CN113727593A - Electromagnetic shielding device of electronic equipment and electronic equipment - Google Patents
Electromagnetic shielding device of electronic equipment and electronic equipment Download PDFInfo
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- CN113727593A CN113727593A CN202110934891.8A CN202110934891A CN113727593A CN 113727593 A CN113727593 A CN 113727593A CN 202110934891 A CN202110934891 A CN 202110934891A CN 113727593 A CN113727593 A CN 113727593A
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- circuit board
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- upper cover
- lower cover
- electromagnetic shielding
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- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 22
- 238000000926 separation method Methods 0.000 claims abstract description 12
- 238000002955 isolation Methods 0.000 claims description 86
- 238000005192 partition Methods 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims 3
- 239000000463 material Substances 0.000 abstract description 6
- 230000005672 electromagnetic field Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The application provides an electromagnetic shielding device of electronic equipment and the electronic equipment, which belong to the technical field of electromagnetic shielding, and particularly comprise an upper cover and a lower cover, wherein the upper cover and the lower cover are respectively arranged on two sides of a circuit board to surround the circuit board and are used for forming an outer shielding layer to protect electromagnetic radiation of the circuit board; the circuit board is provided with an interface, one end of the interface is connected with the circuit board and is positioned on the inner sides of the upper cover and the lower cover, and the other end of the interface is positioned on the outer sides of the upper cover and the lower cover; at least one of the upper cover and the lower cover is internally provided with a separation wall, the separation wall is positioned at a position corresponding to the interface and is vertical to the upper cover or the lower cover, the separation wall is arranged along the periphery of the interface and forms an interface cavity capable of containing the interface, and the separation wall is used for forming an inner layer shielding layer to protect the electromagnetic radiation of the interface. Through the processing scheme of this application, avoided the electromagnetic field to radiate to the external world from the kneck, improved electronic equipment's electromagnetic shielding performance, need not to change circuit design and increase extra material cost, convenient to use.
Description
Technical Field
The present application relates to the field of electromagnetic shielding technologies, and in particular, to an electromagnetic shielding apparatus for an electronic device and an electronic device.
Background
Electromagnetic radiation is an important index of product quality in the fields of household appliances, vehicle-mounted electrical appliances, communication and the like, and shell shielding is an important means for reducing radiation. In the existing housing shielding method, a housing with good sealing (for electromagnetic waves) is mainly used for shielding a circuit board, and electromagnetic radiation generated by the circuit board is shielded to the inside of a metal structure housing as much as possible.
However, common electronic and electrical products inevitably have external interfaces and corresponding connectors, and many connectors are made of non-electromagnetic field shielding materials such as plastics and rubber. Therefore, the external radiation of the interfaces and connectors of some products is often out of standard and is difficult to solve, and if an independent protection circuit is added, the cost is increased.
Disclosure of Invention
In view of the above, embodiments of the present application provide an electromagnetic shielding apparatus for an electronic device and an electronic device, which at least partially solve the problems in the prior art.
In a first aspect, an embodiment of the present application provides an electromagnetic shielding apparatus for an electronic device, where the apparatus includes: the upper cover and the lower cover are respectively arranged on two sides of the circuit board to surround the circuit board and are used for forming an outer shielding layer to protect electromagnetic radiation of the circuit board;
an interface is arranged on the circuit board, one end of the interface is connected with the circuit board and is positioned on the inner sides of the upper cover and the lower cover, and the other end of the interface is positioned on the outer sides of the upper cover and the lower cover;
at least one of the upper cover and the lower cover is internally provided with a separation wall, the separation wall is positioned at a position corresponding to the interface and is vertical to the upper cover or the lower cover, the separation wall is arranged along the periphery of the interface and forms an interface cavity capable of containing the interface, and the separation wall is used for forming an inner layer shielding layer to protect the electromagnetic radiation of the interface.
According to a specific implementation manner of the embodiment of the application, at least one of the top layer of the circuit board and the bottom layer of the circuit board is provided with an isolation belt, and the isolation belt is arranged at the joint of the interface and the circuit board.
According to a specific implementation manner of the embodiment of the application, the top isolation belt of the circuit board corresponds to the isolation wall of the upper cover, and the bottom isolation belt of the circuit board corresponds to the isolation wall of the lower cover.
According to a specific implementation manner of the embodiment of the application, when the circuit board is a top layer/bottom layer wire, an isolation strip gap is arranged on a top layer/bottom layer isolation strip of the circuit board, and the wire is connected with the interface through the isolation strip gap; when the circuit board is an inner-layer wiring, an isolation strip gap is not needed on the top layer/bottom layer isolation strip of the circuit board.
According to a specific implementation manner of the embodiment of the application, when the circuit board is a top layer wire or a bottom layer wire, a partition wall gap is arranged on the partition wall of the upper cover or the lower cover, and the wire is connected with the interface through the partition wall gap; when the circuit board is an inner-layer wiring, a partition wall gap is not needed on the partition wall of the upper cover/the lower cover.
According to a specific implementation manner of the embodiment of the application, the trace includes a power line and a signal line.
According to a specific implementation manner of the embodiment of the application, when the number of the interfaces is multiple, the partition wall can form multiple interconnected interface cavities according to the distance between the interfaces.
According to a specific implementation manner of the embodiment of the application, the isolation belt is made of a metal material.
According to a specific implementation manner of the embodiment of the application, the isolation wall is made of metal.
In a second aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes a circuit board, an interface, and the electromagnetic shielding apparatus according to any embodiment of the first aspect, where the electromagnetic shielding apparatus includes an upper cover, a lower cover, and a partition wall disposed inside at least one of the upper cover and the lower cover.
Advantageous effects
According to the electromagnetic shielding device of the electronic equipment and the electronic equipment, the isolation wall is arranged in the outer shielding layer, namely the upper cover and the lower cover, and surrounds the interface in the isolation wall to form the isolation cavity; the seamless connection is formed by matching with the isolation belt on the circuit board, so that the electromagnetic radiation at the interface is reduced, and the safety performance of the electronic equipment can be effectively improved; if the circuit board is provided with the wiring, an isolation strip gap or an isolation wall gap can be arranged, the use is convenient, the circuit design does not need to be changed, the additional material cost does not need to be increased, and the universality is good.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of an electronic device according to the prior art;
fig. 2 is a schematic view of an electromagnetic shielding apparatus of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic view of an electromagnetic shielding apparatus of an electronic device according to an embodiment of the present invention;
fig. 4 is a top layer structure diagram of a circuit board of an electromagnetic shielding apparatus of an electronic device according to an embodiment of the present invention;
fig. 5 is a top view of an upper cover of an electromagnetic shielding device of an electronic apparatus according to an embodiment of the present invention;
FIG. 6 is a diagram of a circuit board bottom layer of an electromagnetic shielding apparatus of an electronic device according to an embodiment of the present invention;
fig. 7 is a top view of a lower cover of an electromagnetic shielding apparatus of an electronic device according to an embodiment of the invention.
In the figure: 1. an upper cover; 11. an upper cover isolation wall; 12. an upper cover interface cavity; 2. a lower cover; 21. a lower cover isolation wall; 22. a lower cover interface cavity; 23. a partition wall gap; 3. a circuit board; 31. a circuit board top layer isolation belt; 32. a circuit board bottom layer isolation strip; 33. routing of the inner layer of the circuit board; 34. routing at the bottom layer of the circuit board; 4. an interface.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application rather than the number, shape and size of the components in actual implementation, and the type, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
At present, electromagnetic radiation exists in common electronic equipment such as household appliances, vehicle-mounted electrical appliances and the like, shell shielding is a common method for reducing radiation, for example, a shell with good tightness (aiming at electromagnetic waves) is adopted to shield a circuit board, for some electronic equipment adopting interfaces made of non-electromagnetic field shielding materials such as plastics, rubber and the like, overproof external radiation still exists, as shown in figure 1, arrows in the figure indicate electromagnetic radiation, and the interfaces of the existing electronic equipment often have external radiation, so that the design of an electromagnetic shielding device with good shielding property has important significance.
To solve this problem, the inventor proposes a technical idea that: through the matching of the design of the circuit board and the design of the shell structure, the inner layer and the outer layer of shielding are carried out at the corresponding positions of the interface. The outer shield is the overall protection of the circuit board from radiation, i.e. the housing; the inner layer shield is specially used for protecting the radiation of the interface, namely, a shield layer is manufactured around the interface. Particularly, the shell outside the circuit board is additionally provided with an inner shielding layer (partition wall) at an external interface position, a complete isolation strip is additionally arranged at the interface position on the circuit board, the isolation strip can correspond to and be consistent with the inner shielding layer on the shell, and when the device is assembled, the inner shielding layer of the shell and the isolation strip of the circuit board are in tight thread joint crimping, so that the effect of closed electromagnetic isolation is achieved, and the electromagnetic radiation of electronic equipment is effectively reduced.
The electromagnetic shielding device of the electronic apparatus of the present application will be described in detail with reference to fig. 2 to 7.
The embodiment of the application provides an electromagnetic shielding device for electronic equipment, and referring to the electromagnetic shielding device shown in fig. 2-3, the electromagnetic shielding device mainly comprises an upper cover 1 and a lower cover 2, a specific structure of the upper cover 1 and the lower cover 2 in the figure is only an example, in practical application, the specific structure can be adjusted according to a structural shape of an electronic device or a circuit board 3, and the upper cover 1 and the lower cover 2 are mutually matched and are respectively arranged on two sides of the circuit board 3 to surround the circuit board 3, so that complete electronic equipment is formed. The housing formed by the upper cover 1 and the lower cover 2 cooperating with each other serves as an outer shielding layer to protect the circuit board 3 from electromagnetic radiation.
The circuit board 3 is provided with an interface 4, the interface 4 is used for communication between the electronic device and the outside, the interface 4 as commonly used includes a USB interface, a network cable interface, a serial communication interface, a D-type data interface, an infrared interface and the like, one end of the interface 4 is connected with the circuit board 3 and is located at the inner sides of the upper cover and the lower cover, specifically, the interface 4 is connected with a wire on the circuit board 3 and is used for performing communication connection between the circuit board 3 and the outside device, and the interface 4 is located at the side edge of the circuit board 3 under normal conditions; the other end of the interface 4 faces outwards, is positioned on the outer sides of the upper cover 1 and the lower cover 2 and is used for being in communication connection with the outside; more specifically, the upper cover 1 or the lower cover 2 is provided with an opening for passing the mouthpiece 4.
In order to form an inner shielding layer, a partition wall is arranged inside at least one of the upper cover 1 and the lower cover 2, the partition wall is located at a position corresponding to the interface 4 and perpendicular to the upper cover or the lower cover, the partition wall is arranged along the periphery of the interface 4 and forms an interface cavity capable of accommodating the interface 4, and the partition wall is used for forming an inner shielding layer to protect electromagnetic radiation of the interface 4.
In one embodiment, referring to fig. 2 and 7, a partition wall is disposed inside the lower cover 2, and since the interfaces 4 connected to the circuit board 3 are all on the same side and extend out of the upper cover 1 and the lower cover 2 on the same side, the partition wall may be disposed on one side of the upper cover 1 and/or the lower cover 2. In this embodiment, only the lower cover 2 is provided with a lower cover isolation wall 21, the lower cover isolation wall 21 is arranged along the periphery of the interface 4 located at the inner side of the lower cover 2, the wall of the lower cover isolation wall 21 is perpendicular to the bottom plate of the lower cover 2, and forms a lower cover interface cavity 22 for accommodating the interface 4, the height of the lower cover isolation wall 21 should be standard that the position where the circuit board 3 is connected with the interface 4 when the whole device is assembled can just be pressed onto the lower cover isolation wall 21, so that the circuit board 3 and the lower cover isolation wall 21 form a seamless connection, and the electromagnetic radiation generated by the circuit board 3 is isolated at the side of the lower cover isolation wall 21, which faces away from the port 4.
In another embodiment, referring to fig. 3 and 5, the partition wall is disposed inside the upper cover 1, i.e. the upper cover partition wall 11 in the figure, the upper cover partition wall 11 is disposed along the periphery of the interface 4 located inside the upper cover 1, the wall of the upper cover partition wall 11 is perpendicular to the bottom plate of the upper cover 1 and forms an upper cover interface cavity 12 for accommodating the interface 4, the height of the upper cover partition wall 11 should be determined such that the position where the circuit board 3 is connected with the interface 4 when the whole device is assembled can be just pressed onto the upper cover partition wall 11, so that the circuit board 3 and the upper cover partition wall 11 form a seamless connection, and the electromagnetic radiation generated by the circuit board 3 is isolated from the side of the upper cover partition wall 11 facing away from the port 4.
In a preferred embodiment, the inner sides of the upper cover 1 and the lower cover 2 are provided with partition walls, and when the whole device is assembled, the upper cover partition walls 11 and the lower cover partition walls 21 are positioned on both sides of the circuit board 3 and completely surround the interface 4 positioned inside the device to form a more closed partition wall.
It should be noted that the specific height, thickness and shape of the partition wall need to be set according to the size and shape of the specific interface 4, and whether the partition wall is set on the upper cover 1 or the lower cover 2 also needs to be determined according to the actual interface 4.
Furthermore, when a plurality of interfaces 4 are provided, the partition wall can form a plurality of interconnected interface cavities according to the distance between the interfaces 4; or a plurality of interconnected interface cavities are formed according to the type of the interface 4, and the connected interfaces 4 of the same type can be arranged in one interface cavity. Referring to fig. 4-5, it is apparent that there are 3 different types of ports in the figures, and therefore, 3 upper cap port cavities 12 are provided on the upper cap 1.
Furthermore, at least one of the top layer of the circuit board 3 and the bottom layer of the circuit board 3 is provided with an isolation strip, and the isolation strip is arranged at the connection position of the interface 4 and the circuit board 3.
In one embodiment, referring to fig. 2, the top layer of the circuit board 3 is provided with a circuit board top layer isolation belt 31, the circuit board top layer isolation belt 31 is located at the connection position of the interface 4 and the circuit board 3, the circuit board top layer isolation belt 31 is a linear belt-shaped structure, and the interface 4 and the circuit board 3 are isolated by the circuit board top layer isolation belt 31 from both sides when viewed from the surface.
In another embodiment, referring to fig. 3, the bottom layer of the circuit board 3 is provided with a circuit board bottom layer isolation tape 32, also arranged in a linear strip-like configuration, the circuit board bottom layer isolation tape 32 isolating the interface 4 from the circuit board 3 on both sides.
Preferably, the top layer and the bottom layer of the circuit board 3 are respectively provided with isolation belts, so that electromagnetic radiation can be isolated more effectively.
It should be explained that whether the top layer or the bottom layer of the circuit board 3 needs to be provided with the isolation strip is not affected by whether the upper cover 1 or the lower cover 2 is provided with the isolation wall, which is mainly determined according to the shape and the size of the interface 4 and the shape of the upper cover 1 and the lower cover 2, so as to ensure that the interface 4 can be hermetically isolated after the device is assembled.
Specifically, the position of the top isolation belt 31 of the circuit board 3 corresponds to the position of the isolation wall of the upper cover 1, the position of the bottom isolation belt 32 of the circuit board 3 corresponds to the position of the isolation wall of the lower cover 2, when the device is assembled, the top isolation belt 31 of the circuit board can be in tight joint with the isolation wall 11 of the upper cover in a crimping mode, and the bottom isolation belt 32 of the circuit board can be in tight joint with the isolation wall 21 of the lower cover in a crimping mode, so that a closed inner layer shielding structure capable of shielding electromagnetic radiation is formed, the electromagnetic radiation is prevented from being released from an interface position, the external electromagnetic radiation of an electronic product is effectively reduced, and the safety of the product is improved.
Considering that the top layer or the bottom layer of the circuit board 3 has the routing problem, when the circuit board 3 is the top layer/bottom layer routing, an isolation strip gap is arranged on a top layer/bottom layer isolation strip of the circuit board 3, and the routing is connected with the interface 4 through the isolation strip gap; correspondingly, when the circuit board 3 is a top layer/bottom layer trace, a partition wall gap 23 is formed on the partition wall of the upper cover 1 or the lower cover 2.
Specifically, referring to fig. 6, when the bottom layer trace is a bottom layer trace, the bottom layer trace 34 of the circuit board needs to penetrate through the bottom layer surface of the circuit board 3 and be connected with the interface 4, and then an isolation strip gap needs to be formed on the isolation strip 32 of the bottom layer of the circuit board, so that the bottom layer trace of the circuit board penetrates through the isolation strip gap, and the width of the isolation strip gap is close to the diameter of the trace. If a lower cover isolation wall 21 is disposed in the lower cover 2, as shown in fig. 7, an isolation wall gap 23 is disposed at a position corresponding to the wire, so that the wire can pass through the isolation wall gap 23 and be connected to the interface 4.
When the circuit board 3 is an inner layer trace, referring to fig. 4, an isolation strip gap is not required on the top layer/bottom layer isolation strip of the circuit board 3. Accordingly, the partition wall gap 23 does not need to be formed on the partition wall of the upper cover 1 or the lower cover 2.
According to a specific implementation manner of the embodiment of the application, the trace includes a power line and a signal line.
Furthermore, the isolation belt and the isolation wall are made of metal materials. Preferably, the isolation strip and the isolation wall are copper or tin.
In a second aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes a circuit board 3, an interface 4, and an electromagnetic shielding apparatus as described in any embodiment of the first aspect, where the electromagnetic shielding apparatus includes an upper cover 1 and a lower cover 2, and a partition wall disposed on at least one of the upper cover 1 and the lower cover 2.
The embodiment provided by the invention aims at the problem that the electromagnetic radiation exceeds the standard due to the problems of interface materials and the like in the existing electronic equipment, and provides the electromagnetic shielding device of the electronic equipment, wherein the isolation wall is arranged in the outer shielding layer, namely the upper cover and the lower cover, surrounds the periphery of the interface in the inner part and forms an isolation cavity; the seamless connection is formed by matching with the isolation belt on the circuit board, so that the electromagnetic radiation at the interface is reduced, and the safety performance of the electronic equipment can be effectively improved; if the circuit board is provided with the wiring, an isolation strip gap or an isolation wall gap can be arranged, the use is convenient, the circuit design does not need to be changed, the additional material cost does not need to be increased, and the universality is good.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An electromagnetic shielding apparatus for an electronic device, the apparatus comprising: the upper cover and the lower cover are respectively arranged on two sides of the circuit board to surround the circuit board and are used for forming an outer shielding layer to protect electromagnetic radiation of the circuit board;
an interface is arranged on the circuit board, one end of the interface is connected with the circuit board and is positioned on the inner sides of the upper cover and the lower cover, and the other end of the interface is positioned on the outer sides of the upper cover and the lower cover;
at least one of the upper cover and the lower cover is internally provided with a separation wall, the separation wall is positioned at a position corresponding to the interface and is vertical to the upper cover or the lower cover, the separation wall is arranged along the periphery of the interface and forms an interface cavity capable of containing the interface, and the separation wall is used for forming an inner layer shielding layer to protect the electromagnetic radiation of the interface.
2. The electromagnetic shielding device of claim 1, wherein at least one of the top layer of the circuit board and the bottom layer of the circuit board is provided with an isolation strip, and the isolation strip is disposed at a connection position of the interface and the circuit board.
3. The electromagnetic shielding apparatus of claim 2, wherein the top isolation strip of the circuit board corresponds to the isolation wall of the top cover, and the bottom isolation strip of the circuit board corresponds to the isolation wall of the bottom cover.
4. The electromagnetic shielding apparatus of claim 2, wherein when the circuit board is a top layer/bottom layer trace, an isolation strip gap is formed on a top layer/bottom layer isolation strip of the circuit board, and the trace is connected to the interface through the isolation strip gap; when the circuit board is an inner-layer wiring, an isolation strip gap is not needed on the top layer/bottom layer isolation strip of the circuit board.
5. The electromagnetic shielding apparatus of claim 1, wherein when the circuit board is a top layer/bottom layer trace, a spacer gap is formed on the spacer of the top cover/bottom cover, and the trace is connected to the interface through the spacer gap; when the circuit board is an inner-layer wiring, a partition wall gap is not needed on the partition wall of the upper cover/the lower cover.
6. The electromagnetic shielding apparatus of an electronic device according to claim 4 or 5, wherein the trace comprises a power line and a signal line.
7. The electromagnetic shielding apparatus of claim 1, wherein when the plurality of interfaces are provided, the partition wall forms a plurality of interconnected interface cavities according to the distance between the interfaces.
8. An electromagnetic shielding device for electronic equipment according to any one of claims 2-5, wherein said isolation strip is made of metal.
9. The electromagnetic shielding device for electronic devices of any of claims 1-5 and 7, wherein the partition wall is made of metal.
10. An electronic device comprising a circuit board, an interface, and the electromagnetic shielding device according to any one of claims 1 to 9, wherein the electromagnetic shielding device comprises an upper cover and a lower cover, and a partition wall provided inside at least one of the upper cover and the lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110934891.8A CN113727593A (en) | 2021-08-16 | 2021-08-16 | Electromagnetic shielding device of electronic equipment and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110934891.8A CN113727593A (en) | 2021-08-16 | 2021-08-16 | Electromagnetic shielding device of electronic equipment and electronic equipment |
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| CN104619158A (en) * | 2015-02-06 | 2015-05-13 | 山东超越数控电子有限公司 | Method for achieving EMC (Electro Magnetic Compatibility) through standard interface |
| CN205249608U (en) * | 2015-12-22 | 2016-05-18 | 深圳市柔宇科技有限公司 | Printed circuit board |
| CN205266129U (en) * | 2015-12-31 | 2016-05-25 | 苏州肯美威机械制造有限公司 | PCB electromagnetic shield box |
| CN206098950U (en) * | 2016-10-10 | 2017-04-12 | 中兴通讯股份有限公司 | Electronic device |
| CN106879240A (en) * | 2017-02-07 | 2017-06-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US20190045674A1 (en) * | 2017-08-03 | 2019-02-07 | Autel Robotics Co., Ltd. | Electromagnetic shielding structure and electronic device having the same |
| CN207382272U (en) * | 2017-12-30 | 2018-05-18 | 西安开容电子技术有限责任公司 | A kind of servo-drive equipment junction filter |
| CN108848644A (en) * | 2018-08-23 | 2018-11-20 | 上海航天科工电器研究院有限公司 | A kind of great-power electromagnetic sealing heat dissipating cabinet |
| CN209472965U (en) * | 2018-10-31 | 2019-10-08 | 苏州汇川联合动力系统有限公司 | Electromagnetic armouring structure and DC converter |
| CN209979856U (en) * | 2019-02-21 | 2020-01-21 | 上海华测导航技术股份有限公司 | Circuit structure and navigation receiver |
| CN112423573A (en) * | 2019-08-20 | 2021-02-26 | 上海海拉电子有限公司 | Electromagnetic protection device |
| CN212162881U (en) * | 2020-06-16 | 2020-12-15 | 武汉中电通信有限责任公司 | Charging device suitable for storage battery charging |
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