CN217588893U

CN217588893U - Clamping structure for die bonder and chip mounter

Info

Publication number: CN217588893U
Application number: CN202220976894.8U
Authority: CN
Inventors: 刘祥坤
Original assignee: Xinpeng Semiconductor Technology Rudong Co ltd
Current assignee: Xinpeng Semiconductor Technology Rudong Co ltd
Priority date: 2022-04-25
Filing date: 2022-04-25
Publication date: 2022-10-14
Anticipated expiration: 2032-04-25

Abstract

The utility model discloses a solid brilliant chip mounter is with pressing from both sides tight structure, including paster location case and circuit board base material, the entry has been seted up at the top of paster location case, and the inner wall of entry rotates and installs first guide arm, the inner wall fixedly connected with of entry and the parallel second guide arm of first guide arm, two sections external screw threads have been seted up on the first guide arm, and the screw thread of these two sections external screw threads revolves to opposite. This solid brilliant chip mounter is with pressing from both sides compact structure, arrange circuit board substrate in two on bearing the weight of the bottom plate, the rotary wheel dish afterwards, make first guide arm rotate, then make two drive blocks move in opposite directions on first guide arm, so that two centre gripping subassemblies move in opposite directions, the trace block slides on the second guide arm, thereby make two centre gripping subassemblies press from both sides tight fixedly to circuit board substrate, the settlement of cooperation buffering cushion, the exposed core of avoiding circuit board substrate receives wearing and tearing, it is very convenient to press from both sides tight operation, and can centre gripping not unidimensional circuit board substrate, the suitability is stronger.

Description

Clamping structure for die bonder and chip mounter

Technical Field

The utility model relates to a solid brilliant chip mounter technical field specifically is a solid brilliant chip mounter is with pressing from both sides tight structure.

Background

A die bonder or a chip mounter is key equipment for a semiconductor subsequent packaging process, realizes automatic picking of chips from a wafer and placing of the chips on a lead frame, and is equipment for accurately placing surface-mounted components on a PCB (printed circuit board) pad by moving a mounting head. The operation of the clamping structure on the existing die bonder chip mounter is complex mostly, the circuit boards with different sizes cannot be clamped and positioned, and in addition, after the chip mounter finishes the chip mounter, the circuit boards cannot be collected and conveyed, so that the working efficiency of the chip mounter is reduced. Therefore, a clamping structure for a die bonder and a die bonder is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a solid brilliant chip mounter is with pressing from both sides tight structure to solve the problem that above-mentioned background art provided.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a solid brilliant chip mounter is with pressing from both sides tight structure, includes paster location case and circuit board substrate, the entry has been seted up at the top of paster location case, and the inner wall of entry rotates and installs first guide arm, the inner wall fixedly connected with of entry and the parallel second guide arm of first guide arm, two sections external screw threads have been seted up on the first guide arm, and the screw thread of these two sections external screw threads revolves to opposite, the equal threaded mounting of two sections external screw thread departments on the first guide arm has the drive block, slidable mounting has two interlock blocks corresponding with the drive block position on the second guide arm, and a centre gripping subassembly of fixedly connected with between left drive block and the left side interlock block, another centre gripping subassembly of fixedly connected with between drive block on right side and the interlock block on right side, and circuit board substrate is fixed in between two centre gripping subassemblies.

Preferably, the clamping components are of a U-shaped frame structure, the two clamping components are symmetrically arranged, the inner wall of each clamping component is fixedly connected with the bearing bottom plate, the circuit board base material is arranged at the top of the bearing bottom plate, and the two clamping components clamp the two sides of the circuit base material.

Preferably, the inner wall of the clamping component is fixedly connected with a buffering soft cushion, and the side surface of the circuit board base material is abutted against the buffering soft cushion.

Preferably, all seted up the slide opening on the curb plate around the paster location case, and sliding connection has uncovered receipts magazine in the slide opening, the interior roof fixedly connected with guide table of paster location case, and the top of guide table is the type of falling V, the quantity of uncovered receipts magazine is two to the symmetry slides in the both sides of guide table.

Preferably, the equal fixedly connected with side track in both sides of paster positioning box, and seted up smooth chamber in the side track, the rotating lead screw is installed to the smooth intracavity internal rotation, and the screw thread is installed at the rotating lead screw and follow-up piece, follow-up piece sliding connection is in smooth intracavity, the side track is close to one side of paster positioning box and seted up and is led to the communicating logical groove in smooth chamber, the movable groove in leading to the groove intercommunication is all seted up to the both sides of paster positioning box, and slidable mounting has the connecting piece in the movable groove, fixed connection is on uncovered receipts box and follow-up piece respectively at the both ends of connecting piece, and fixed mounting has step motor on one of them side track, step motor's output side track fixed connection is in the one end of rotating lead screw, and the other end of this rotating lead screw extends outward and is connected with another rotating lead screw transmission through the conveyer belt.

Preferably, one end of the first guide rod extends out of the patch positioning box and is fixedly connected with a rotating wheel disc.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) This solid brilliant chip mounter is with pressing from both sides compact structure, two centre gripping subassemblies are in the detached state at first, arrange circuit board substrate in two bearing bottom plate on, the rotary wheel dish afterwards, make first guide arm rotate, then make two drive blocks move in opposite directions on first guide arm, so that two centre gripping subassemblies move in opposite directions, the trace block slides on the second guide arm, thereby make two centre gripping subassemblies press from both sides tightly fixed to circuit board substrate, the settlement of cooperation buffering cushion, the exposed core who avoids circuit board substrate receives wearing and tearing, it is very convenient to press from both sides tight operation, and can centre gripping not unidimensional circuit board substrate, the suitability is stronger.

(2) This solid brilliant chip mounter is with pressing from both sides compact structure can carry out the paster task to the circuit board substrate after pressing from both sides tightly, reverse wrench movement rotating wheel dish after the paster ends, make two centre gripping subassemblies separate gradually, then make the space increase between two centre gripping subassemblies, collect in circuit board substrate falls into uncovered collecting box through the direction platform, but uncovered collecting box roll-off paster positioning box, and then so that the clamping jaw mechanism on the production line acquires the material in the uncovered collecting box, make the orderly transportation of circuit board substrate.

(3) This solid brilliant chip mounter is with pressing from both sides tight structure, after the circuit board substrate after the paster is accomplished slided to uncovered collecting box in, step motor opens and drive the rotating lead screw and rotates, makes the follow-up block slide in sliding chamber, makes then the linkage drive uncovered collecting box slide to the paster positioning box is outer, acquires the back with the material in it, and the follow-up block drives uncovered collecting box and resets and slide to the paster positioning box in to be located centre gripping subassembly below, so that the receipts of next round.

Drawings

FIG. 1 is a sectional view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a perspective view of the structural clamping assembly of the present invention;

FIG. 4 is a schematic view of the structure clamping assembly of the present invention connected to a circuit board substrate;

fig. 5 is a perspective view of the side rail structure of the present invention.

In the figure: 1. a patch positioning box; 2. a first guide bar; 201. an external thread; 3. a second guide bar; 4. a drive block; 5. a linkage block; 6. rotating the wheel disc; 7. a clamping assembly; 71. a cushion pad; 72. a load floor; 8. a circuit board substrate; 9. an open material receiving box; 10. a guide table; 11. side rails; 110. a through groove; 12. a slide chamber; 13. rotating the screw rod; 14. a follow-up block; 15. a connecting member; 16. a stepping motor; 17. and (4) a conveyor belt.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following embodiments:

example one

The utility model provides a solid brilliant chip mounter is with pressing from both sides compact structure, including paster location case 1 and circuit board substrate 8, the entry has been seted up at the top of paster location case 1, and the inner wall of entry rotates and installs first guide arm 2, the inner wall fixedly connected with of entry has the second guide arm 3 parallel with first guide arm 2, two sections external screw thread 201 have been seted up on the first guide arm 2, and the screw thread of these two sections external screw thread 201 revolves to opposite, two sections external screw thread 201 departments on the first guide arm 2 are threaded and are installed drive block 4, slidable mounting has two interlock blocks 5 corresponding with drive block 4 position on the second guide arm 3, fixedly connected with a centre gripping subassembly 7 between left drive block 4 and the left side interlock block 5, another centre gripping subassembly 7 of fixedly connected with between drive block 4 on right side and the interlock block 5 on right side, and circuit board substrate 8 is fixed in between two centre gripping subassemblies 7, the moving direction of two centre gripping subassemblies 7 is opposite.

Furthermore, the clamping components 7 are of a U-shaped frame structure, the two clamping components 7 are symmetrically arranged, the inner wall of each clamping component 7 is fixedly connected with the bearing bottom plate 72, the circuit board base material 8 is arranged at the top of the bearing bottom plate 72, and the two clamping components 7 clamp two sides of the circuit board base material.

Furthermore, the inner wall of the clamping component 7 is fixedly connected with a cushion pad 71, and the side surface of the circuit board substrate 8 is abutted against the cushion pad 71.

Furthermore, one end of the first guide rod 2 extends out of the patch positioning box 1 and is fixedly connected with a rotating wheel disc 6, so that the rotating action of the first guide rod 2 is realized.

The specific implementation manner of this embodiment is: firstly, the two clamping components 7 are in a separated state, the circuit board base materials 8 are placed on the two bearing bottom plates 72, then the rotating wheel disc 6 is rotated to enable the first guide rod 2 to rotate, then the two driving blocks 4 are enabled to move oppositely on the first guide rod 2, so that the two clamping components 7 move oppositely, and the linkage block 5 slides on the second guide rod 3, so that the two clamping components 7 clamp and fix the circuit board base materials 8, and the clamping ends of the circuit board base materials 8 are prevented from being worn by matching with the setting of the buffer cushion 71, the clamping operation is very convenient, the circuit board base materials 8 with different sizes can be clamped, and the adaptability is stronger;

can carry out the paster task to circuit board substrate 8 after pressing from both sides tightly, reverse wrench movement rotating wheel disc 6 after the paster ends, make two centre gripping subassemblies 7 separate gradually, then make the space increase between two centre gripping subassemblies 7, collect in falling into uncovered collection box 9 through direction platform 10 until circuit board substrate 8, uncovered collection box 9 roll-off paster positioning box 1, and then so that the gripper mechanism on the production line acquires the material in uncovered collection box 9, make circuit board substrate 8 transport in order.

Example two

The difference from the first embodiment is that the following contents are also included:

all seted up the slide opening on the curb plate around paster positioning box 1, and sliding connection has uncovered receipts magazine 9 in the slide opening, and the interior roof fixedly connected with direction platform 10 of paster positioning box 1, and the top of direction platform 10 is the type of falling V, and the quantity of uncovered receipts magazine 9 is two to the symmetry slides in the both sides of direction platform 10.

Furthermore, both sides of the patch positioning box 1 are fixedly connected with side rails 11, and a sliding cavity 12 is formed in the side rails 11, a rotating lead screw 13 is rotatably installed in the sliding cavity 12, a follower block 14 is installed on the rotating lead screw 13 in a threaded manner, the follower block 14 is slidably connected in the sliding cavity 12, a through groove 110 communicated with the sliding cavity 12 is formed in one side of the side rails 11 close to the patch positioning box 1, moving grooves communicated with the through groove 110 are formed in both sides of the patch positioning box 1, a connecting piece 15 is slidably installed in the moving grooves, both ends of the connecting piece 15 are respectively and fixedly connected to the open material receiving box 9 and the follower block 14, a stepping motor 16 is fixedly installed on one side rail 11, an output end of the stepping motor 16 is fixedly connected to one end of the rotating lead screw 13, the other end of the rotating lead screw 13 extends out of the rotating lead screw 11 and is in transmission connection with the other rotating lead screw 13 through a conveyor belt 17, and the two rotating lead screws 13 can synchronously rotate through the transmission of the conveyor belt 17, so that the movement of the two open material receiving boxes 9 has synchronism.

In this embodiment: after the circuit board substrate 8 after the paster is finished slides into the open material receiving box 9, the stepping motor 16 is started and drives the rotating screw rod 13 to rotate, the follow-up block 14 slides in the sliding cavity 12, then the linkage piece 15 drives the open material receiving box 9 to slide towards the outside of the paster positioning box 1, after the materials in the box are obtained, the follow-up block 14 drives the open material receiving box 9 to reset and slide into the paster positioning box 1 and is positioned below the clamping component 7, and therefore the next round of material receiving is facilitated.

Those not described in detail in this specification are within the skill of the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a solid brilliant chip mounter is with clamping structure, includes paster location case (1) and circuit board substrate (8), its characterized in that: the entry has been seted up at the top of paster positioning box (1), and the inner wall of entry rotates and installs first guide arm (2), the inner wall fixedly connected with of entry and second guide arm (3) that first guide arm (2) are parallel, two sections external screw thread (201) have been seted up on first guide arm (2), and the screw thread of these two sections external screw thread (201) revolves to opposite, equal threaded mounting has drive block (4) in two sections external screw thread (201) departments on first guide arm (2), slidable mounting has two interlock pieces (5) corresponding with drive block (4) position on second guide arm (3), and fixedly connected with one centre gripping subassembly (7) between left drive block (4) and left side interlock piece (5), another centre gripping subassembly (7) of fixedly connected with between drive block (4) on right side and the interlock piece (5) on right side, and circuit board substrate (8) are fixed in between two centre gripping subassemblies (7).

2. The clamping structure for the die bonder and die bonder as claimed in claim 1, wherein: the clamping assembly (7) is of a U-shaped frame structure, the two clamping assemblies (7) are symmetrically arranged, the inner wall of each clamping assembly (7) is fixedly connected with a bearing bottom plate (72), the circuit board base material (8) is arranged at the top of the bearing bottom plate (72), and the two clamping assemblies (7) clamp the two sides of the circuit base material.

3. The clamping structure for the die bonder patch machine as claimed in claim 2, wherein: the inner wall fixedly connected with cushion (71) of centre gripping subassembly (7), the side of circuit board substrate (8) supports on cushion (71).

4. The clamping structure for the die bonder and die bonder as claimed in claim 1, wherein: all seted up the slide opening on the curb plate around paster positioning box (1), and sliding connection has uncovered receipts magazine (9) in the slide opening, the interior roof fixedly connected with guide table (10) of paster positioning box (1), and the top of guide table (10) is the type of falling V, the quantity of uncovered receipts magazine (9) is two to the symmetry slides in the both sides of guide table (10).

5. The clamping structure for the die bonder patch machine as claimed in claim 4, wherein: the equal fixedly connected with side rail (11) in both sides of paster positioning box (1), and seted up smooth chamber (12) in side rail (11), rotating lead screw (13) are installed to smooth chamber (12) internal rotation, and screw thread installation has follow-up block (14) on rotating lead screw (13), follow-up block (14) sliding connection is in smooth chamber (12), side rail (11) are close to one side of paster positioning box (1) and seted up and lead to groove (110) that communicate with smooth chamber (12), the movable groove in leading to groove (110) intercommunication is all seted up to the both sides of paster positioning box (1), and slidable mounting has connecting piece (15) in the movable groove, the both ends of connecting piece (15) are fixed connection respectively on uncovered receipts magazine (9) and follow-up block (14), and fixed mounting has step motor (16) on one of them side rail (11), the output fixed connection of step motor (16) is in the one end of rotating lead screw (13), and the other end of this rotating lead screw (13) extends outside side rail (11) and is connected with another rotating through conveyer belt (17) transmission.

6. The clamping structure for the die bonder patch machine as claimed in claim 1, wherein: one end of the first guide rod (2) extends out of the patch positioning box (1) and is fixedly connected with a rotating wheel disc (6).