述衬底上且与所述栅极异层设置,所述有源层与所述栅极重叠设置;
阻隔层,所述阻隔层至少覆盖所述有源层和所述栅极,所述阻隔层用于阻隔水氧;
平坦层,所述平坦层覆盖在所述阻隔层上;以及
源漏金属层,所述源漏金属层设置在所述平坦层上,所述源漏金属层包括源极和漏极,所述源极和所述漏极分别连接于所述有源层。
可选的,在本申请的一些实施例中,所述基板还包括第一绝缘层,所述第一绝缘层设置在所述有源层上,所述栅极设置在所述第一绝缘层上;
所述有源层、所述第一绝缘层和所述栅极堆叠形成凸出结构,所述阻隔层覆盖所述凸出结构的外表面。
可选的,在本申请的一些实施例中,所述有源层包括第一顶面和连接于所述第一顶面周沿的第一侧面;
所述第一绝缘层设置在所述第一顶面的中间区域,所述第一绝缘层包括第二顶面和连接于所述第二顶面周沿的第二侧面;
所述栅极设置在所述第二顶面上,所述栅极包括第三顶面和连接于所述第三顶面周沿的第三侧面;
所述阻隔层覆盖所述第一顶面的侧边区域、所述第一侧面、所述第二侧面、所述第三顶面和所述第三侧面。
可选的,在本申请的一些实施例中,所述基板还包括遮光层、缓冲层和第二绝缘层,所述遮光层设置在所述衬底上,所述遮光层与所述有源层重叠设置,所述缓冲层设置在所述遮光层和所述有源层之间,所述第二绝缘层设置在所述源漏金属层上;
所述源漏金属层还包括源极延长线,所述源极延长线分别连接于所述源极和所述遮光层。
可选的,在本申请的一些实施例中,所述基板还包括第一绝缘层,所述第一绝缘层设置所述栅极上,所述有源层设置在所述第一绝缘层上;
所述阻隔层覆盖在所述有源层的外表面。
可选的,在本申请的一些实施例中,所述第一绝缘层设置有沟槽,所述沟槽绕设在所述栅极的外周,所述阻隔层覆盖所述沟槽。
可选的,在本申请的一些实施例中,所述阻隔层的密度大于或等于2.5g/cm3。
可选的,在本申请的一些实施例中,所述阻隔层为单层结构,所述阻隔层的材料包括金属氧化物。
可选的,在本申请的一些实施例中,所述阻隔层包括第一阻隔层和第二阻隔层,所述第二阻隔层设置在所述第一阻隔层上,所述第一阻隔层的材料包括金属氧化物,所述第二阻隔层的材料包括硅氧化物。
可选的,在本申请的一些实施例中,所述有源层的材料包括多晶硅、单晶硅和金属氧化物中的一种。
相应的,本申请实施例还提供一种显示面板,其包括如上述实施例所述的基板,所述显示面板还包括层叠设置的第一电极、发光层和第二电极,所述第一电极连接于所述漏极。
相应的,本申请实施例还提供另一种显示面板,其包括阵列基板、对向基板和设置在所述阵列基板和所述对向基板之间的液晶;所述阵列基板包括上述实施例的所述的基板。
本申请实施例采的基板及显示面板中,薄膜晶体管包括栅极、有源层和源漏金属层,有源层与栅极异层设置,有源层与栅极重叠设置;阻隔层至少覆盖有源层和栅极,阻隔层用于阻隔水氧;平坦层覆盖在阻隔层;源漏金属层设置在平坦层上,源漏金属层包括源极和漏极,源极和漏极分别连接于有源层。本申请实施例采用阻隔层至少覆盖薄膜晶体管的栅极和有源层,以阻隔外界的氢、氧和水汽等侵入栅极和有源层,且采用平坦层平坦有源层和栅极的堆叠结构,从而降低源漏金属层及以上的膜层受复杂地形影响的风险。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本申请提供的基板的第一实施例的结构示意图;
图2是本申请提供的基板的第一实施例的凸出结构的结构示意图;
图3是本申请提供的基板的第一实施例的阻隔层的另一结构示意图;
图4是本申请提供的基板的第二实施例的结构示意图;
图5是本申请提供的基板的第三实施例的结构示意图;
图6是本申请实施例提供的显示面板的第一实施例的结构的示意图;
图7是本申请实施例提供的显示面板的第二实施例的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。此外,应当理解的是,此处所描述的具体实施方式仅用于说明和解释本申请,并不用于限制本申请。在本申请中,在未作相反说明的情况下,使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下,具体为附图中的图面方向;而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种基板及显示面板,另外薄膜晶体管的源极和漏极是可以互换的。在本申请实施例中,为区分薄膜晶体管除栅极之外的两极,将其中一极称为源极,另一极称为漏极。下文进行详细说明。需说明的是,以下实施例的描述顺序不作为对实施例优选顺序的限定。
图1是本申请提供的基板的第一实施例的结构示意图;本申请实施例提供一种基板100,其包括衬底11和多个薄膜晶体管TFT。多个薄膜晶体管TFT设置在衬底11上。
薄膜晶体管TFT包括栅极12、有源层13、阻隔层14、平坦层15和源漏金属层16。
栅极12设置在衬底11上。有源层13设置在衬底11上且与栅极12异层设置。有源层13与栅极12重叠设置。
阻隔层14至少覆盖有源层13和栅极12。阻隔层14用于阻隔水氧。平坦层15覆盖在阻隔层14上。源漏金属层16包括源极161和漏极162,源漏金属层16设置在平坦层15上。源极161和漏极162分别连接于有源层13。
本申请实施例的基板100采用阻隔层14至少覆盖薄膜晶体管TFT的栅极12和有源层13,以阻隔外界的氢、氧和水汽等侵入栅极12和有源层13;且采用平坦层15平坦有源层13和栅极12的堆叠结构,从而降低源漏金属层16及以上的膜层受复杂地形影响的风险,从而提高面板的发光效率。
可选的,衬底11可为硬性基板或者柔性衬底。衬底11的材质包括玻璃、蓝宝石、硅、二氧化硅、聚乙烯、聚丙烯、聚苯乙烯、聚乳酸、聚对苯二甲酸乙二醇酯、聚酰亚胺或聚氨酯中的一种。
可选的,有源层13的材料包括多晶硅、单晶硅和金属氧化物中的一种。比如可以是铟镓锌氧化物(IGZO)、锌氧化物、铟锡氧化物和铟锡锌氧化物等。
可选的,平坦层15的材料可以是有机透明膜层,比如透明光刻胶、环氧树脂、聚酰亚胺、聚乙烯醇、聚甲基丙烯酸甲酯、聚苯乙烯等。
可选的,在本第一实施例中,基板100还包括第一绝缘层17。第一绝缘层17设置在有源层13上。栅极12设置在第一绝缘层17上。
有源层13、第一绝缘层17和栅极12堆叠形成凸出结构TC。阻隔层14覆盖凸出结构TC的外表面。
本第一实施例采用阻隔层14覆盖凸出结构TC的整个外表面,进一步提高薄膜晶体管TFT防水氧的性能。
可选的,请参照图1和2,有源层13包括第一顶面13a和连接于第一顶面13a周沿的第一侧面13b。
第一绝缘层17设置在第一顶面13a的中间区域。第一绝缘层17包括第二顶面17a和连接于第二顶面17a周沿的第二侧面17b。
栅极12设置在第二顶面17a上。栅极12包括第三顶面12a和连接于第三顶面12a周沿的第三侧面12b。
阻隔层14覆盖第一顶面13a的侧边区域、第一侧面13b、第二侧面17b、第三顶面12a和第三侧面12b。
可选的,第一绝缘层17的材料可以是硅氧化物、硅氮化物或硅氮氧化物。
可选的,基板100还包括遮光层18、缓冲层19和第二绝缘层110。遮光层18设置在衬底11上。遮光层18与有源层13重叠设置。缓冲层19设置在遮光层18和有源层13之间。第二绝缘层110设置在源漏金属层16上。
源漏金属层16还包括源极延长线163。源极延长线163分别连接于源极161和遮光层18。
其中,由于源极延长线163和遮光层18之间设置有阻隔层14和平坦层15,使得二者之间的间距加大,进而降低了二者之间的寄生电容。也就是说,阻隔层14和平坦层15的层叠设置,不仅提高了薄膜晶体管TFT的防水氧性能,平坦化了前端制程形成的复杂地形,而且降低了遮光层18和源极延长线163之间的寄生电容。
可选的,遮光层18可以是钼钛堆叠结构或钼铜堆叠结构。缓冲层19的材料可以是硅氮化物或硅氧化物,亦或者是硅氮化物膜层和硅氧化物膜层的堆叠结构。
可选的,第二绝缘层110可以是钝化层,比如可以是硅氧化物等。
可选的,阻隔层14的密度大于或等于2.5g/cm3。这样的设置以达到较好地隔绝水氧的效果。阻隔层14的密度可以是2.5g/cm3、3g/cm3、3.5g/cm3和5g/cm3等。
可选的,阻隔层14的厚度介于300埃到500埃之间,比如可以是300埃、400埃和500埃。阻隔层14的厚度大于或等于300埃,以使得阻隔层14达到较好地隔绝水氧的效果;阻隔层14的厚度小于或等于500埃,以避免阻隔层14太厚,增加了薄膜晶体管区域的地势高度。
可选的,阻隔层14为单层结构。阻隔层14的材料包括金属氧化物。比如,阻隔层14的材料可以是氧化镁、氧化锌、氧化铝、氧化镍或氧化锡等金属氧化物。
其中阻隔层14是由金属氧化物形成的致密氧化膜。比如可以采用金属氧化物作为靶材,利用溅射的方式在衬底11上形成致密氧化膜。
可选的,当阻隔层14的材料是氧化铝(Al2O3)时,其中氧和铝的配比是1.5:1。当阻隔层14的材料是氧化锌(ZnO)时,其中氧和锌的配比是1:1。当阻隔层14的材料是氧化镁(MgO)时,其中氧和镁的配比是1:1。
可选的,在一些实施例中,请参照图3,阻隔层14包括第一阻隔层141和第二阻隔层142,第二阻隔层142设置在第一阻隔层141上。第一阻隔层141的材料包括金属氧化物。第二阻隔层142的材料包括硅氧化物。
采用第一阻隔层141和第二阻隔层142堆叠的方式,可以进一步提高薄膜晶体管TFT的防水性能。
可选的,第一阻隔层141和第二阻隔层142也可以是交替设置。
第一阻隔层141是由金属氧化物形成的致密氧化膜。比如可以采用金属氧化物作为靶材,利用溅射的方式在衬底11上形成致密氧化膜。其中金属氧化物可以是氧化镁、氧化锌、氧化铝、氧化镍或氧化锡等金属氧化物。
请参照图4,本实施例的基板200包括衬底11和多个薄膜晶体管TFT。多个薄膜晶体管TFT设置在衬底11上。
薄膜晶体管TFT包括栅极12、有源层13、阻隔层14、平坦层15和源漏金属层16。栅极12设置在衬底11上。有源层13设置在衬底11上且与栅极12异层设置。有源层13与栅极12重叠设置。阻隔层14至少覆盖有源层13和栅极12。阻隔层14用于阻隔水氧。平坦层15覆盖在阻隔层14上。源漏金属层16包括源极161和漏极162,源漏金属层16设置在平坦层15上。源极161和漏极162分别连接于有源层13。
本实施例的基板200与上述实施例的基板100的不同之处在于:基板200还包括第一绝缘层17。第一绝缘层17设置栅极12上。有源层13设置在第一绝缘层17上。第二绝缘层110覆盖源漏金属层16和平坦层15。
阻隔层14覆盖在有源层13的外表面。
具体的,阻隔层14覆盖有源层13的顶面和连接于所述顶面的侧面。
本实施例的基板200采用阻隔层14覆盖有源层13,且采用平坦层15平坦化栅极12、第一绝缘层17和有源层13的堆叠结构,提高面板的发光效率。
请参照图5,本实施例的基板300与上述实施例的基板200的不同之处在于:第一绝缘层17设置有沟槽171。沟槽171绕设在栅极12的外周,阻隔层14覆盖沟槽171。
平坦层15覆盖栅极12、第一绝缘层17和有源层13的堆叠结构,以平坦堆叠结构的凸出地形;平坦层15也覆盖沟槽171,以平坦沟槽171的凹陷地形,为后续膜层提供一个平坦的基面,进而提高面板的发光效率。
本实施例的基板300在上述实施例的基板200的基础上,设置有绕设在栅极12外周的沟槽171,并采用阻隔层14延伸入沟槽171,使得阻隔层14包覆有源层13和栅极12,提高了薄膜晶体管TFT的防水氧性能。
相应的,请参照图6,本申请实施例还提供一种显示面板1000,其包括如上述实施例所述的基板(100/200/300)。显示面板1000还包括层叠设置的第一电极P1、发光层EL和第二电极P2。第一电极P1连接于漏极162。
其中本实施例的显示面板1000以实施例的基板100为例进行示意,但不限于此。
其中,第一电极P1为阳极,第二电极P2为阴极。在一些实施例中,第一电极P1也可以是阴极,第二电极P2则是阳极。
可选的,发光层EL的材料可以是有机材料,比如可以是Alq3、双(2-甲基-8-羟基喹啉-N1,O8)-(1,1'-联苯-4-羟基)铝(BAlq)、DPVBi、Almq3、3-叔丁基-9,10-二(2-萘)蒽(TBADN)。
发光层EL的材料也可以是无机材料,比如可以是选自IV族半导体纳米晶、II-V族半导体纳米晶、II-VI族半导体纳米晶、IV-VI族半导体纳米晶、III-V族半导体纳米晶和III-VI族半导体纳米晶等中的一种或多种。作为举例,可以为硅量子点、锗量子点、硫化镉量子点、硒化镉量子点、碲化镉量子点、硒化锌量子点、硫化铅量子点、硒化铅量子点、磷化铟量子点、砷化铟量子点和氮化镓量子点等中的一种或多种。
本申请实施例的显示面板1000中,薄膜晶体管TFT包括栅极12、有源层13和源漏金属层16。有源层13与栅极12异层设置,有源层13与栅极12重叠设置;阻隔层14至少覆盖有源层13和栅极12,阻隔层14用于阻隔水氧。平坦层15覆盖在阻隔层14;源漏金属层16设置在平坦层15上。源漏金属层16包括源极161和漏极162,源极161和漏极162分别连接于有源层13。
本申请实施例的显示面板1000采用阻隔层14至少覆盖薄膜晶体管TFT的栅极12和有源层13,以阻隔外界的氢、氧和水汽等侵入栅极12和有源层13,且采用平坦层15平坦有源层13和栅极12的堆叠结构,从而降低源漏金属层16及以上的膜层受复杂地形影响的风险,进而提高显示面板1000的发光效率。
相应的,请参照图7,本申请实施例还提供另一种显示面板2000,其包括阵列基板AR、对向基板CF和设置在阵列基板AR和对向基板CF之间的液晶LC。阵列基板AR包括上述实施例的所述基板(100/200/300)。
其中本实施例的显示面板2000以上述实施例的基板100作为阵列基板AR的一部分为例进行示意,但并不限于此。
本申请实施例的显示面板2000中,薄膜晶体管TFT包括栅极12、有源层13和源漏金属层16。有源层13与栅极12异层设置,有源层13与栅极12重叠设置;阻隔层14至少覆盖有源层13和栅极12,阻隔层14用于阻隔水氧。平坦层15覆盖在阻隔层14;源漏金属层16设置在平坦层15上。源漏金属层16包括源极161和漏极162,源极161和漏极162分别连接于有源层13。
本申请实施例的显示面板1000采用阻隔层14至少覆盖薄膜晶体管TFT的栅极12和有源层13,以阻隔外界的氢、氧和水汽等侵入栅极12和有源层13,且采用平坦层15平坦有源层13和栅极12的堆叠结构,从而降低源漏金属层16及以上的膜层受复杂地形影响的风险,进而提高显示面板1000的发光效率。
以上对本申请实施例所提供的一种基板及显示面板进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。
Claims (11)
1.一种基板,其特征在于,包括:
衬底;以及
多个薄膜晶体管,所述薄膜晶体管设置在所述衬底上;
所述薄膜晶体管包括:
栅极,所述栅极设置在所述衬底上;
有源层,所述有源层设置在所述衬底上且与所述栅极异层设置,所述有源层与所述栅极重叠设置;
阻隔层,所述阻隔层至少直接覆盖所述有源层和覆盖所述栅极,所述阻隔层用于阻隔水氧,所述阻隔层的材料为绝缘材料;
平坦层,所述平坦层覆盖在所述阻隔层上;以及
源漏金属层,所述源漏金属层设置在所述平坦层上,所述源漏金属层包括源极和漏极,所述源极和所述漏极分别连接于所述有源层。
2.根据权利要求1所述的基板,其特征在于,所述基板还包括第一绝缘层,所述第一绝缘层设置在所述有源层上,所述栅极设置在所述第一绝缘层上;
所述有源层、所述第一绝缘层和所述栅极堆叠形成凸出结构,所述阻隔层覆盖所述凸出结构的外表面。
3.根据权利要求2所述的基板,其特征在于,所述有源层包括第一顶面和连接于所述第一顶面周沿的第一侧面;
所述第一绝缘层设置在所述第一顶面的中间区域,所述第一绝缘层包括第二顶面和连接于所述第二顶面周沿的第二侧面;
所述栅极设置在所述第二顶面上,所述栅极包括第三顶面和连接于所述第三顶面周沿的第三侧面;
所述阻隔层覆盖所述第一顶面的侧边区域、所述第一侧面、所述第二侧面、所述第三顶面和所述第三侧面。
4.根据权利要求2所述的基板,其特征在于,所述基板还包括遮光层、缓冲层和第二绝缘层,所述遮光层设置在所述衬底上,所述遮光层与所述有源层重叠设置,所述缓冲层设置在所述遮光层和所述有源层之间,所述第二绝缘层设置在所述源漏金属层上;
所述源漏金属层还包括源极延长线,所述源极延长线分别连接于所述源极和所述遮光层。
5.根据权利要求1所述的基板,其特征在于,所述基板还包括第一绝缘层,所述第一绝缘层设置所述栅极上,所述有源层设置在所述第一绝缘层上;
所述阻隔层覆盖在所述有源层的外表面。
6.根据权利要求5所述的基板,其特征在于,所述第一绝缘层设置有沟槽,所述沟槽绕设在所述栅极的外周,所述阻隔层覆盖所述沟槽。
7.根据权利要求1-6任意一项所述的基板,其特征在于,所述阻隔层的密度大于或等于2.5g/cm3。
8.根据权利要求1-6任意一项所述的基板,其特征在于,所述阻隔层为单层结构,所述阻隔层的材料包括金属氧化物。
9.根据权利要求1-6任意一项所述的基板,其特征在于,所述阻隔层包括第一阻隔层和第二阻隔层,所述第二阻隔层设置在所述第一阻隔层上,所述第一阻隔层的材料包括金属氧化物,所述第二阻隔层的材料包括硅氧化物。
10.一种显示面板,其特征在于,包括如权利要求1-8任意一项所述的基板,所述显示面板还包括层叠设置的第一电极、发光层和第二电极,所述第一电极连接于所述漏极。
11.一种显示面板,其特征在于,包括阵列基板、对向基板和设置在所述阵列基板和所述对向基板之间的液晶;所述阵列基板包括如权利要求1-9任意一项所述的基板。
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