CN112333991A - Heat dissipation equipment capable of realizing overvoltage protection of chip - Google Patents

Heat dissipation equipment capable of realizing overvoltage protection of chip Download PDF

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Publication number
CN112333991A
CN112333991A CN202011311883.XA CN202011311883A CN112333991A CN 112333991 A CN112333991 A CN 112333991A CN 202011311883 A CN202011311883 A CN 202011311883A CN 112333991 A CN112333991 A CN 112333991A
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CN
China
Prior art keywords
cavity
bevel gear
end wall
fixedly arranged
rotating shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202011311883.XA
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Chinese (zh)
Inventor
王根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Tingqi Computer Co ltd
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Shanghai Tingqi Computer Co ltd
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Application filed by Shanghai Tingqi Computer Co ltd filed Critical Shanghai Tingqi Computer Co ltd
Priority to CN202011311883.XA priority Critical patent/CN112333991A/en
Publication of CN112333991A publication Critical patent/CN112333991A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the relevant field of chip heat dissipation devices, in particular to a heat dissipation device capable of realizing overvoltage protection on a chip, which comprises a box body and a bevel gear cavity fixedly arranged in the box body, wherein a driving shaft is rotatably arranged on the upper side end wall of the bevel gear cavity, the driving shaft is in power connection with a main shaft of a motor, the motor is fixedly arranged on the upper side end wall of the bevel gear cavity, a first bevel gear is fixedly arranged on the outer surface of the lower side tail end of the driving shaft, and the first bevel gear and a second bevel gear are in meshing transmission, the heat dissipation device capable of realizing overvoltage protection on the chip can detect the temperature of the chip, can realize cooling protection on the chip, can detect the voltage introduced into the chip, can realize voltage stabilization protection on the chip when the voltage is unstable, and can automatically clean dust on the surface of the chip, the clutching between the shafts can be used to control the various processes.

Description

Heat dissipation equipment capable of realizing overvoltage protection of chip
Technical Field
The invention relates to the field of chip heat dissipation devices, in particular to heat dissipation equipment capable of realizing overvoltage protection on a chip.
Background
The chip is more and more widely applied in our present life and plays an important role, for example, the chip is applied to mobile phones and computers, along with the application of a large amount of chips, the heat dissipation protection of the chip also becomes a serious problem, if the chip temperature is too high, the chip is damaged, the current heat dissipation device can only realize simple heat dissipation of the chip, can not realize overvoltage protection on the chip, and can not realize cleaning of dust on the surface of the chip, so that the problem needs to be improved by arranging a heat dissipation device capable of realizing overvoltage protection on the chip.
Disclosure of Invention
The invention aims to provide a heat dissipation device capable of protecting a chip from overvoltage, which can overcome the defects in the prior art, so that the practicability of the device is improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a heat dissipation device capable of realizing chip overvoltage protection, which comprises a box body and a bevel gear cavity fixedly arranged in the box body, wherein a driving shaft is rotatably arranged on the upper end wall of the bevel gear cavity, the driving shaft is in power connection with a main shaft of a motor, the motor is fixedly arranged on the upper end wall of the bevel gear cavity, a first bevel gear is fixedly arranged on the outer surface of the lower end of the driving shaft, the first bevel gear is in meshing transmission with a second bevel gear, the second bevel gear is fixedly arranged on the outer surface of the right end of a bevel gear shaft, a first transmission device for transmission between the bevel gear shaft and a screw rod is arranged on the outer surface of the left end of the bevel gear shaft, the screw rod is rotatably arranged between the left end wall and the right end wall of a first cavity, a sliding block is rotatably connected on the outer surface of the, the outer surface of the lower side end wall of the sliding block is fixedly provided with a dust suction port, the left side end wall of the dust suction port is fixedly connected with a dust suction pipe, the dust suction pipe is far away from the end of one side of the dust suction port and is fixedly connected with a dust suction box, the dust suction box is fixedly arranged on the upper side end wall of the first cavity, the outer surface of the lower side end wall of the sliding block on the right side of the dust suction port is fixedly provided with a cleaning brush, the cleaning brush is used for cleaning the surface of a chip board, the chip board is fixedly arranged on the lower side end wall of the first cavity, the left side end wall of the chip board is fixedly provided with a temperature sensor, the temperature sensor is used for detecting the temperature of the chip board, the lower side end wall of the first cavity on the lower side of the chip board is fixedly provided with a fan installation cavity, the meshing transmission between first bevel gear and the third bevel gear, third bevel gear fixed mounting is at the terminal surface in the left side of pivot one, a rotation of pivot is installed in the box on bevel gear chamber right side, the terminal surface fixed mounting in the right side of pivot one has and is used for driven second transmission between pivot one and the rack, rack slidable mounting is on the upper side end wall at the pressure regulating cavity, rack downside end wall surface fixed connection has the stabiliser, contact between stabiliser and the contact block, contact block fixed mounting is on the lower side end wall of pressure regulating cavity, fixed connection between contact block and circular telegram line, circular telegram line is kept away from contact block one side end with fixed connection between the board, fixed connection between circular telegram line and the voltage detector, voltage detector fixed mounting is on the right side end wall of first cavity, the voltage detector is used for detecting the chip board voltage, and the voltage stabilizer is used for adjusting the chip board voltage.
Further, the first transmission device comprises the bevel gear shaft, an installation cavity is fixedly arranged in the box body on the left side of the bevel gear cavity, a fourth bevel gear is fixedly arranged on the outer surface of the tail end of the left side of the bevel gear shaft in the installation cavity, the fourth bevel gear and a fifth bevel gear are in meshing transmission, the fifth bevel gear is fixedly arranged on the outer surface of the tail end of the lower side of a rotating shaft II, the rotating shaft II is rotatably arranged in the box body on the upper side of the installation cavity, the outer surface of the tail end of the upper side of the rotating shaft II is rotatably connected with a rotating shaft III, a spring cavity is fixedly arranged in the tail end of the upper side of the rotating shaft II, a first connecting spring is fixedly connected on the end wall of the lower side of the spring cavity, a connecting block is fixedly connected at the tail, electromagnet fixed mounting is in the electromagnet installation cavity, the electromagnet installation cavity is fixed to be set up in the end of the three downside of pivot, three rotations of pivot are installed two upsides of pivot in the box, the installation cavity upside the box internal fixation is provided with the meshing chamber, in the meshing chamber the terminal fixed surface of the upside of the three pivot installs gear one, gear one and meshing transmission between the mouth, meshing mouth fixed circumference array is installed on the left side end wall of carousel, carousel fixed mounting is in the terminal surface in left side of lead screw.
Further, the cooling device comprises the driving shaft, a transmission cavity is fixedly arranged in the box body on the upper side of the bevel gear cavity, a rotating frame is fixedly arranged on the outer surface of the tail end of the upper side of the driving shaft in the transmission cavity, an inflation cavity is fixedly arranged in the rotating frame in an array manner, a second connecting spring is fixedly connected to the end wall, close to one side of the driving shaft, of the inflation cavity, a meshing block is fixedly connected to the tail end, far away from one side of the driving shaft, of the second connecting spring, the meshing block is slidably arranged in the inflation cavity, an air pump is fixedly arranged on the end wall, close to one side of the driving shaft, of the inflation cavity and used for inflating the inflation cavity, meshing transmission is performed between the meshing block and the second gear, the second gear is fixedly arranged on the outer surface of the tail end of the, the fan mounting cavity is interior the terminal fixed surface of upside of gear shaft installs the mounting disc, the mounting disc is kept away from the flabellum is installed to gear shaft side end wall outer fixed surface circumference array, the fan mounting cavity left and right sides fixed mounting has the cooling tube in the box, the cooling tube is used for chip board water-cooling.
Further, the second transmission device comprises the first rotating shaft, a second cavity is fixedly arranged in the box body on the right side of the bevel gear cavity, an electromagnet is fixed on the outer surface of the right end of the first rotating shaft in the second cavity, a pushing cavity is fixedly arranged in an array in the electromagnet, a hydraulic cylinder is fixedly arranged on the end wall of one side, close to the first rotating shaft, of the pushing cavity, the hydraulic cylinder is fixedly connected with a hydraulic rod, a conical meshing block is fixedly connected to the outer surface of the end wall of one side, far away from the hydraulic cylinder, of the hydraulic rod, the conical meshing block is slidably arranged in the pushing cavity, the conical meshing block is in meshing transmission with a sixth bevel gear, the sixth bevel gear is fixedly arranged on the outer surface of the end of the lower side of the fourth rotating shaft, a worm is fixedly arranged on the outer surface of the end of the upper side of the, the worm wheel is fixedly installed on the outer surface of the tail end of the front side of the fifth rotating shaft, the fifth rotating shaft is installed on the left side of the worm and on the end wall of the rear side of the pressure regulating cavity, and the rack is in meshing transmission with the voltage detector.
The invention has the beneficial effects that: the utility model provides a can realize detecting the temperature of chip overvoltage protection, and can realize cooling down the protection to the chip, can realize detecting the voltage that lets in the chip, and can realize carrying out steady voltage protection to the chip when voltage is unstable, can realize that the automation is cleaned the dust on chip surface, can utilize the separation and reunion between the axle to control each action process.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural diagram of a heat dissipation device capable of protecting a chip from overvoltage according to the present invention.
Fig. 2 is an enlarged schematic view of a in fig. 1.
Fig. 3 is an enlarged schematic view of B in fig. 1.
Fig. 4 is an enlarged schematic view of C in fig. 1.
Detailed Description
The invention will now be described in detail with reference to fig. 1-4, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.
The heat dissipation apparatus capable of protecting the chip from overvoltage described with reference to fig. 1-4 includes a case 11 and a bevel gear cavity 45 fixedly disposed in the case 11, a driving shaft 39 is rotatably mounted on an upper end wall of the bevel gear cavity 45, the driving shaft 39 is in power connection with a main shaft of a motor 36, the motor 36 is fixedly mounted on the upper end wall of the bevel gear cavity 45, a first bevel gear 38 is fixedly mounted on an outer surface of a lower end of the driving shaft 39, the first bevel gear 38 and the second bevel gear 37 are in meshing transmission, the second bevel gear 37 is fixedly mounted on an outer surface of a right end of a bevel gear shaft 34, a first transmission device 100 for transmission between the bevel gear shaft 34 and a lead screw 13 is mounted on an outer surface of a left end of the bevel gear shaft 34, the lead screw 13 is rotatably mounted between left and right end walls of the first cavity 12, the outer surface of the screw rod 13 is rotatably connected with a sliding block 21, the sliding block 21 is slidably mounted between the front end wall and the rear end wall of the first cavity 12, a dust suction port 23 is fixedly mounted on the outer surface of the lower end wall of the sliding block 21, a chip suction pipe 19 is fixedly connected to the left end wall of the dust suction port 23, the dust suction pipe 19 is far away from the tail end of one side of the dust suction port 23 and a dust suction box 20, the dust suction box 20 is fixedly mounted on the upper end wall of the first cavity 12, a cleaning brush 22 is fixedly mounted on the outer surface of the lower end wall of the sliding block 21 on the right side of the dust suction port 23, the cleaning brush 22 is used for cleaning the surface of the chip board 14, the chip board 14 is fixedly mounted on the lower end wall of the first cavity 12, the chip board 14 is left, a temperature sensor 30 is fixedly mounted on the lower end wall of the first cavity, the fixed fan installation cavity 18 that is provided with on the downside end wall of first cavity 12 of chip board 14 downside, install in the fan installation cavity 18 and be used for the chip board 14 carries out the heat sink 101 that cools down, meshing transmission between first bevel gear 38 and the third bevel gear 40, third bevel gear 40 fixed mounting is at the terminal surface in left side of a pivot 41, a pivot 41 rotates to be installed the bevel gear chamber 45 right side in the box 11, the terminal surface fixed mounting in right side of a pivot 41 has and is used for driven second transmission 102 between a pivot 41 and the rack 55, rack 55 slidable mounting is on the upside end wall at pressure regulating cavity 72, rack 55 downside end wall surface fixed connection has stabiliser 50, contact between stabiliser 50 and the contact block 49, contact block 49 fixed mounting is in on the downside end wall of pressure regulating cavity 72, fixed connection between contact piece 49 and circular telegram line 44, circular telegram line 44 is kept away from contact piece 49 one side end with fixed connection between the chip board 14, fixed connection between circular telegram line 44 and the voltage detector 71, voltage detector 71 fixed mounting is in on the right side end wall of first cavity 12, voltage detector 71 is used for right chip board 14 voltage detects, stabiliser 50 is used for right chip board 14 voltage adjusts.
Beneficially, the first transmission 100 includes the bevel gear shaft 34, a mounting cavity 32 is fixedly arranged in the case 11 on the left side of the bevel gear cavity 45, a fourth bevel gear 33 is fixedly arranged on the outer surface of the left end of the bevel gear shaft 34 in the mounting cavity 32, the fourth bevel gear 33 is in meshing transmission with a fifth bevel gear 31, the fifth bevel gear 31 is fixedly arranged on the outer surface of the lower end of a second rotating shaft 29, the second rotating shaft 29 is rotatably arranged in the case 11 on the upper side of the mounting cavity 32, the outer surface of the upper end of the second rotating shaft 29 is rotatably connected with a third rotating shaft 28, a spring cavity 65 is fixedly arranged in the upper end of the second rotating shaft 29, a first connecting spring 64 is fixedly connected to the lower end wall of the spring cavity 65, a connecting block 61 is fixedly connected to the upper end of the first connecting spring 64, and the connecting block 61 is slidably arranged in the spring, adsorb each other between connecting block 61 and the electro-magnet 62, electro-magnet 62 fixed mounting is in electro-magnet installation cavity 63, electro-magnet installation cavity 63 is fixed to be set up in the end of three 28 downside of pivot, three 28 of pivot rotate to be installed two 29 upsides of pivot in the box 11, installation cavity 32 upside the box 11 internal fixation is provided with meshing chamber 26, in the meshing chamber 26 the terminal fixed surface of upside of three 28 of pivot installs gear 27, meshing transmission between gear 27 and the meshing mouth 24, meshing mouth 24 fixed circumference array is installed on the left side end wall of carousel 25, carousel 25 fixed mounting be in the terminal surface in left side of lead screw 13.
Advantageously, the cooling device 101 includes the driving shaft 39, a transmission cavity 42 is fixedly arranged in the box 11 on the upper side of the bevel gear cavity 45, a rotating frame 57 is fixedly mounted on the outer surface of the upper end of the driving shaft 39 in the transmission cavity 42, air inflation cavities 60 are fixedly arranged in the rotating frame 57 in an array, a second connecting spring 58 is fixedly connected to the end wall of one side of the air inflation cavity 60 close to the driving shaft 39, an engaging block 56 is fixedly connected to the end of one side of the second connecting spring 58 far away from the driving shaft 39, the engaging block 56 is slidably mounted in the air inflation cavity 60, an air pump 59 is fixedly mounted on the end wall of one side of the air inflation cavity 60 close to the driving shaft 39, the air pump 59 is used for inflating the air inflation cavity 60, meshing transmission is performed between the engaging block 56 and a second gear 43, the second gear 43 is fixedly mounted on the outer surface of, gear shaft 17 runs through the rotation and installs on the upside end wall of transmission chamber 42, in the fan installation cavity 18 the terminal fixed surface of upside of gear shaft 17 installs mounting disc 16, mounting disc 16 keeps away from the fan blade 15 is installed to gear shaft 17 a side end wall fixed surface circumference array, the fan installation cavity 18 the left and right sides fixed mounting has cooling tube 35 in the box 11, cooling tube 35 is used for the water-cooling of chip board 14.
Advantageously, the second transmission device 102 includes the first rotating shaft 41, a second cavity 46 is fixedly arranged in the box 11 on the right side of the bevel gear cavity 45, an electromagnet 62 is fixed on the outer surface of the right end of the first rotating shaft 41 in the second cavity 46, a pushing cavity 67 is fixedly arranged in an array in the electromagnet 62, a hydraulic cylinder 70 is fixedly mounted on the end wall of one side of the pushing cavity 67, which is close to the first rotating shaft 41, the hydraulic cylinder 70 is fixedly connected with a hydraulic rod 68, a conical engagement block 69 is fixedly connected on the outer surface of the end wall of one side of the hydraulic rod 68, which is far away from the hydraulic cylinder 70, the conical engagement block 69 is slidably mounted in the pushing cavity 67, the conical engagement block 69 is in engagement transmission with a sixth bevel gear 47, the sixth bevel gear 47 is fixedly mounted on the outer surface of the lower end of the fourth rotating shaft 48, and a worm 52 is fixedly mounted on the outer surface of, the worm 52 and the worm wheel 51 are in meshing transmission, the worm wheel 51 is fixedly installed on the outer surface of the tail end of the front side of the five rotating shaft 53, the five rotating shaft 53 is rotatably installed on the rear end wall of the pressure regulating cavity 72 on the left side of the worm 52, and the rack 55 and the voltage detector 71 are in meshing transmission.
The fixing and connecting method in this embodiment includes, but is not limited to, bolting, welding, and the like.
In the initial state: the temperature sensor 30 is turned on, the voltage detector 71 is turned on, and the electromagnet 62 loses power.
Sequence of mechanical actions of the whole device:
when the equipment of the invention is in operation, when the surface of the chip board 14 needs to be cleaned, the electromagnet 62 is powered on, so that the electromagnet 62 adsorbs the connecting block 61, so that the second rotating shaft 29 and the third rotating shaft 28 are fixedly connected, the dust collection box 20 is started, the motor 36 is started, so that the driving shaft 39 is driven to rotate, so that the first bevel gear 38 is driven to rotate, the first bevel gear 38 and the second bevel gear 37 are in meshing transmission, so that the bevel gear shaft 34 is driven to rotate, so that the fourth bevel gear 33 is driven to rotate, the fourth bevel gear 33 and the fifth bevel gear 31 are in meshing transmission, so that the second rotating shaft 29 is driven to rotate, so that the third rotating shaft 28 is driven to rotate, so that the first gear 27 is driven to rotate, and the first gear 27 and the meshing port 24 are in meshing transmission, thereby drive the carousel 25 rotates, thereby makes lead screw 13 rotate, lead screw 13 rotates, thereby drives slider 21 moves to the right, thereby makes cleaning brush 22 move to the right, slider 21 moves to the right, thereby drives dust absorption mouth 23 moves to the right, thereby absorbs the dust on chip board 14 surface passes through dust absorption pipe 19 and enters into in the dust absorption case 20.
The temperature sensor 30 detects the temperature rise of the chip board 14, sends a signal to the air pump 59, the air pump 59 inflates the inflation cavity 60, so as to push the engagement block 56 and the second gear 43 to perform engagement transmission, so as to drive the gear shaft 17 to rotate, so as to rotate the mounting disc 16, so as to rotate the fan blades 15 to cool the chip board 14, and when the temperature sensor 30 detects that the temperature of the chip board 14 is too high, the cooling pipe 35 is started to cool the chip board 14.
When the voltage detector 71 detects that the voltage applied to the chip board 14 is unstable, a signal is sent to the hydraulic cylinder 70, the hydraulic cylinder 70 drives the hydraulic rod 68 to move, so that the conical engagement block 69 and the sixth bevel gear 47 are in engagement transmission, so that the rotating shaft four 48 is driven to rotate, so that the worm 52 rotates, the worm 52 and the worm gear 51 are in engagement transmission, so that the rotating shaft five 53 is driven to rotate, so that the gear three 54 rotates, and the gear three 54 and the rack 55 are in engagement transmission, so that the voltage stabilizer 50 is driven to move downwards to be in contact with the contact block 49, so that the voltage applied to the chip board 14 is adjusted.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (4)

1. The utility model provides a can realize the radiator for chip overvoltage protection, include the box and the box internal fixation is provided with bevel gear chamber, its characterized in that: the upper end wall of the bevel gear cavity is rotatably provided with a driving shaft, the driving shaft is in power connection with a main shaft of a motor, the motor is fixedly arranged on the upper end wall of the bevel gear cavity, the outer surface of the lower end of the driving shaft is fixedly provided with a first bevel gear, the first bevel gear and a second bevel gear are in meshing transmission, the second bevel gear is fixedly arranged on the outer surface of the right end of a bevel gear shaft, the outer surface of the left end of the bevel gear shaft is provided with a first transmission device for transmission between the bevel gear shaft and a screw rod, the screw rod is rotatably arranged between the left end wall and the right end wall of the first cavity, the outer surface of the screw rod is rotatably connected with a sliding block, the sliding block is slidably arranged between the front end wall and the rear end wall of the first cavity, the outer surface of the, the dust collection pipe is fixedly connected with the dust collection box at the end of one side far away from the dust collection port, the dust collection box is fixedly installed on the upper side end wall of the first cavity, a cleaning brush is fixedly installed on the outer surface of the lower side end wall of the sliding block on the right side of the dust collection port and used for cleaning the surface of a chip board, the chip board is fixedly installed on the lower side end wall of the first cavity, a temperature sensor is fixedly installed on the lower side end wall of the first cavity on the left side of the chip board and used for detecting the temperature of the chip board, a fan installation cavity is fixedly arranged on the lower side end wall of the first cavity on the lower side of the chip board, a cooling device used for cooling the chip board is installed in the fan installation cavity, the first bevel gear and the third bevel gear are in meshing transmission, and the third bevel gear is fixedly installed on the outer surface of the left side end of the, the first rotating shaft is rotatably arranged in the box body on the right side of the bevel gear cavity, a second transmission device for transmission between the first rotating shaft and the rack is fixedly arranged on the outer surface of the tail end of the right side of the first rotating shaft, the rack is slidably arranged on the upper end wall of the pressure regulating cavity, the outer surface of the lower end wall of the rack is fixedly connected with a voltage stabilizer, the voltage stabilizer is contacted with the contact block, the contact block is fixedly arranged on the lower side end wall of the pressure regulating cavity, the contact block is fixedly connected with an energizing wire, the tail end of one side of the energizing wire, which is far away from the contact block, is fixedly connected with the chip board, the electrified wire is fixedly connected with the voltage detector, the voltage detector is fixedly arranged on the right side end wall of the first cavity, the voltage detector is used for detecting the chip board voltage, and the voltage stabilizer is used for adjusting the chip board voltage.
2. The heat dissipation device of claim 1, wherein the heat dissipation device comprises: the first transmission device comprises the bevel gear shaft, an installation cavity is fixedly arranged in the box body at the left side of the bevel gear cavity, a fourth bevel gear is fixedly arranged on the outer surface of the tail end at the left side of the bevel gear shaft in the installation cavity, the fourth bevel gear and a fifth bevel gear are in meshing transmission, the fifth bevel gear is fixedly arranged on the outer surface of the tail end at the lower side of a rotating shaft II, the rotating shaft II is rotatably arranged in the box body at the upper side of the installation cavity, the outer surface of the tail end at the upper side of the rotating shaft II is rotatably connected with a rotating shaft III, a spring cavity is fixedly arranged in the tail end at the upper side of the rotating shaft II, a first connecting spring is fixedly connected to the end wall at the lower side of the spring cavity, a connecting block is fixedly connected to the tail end at the upper side of, the fixed setting of electro-magnet installation cavity is in the end of three downside of pivot, three rotations of pivot are installed two upsides of pivot in the box, the installation cavity upside the box internal fixation is provided with the meshing chamber, in the meshing chamber the terminal fixed surface of upside of three of pivot installs gear one, gear one and meshing transmission between the mouth, the fixed circumference array of meshing mouth is installed on the left side end wall of carousel, carousel fixed mounting is in the terminal surface in left side of lead screw.
3. The heat dissipation device of claim 1, wherein the heat dissipation device comprises: the cooling device comprises the driving shaft, a transmission cavity is fixedly arranged in the box body on the upper side of the bevel gear cavity, a rotating frame is fixedly arranged on the outer surface of the tail end of the upper side of the driving shaft in the transmission cavity, an inflation cavity is fixedly arranged in the rotating frame in an array mode, a second connecting spring is fixedly connected to the end wall, close to one side of the driving shaft, of the inflation cavity, a meshing block is fixedly connected to the tail end, far away from one side of the driving shaft, of the second connecting spring, the meshing block is slidably arranged in the inflation cavity, an air pump is fixedly arranged on the end wall, close to one side of the driving shaft, of the inflation cavity and used for inflating the inflation cavity, meshing transmission is carried out between the meshing block and a second gear, the second gear is fixedly arranged on the outer surface of the tail, the fan mounting cavity is interior the terminal fixed surface of upside of gear shaft installs the mounting disc, the mounting disc is kept away from the flabellum is installed to gear shaft side end wall outer fixed surface circumference array, the fan mounting cavity left and right sides fixed mounting has the cooling tube in the box, the cooling tube is used for chip board water-cooling.
4. The heat dissipation device of claim 1, wherein the heat dissipation device comprises: the second transmission device comprises the first rotating shaft, a second cavity is fixedly arranged in the box body on the right side of the bevel gear cavity, an electromagnet is fixedly arranged on the outer surface of the right end of the first rotating shaft in the second cavity, a pushing cavity is fixedly arranged in the electromagnet array, a hydraulic cylinder is fixedly arranged on the end wall of one side, close to the first rotating shaft, of the pushing cavity, the hydraulic cylinder is fixedly connected with a hydraulic rod, a conical meshing block is fixedly connected to the outer surface of the end wall of one side, far away from the hydraulic cylinder, of the hydraulic rod, the conical meshing block is slidably arranged in the pushing cavity, the conical meshing block is in meshing transmission with a sixth bevel gear, the sixth bevel gear is fixedly arranged on the outer surface of the end of the lower side of the fourth rotating shaft, a worm is fixedly arranged on the outer surface of the end of the upper side of, the worm wheel is fixedly installed on the outer surface of the tail end of the front side of the fifth rotating shaft, the fifth rotating shaft is installed on the left side of the worm and on the end wall of the rear side of the pressure regulating cavity, and the rack is in meshing transmission with the voltage detector.
CN202011311883.XA 2020-11-20 2020-11-20 Heat dissipation equipment capable of realizing overvoltage protection of chip Withdrawn CN112333991A (en)

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CN202011311883.XA CN112333991A (en) 2020-11-20 2020-11-20 Heat dissipation equipment capable of realizing overvoltage protection of chip

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Application Number Priority Date Filing Date Title
CN202011311883.XA CN112333991A (en) 2020-11-20 2020-11-20 Heat dissipation equipment capable of realizing overvoltage protection of chip

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113725177A (en) * 2021-08-30 2021-11-30 重庆电子工程职业学院 Microelectronic chip heat dissipation device and heat dissipation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113725177A (en) * 2021-08-30 2021-11-30 重庆电子工程职业学院 Microelectronic chip heat dissipation device and heat dissipation method thereof
CN113725177B (en) * 2021-08-30 2023-10-03 重庆电子工程职业学院 Microelectronic chip heat dissipation device and heat dissipation method thereof

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Application publication date: 20210205