CN113725177B - Microelectronic chip heat dissipation device and heat dissipation method thereof - Google Patents
Microelectronic chip heat dissipation device and heat dissipation method thereof Download PDFInfo
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- CN113725177B CN113725177B CN202111002565.XA CN202111002565A CN113725177B CN 113725177 B CN113725177 B CN 113725177B CN 202111002565 A CN202111002565 A CN 202111002565A CN 113725177 B CN113725177 B CN 113725177B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 238000004377 microelectronic Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims description 8
- 239000000428 dust Substances 0.000 claims abstract description 35
- 239000002344 surface layer Substances 0.000 claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 26
- 238000007599 discharging Methods 0.000 claims abstract description 8
- 229920000742 Cotton Polymers 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 241000883990 Flabellum Species 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a microelectronic chip heat dissipating device, wherein two symmetrical air inlets are arranged at the bottom of one side of a shell, which is far away from each other, a placing plate positioned above the air inlets is fixedly connected in the shell, a plurality of chips are arranged at the top of the placing plate, a first sliding plate positioned above the chips is connected in a sliding manner in the shell, a heat dissipating component used for dissipating heat of the chips is arranged in the first sliding plate, a discharging component used for separating and discharging heat emitted by the chips is arranged in the shell, a cleaning component used for cleaning the surface layers of the chips is arranged at the bottom of the first sliding plate, a plurality of air exhaust holes are arranged at the top of the shell, and a rotating door contacted with the first sliding plate is connected in a rotating manner in the shell; the problems that the hot air discharge port of the existing microelectronic chip heat dissipation device is fixed, dust is easily covered on the surface layer of the chip, dust is accumulated on fan blades, and the efficiency of the fan for discharging hot air is affected are solved.
Description
Technical Field
The invention belongs to the field of microelectronic chips, and relates to a microelectronic chip heat dissipation device and a heat dissipation method thereof.
Background
A chip is an integrated circuit, also known as a thin film integrated circuit, that has circuitry fabricated on the surface of a semiconductor chip. In addition, a thick film integrated circuit is a miniaturized circuit formed by integrating independent semiconductor equipment and passive components into a substrate or a circuit board, more heat can be generated in the chip work, and the heat needs to be discharged through a heat radiating device in time, so that the influence on the normal work of the chip is avoided.
The chip is used in electrical apparatus such as computer more, traditional heat dissipation mode is through fan with hot air emission to outside, but when the hot air of exhaust, the direction of discharge of hot air is in fixedly, and a large amount of hot air discharge mouth department collection under the long-time, not only influence nearby air environment and make the hot air block up the discharge mouth, hinder the emission of hot air, and then influence the heat dissipation of microelectronic chip, and in the radiating in-process of fan, dust in the air can pile up at the top layer of microelectronic chip, can't dispel the heat to the chip, in addition under the long-time running condition of fan, the fan top layer can pile up a large amount of dust equally, seriously influence the efficiency of fan exhaust hot air.
Disclosure of Invention
In view of this, the present invention provides a microelectronic chip heat dissipation device and a heat dissipation method thereof, which aims to solve the problems that the hot air discharge opening of the existing microelectronic chip heat dissipation device is fixed, the surface layer of the chip is easy to cover dust, the dust is accumulated on the fan blades, and the efficiency of the fan for discharging hot air is affected.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a microelectronic chip heat abstractor, includes the casing, one side bottom that the casing kept away from each other is equipped with two symmetrical inlet port, fixedly connected with is located the board of placing of inlet port top in the casing, the top of placing the board is provided with a plurality of chips, sliding connection has the first slide that is located the chip top in the casing, be equipped with in the first slide and be used for carrying out the radiating subassembly of chip, be equipped with in the casing and be used for carrying out the radiating subassembly of discharging separately with the heat that the chip gives off, the bottom of first slide is equipped with the clearance subassembly that is used for carrying out the clearance to the chip top layer, the top of casing is equipped with a plurality of exhaust holes, the casing swivelling joint has the revolving door that bumps with first slide.
Further, the radiating component is including setting up the rectangle through-hole in first slide, sliding connection has the rectangle piece in the rectangle through-hole, the bottom rotation of rectangle piece runs through there is the pivot, the top fixedly connected with of pivot is located the flabellum of rectangle piece, the bottom fixedly connected with worm wheel of pivot, be transversely rotated in the casing and be connected with the worm with worm wheel engaged with, the outer wall fixed sleeve of worm is equipped with first gear, one side fixedly connected with driving motor of casing, and driving motor's output shaft runs through one side of casing and with the one end fixed connection of worm, one side inner wall fixedly connected with a plurality of second springs of rectangle through-hole, and the other end of a plurality of second springs all with one side fixed connection of rectangle piece, be equipped with the rotary groove in the first slide, be equipped with the screw rod through fixed block rotation connection in the rotary groove, be equipped with the circular through-hole with the rotary groove concentric with the centre of a circle, the nut piece that bumps with the rectangle piece, and keep away from the one end thread of circular through-hole runs through the nut piece, one end fixedly connected with the screw rod is kept away from the one side of screw rod, one side that the screw rod is equipped with the disc is kept away from the recess.
Further, the exhaust assembly is including being horizontal fixed connection dead lever in the casing, and the dead lever is located the top of first slide, the outer wall rotation cover of dead lever is equipped with deflector and third gear, one side inner wall rotation of casing is connected with the axis of rotation, the outer wall fixed cover of axis of rotation is equipped with cam and second gear, and second gear and first gear mesh mutually, one side inner wall sliding connection of casing has the first rack with third gear mesh mutually, and the bottom and the outer wall sliding connection of cam of first rack.
Further, the clearance subassembly includes two symmetrical fixed plates of fixed connection in first slide bottom, two one side that the fixed plate is close to each other rotates and runs through same dwang, the one end fixedly connected with fourth gear of dwang, one side inner wall fixedly connected with of casing with fourth gear engaged with second rack, the fixed cover of outer wall of dwang is equipped with the rotary drum brush that touches with the chip top.
Further, an air filter screen is fixedly connected in the air inlet hole, outside air enters the shell through the air inlet hole, dust in the outside air is filtered by the air filter screen, and the outside dust is prevented from being excessive and covered on the surface layer of the chip.
Further, be equipped with a plurality of bell mouth in the board of placing, the air passes through the bell mouth and gets into between first slide and the chip, and the velocity of flow of air can be accelerated when passing through the bell mouth to the air after the filtration, and then can take away the heat on chip top layer, reaches the purpose of quick cooling to the chip.
Further, one side that the nut piece is close to the rectangle piece fixedly connected with rubber layer, can avoid the nut piece to lead to the fact wearing and tearing to the surface of rectangle piece through the rubber layer.
Further, the outer wall fixed cover of cam is equipped with the slide rail, the bottom fixedly connected with of first rack rotates the slider, and rotates slider and slide rail sliding fit.
Further, one side of casing rotates and is connected with the rotor plate, sliding connection has the second slide in the rotor plate, one side that the second slide is close to the casing fixedly connected with a plurality of first springs, and the other end of a plurality of first springs all with one side inner wall fixed connection of rotor plate, one side that the second slide is close to the casing fixedly connected with runs through the first magnet of rotor plate, one side of casing fixedly inlay have with first magnet matched with second magnet, one side fixedly connected with washs cotton of casing is kept away from to the second slide, anticlockwise rotation rotor plate, and magnetic attraction disappears between first magnet and the second magnet, because the first spring is in compression state before, the second slide is outside under the elasticity effect of first spring after the disappearance, washs cotton and can extend to in the rectangle piece and touch with the flabellum this moment, and then drive the flabellum through the pivot and rotate, and then can make washs cotton to clear up the dust on the flabellum top layer.
A heat dissipation method of a microelectronic chip heat dissipation device comprises the following steps:
s1, starting a driving motor to drive a worm to rotate, wherein the worm is meshed with a worm wheel, the worm wheel, a rotating shaft and fan blades are driven by the worm wheel to rotate, heat is generated when a chip runs, the heat is filled between a first sliding plate and a placing plate, the fan blades can upwards discharge hot air between the first sliding plate and the placing plate, outside air enters a shell through an air inlet hole, dust in the outside air is filtered by an air filter screen, the filtered air enters between the first sliding plate and the placing plate through a conical hole, the flow speed of the air can be accelerated when the filtered air passes through the conical hole, and then the heat on the surface layer of the chip can be taken away, so that the purpose of rapidly cooling the chip is achieved;
s2, the worm rotates to drive the first gear to rotate, the first gear is meshed with the second gear, the rotating shaft and the cam start to rotate, and as the cam is in sliding connection with the first rack, the first rack starts to slide up and down in a reciprocating manner along with the rotation of the cam, and the first rack is meshed with the third gear, so that the third gear and the guide plate can rotate in a reciprocating manner, and when the fan blades discharge hot air upwards, the hot air can be discharged from exhaust holes in different directions through the reciprocating rotation of the guide plate, and the hot air is prevented from accumulating in one exhaust hole;
s3, when dust is fully distributed on the chip and the fan blades, the hexagonal screw plate is inserted into the hexagonal groove through the circular through hole, the screw rod is driven to rotate through the hexagonal screw plate, the screw rod is in threaded connection with the nut block, the nut block starts to push the rectangular block towards the direction of the second spring, the second spring starts to compress at the moment, the worm is disengaged from the worm wheel, then the hexagonal screw plate is taken away, the rotating door is rotated to pull the first sliding plate outwards, and as the fourth gear is engaged with the second rack, when the first sliding plate moves outwards, the rotating rod starts to rotate under the action of the second rack and the fourth gear, and then the rotating drum brush can clear the dust on the surface layer of the chip;
s4, when the rectangular block and the fan blade are moved out of the shell, the rotating plate is rotated anticlockwise, the magnetic attraction between the first magnet and the second magnet disappears, and because the first spring is always in a compressed state before, after the magnetic force between the first magnet and the second magnet disappears, the second sliding plate slides outwards under the action of the elasticity of the first spring, at the moment, cleaning cotton can extend into the rectangular block to touch the fan blade, then the fan blade is driven to rotate through the rotating shaft, and further cleaning cotton can clean dust on the surface layer of the fan blade, after cleaning is finished, the rotating plate is rotated reversely until the rotating plate is abutted against the shell, the second sliding plate slides towards the shell under the action of the magnetic attraction between the first magnet and the second magnet, and the first spring begins to be compressed again;
s5, the first sliding plate reenters the shell until the rotating groove is aligned with the circular through hole, then the screw rod is driven to reversely rotate by inserting the hexagonal screw plate into the hexagonal groove, at the moment, the nut block slides towards the circular through hole, the rectangular block starts to slide towards the circular through hole under the elastic force of the second spring until the worm wheel and the worm touch, and then the worm is slowly rotated until the worm wheel and the worm wheel are meshed again.
The invention has the beneficial effects that:
1. according to the microelectronic chip heat dissipation device disclosed by the invention, the worm is driven to rotate by starting the driving motor, so that the fan blade can rotate, hot air between the first sliding plate and the placing plate can be moved upwards, the guide plate can be driven to rotate reciprocally, the hot air is discharged to the outside through the exhaust holes in different directions, and the phenomenon that the hot air is accumulated at one outlet to influence the subsequent hot air discharge is avoided.
2. According to the microelectronic chip heat dissipation device disclosed by the invention, external air enters the shell through the air inlet hole, the air filter screen filters dust in the external air, the filtered air enters between the first sliding plate and the chip through the conical hole, and the flow velocity of the air can be accelerated when the filtered air passes through the conical hole, so that heat on the surface layer of the chip can be taken away, and the purpose of rapidly cooling the chip is achieved.
3. According to the microelectronic chip heat dissipation device disclosed by the invention, the first sliding plate is pulled outwards, and when the first sliding plate moves outwards, the rotating rod starts to rotate under the action of the second rack and the fourth gear, so that the rotating drum brush can remove dust on the surface layer of the chip, and the chip is prevented from being fully covered with dust, and the heat dissipation of the chip is prevented from being influenced.
4. According to the microelectronic chip heat dissipation device disclosed by the invention, the rotating plate is rotated, the magnetic attraction between the first magnet and the second magnet disappears, the second sliding plate slides outwards under the action of the elasticity of the first spring, and the cleaning cotton can extend into the rectangular block to touch the fan blades, so that the fan blades can touch the cleaning cotton through the rotating shaft and the fan blades, dust on the surface layers of the fan blades is removed by the cleaning cotton, and the excessive influence on heat dissipation efficiency caused by the dust on the surface layers of the fan blades is prevented.
5. According to the microelectronic chip heat dissipation device disclosed by the invention, the driving motor is started to drive the worm to rotate, so that heat emitted by a chip can be discharged from the exhaust holes in different directions, heat accumulation at one outlet is avoided, the subsequent heat dissipation is influenced, the flow speed of air can be accelerated through the conical hole, the heat on the surface layer of the chip can be further taken away, the purpose of rapidly cooling the chip is achieved, in addition, dust fully distributed on the fan blades and the chip can be timely removed, excessive dust is prevented, and the heat dissipation efficiency is improved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and other advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the specification.
Drawings
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in the following preferred detail with reference to the accompanying drawings, in which:
FIG. 1 is a front cross-sectional view of a microelectronic die heat dissipation device in accordance with the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 in accordance with the present invention;
FIG. 3 is a cross-sectional view taken along the line B-B of FIG. 1 in accordance with the present invention;
FIG. 4 is a cross-sectional view taken along the line C-C of FIG. 1 in accordance with the present invention;
FIG. 5 is an enlarged view of the invention at D in FIG. 2;
FIG. 6 is an enlarged view of the invention at E in FIG. 2;
FIG. 7 is a second cross-sectional view taken along the line A-A of FIG. 1 in accordance with the present invention;
fig. 8 is an enlarged view of fig. 7 at F in accordance with the present invention.
Reference numerals: 1. a housing; 2. an air inlet hole; 3. placing a plate; 4. a chip; 5. a first slide plate; 6. an exhaust hole; 7. rectangular through holes; 8. rectangular blocks; 9. a rotating shaft; 10. a fan blade; 11. a worm wheel; 12. a worm; 13. a driving motor; 14. a first gear; 15. a rotating shaft; 16. a cam; 17. a second gear; 18. a first rack; 19. a fixed rod; 20. a guide plate; 21. a third gear; 22. a circular through hole; 23. a rotating groove; 24. a screw; 25. a circular plate; 26. hexagonal grooves; 27. a nut block; 28. a fixing plate; 29. a rotating lever; 30. a fourth gear; 31. a second rack; 32. a rotating drum brush; 33. a rotating plate; 34. a second slide plate; 35. a first spring; 36. a first magnet; 37. a second magnet; 38. cleaning cotton; 39. an air filter screen; 40. a tapered bore; 41. a rubber layer; 42. a slide rail; 43. rotating the sliding block; 44. a rotating door; 45. and a second spring.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the illustrations provided in the following embodiments merely illustrate the basic idea of the present invention by way of illustration, and the following embodiments and features in the embodiments may be combined with each other without conflict.
Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to limit the invention; for the purpose of better illustrating embodiments of the invention, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the size of the actual product; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc., that indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but not for indicating or suggesting that the referred device or element must have a specific azimuth, be constructed and operated in a specific azimuth, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limiting the present invention, and that the specific meaning of the above terms may be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
The microelectronic chip heat dissipating device shown in fig. 1-6 comprises a housing 1, two symmetrical air inlet holes 2 are arranged at the bottom of one side of the housing 1 away from each other, an air filter 39 is fixedly connected in the air inlet holes 2 through bolts, external air enters the housing 1 through the air inlet holes 2, the air filter 39 filters dust in the external air to avoid excessive external dust and cover the surface layer of a chip 4, a placing plate 3 positioned above the air inlet holes 2 is fixedly connected in the housing 1, a plurality of taper holes 40 are arranged in the placing plate 3, the air enters between a first sliding plate 5 and the chip 4 through the taper holes 40, the flow velocity of the air can be accelerated when the filtered air passes through the taper holes 40, heat on the surface layer of the chip 4 can be taken away, the purpose of rapidly cooling the chip 4 is achieved, the top of the placing plate 3 is provided with a plurality of chips 4, the first slide plate 5 is slidably connected in the shell 1 and is positioned above the chip 4, a heat dissipation component for dissipating heat of the chip 4 is arranged in the first slide plate 5, a discharge component for separately discharging heat dissipated by the chip 4 is arranged in the shell 1, the discharge component comprises a fixing rod 19 which is transversely and fixedly connected in the shell 1, the fixing rod 19 is positioned above the first slide plate 5, a guide plate 20 and a third gear 21 are rotatably sleeved on the outer wall of the fixing rod 19, a rotating shaft 15 is rotatably connected on the inner wall of one side of the shell 1, a cam 16 and a second gear 17 are fixedly sleeved on the outer wall of the rotating shaft 15 through a jackscrew, a slide rail 42 is fixedly sleeved on the outer wall of the cam 16, a rotating slide block 43 is fixedly connected at the bottom end of the first rack 18, the rotating slide block 43 is in sliding fit with the slide rail 42, the second gear 17 is meshed with the first gear 14, the inner wall of one side of the shell 1 is slidably connected with a first rack 18 meshed with a third gear 21, the bottom end of the first rack 18 is slidably connected with the outer wall of the cam 16, a cleaning component for cleaning the surface layer of the chip 4 is arranged at the bottom of the first sliding plate 5, a plurality of exhaust holes 6 are formed in the top of the shell 1, and a rotating door 44 which is in contact with the first sliding plate 5 is rotationally connected with the shell 1.
In the invention, the heat radiation component comprises a rectangular through hole 7 arranged in a first slide plate 5, a rectangular block 8 is connected in a sliding way in the rectangular through hole 7, a rotating shaft 9 is penetrated through the bottom of the rectangular block 8 in a rotating way, a fan blade 10 positioned in the rectangular block 8 is fixedly connected with the top end of the rotating shaft 9 through a screw, a worm wheel 11 is welded at the bottom end of the rotating shaft 9, a worm 12 meshed with the worm wheel 11 is transversely connected in a shell 1 in a rotating way, a first gear 14 is fixedly sleeved on the outer wall of the worm 12, one side of the shell 1 is fixedly connected with a driving motor 13, an output shaft of the driving motor 13 penetrates one side of the shell 1 and is fixedly connected with one end of the worm 12, a plurality of second springs 45 are fixedly connected with one side inner wall of the rectangular through hole 7, the other ends of the second springs 45 are fixedly connected with one side of the rectangular block 8, a rotating groove 23 is arranged in the first slide plate 5, a screw 24 is rotationally connected in the rotating groove 23 through a fixed block, the shell 1 is internally provided with a circular through hole 22 concentric with the rotary groove 23, the rotary groove 23 is slidably connected with a nut block 27 which is contacted with the rectangular block 8, one side of the nut block 27 close to the rectangular block 8 is fixedly connected with a rubber layer 41, the surface of the rectangular block 8 can be prevented from being worn by the nut block 27 through the rubber layer 41, one end of the screw 24 far away from the circular through hole 22 is threaded through the nut block 27, one end of the screw 24 far away from the nut block 27 is fixedly connected with a circular plate 25, one side of the circular plate 25 far away from the screw 24 is provided with a hexagonal groove 26, the worm 12 is driven to rotate by starting the driving motor 13, not only the fan blade 10 can rotate, but also the hot air between the first sliding plate 5 and the placing plate 3 can be driven to reciprocate, the guide plate 20 can be discharged outwards through vent holes 6 in different directions, avoiding hot air accumulating at one outlet and affecting the subsequent hot air discharge.
In the invention, the cleaning component at the bottom of the first slide plate 5 comprises two symmetrical fixing plates 28 fixedly connected to the bottom of the first slide plate 5, one side, close to each other, of the two fixing plates 28 rotates to penetrate through the same rotating rod 29, one end of the rotating rod 29 is fixedly connected with a fourth gear 30, the inner wall of one side of the shell 1 is welded with a second rack 31 meshed with the fourth gear 30, and the outer wall of the rotating rod 29 is fixedly sleeved with a rotary drum brush 32 in contact with the top of the chip 4.
According to the invention, by pulling the first sliding plate 5 outwards, when the first sliding plate 5 moves outwards, the rotating rod 29 starts to rotate under the action of the second rack 31 and the fourth gear 30, and the rotating drum brush 32 can further remove dust on the surface layer of the chip 4, so that the chip 4 is prevented from being fully covered with dust, and heat dissipation of the chip 4 is prevented.
Example two
As a further improvement of the previous embodiment, as shown in fig. 1-8, a microelectronic chip heat dissipating device includes a housing 1, two symmetrical air inlets 2 are provided at the bottom of one side of the housing 1 away from each other, an air filter 39 is fixedly connected in the air inlets 2 through bolts, external air enters the housing 1 through the air inlets 2, and the air filter 39 filters dust in the external air to avoid excessive external dust, covers the surface layer of the chip 4, a placing plate 3 is fixedly connected in the housing 1 above the air inlets 2, a plurality of tapered holes 40 are provided in the placing plate 3, the air enters between the first slide plate 5 and the chip 4 through the tapered holes 40, the flow rate of the air after filtration can be accelerated when the air passes through the tapered holes 40, and the heat on the surface layer of the chip 4 can be further taken away, thereby achieving the purpose of rapidly cooling the chip 4, the top of the placing plate 3 is provided with a plurality of chips 4, a first sliding plate 5 which is positioned above the chips 4 is connected in a sliding way in the shell 1, a heat dissipation component which is used for dissipating heat of the chips 4 is arranged in the first sliding plate 5, a discharge component which is used for separately discharging heat which is dissipated by the chips 4 is arranged in the shell 1, the discharge component comprises a fixing rod 19 which is transversely and fixedly connected in the shell 1, the fixing rod 19 is positioned above the first sliding plate 5, a guide plate 20 and a third gear 21 are sleeved on the outer wall of the fixing rod 19 in a rotating way, a rotating shaft 15 is connected on the inner wall of one side of the shell 1 in a rotating way, a cam 16 and a second gear 17 are sleeved on the outer wall of the rotating shaft 15 in a rotating way of a jackscrew fixing way, a sliding rail 42 is sleeved on the outer wall of the cam 16, a rotating sliding block 43 is fixedly connected on the bottom end of the first rack 18, the rotating block 43 is in sliding fit with the sliding rail 42, the second gear 17 is meshed with the first gear 14, the inner wall of one side of the shell 1 is slidably connected with a first rack 18 meshed with a third gear 21, the bottom end of the first rack 18 is slidably connected with the outer wall of the cam 16, a cleaning component for cleaning the surface layer of the chip 4 is arranged at the bottom of the first sliding plate 5, a plurality of exhaust holes 6 are formed in the top of the shell 1, and a rotating door 44 which is in contact with the first sliding plate 5 is rotationally connected with the shell 1.
In the invention, the heat radiation component comprises a rectangular through hole 7 arranged in a first slide plate 5, a rectangular block 8 is connected in a sliding way in the rectangular through hole 7, a rotating shaft 9 is penetrated through the bottom of the rectangular block 8 in a rotating way, a fan blade 10 positioned in the rectangular block 8 is fixedly connected with the top end of the rotating shaft 9 through a screw, a worm wheel 11 is welded at the bottom end of the rotating shaft 9, a worm 12 meshed with the worm wheel 11 is transversely connected in a shell 1 in a rotating way, a first gear 14 is fixedly sleeved on the outer wall of the worm 12, one side of the shell 1 is fixedly connected with a driving motor 13, an output shaft of the driving motor 13 penetrates one side of the shell 1 and is fixedly connected with one end of the worm 12, a plurality of second springs 45 are fixedly connected with one side inner wall of the rectangular through hole 7, the other ends of the second springs 45 are fixedly connected with one side of the rectangular block 8, a rotating groove 23 is arranged in the first slide plate 5, a screw 24 is rotationally connected in the rotating groove 23 through a fixed block, the shell 1 is internally provided with a circular through hole 22 concentric with the rotary groove 23, the rotary groove 23 is slidably connected with a nut block 27 which is contacted with the rectangular block 8, one side of the nut block 27 close to the rectangular block 8 is fixedly connected with a rubber layer 41, the surface of the rectangular block 8 can be prevented from being worn by the nut block 27 through the rubber layer 41, one end of the screw 24 far away from the circular through hole 22 is threaded through the nut block 27, one end of the screw 24 far away from the nut block 27 is fixedly connected with a circular plate 25, one side of the circular plate 25 far away from the screw 24 is provided with a hexagonal groove 26, the worm 12 is driven to rotate by starting the driving motor 13, not only the fan blade 10 can rotate, but also the hot air between the first sliding plate 5 and the placing plate 3 can be driven to reciprocate, the guide plate 20 can be discharged outwards through vent holes 6 in different directions, avoiding hot air accumulating at one outlet and affecting the subsequent hot air discharge.
In the invention, the cleaning assembly comprises two symmetrical fixing plates 28 fixedly connected to the bottom of the first sliding plate 5, one side, close to each other, of the two fixing plates 28 rotates to penetrate through the same rotating rod 29, one end of the rotating rod 29 is fixedly connected with a fourth gear 30, a second rack 31 meshed with the fourth gear 30 is welded on the inner wall of one side of the shell 1, and a rotary drum brush 32 in contact with the top of the chip 4 is fixedly sleeved on the outer wall of the rotating rod 29.
According to the invention, by pulling the first sliding plate 5 outwards, when the first sliding plate 5 moves outwards, the rotating rod 29 starts to rotate under the action of the second rack 31 and the fourth gear 30, and the rotating drum brush 32 can further remove dust on the surface layer of the chip 4, so that the chip 4 is prevented from being fully covered with dust, and heat dissipation of the chip 4 is prevented.
In the invention, a rotating plate 33 is rotatably connected to one side of a housing 1, a second sliding plate 34 is slidably connected to the rotating plate 33, a plurality of first springs 35 are fixedly connected to one side of the second sliding plate 34 close to the housing 1, the other ends of the plurality of first springs 35 are fixedly connected to one side inner wall of the rotating plate 33, a first magnet 36 penetrating through the rotating plate 33 is fixedly connected to one side of the second sliding plate 34 close to the housing 1, a second magnet 37 matched with the first magnet 36 is fixedly embedded in one side of the housing 1, cleaning cotton 38 is fixedly connected to one side of the second sliding plate 34 far away from the housing 1, the rotating plate 33 is rotated anticlockwise, and magnetic attraction between the first magnet 36 and the second magnet 37 disappears.
The advantages of the embodiment over the first embodiment are: the shell 1 is rotatably connected with the rotating plate 33 on one side, the second sliding plate 34 is connected in a sliding manner in the rotating plate 33, a plurality of first springs 35 are fixedly connected to one side, close to the shell 1, of the second sliding plate 34, the other ends of the plurality of first springs 35 are fixedly connected with one side inner wall of the rotating plate 33, a first magnet 36 penetrating through the rotating plate 33 is fixedly connected to one side, close to the shell 1, of the second sliding plate 34, a second magnet 37 matched with the first magnet 36 is fixedly embedded in one side, far away from the shell 1, of the second sliding plate 34, cleaning cotton 38 is fixedly connected to one side, far away from the shell 1, of the second sliding plate 34, the rotating plate 33 is rotated anticlockwise, the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, and because the first springs 35 are always in a compressed state, after the magnetic force between the first magnets 36 and the second magnets 37 disappears, the second sliding plate 34 slides outwards under the elastic force of the first springs 35, at the moment, the cleaning cotton 38 can extend into the rectangular block 8 to touch with the fan blades 10, then the fan blades 10 are driven to rotate through the rotating shafts 9, and the cleaning cotton 38 can clean dust on the surface layers of the fan blades 10.
A heat dissipation method of a microelectronic chip heat dissipation device comprises the following steps:
s1, a driving motor 13 is started to drive a worm 12 to rotate, the worm 12 is meshed with a worm wheel 11, the worm 12 drives the worm wheel 11, a rotating shaft 9 and fan blades 10 to rotate, heat is generated when a chip 4 runs, the heat is filled between a first sliding plate 5 and a placing plate 3, then the fan blades 10 can discharge hot air between the first sliding plate 5 and the placing plate 3 upwards, outside air enters a shell 1 through an air inlet hole 2, an air filter screen 39 filters dust in the outside air, the filtered air enters the space between the first sliding plate 5 and the placing plate 3 through a conical hole 40, the flow velocity of the air can be accelerated when the filtered air passes through the conical hole 40, and then the heat on the surface layer of the chip 4 can be taken away, so that the purpose of rapidly cooling the chip 4 is achieved;
s2, the worm 12 rotates to drive the first gear 14 to rotate, the first gear 14 is meshed with the second gear 17, the rotating shaft 15 and the cam 16 start to rotate, the cam 16 is in sliding connection with the first rack 18, the first rack 18 starts to slide up and down in a reciprocating manner along with the rotation of the cam 16, the first rack 18 is meshed with the third gear 21, the third gear 21 and the guide plate 20 can further rotate in a reciprocating manner, and when the fan blade 10 discharges hot air upwards, the hot air can be discharged from the exhaust holes 6 in different directions through the reciprocating rotation of the guide plate 20, so that the hot air is prevented from accumulating in one exhaust hole;
s3, when dust is fully distributed on the chip 4 and the fan blade 10, the hexagonal screw plate is inserted into the hexagonal groove 26 through the circular through hole 22, the screw 24 is driven to rotate by the hexagonal screw plate, the screw 24 is in threaded connection with the nut block 27, the nut block 27 starts to push the rectangular block 8 towards the direction of the second spring 45, the second spring 45 starts to be compressed, the worm 12 and the worm wheel 11 are disengaged, then the hexagonal screw plate is taken away, the rotating door 44 is rotated to pull the first sliding plate 5 outwards, and the rotating rod 29 starts to rotate under the action of the second rack 31 and the fourth rack 30 when the first sliding plate 5 moves outwards due to the engagement of the fourth gear 30, so that the rotating drum brush 32 can clear the dust on the surface layer of the chip 4;
s4, when the rectangular block 8 and the fan blade 10 are moved out of the shell 1, the rotating plate 33 is rotated anticlockwise, the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, because the first spring 35 is always in a compressed state, after the magnetic force between the first magnet 36 and the second magnet 37 disappears, the second sliding plate 34 slides outwards under the elastic force of the first spring 35, at the moment, the cleaning cotton 38 can extend into the rectangular block 8 to touch the fan blade 10, then the fan blade 10 is driven to rotate through the rotating shaft 9, and then dust on the surface layer of the fan blade 10 can be cleaned by the cleaning cotton 38, after cleaning is finished, the rotating plate 33 is rotated reversely until the rotating plate 33 is abutted against the shell 1, the second sliding plate 34 slides towards the shell 1 under the magnetic attraction between the first magnet 36 and the second magnet 37, and the first spring 35 starts to be compressed again;
s5, the first sliding plate 5 reenters the shell 1 until the rotating groove 23 is aligned with the circular through hole 22, then the hexagonal screw 24 is driven to rotate reversely by inserting the hexagonal screw plate into the hexagonal groove 26, at the moment, the nut block 27 slides towards the circular through hole 22, the rectangular block 8 starts to slide towards the circular through hole 22 under the elastic force of the second spring 45 until the worm wheel 11 and the worm 12 touch, and then the worm 12 is slowly rotated until the worm 12 and the worm wheel 11 are re-meshed.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the claims of the present invention.
Claims (5)
1. The utility model provides a microelectronic chip heat abstractor, includes casing (1), its characterized in that, one side bottom that casing (1) kept away from each other is equipped with two symmetrical inlet port (2), fixedly connected with is located place board (3) above inlet port (2) in casing (1), be equipped with a plurality of taper holes (40) in placing board (3), the top of placing board (3) is provided with a plurality of chips (4), sliding connection has first slide (5) that are located chip (4) top in casing (1), be equipped with in first slide (5) and be used for carrying out radiating assembly to chip (4), be equipped with in casing (1) and be used for carrying out the radiating exhaust assembly of separating the heat that distributes of chip (4), the bottom of first slide (5) is equipped with the clearance subassembly that is used for carrying out the clearance to chip (4) top layer, the top of casing (1) is equipped with a plurality of exhaust holes (6), casing (1) rotation is connected with rotation door (44) that touches first slide (5); one side of the shell (1) is rotationally connected with a rotating plate (33), a second sliding plate (34) is connected in a sliding manner in the rotating plate (33), one side, close to the shell (1), of the second sliding plate (34) is fixedly connected with a plurality of first springs (35), the other ends of the first springs (35) are fixedly connected with one side inner wall of the rotating plate (33), one side, close to the shell (1), of the second sliding plate (34) is fixedly connected with a first magnet (36) penetrating through the rotating plate (33), one side, close to the shell (1), of the second sliding plate (34) is fixedly embedded with a second magnet (37) matched with the first magnet (36), and one side, far away from the shell (1), of the second sliding plate (34) is fixedly connected with cleaning cotton (38);
the heat dissipation assembly comprises a rectangular through hole (7) arranged in a first sliding plate (5), a rectangular block (8) is connected in a sliding manner in the rectangular through hole (7), a rotating shaft (9) is fixedly connected to the bottom of the rectangular block (8) in a penetrating manner, fan blades (10) arranged in the rectangular block (8) are fixedly connected to the top end of the rotating shaft (9), a worm wheel (11) is fixedly connected to the bottom end of the rotating shaft (9), a worm (12) meshed with the worm wheel (11) is transversely connected in the shell (1) in a rotating manner, a first gear (14) is fixedly sleeved on the outer wall of the worm (12), a driving motor (13) is fixedly connected to one side of the shell (1) in a penetrating manner, one end of the driving motor (13) is fixedly connected with one end of the worm (12), a plurality of second springs (45) are fixedly connected to the inner wall of one side of the rectangular through hole (7), the other ends of the second springs (45) are fixedly connected with one side of the rectangular block (8), a rotating groove (23) is formed in the shell (5), a circular groove (23) is formed in the shell (23), and the circular groove (23) is formed in the shell (23), the nut block (27) is connected with the rectangular block (8) in a sliding manner in the rotating groove (23), one end of the screw rod (24) far away from the circular through hole (22) penetrates through the nut block (27) through threads, one end of the screw rod (24) far away from the nut block (27) is fixedly connected with a circular plate (25), and one side of the circular plate (25) far away from the screw rod (24) is provided with a hexagonal groove (26);
the discharging assembly comprises a fixing rod (19) which is transversely and fixedly connected in a shell (1), the fixing rod (19) is positioned above the first sliding plate (5), a guide plate (20) and a third gear (21) are rotatably sleeved on the outer wall of the fixing rod (19), a rotating shaft (15) is rotatably connected to the inner wall of one side of the shell (1), a cam (16) and a second gear (17) are fixedly sleeved on the outer wall of the rotating shaft (15), the second gear (17) is meshed with the first gear (14), a first rack (18) meshed with the third gear (21) is slidably connected to the inner wall of one side of the shell (1), and the bottom end of the first rack (18) is slidably connected with the outer wall of the cam (16);
the cleaning assembly comprises two symmetrical fixing plates (28) fixedly connected to the bottom of the first sliding plate (5), one side, close to each other, of each fixing plate (28) rotates to penetrate through the same rotating rod (29), one end of each rotating rod (29) is fixedly connected with a fourth gear (30), one side inner wall of the shell (1) is fixedly connected with a second rack (31) meshed with the fourth gear (30), and a rotary drum brush (32) touching the top of the chip (4) is fixedly sleeved on the outer wall of each rotating rod (29).
2. A microelectronic chip heat dissipation device according to claim 1, characterized in that the air inlet (2) is fixedly connected with an air filter (39).
3. A microelectronic die heat sink according to claim 1, characterized in that the side of the nut block (27) adjacent to the rectangular block (8) is fixedly connected with a rubber layer (41).
4. The microelectronic die heat dissipating device according to claim 1, wherein the outer wall of the cam (16) is fixedly sleeved with a sliding rail (42), the bottom end of the first rack (18) is fixedly connected with a rotating sliding block (43), and the rotating sliding block (43) is in sliding fit with the sliding rail (42).
5. The heat dissipation method of the microelectronic chip heat dissipation device is characterized by comprising the following steps:
s1, a driving motor (13) is started to drive a worm (12) to rotate, the worm (12) is meshed with a worm wheel (11), the worm (12) drives the worm wheel (11), a rotating shaft (9) and fan blades (10) to rotate, so that the fan blades (10) can upwards discharge hot air between a first sliding plate (5) and a placing plate (3), outside air enters a shell (1) through an air inlet hole (2), heat on the surface layer of a chip (4) can be taken away, and the purpose of rapidly cooling the chip (4) is achieved;
s2, the worm (12) rotates to drive the first gear (14) to rotate, the first gear (14) is meshed with the second gear (17), the rotating shaft (15) and the cam (16) start to rotate, the first rack (18) starts to slide up and down along with the rotation of the cam (16), the first rack (18) is meshed with the third gear (21), and when the fan blades (10) discharge hot air upwards, the guide plates (20) rotate back and forth to enable the hot air to be discharged from the exhaust holes (6) in different directions;
s3, inserting a hexagonal screw plate into the hexagonal groove (26) through the circular through hole (22), driving the screw (24) to rotate through the hexagonal screw plate, enabling the nut block (27) to start pushing the rectangular block (8) towards the direction of the second spring (45), enabling the second spring (45) to start compressing, enabling the worm (12) and the worm wheel (11) to be disengaged, then taking away the hexagonal screw plate, enabling the rotating door (44) to rotate to pull the first sliding plate (5) outwards, enabling the rotating rod (29) to start rotating under the action of the second rack (31) and the fourth rack (30) when the first sliding plate (5) moves outwards, and enabling the rotating drum brush (32) to clean dust on the surface layer of the chip (4);
s4, when the rectangular block (8) and the fan blades (10) are moved out of the shell (1), the rotating plate (33) is rotated anticlockwise, magnetic attraction between the first magnet (36) and the second magnet (37) disappears, after magnetic force between the first magnet (36) and the second magnet (37) disappears, the second sliding plate (34) slides outwards under the action of the elastic force of the first spring (35), at the moment, cleaning cotton (38) can extend into the rectangular block (8) to be contacted with the fan blades (10), and then the fan blades (10) are driven to rotate through the rotating shaft (9), so that dust on the surface layer of the fan blades (10) can be cleaned by the cleaning cotton (38);
s5, the first sliding plate (5) reenters the shell (1) until the rotating groove (23) is aligned with the circular through hole (22), then the screw rod (24) is driven to reversely rotate by inserting a hexagonal screw plate into the hexagonal groove (26), at the moment, the nut block (27) slides towards the circular through hole (22), and the rectangular block (8) starts to slide towards the circular through hole (22) under the elastic force of the second spring (45) until the worm wheel (11) and the worm (12) are contacted, and then the worm (12) is slowly rotated until the worm (12) and the worm wheel (11) are meshed again.
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| CN114823545A (en) * | 2022-02-28 | 2022-07-29 | 河南芯睿电子科技有限公司 | Packaging structure for power management chip and working method thereof |
| CN114421918B (en) * | 2022-03-31 | 2022-06-21 | 深圳新声半导体有限公司 | Bulk acoustic wave filter chip |
| CN114825766B (en) * | 2022-05-16 | 2023-06-02 | 湖南迎德祥机电科技有限公司 | Intelligent control motor with good temperature control function and processing device thereof |
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