CN113725193A - Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method - Google Patents

Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method Download PDF

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Publication number
CN113725193A
CN113725193A CN202110996735.4A CN202110996735A CN113725193A CN 113725193 A CN113725193 A CN 113725193A CN 202110996735 A CN202110996735 A CN 202110996735A CN 113725193 A CN113725193 A CN 113725193A
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Prior art keywords
chip
packaging
packaged
assembly
direct current
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CN202110996735.4A
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Chinese (zh)
Inventor
宋志华
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Shenzhen Qiancheng Semiconductor Technology Co ltd
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Shenzhen Qiancheng Semiconductor Technology Co ltd
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Priority to CN202110996735.4A priority Critical patent/CN113725193A/en
Publication of CN113725193A publication Critical patent/CN113725193A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)

Abstract

The invention relates to the technical field of chip packaging, and discloses a direct current direct drive type driving chip with multiple packaging forms, a packaging device and a packaging method, wherein stable and ordered blanking is completed by a simple mechanical structure through arrangement of an electric telescopic rod and the like, rapid thermal fusion packaging is realized by adopting a fluorescent marking mode and matching with a hot melting gun, then different chip packaging shells can be self-adaptively selected while precise packaging is realized, the packaging efficiency is improved, two clamping blocks on corresponding positions are driven to rotate by using a clamping cylinder and the like to rotate by using a corresponding rotating shaft as a shaft, then the clamping blocks on the two sides clamp the two sides of a chip to be packaged, the stability during packaging is further improved, the influence of the operation of a conveyor belt on the displacement of the chip to be packaged is avoided, the push plate pushes the corresponding chip to be packaged into a defective product groove through the operation of a material returning cylinder, and defective product collection is completed, and the packaging effect of the assembly line is ensured.

Description

Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method
Technical Field
The invention relates to the technical field of chip packaging, in particular to a direct current direct drive type driving chip in a multi-packaging form, a packaging device and a packaging method.
Background
The chip package is a housing for mounting a semiconductor integrated circuit chip, and has functions of mounting, fixing, sealing, protecting the chip, and enhancing the electrothermal performance. The chip package is a bridge for communicating the internal world of the chip with an external circuit, the connection point of the chip is connected to the pin of the package shell by a lead, and the pin is connected with other devices by the lead on the printed board; the package plays an important role in CPU and other LSI integrated circuits, the pin number is increased, the pin pitch is reduced, the weight is reduced, the reliability is improved, and the use is more convenient.
In the prior art, a common LED driving chip adopts a completely independent three-way constant current driving circuit, so that a lot of resources are consumed for trimming the three-way circuit into an accurate expected value, if the three-way circuit is trimmed to be the same, as the working voltages and the luminous efficiencies of three RGB lamp beads are different, in order to enable the light intensities of the three RGB colors to reach a proper proportion, a gamma correction algorithm with a large proportion must be adopted on software, and the available blue resolution is obviously smaller than the resolutions of red light and green light; in addition, the current chip packaging device can only package a single-packaging chip, different packaging forms cannot be adaptively switched according to different chip pins, and the practicability is low.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a direct current direct drive type driving chip with multiple packaging forms and a packaging method, which have the advantages of high intelligence and the like and solve the series problems of inaccurate positioning and the like in the prior art.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a direct current direct drive type driving chip in a multi-package form comprises a chip body, wherein a marking groove used for marking fluorescent substances is formed in the chip body, and the chip body adopts a multi-package form comprising SOP8, ESOP8 and 5050-18;
the chip body also comprises a constant power mode used for controlling the chips to be capable of working in a stacking mode under 220V pulse direct current high voltage;
the chip body is externally connected with a voltage dividing resistor for optimizing the heat dissipation distribution of the system;
the chip body has the decoding and coding capability of the return-to-zero code of 1.5 MHz;
the chip body is internally provided with a trimming current source and an oscillator;
the chip body is matched with various LED lamp beads through the combination of a variable frequency PWM driving technology, frame frequency and white balance;
the chip body is also provided with a signal loss connection lamp-out function and a color lack detection lamp-out function.
A packaging device of a direct current direct drive type driving chip in a multi-packaging form is used for packaging a chip to be packaged into the direct current direct drive type driving chip in the multi-packaging form and comprises a mounting frame, wherein a transmission assembly, a blanking assembly, a positioning assembly, a packaging assembly, a detection assembly and a screening assembly are sequentially arranged on the mounting frame;
the transmission assembly comprises a driving assembly and a conveyor belt which are matched with each other and is used for conveying the chip to be packaged;
the blanking assembly is used for blanking a plurality of chips to be packaged one by one and falling the chips to the conveyor belt;
the positioning component comprises a corresponding marking component, a positioning instrument and an identifier, the marking component is used for marking and positioning the chip (4) to be packaged by using a fluorescent marking technology, the marking component is positioned between the blanking component and the packaging component, the positioning instrument (35) matched with the marking component is further arranged on the packaging component, and the identifier capable of analyzing the packaging form of the chip to be packaged is connected to the positioning instrument;
the packaging assembly comprises a first station, a second station and a hot melting gun, wherein the first station and the second station correspond to each other in position, and the hot melting gun is used for carrying out hot sealing on the chip to be packaged;
the detection assembly is used for being matched with the screening assembly to classify and collect the final qualified products and the defective products of the chips to be packaged.
Preferably, the blanking assembly comprises a replacement plate matched with the chip to be packaged and a chip storage box for storing the chip to be packaged, the chip storage box and an electric telescopic rod are fixedly mounted on the mounting frame, the output end of the electric telescopic rod is fixedly connected with a material pushing rod, a blanking chute corresponding to the position of the chip storage box is further formed in the mounting frame, the top end of the material pushing rod corresponds to the height of the blanking chute, and one end of the material pushing rod extends out of one side of the chip storage box;
a replacement plate is sleeved in the blanking chute in a sliding manner, two sides of the replacement plate are fixedly connected with protruding blocks, guide rods which are sleeved on the mounting frame in a sliding manner are fixedly connected on the protruding blocks, compensation springs are sleeved on the guide rods, and two ends of each compensation spring are fixedly connected to the mounting frame and the protruding blocks respectively;
one side of the material pushing rod is kept attached to one side of the supplementary plate.
Preferably, the encapsulation subassembly is still including driving first station (18) with second station (19) synchronous pivoted station dish (7), just one side of encapsulation subassembly still is equipped with rather than the encapsulation casing of looks adaptation and stores the box, the encapsulation casing stores the different chip packaging box of placing a plurality of superpositions and encapsulation form in the box, still be equipped with on the mounting bracket with the station dish reaches the encapsulation casing stores the material loading subassembly of box homogeneous phase adaptation, the material loading subassembly be used for with the encapsulation casing stores the interior chip packaging box of box and removes to correspond the position on the station dish.
Preferably, the packaging assembly further comprises a guide assembly capable of driving the hot melting gun to move, the station disc is provided with two groups of first stations and second stations corresponding to each other in position, and the first stations and the second stations are respectively used for storing the chip packaging boxes in different packaging forms;
the mounting frame is further provided with the guide assembly and the packaging motor which are matched, the guide assembly is sleeved with a sliding seat in a sliding mode, the sliding seat is fixedly connected with a packaging air cylinder capable of driving the hot melting gun to lift, the packaging motor is further arranged at one end of the guide assembly, the output end of the packaging motor is fixedly connected with a lead screw, and the sliding seat is sleeved on the lead screw in a threaded mode;
and the mounting frame is also provided with a rotating motor capable of driving the station disc to rotate.
Preferably, a fixed clamp plate is fixedly sleeved on the hot melting gun, an air gun is slidably sleeved on the fixed clamp plate, a fixed disc is fixedly sleeved on the air gun, a compression spring is sleeved on the air gun, and two ends of the compression spring are respectively and fixedly connected to the fixed clamp plate and the fixed disc;
the bottom end of the air gun is communicated with a sucker matched with the chip to be packaged, and the bottom end of the sucker is positioned below the bottom end of the hot melting gun in a natural state;
the hot melting gun is also provided with the positioning instrument matched with the marking component for use.
Preferably, the detection subassembly is including being used for detecting whether treat that the encapsulation chip encapsulates complete scanner and can drive telescopic cylinder and the adaptation cylinder that the scanner goes up and down, fixed mounting has on the mounting bracket telescopic cylinder, just telescopic cylinder's output fixedly connected with the adaptation cylinder, the output fixedly connected with of adaptation cylinder the scanner.
Preferably, the screening assembly further comprises a defective product groove and a collecting box which correspond to each other, the material returning cylinder is arranged on one side of the detection assembly, a push plate is fixedly connected to the output end of the material returning cylinder, the defective product groove corresponding to the position of the push plate is further arranged on the mounting frame, and the collecting box is arranged at one end of the conveyor belt.
Preferably, still be equipped with on the mounting bracket and right wait to encapsulate the chip and press from both sides the fixed subassembly of tight fixed, fixed subassembly contains and installs a plurality of centre gripping cylinders on the mounting bracket, centre gripping cylinder's output fixedly connected with connecting block, it is connected with the clamp splice that two positions are corresponding to rotate through the pivot on the connecting block, and two archs the clamp splice can realize right through rotating on the conveyer belt wait to encapsulate the chip and press from both sides tightly whether.
A packaging method of a direct current direct drive type driving chip in a multi-packaging form uses a chip body in the technical scheme of the direct current direct drive type driving chip in the multi-packaging form and a packaging device of the direct current direct drive type driving chip in the multi-packaging form in any one of the technical schemes.
(III) advantageous effects
Compared with the prior art, the invention provides a direct current direct drive type driving chip with multiple packaging forms and a packaging method thereof, and the direct current direct drive type driving chip with multiple packaging forms has the following beneficial effects:
1. the direct current direct drive type driving chip with multiple packaging forms, the packaging device and the packaging method thereof have the advantages that the consistency of each path of current of the LED is considered, the resolution ratio and the white balance are a great challenge for most LED driving chips, the VF-PWM technology is adopted by the chip, the channel difference of RGB and the contradiction between the resolution ratio and the white balance are flexibly and skillfully solved, the chip adopts VF-PWM technology, utilizes a single driver, adopts a time division multiplexing method to drive three paths of LEDs, and when the three paths of LEDs are driven, according to the requirement of white balance, channels with high power demand are driven with a lower clock count and channels with low power demand are counted with a higher clock, and thus, while white balance is satisfactorily achieved without sacrificing resolution, we can derive the power contribution from the distributed RGB by setting the PWM count clock prescaler of R, G and B during a complete PWM cycle.
2. This direct current direct drive formula driver chip of many encapsulation forms and packaging hardware and packaging method thereof, through control electric telescopic handle operation, make the ejector pin remove to the one side that is close to the conveyer belt, promote then in the unloading spout treat the encapsulation chip to the conveyer belt on, and simultaneously, the replacement board is followed the ejector pin and is removed under compensating spring's effect, avoid the upper strata treat the encapsulation chip to fall to electric telescopic handle in, electric telescopic handle reverse operation thereupon, make the one end of ejector pin return to the original position, then the upper strata is treated the encapsulation chip and is fallen to electric telescopic handle in, thereby realize stable orderly blanking through simple mechanical structure, cooperate other subassemblies to carry out high efficiency chip package.
3. The direct current direct drive type driving chip with multiple packaging forms, the packaging device and the packaging method thereof have the advantages that the chip to be packaged is subjected to fluorescence marking through the marking assembly, when the chip to be packaged moves to a relative position on the packaging assembly, the marking position is identified through the locator, so that the chip to be packaged is accurately positioned by matching with the identifier, the packaging position is prevented from generating large deviation, the specific packaging form of the chip to be packaged is judged through the identification effect of the identifier, the rotating motor is controlled to operate, the corresponding first station or second station is rotated to one side close to the conveyor belt, then the packaging motor and the packaging cylinder are controlled to operate, the air gun moves the chip packaging shell in the first station or second station at the corresponding position to the chip to be packaged through the suction cup to the corresponding position on the chip to be packaged, and the hot melting gun is matched to realize quick hot melting packaging, and then, when the accurate packaging is realized, different chip packaging shells can be selected in a self-adaptive manner, and the packaging efficiency is improved.
4. This direct current direct drive formula driver chip of many encapsulation forms and packaging hardware and packaging method thereof, when carrying out instantaneous heating through the hot melt rifle, because the height of sucking disc is lower, can make its preferential surface contact with waiting to encapsulate the chip, cooperation compression spring's use then, treat to encapsulate the chip and play the effect of compressing tightly to a certain extent before the encapsulation, unexpected offset appears when avoiding encapsulating, and simultaneously, through centre gripping cylinder operation, make the connecting block go up and down, it uses the pivot that corresponds to drive two clamp splices on the corresponding position to rotate as the axle, then make the clamp splice of both sides treat the both sides of encapsulating the chip and press from both sides tightly, stability when further improving the encapsulation, the operation of avoiding the conveyer belt is treated and is encapsulated the chip and cause the displacement influence.
5. According to the direct current direct-drive type driving chip with multiple packaging forms, the packaging device and the packaging method of the direct current direct-drive type driving chip, when the chip to be packaged is packaged and conveyed to the corresponding position on the scanner through the conveyor belt, the clamping block clamps the corresponding chip to be packaged through the operation of the corresponding clamping cylinder, the position of the scanner is adjusted in real time through the telescopic cylinder and the adaptive cylinder, the surface of the chip to be packaged is scanned and identified, whether packaging defective parts exist is judged, if the packaging effect is good, the chip to be packaged is conveyed into the collecting box through the conveyor belt to be collected in a centralized mode, if the packaging effect is found to be unsatisfactory, the material returning cylinder operates, the corresponding chip to be packaged is pushed into the defective product groove by the push plate, defective product collection is completed, and the packaging effect of the assembly line is guaranteed.
Drawings
FIG. 1 is a first perspective view of a chip package device according to the present invention;
FIG. 2 is a second perspective view of the chip package device according to the present invention;
FIG. 3 is a schematic perspective view of the chip packaging apparatus of the present invention with the mounting frame removed;
FIG. 4 is a schematic view of a three-dimensional structure of a blanking assembly of the chip packaging apparatus of the present invention;
FIG. 5 is a schematic view of another perspective structure of a blanking assembly of the chip packaging apparatus according to the present invention;
FIG. 6 is a schematic perspective view of a package assembly of the chip package device of the present invention;
FIG. 7 is a schematic view of another perspective structure of a package assembly of the present invention;
FIG. 8 is a schematic perspective view of a detection assembly of the chip packaging apparatus according to the present invention;
FIG. 9 is an enlarged view of the chip package device of FIG. 7A;
fig. 10 is a schematic perspective view of a clamping cylinder of the chip packaging apparatus according to the present invention.
In the figure: 1. a mounting frame; 2. a drive assembly; 3. a conveyor belt; 4. a chip to be packaged; 5. a chip storage box; 6. a marking component; 7. a station disc; 8. a scanner; 9. a material returning cylinder; 10. a clamping cylinder; 11. an electric telescopic rod; 12. a material pushing rod; 13. a blanking chute; 14. replacing the board; 15. a bump; 16. a package housing storage box; 17. a feeding assembly; 18. a first station; 19. a second station; 20. a guide assembly; 21. packaging the motor; 22. packaging the cylinder; 23. a rotating electric machine; 24. a telescopic cylinder; 25. adapting the cylinder; 26. pushing the plate; 27. a defective product tank; 28. a collection box; 29. a hot melt gun; 30. fixing the clamping plate; 31. an air gun; 32. fixing the disc; 33. a compression spring; 34. a suction cup; 35. a positioning instrument; 36. an identifier; 37. connecting blocks; 38. a rotating shaft; 39. and (5) clamping blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background of the invention, the prior art has disadvantages, and in order to solve the above technical problems, the present application provides a direct current direct drive type driving chip with multiple package forms and a packaging method thereof.
In a typical embodiment of the present application, as shown in fig. 1 to 10, a multi-package dc direct-drive driver chip includes a chip body, wherein a mark slot for marking a fluorescent material is formed on the chip body, and the chip body is suitable for various package forms, including package forms of SOP8, ESOP8, and 5050 to 18;
the chip body also comprises a constant power mode, and the control chip can be stacked and work under 220V pulse direct current high voltage;
an external voltage-dividing resistor can be selected, and the heat dissipation distribution of the system is optimized;
return to zero code decoding and encoding capabilities up to 1.5 MHz;
a high-standard trimming current source and an oscillator are arranged in the circuit;
the frequency conversion PWM driving technology, the frame frequency and the white balance are combined and arranged, and various LED lamp beads are flexibly matched;
and the chip body is also provided with a signal loss connection lamp-out function and a color lack detection lamp-out function.
A direct current direct drive type driving chip packaging device in a multi-packaging form comprises a mounting frame 1 and a chip 4 to be packaged, wherein a transmission assembly, a blanking assembly, a positioning assembly, a packaging assembly, a detection assembly and a screening assembly are sequentially arranged on the mounting frame 1;
in this embodiment, the transmission assembly is used for transmitting the chip 4 to be packaged and includes the driving assembly 2 and the conveyor belt 3 which are adapted to each other, the chip 4 to be packaged is located on the conveyor belt 3, and the conveyor belt 3 is located on the plurality of assemblies and adapted to the positions of the plurality of assemblies;
in this embodiment, the blanking assembly is configured to perform blanking on a plurality of chips 4 to be packaged one by one and drop the chips onto the conveyor belt 3, and the chips 4 to be packaged include the replacement board 14 adapted to the chips 4 to be packaged;
in this embodiment, the positioning component includes a corresponding marking component 6 and a positioning instrument 35, the marking component 6 performs marking positioning on the chip 4 to be packaged by using a fluorescent marking technology, the marking component 6 is located between the blanking component and the packaging component, and the packaging component is further provided with the positioning instrument 35 adapted to the marking component 6;
in this embodiment, the packaging assembly includes a first station 18 and a second station 19 corresponding to each other in position, and further includes a hot melting gun 29 for performing hot sealing on the chip 4 to be packaged and a station tray 7 capable of driving the first station 18 and the second station 19 to rotate synchronously;
in this embodiment, the detecting component includes a scanner 8 for detecting whether the chip 4 to be packaged is completely packaged, and the detecting component can be matched with the screening component to classify and collect the final qualified products and the defective products of the chip 4 to be packaged.
As an implementation manner in this embodiment, the blanking assembly further includes a chip storage box 5 for storing a chip 4 to be packaged, the chip storage box 5 and an electric telescopic rod 11 are fixedly mounted on the mounting frame 1, an output end of the electric telescopic rod 11 is fixedly connected with a material pushing rod 12, the mounting frame 1 is further provided with a blanking chute 13 corresponding to the chip storage box 5 in position, a top end of the material pushing rod 12 corresponds to the height of the blanking chute 13, and one end of the material pushing rod 12 extends out of one side of the chip storage box 5;
in this embodiment, a replacement plate 14 is slidably sleeved in the blanking chute 13, two sides of the replacement plate 14 are fixedly connected with a bump 15, the bump 15 is fixedly connected with a guide rod slidably sleeved on the mounting frame 1, the guide rod is sleeved with a compensation spring, and two ends of the compensation spring are fixedly connected to the mounting frame 1 and the bump 15 respectively;
in this embodiment, one side of the plunger 12 remains attached to one side of the patch panel 14.
As an implementation manner in this embodiment, one side of the package assembly is further provided with a package housing storage box 16 adapted to the package assembly, a plurality of stacked chip package boxes with different package forms are placed in the package housing storage box 16, the mounting frame 1 is further provided with a feeding assembly 17 adapted to both the station tray 7 and the package housing storage box 16, and the feeding assembly 17 is used for moving the chip package boxes in the package housing storage box 16 to corresponding positions on the station tray 7.
As an implementation manner in this embodiment, the packaging assembly further includes a guiding assembly 20 capable of driving the heat melting gun 29 to move, the station tray 7 is provided with two sets of first stations 18 and second stations 19 corresponding in position, and the first stations 18 and the second stations 19 are respectively used for storing chip packaging boxes of different packaging forms;
in this embodiment, the mounting bracket 1 is further provided with a guide assembly 20 and an encapsulation motor 21 which are matched with each other, the guide assembly 20 is slidably sleeved with a sliding seat, the sliding seat is fixedly connected with an encapsulation cylinder 22 which can drive the hot melt gun 29 to ascend and descend, one end of the guide assembly 20 is further provided with the encapsulation motor 21, the output end of the encapsulation motor 21 is fixedly connected with a lead screw, and the sliding seat is in threaded sleeve connection with the lead screw;
in the present embodiment, a rotating motor 23 for rotating the position disk 7 is further mounted on the mounting frame 1.
As an implementation manner in this embodiment, a fixing clamp plate 30 is fixedly sleeved on the hot melting gun 29, an air gun 31 is slidably sleeved on the fixing clamp plate 30, a fixing plate 32 is fixedly sleeved on the air gun 31, a pressing spring 33 is sleeved on the air gun 31, and two ends of the pressing spring 33 are respectively and fixedly connected to the fixing clamp plate 30 and the fixing plate 32;
in the embodiment, the bottom end of the air gun 31 is communicated with a suction cup 34 adapted to the chip 4 to be packaged, and the bottom end of the suction cup 34 is located below the bottom end of the hot melting gun 29 in a natural state;
in this embodiment, the hot melting gun 29 is further provided with an aligner 35 used in cooperation with the marking assembly 6, and the aligner 35 is further connected with a recognition instrument 36 capable of analyzing the packaging form of the chip 4 to be packaged.
As an implementation manner in this embodiment, the detection assembly further includes a telescopic cylinder 24 and an adaptation cylinder 25 which can drive the scanner 8 to go up and down, the telescopic cylinder 24 is fixedly mounted on the mounting frame 1, the output end of the telescopic cylinder 24 is fixedly connected with the adaptation cylinder 25, and the output end of the adaptation cylinder 25 is fixedly connected with the scanner 8.
As an implementation manner in this embodiment, the screening component further includes a defective product groove 27 and a collecting box 28 corresponding to each other, a material returning cylinder 9 is disposed on one side of the detection component, a push plate 26 is fixedly connected to an output end of the material returning cylinder 9, a defective product groove 27 corresponding to the position of the push plate 26 is further disposed on the mounting frame 1, and the collecting box 28 is disposed at one end of the conveyor belt 3.
As an implementation manner in this embodiment, the mounting frame 1 is further provided with a fixing component capable of clamping and fixing the chip 4 to be packaged, the fixing component includes a plurality of clamping cylinders 10 installed on the mounting frame 1, an output end of each clamping cylinder 10 is fixedly connected with a connecting block 37, the connecting block 37 is rotatably connected with two clamping blocks 39 corresponding in position through a rotating shaft 38, and the two arc-shaped clamping blocks 39 can rotate to clamp the chip 4 to be packaged on the conveyor belt 3 or not.
A multi-package direct current direct drive type driving chip packaging method uses the chip body and the chip packaging device.
The working principle of the invention is as follows: when encapsulating the chip, arrange a plurality of chips of treating encapsulation 4 in the chip that corresponds and store box 5, operate through control electric telescopic handle 11, make ejector pin 12 to the one side removal that is close to conveyer belt 3, promote then treat in the unloading spout 13 and encapsulate on chip 4 to conveyer belt 3, and simultaneously, replace that the board 14 follows ejector pin 12 and remove under compensating spring's effect, avoid the upper layer treat that encapsulation chip 4 falls to electric telescopic handle 11 in, 11 reverse operations of electric telescopic handle thereupon, make the one end of ejector pin 12 return to in, then the upper layer is treated encapsulation chip 4 and is fallen to electric telescopic handle 11 in the original position, thereby realize stable orderly blanking through simple mechanical structure, cooperate other subassemblies to carry out high efficiency chip encapsulation.
The chip 4 to be packaged falling on the conveyor belt 3 passes through the relative position on the marking component 6, the chip 4 to be packaged is subjected to fluorescent marking through the marking component 6, when the chip 4 to be packaged moves to the relative position on the packaging component, the marking position is identified through the locator 35, the chip 4 to be packaged is accurately positioned by the identification instrument 36, the packaging position is prevented from generating large deviation, the specific packaging form of the chip 4 to be packaged is judged through the identification function of the identification instrument 36, the rotating motor 23 is controlled to operate, the corresponding first station 18 or second station 19 rotates to one side close to the conveyor belt 3, then the packaging motor 21 and the packaging cylinder 22 are controlled to operate, and the air gun 31 moves the chip packaging shell in the first station 18 or second station 19 on the corresponding position to the chip 4 to be packaged through the suction cup 34, the cooperation hot melt rifle 29 realizes quick hot melt encapsulation, then when realizing accurate encapsulation, can the different chip package casings of self-adaptation formula selection again, has improved encapsulation efficiency.
In last encapsulation process, when carrying out instantaneous heating through hot melt rifle 29, because sucking disc 34 highly lower, can make its preferential surface contact with waiting to encapsulate chip 4, cooperation pressure spring 33's use then, treat to encapsulate chip 4 and play the effect of compressing tightly to a certain extent before the encapsulation, unexpected offset appears when avoiding encapsulating, and simultaneously, through centre gripping cylinder 10 operation, make connecting block 37 go up and down, it rotates as the axle to drive two clamp splice 39 on the corresponding position with the pivot 38 that corresponds, then make the clamp splice 39 of both sides treat the both sides of encapsulating chip 4 and press from both sides tightly, stability when further improving the encapsulation, avoid the operation of conveyer belt 3 to treat that encapsulation chip 4 causes the displacement influence.
The packaged chips 4 to be packaged are transported to the corresponding positions on the scanner 8 through the conveyor belt 3, the corresponding clamping cylinders 10 are operated to enable the clamping blocks 39 to clamp the corresponding chips 4 to be packaged, the positions of the scanner 8 are adjusted in real time through the telescopic cylinders 24 and the adapting cylinders 25, the surfaces of the chips 4 to be packaged are scanned and identified, whether poor packaging positions exist is judged, if the packaging effect is good, the chips 4 to be packaged are conveyed into the collecting box 28 through the conveyor belt 3 to be collected in a centralized mode, if the packaging effect is found to be unsatisfactory, the material returning cylinders 9 are operated to enable the push plates 26 to push the corresponding chips 4 to be packaged into the defective product grooves 27, defective product collection is completed, and the packaging effect of the assembly line is guaranteed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. A direct current direct drive type driving chip with multiple packaging forms is characterized by comprising a chip body,
the chip body is provided with a marking groove for marking fluorescent substances, and the chip body adopts a multi-packaging form comprising SOP8, ESOP8 and 5050-18;
the chip body also comprises a constant power mode used for controlling the chips to be capable of working in a stacking mode under 220V pulse direct current high voltage;
the chip body is externally connected with a voltage dividing resistor for optimizing the heat dissipation distribution of the system;
the chip body has the decoding and coding capability of the return-to-zero code of 1.5 MHz;
the chip body is internally provided with a trimming current source and an oscillator;
the chip body is matched with various LED lamp beads through the combination of a variable frequency PWM driving technology, frame frequency and white balance;
the chip body is also provided with a signal loss connection lamp-out function and a color lack detection lamp-out function.
2. The utility model provides a packaging hardware of direct current direct drive formula driver chip of many encapsulated forms for will treat that encapsulated chip (4) encapsulates into direct current direct drive formula driver chip of many encapsulated forms, its characterized in that: the automatic feeding device comprises an installation rack (1), wherein a transmission assembly, a blanking assembly, a positioning assembly, a packaging assembly, a detection assembly and a screening assembly are sequentially arranged on the installation rack (1);
the transmission assembly comprises a driving assembly (2) and a conveyor belt (3) which are matched with each other and used for conveying the chip (4) to be packaged;
the blanking assembly is used for blanking a plurality of chips (4) to be packaged one by one and falling onto the conveyor belt (3);
the positioning component comprises a corresponding marking component (6), a positioning instrument (35) and an identification instrument (36), the marking component (6) is used for marking and positioning the chip (4) to be packaged by using a fluorescent marking technology, the marking component (6) is positioned between the blanking component and the packaging component, the positioning instrument (35) matched with the marking component (6) is further arranged on the packaging component, and the identification instrument (36) capable of analyzing the packaging form of the chip (4) to be packaged is connected to the positioning instrument (35);
the packaging assembly comprises a first station (18), a second station (19) and a hot melting gun (29), wherein the first station and the second station are corresponding in position, and the hot melting gun is used for carrying out hot sealing on the chip (4) to be packaged;
the detection assembly is used for being matched with the screening assembly to classify and collect the final qualified products and the defective products of the chips (4) to be packaged.
3. The packaging device of the direct current direct drive type driving chip in multi-package form according to claim 2, wherein: the blanking assembly comprises a replacement plate (14) matched with the chip (4) to be packaged and a chip storage box (5) used for storing the chip (4) to be packaged, the chip storage box (5) and an electric telescopic rod (11) are fixedly mounted on the mounting frame (1), the output end of the electric telescopic rod (11) is fixedly connected with a material pushing rod (12), a blanking chute (13) corresponding to the position of the chip storage box (5) is further formed in the mounting frame (1), the top end of the material pushing rod (12) corresponds to the height of the blanking chute (13), and one end of the material pushing rod (12) extends out of one side of the chip storage box (5);
a supplement plate (14) is sleeved in the blanking chute (13) in a sliding manner, convex blocks (15) are fixedly connected to two sides of the supplement plate (14), guide rods which are sleeved on the mounting rack (1) in a sliding manner are fixedly connected to the convex blocks (15), compensation springs are sleeved on the guide rods, and two ends of each compensation spring are fixedly connected to the mounting rack (1) and the convex blocks (15) respectively;
one side of the material pushing rod (12) is kept jointed with one side of the supplement plate (14).
4. The packaging device of the direct current direct drive type driving chip of the multi-package form according to claim 3, wherein: the encapsulation subassembly is still including driving first station (18) with synchronous pivoted station dish (7) of second station (19), just one side of encapsulation subassembly still is equipped with the encapsulation casing rather than the looks adaptation and stores box (16), the encapsulation casing stores and has placed the different chip packaging box of a plurality of superpositions and encapsulation form in box (16), still be equipped with on mounting bracket (1) with station dish (7) and the encapsulation casing stores material loading subassembly (17) of box (16) homogeneous phase adaptation, material loading subassembly (17) are used for with the encapsulation casing stores the chip packaging box in box (16) and removes to correspond the position on station dish (7).
5. The packaging device of the direct current direct drive type driver ic with multiple packaging forms of claim 4, wherein: the packaging assembly further comprises a guide assembly (20) capable of driving the hot melting gun (29) to move, two groups of first stations (18) and second stations (19) corresponding in position are arranged on the station disc (7), and the first stations (18) and the second stations (19) are respectively used for storing the chip packaging boxes in different packaging forms;
the mounting rack (1) is further provided with a guide assembly (20) and a packaging motor (21) which are matched with each other, the guide assembly (20) is sleeved with a sliding seat in a sliding mode, a packaging cylinder (22) capable of driving the hot melt gun (29) to ascend and descend is fixedly connected to the sliding seat, the packaging motor (21) is further arranged at one end of the guide assembly (20), the output end of the packaging motor (21) is fixedly connected with a lead screw, and the sliding seat is sleeved on the lead screw in a threaded mode;
the mounting rack (1) is further provided with a rotating motor (23) which can drive the station disc (7) to rotate.
6. The packaging device of the direct current direct drive type driver ic with multiple packaging forms of claim 5, wherein: the hot melting gun (29) is fixedly sleeved with a fixed clamping plate (30), the fixed clamping plate (30) is sleeved with an air gun (31) in a sliding mode, the air gun (31) is fixedly sleeved with a fixed plate (32), the air gun (31) is sleeved with a compression spring (33), and two ends of the compression spring (33) are fixedly connected to the fixed clamping plate (30) and the fixed plate (32) respectively;
the bottom end of the air gun (31) is communicated with a sucking disc (34) matched with the chip (4) to be packaged, and the bottom end of the sucking disc (34) is positioned below the bottom end of the hot melting gun (29) in a natural state;
the hot melting gun (29) is also provided with the positioning instrument (35) matched with the marking assembly (6).
7. The packaging device of the direct current direct drive type driver ic with multiple packaging forms of claim 4, wherein: the detection assembly comprises a detection component, wherein the detection component is used for detecting whether the to-be-packaged chip (4) is completely packaged, the scanner (8) is packaged completely, and the detection component can drive the scanner (8) to ascend and descend, the telescopic cylinder (24) and the adaptive cylinder (25) are fixedly mounted on the mounting frame (1), the telescopic cylinder (24) is fixedly connected with the output end of the telescopic cylinder (24), the adaptive cylinder (25) is fixedly connected with the output end of the adaptive cylinder (25), and the scanner (8) is arranged on the mounting frame.
8. The packaging device of the direct current direct drive type driver ic with multiple packaging forms of claim 7, wherein: the screening assembly further comprises a defective product groove (27) and a collecting box (28) which correspond to each other, the material returning cylinder (9) is arranged on one side of the detection assembly, a push plate (26) is fixedly connected to the output end of the material returning cylinder (9), the defective product groove (27) corresponding to the position of the push plate (26) is further arranged on the mounting frame (1), and the collecting box (28) is arranged at one end of the conveyor belt (3).
9. The packaging device of the direct current direct drive type driver ic with multiple packaging forms of claim 8, wherein: still be equipped with on mounting bracket (1) and right wait to encapsulate chip (4) and press from both sides the fixed subassembly of tight fixing, fixed subassembly contains and installs a plurality of centre gripping cylinders (10) on mounting bracket (1), the output fixedly connected with connecting block (37) of centre gripping cylinder (10), it is connected with two corresponding clamp splice (39) in position to rotate through pivot (38) on connecting block (37), and two archs clamp splice (39) can be realized right through rotating on conveyer belt (3) wait to encapsulate chip (4) and press from both sides tightly whether.
10. A packaging method of a direct current direct drive type driving chip in a multi-packaging form is characterized by comprising the following steps: a package device using the chip body as claimed in claim 1 and the direct current direct drive type driver chip of multi-package type as claimed in any one of claims 2 to 9.
CN202110996735.4A 2021-08-27 2021-08-27 Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method Pending CN113725193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110996735.4A CN113725193A (en) 2021-08-27 2021-08-27 Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110996735.4A CN113725193A (en) 2021-08-27 2021-08-27 Direct current direct drive type driving chip with multiple packaging forms, packaging device and packaging method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361073A (en) * 2021-12-31 2022-04-15 先之科半导体科技(东莞)有限公司 Automatic packaging equipment for high-current field effect transistor
CN115312445A (en) * 2022-10-11 2022-11-08 山东中兴科技开发有限公司 Package manufacturing equipment for integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361073A (en) * 2021-12-31 2022-04-15 先之科半导体科技(东莞)有限公司 Automatic packaging equipment for high-current field effect transistor
CN115312445A (en) * 2022-10-11 2022-11-08 山东中兴科技开发有限公司 Package manufacturing equipment for integrated circuit
CN115312445B (en) * 2022-10-11 2022-12-13 山东中兴科技开发有限公司 Package manufacturing equipment for integrated circuit

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