CN113745167B - Broad-width printing head splicing and packaging method and broad-width printing head packaging structure - Google Patents

Broad-width printing head splicing and packaging method and broad-width printing head packaging structure Download PDF

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Publication number
CN113745167B
CN113745167B CN202010463230.7A CN202010463230A CN113745167B CN 113745167 B CN113745167 B CN 113745167B CN 202010463230 A CN202010463230 A CN 202010463230A CN 113745167 B CN113745167 B CN 113745167B
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China
Prior art keywords
base
printing head
flexible circuit
head chips
glue
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CN202010463230.7A
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CN113745167A (en
Inventor
王伟
徐飞
张华�
付伟欣
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Shanghai Ao Rui Technology Co ltd
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Shanghai Ao Rui Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

The invention provides a wide printing head splicing and packaging method and a wide printing head packaging structure, wherein the method comprises the following steps: providing a base; at least two printing head chips are sequentially adhered to different positions on the upper surface of the base along the X direction, wherein at least one part of the printing head chip adhered in the later step and at least one part of the printing head chip adhered in the previous step are overlapped in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular. The invention mounts all the printing head chips on one base, can reduce relative position deviation and improve levelness, and can further improve position deviation and levelness by adding a pre-curing step and selecting a base with a coefficient closer to the CTE coefficient of the chip. Compared with the traditional scheme that each printing head chip is respectively attached to different small bases and then assembled, the packaging scheme that a plurality of printing head chips are all attached to one base is higher in efficiency and lower in cost.

Description

Broad-width printing head splicing and packaging method and broad-width printing head packaging structure
Technical Field
The invention belongs to the field of industrial and consumer printing, and relates to a wide printing head splicing and packaging method and a wide printing head packaging structure.
Background
In recent years, with the progress of wide-format ink-jet printing technology, the wide-format ink-jet printing market has been rapidly developed, and the wide-format ink-jet printing technology has become a technology of growing importance in the fields of industrial printing and consumer printing. The demand for wide inkjet printing in advertising, decoration, and textile digital printing applications has increased greatly. The printing of the wide width needs to be realized by splicing and mounting the chip of the printing head, and the traditional packaging and splicing scheme is to firstly mount the chip on a module with a soft board, and then assemble the module into the wide width printing head by splicing and mounting. The wide-width splicing requires that the smaller the relative deviation of the spacing positions between the chips and the nozzles of the functional areas of the chips, the better, otherwise the printing effect of the splicing areas is affected. But the splicing between the modules uses a clamp jig alignment scheme, and the relative position errors and levelness errors between the chips are larger. For this reason, the width printing chip is not spliced accurately, the printing effect is not ideal, and subsequent other software and hardware are required for calibration, so that the production efficiency and the printing effect of wide printing are limited.
Therefore, how to realize high-precision mounting of chips, to realize efficient and high-precision alignment of the relative positions of functional chips, to realize seamless splicing and consistent levelness of the wide-width printing head chips, and to enable printing quality to be seamless, is an important technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a method for splicing and packaging a wide print head and a wide print head packaging structure, which are used for solving the problems of unsatisfactory printing effect and low production efficiency of wide print products in the prior art.
To achieve the above and other related objects, the present invention provides a method for splicing and packaging a wide print head, comprising the steps of:
providing a base;
at least two printing head chips are sequentially stuck to different positions on the upper surface of the base along the X direction, wherein the printing head chip stuck in the later step and the printing head chip stuck in the previous step are overlapped at least partially in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular.
Optionally, the printhead chip is adhered to the upper surface of the base by glue.
Optionally, the method further comprises the step of performing a heat curing process to cure the glue between the printhead die and the submount.
Optionally, the glue comprises a UV thermosetting glue, and before the heat curing step, a step of turning on a UV lamp to pre-cure the glue between the printhead die and the submount is further included.
Optionally, attaching the printhead die to the upper surface of the base includes the steps of:
glue is applied to a preset position on the upper surface of the base;
and adsorbing the printing head chip through a suction device, pressing the printing head chip to a preset position on the upper surface of the base, and starting to execute the pre-curing step while the suction device presses the printing head chip to the upper surface of the base.
Optionally, the method further comprises the step of adhering a flexible circuit board to the upper surface of the base and electrically connecting the print head chip with the flexible circuit board, wherein the flexible circuit board is provided with an external circuit interface.
Optionally, the flexible circuit board is adhered to the upper surface of the base by double-sided adhesive tape or glue.
Optionally, different print head chips are respectively electrically connected with the independent flexible circuit boards, or at least two print head chips share one flexible circuit board.
Optionally, the print head chip is electrically connected to the flexible circuit board by a wire bonding method or a pad thermocompression bonding method.
Optionally, the material of the base includes at least one of ceramics, stainless steel and plastics.
The invention also provides a broad print head packaging structure, comprising:
a base, a base seat and a base seat,
at least two print head chips are sequentially stuck to different positions on the upper surface of the base along the X direction, at least one part of every two adjacent print head chips are overlapped in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular.
Optionally, the print head chip and the base are bonded by using UV thermosetting glue.
Optionally, the wide print head packaging structure further includes a flexible circuit board, the flexible circuit board is adhered to the upper surface of the base, the print head chip is electrically connected with the flexible circuit board, and the flexible circuit board is provided with an external circuit interface.
Optionally, different print head chips are respectively electrically connected with the independent flexible circuit boards, or at least two print head chips share one flexible circuit board.
Optionally, the material of the base includes at least one of ceramics, stainless steel and plastics.
As described above, according to the wide print head splicing and packaging method and the wide print head packaging structure, all the plurality of print head chips are mounted on the same base, compared with the wide print heads on the market, which have the relative position deviation of +/-25 microns and the relative position levelness deviation of more than +/-100 microns, the wide print head packaging structure has the advantages of smaller relative position deviation and better levelness. In addition, the relative position deviation can be further controlled within +/-7 microns by adding a pre-curing step, and the relative position levelness deviation can be further controlled within +/-50 microns by selecting a base which is closer to the CTE coefficient of the chip. In addition, compared with the traditional scheme that each printing head chip is respectively attached to different small bases and then assembled, the scheme of attaching all the printing head chips to one base is higher in efficiency and lower in cost.
Drawings
Fig. 1 shows a top view of a wide printhead package structure of the present invention.
Fig. 2 shows a side view of a wide printhead package structure of the present invention in one embodiment.
Fig. 3 shows a side view of a wide printhead package structure of the present invention in another embodiment.
Description of element reference numerals
1. Base seat
2. First print head chip
3. Second print head chip
4. Third print head chip
5. Flexible circuit board
6. External circuit interface
7. Connecting wire
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 1 to 3. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Example 1
The embodiment provides a splicing and packaging method for a wide printing head, which comprises the following steps:
s1: providing a base;
s2: at least two printing head chips are sequentially stuck to different positions on the upper surface of the base along the X direction, wherein the printing head chip stuck in the later step and the printing head chip stuck in the previous step are overlapped at least partially in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular.
As an example, referring to fig. 1, three print head chips (a first print head chip 2, a second print head chip 3 and a third print head chip 4) are sequentially adhered to different positions on the upper surface of the base 1 along the X direction, where at least a part of the print head chip adhered in the next step and the print head chip adhered in the previous step overlap in the Y direction, so as to achieve seamless docking of the nozzles, and a wide print head is assembled. Among them, the same type of head chip is preferably used for the plurality of head chips.
Of course, in other embodiments, the number of the print head chips may be adjusted as required, for example, two print head chips may be used for splicing, or more than three print head chips may be used for splicing, which should not excessively limit the protection scope of the present invention.
As an example, the plurality of print head chips are arranged in an AB-type regular manner, that is, in a Y-direction in a one-to-one manner, so that on one hand, space utilization can be improved, and on the other hand, subsequent mounting of the flexible circuit board can be facilitated.
As an example, the printhead chip is attached to the upper surface of the base 1 by glue. In this embodiment, glue is applied to a preset position on the upper surface of the base, and then the print head chip is sucked by the suction device and pressed to the preset position on the upper surface of the base.
It should be noted that the present invention is applicable not only to small-sized printhead chips but also to large-sized printhead chips. For larger size printhead chips, for example, those with a width of 1 inch in the X direction, the chip pick-up and mounting accuracy requirements of such chips may not be met by a chip mounter on the market, and the relevant mounting fixture of the custom device may be designed by close cooperation with the device vendor.
As an example, a large-size suction nozzle is customized to suck a chip, a recognition system is optimized, a zoom lens is used for recognizing a chip mark (mark) point, the chip is firstly roughly recognized under the condition of one lens, then the lens of the system is adjusted to four times of focal length to enlarge the recognition chip mark point, fine recognition is performed, and the first printing head chip 2 is attached to a designated position of the base 1. And then the second print head chip 3 takes the first print head chip 2 as an alignment point, and after glue (such as epoxy glue) is dispensed at the other designated position of the base 1, the identification mark point is set at the expected positions of the first print head chip 2 and the second print head chip 3 to mount the second print head chip 3. After the completion, the third print head chip 4 is mounted by using the second print head chip 3 as an alignment point in the same way.
Of course, in other embodiments, the lens magnification of the coarse recognition and the fine recognition may be adjusted as needed, and the scope of the present invention should not be excessively limited herein.
As an example, after the mounting of three head chips is completed, a heat curing process is further performed to cure the glue between the head chips and the submount 1. In this embodiment, the above-mentioned mounted structure is put into an oven to be baked at a preset temperature, so that the glue is cured, wherein the base 1 is a plastic substrate with high temperature resistance, including but not limited to polyphenylene sulfide (PPS for short), and PPS is taken as an example in this embodiment. After the glue is cured, the relative position of the chip is measured, and the overall deviation is about 15 micrometers. Compared with the wide print head relative position deviation of + -25 micrometers in the market, the wide print head relative position deviation manufactured by the embodiment is greatly improved.
As an example, a flexible circuit board 5 is further adhered to the upper surface of the base 1, and the printhead chip is electrically connected to the flexible circuit board 5, and the flexible circuit board 5 is provided with an external circuit interface 6 for connection with an external control component.
As an example, the flexible circuit board 5 may be adhered to the upper surface of the base 1 by double sided tape or glue, and the print head chip may be electrically connected to the flexible circuit board 5 by a wire bonding method (such as the connection wire 7 shown in fig. 1) or a pad thermocompression bonding method (such as copper thermocompression bonding).
As an example, different print head chips may be electrically connected to the separate flexible circuit boards, or at least two print head chips may share one flexible circuit board. Fig. 1 shows a case where three print head chips use respective flexible circuit boards, respectively.
The product obtained by the wide printing head splicing and packaging method can meet the existing wide printing requirement. Compared with the traditional scheme of firstly attaching to a module and then assembling and splicing, the method has the defects of low precision and poor efficiency, and the product obtained by adopting the method for splicing and packaging the wide print head has higher printing precision, less modification of a printing system and higher production efficiency, so that mass production of high-performance wide print head products is possible.
Example two
The embodiment and the first embodiment adopt basically the same technical scheme, and the difference is that the base material is more optimized.
Specifically, the susceptor needs to be cleaned before the printhead chip is mounted, and is pre-baked after cleaning. When the base adopts a plastic refined part, the measurement data show that the base generates crying face deformation after baking, and the deformation is about 150 microns. As shown in fig. 2, the printhead chip is made of silicon-based material, and has good rigidity, and the chip is uneven when the printhead chip is attached to the deformation base, so that the accuracy of the position of the chip is affected. A plurality of plastic base materials are selected for testing, and all have different degrees of warping.
In this embodiment, a ceramic material is ultimately selected as the base in order to achieve a deformation coefficient close to that of the printhead die material. Wherein the CTE coefficient (coefficient of thermal expansion) of the ceramic is about 40X 10 -7 Per DEG C, and a CTE coefficient of silicon of 35X 10 -7 The temperature/. Degree.C.is very close. As shown in fig. 3, the large-sized chip is mounted on the ceramic base to maintain good flatness. The relative position deviation of the test after the printing head chip is solidified is about +/-11 microns, and the relative position deviation is obviously improved.
Of course, in other embodiments, other materials may be selected that have a CTE close to that of the chip, such as stainless steel, without unduly limiting the scope of the invention herein.
Example III
The embodiment and the first embodiment adopt basically the same technical scheme, and the difference is that the base material is more optimized, and the pre-curing step of the glue is added.
Specifically, the printhead die is bonded using a heat curable glue, and the selected high viscosity glue can prevent movement after die attach. Experiments show that the positions of the chips are not obviously moved after the chips are mounted, but when the chips are baked and cured at a high temperature in an oven, the viscosity of the glue is reduced at a high temperature, and the glue reaction can cause the chips to have tiny displacement. The glue with different viscosities is evaluated, and the displacement phenomenon of the chip after baking is still found.
In this embodiment, the UV thermosetting glue (the raw material of the UV system is added in the thermosetting glue) is more solvent-resistant than the common UV thermosetting glue without thermosetting, and the UV thermosetting glue used in this embodiment can be pre-cured by UV.
As an example, the UV thermosetting glue uses a UV glue of an epoxy system.
Specifically, a UV curing system is customized on the mounting equipment, UV thermosetting glue is applied to a designated area of a ceramic substrate, then a printing head chip is sucked for mounting, and a UV lamp is turned on for pre-curing while the printing head chip is pressed down. After the three chips are attached and pre-cured, the product is moved into an oven to be baked at high temperature to completely cure the glue. After the completion, the relative position of the printing head chip is measured, and the mounting position deviation of +/-7 microns of the design requirement is basically achieved. The mounted product is actually measured and printed, the relative position and levelness of the chip of the product reach the design requirements, and the printed test meets the requirements.
Example IV
In this embodiment, taking three print head chips as an example, a first print head chip 2, a second print head chip 3 and a third print head chip 4 are sequentially adhered to different positions on the upper surface of the base 1 along the X direction, at least a portion of two adjacent print head chips overlap in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base 1, and the X direction and the Y direction are mutually perpendicular.
By way of example, the material of the base 1 includes, but is not limited to, ceramic, stainless steel or plastic. In this embodiment, it is preferable to use ceramics having CTE coefficients (thermal expansion coefficients) closer to those of silicon, so that thermal deformation of the susceptor can be reduced, and thus, variations in mounting positions of the head chips can be reduced.
As an example, a glue bond is used between the printhead die and the base. In this embodiment, the UV thermosetting glue is preferably used for bonding, which can avoid displacement of the printhead chip during baking after pre-curing, so as to further reduce the deviation of the mounting position of the printhead chip.
As an example, the wide print head package structure further includes a flexible circuit board 5, the flexible circuit board 5 is adhered to the upper surface of the base 1, the print head chip is electrically connected to the flexible circuit board 5, and the flexible circuit board 5 is provided with an external circuit interface 6 for connection with an external control component.
As an example, the mounting accuracy of the flexible circuit board 5 is lower than that of the print head chip, and thus the flexible circuit board can be adhered to the upper surface of the base 1 by double-sided adhesive tape or glue. After the mounting, the flexible circuit board 5 is electrically connected with the print head chip by a wire bonding method (such as the connecting wire 7 shown in fig. 1) or a pad thermocompression bonding method (such as copper thermocompression bonding).
As an example, different print head chips may be electrically connected to the separate flexible circuit boards, or at least two print head chips may share one flexible circuit board. Fig. 1 shows a case where three print head chips use respective flexible circuit boards, respectively.
The packaging structure of the wide printing head of the embodiment has smaller relative position deviation and higher levelness, so that the printing precision is higher, and the existing wide printing requirement can be met.
In summary, according to the wide print head splicing and packaging method and the wide print head packaging structure, a plurality of print head chips are all mounted on one base, compared with the wide print heads in the market, which have the relative position deviation of +/-25 microns and the relative position levelness deviation of more than +/-100 microns, the wide print head packaging structure has the advantages of smaller relative position deviation and better levelness. In addition, the relative position deviation can be further controlled within +/-7 microns by adding a pre-curing step, and the relative position levelness deviation can be further controlled within +/-50 microns by selecting a base which is closer to the CTE coefficient of the chip. In addition, compared with the traditional scheme that each printing head chip is respectively attached to different small bases and then assembled, the scheme of attaching all the printing head chips to one base is higher in efficiency and lower in cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (6)

1. The splicing and packaging method for the wide printing head is characterized by comprising the following steps of:
providing a base, wherein the base is made of ceramics;
dispensing glue on a preset position on the upper surface of the base, wherein the glue comprises UV thermosetting glue;
sequentially adhering at least two printing head chips to different positions on the upper surface of the base along the X direction, wherein the printing head chips are adsorbed by a suction device, the printing head chips are pressed to the preset positions on the upper surface of the base, a UV lamp is turned on while the suction device presses the printing head chips to the upper surface of the base so as to pre-cure glue between the printing head chips and the base, at least one part of the printing head chips adhered in the later step and at least one part of the printing head chips adhered in the previous step are overlapped in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular;
a thermal curing process is performed to cure the glue between the printhead die and the submount.
2. The method of claim 1, wherein: the method also comprises the step of adhering a flexible circuit board to the upper surface of the base and electrically connecting the printing head chip with the flexible circuit board, wherein the flexible circuit board is provided with an external circuit interface.
3. The broad width printhead splice packaging method of claim 2, wherein: and the flexible circuit board is adhered to the upper surface of the base through double faced adhesive tape or glue.
4. The broad width printhead splice packaging method of claim 2, wherein: different printing head chips are respectively and electrically connected with the independent flexible circuit boards, or at least two printing head chips share one flexible circuit board.
5. The broad width printhead splice packaging method of claim 2, wherein: and electrically connecting the printing head chip with the flexible circuit board by a wire bonding mode or a bonding pad hot-press bonding mode.
6. A broad width printhead package structure, characterized in that: comprising the following steps:
a base, a base seat and a base seat,
at least two printing head chips are sequentially stuck to different positions on the upper surface of the base along the X direction, at least one part of the adjacent two printing head chips are overlapped in the Y direction, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular;
wherein, the manufacture of the broad print head packaging structure adopts the broad print head splicing packaging method as claimed in any one of claims 1-5.
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