CN113578867A - Chip dust removal plastic envelope device - Google Patents

Chip dust removal plastic envelope device Download PDF

Info

Publication number
CN113578867A
CN113578867A CN202110879853.7A CN202110879853A CN113578867A CN 113578867 A CN113578867 A CN 113578867A CN 202110879853 A CN202110879853 A CN 202110879853A CN 113578867 A CN113578867 A CN 113578867A
Authority
CN
China
Prior art keywords
dust
device body
chip
plastic
screw rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110879853.7A
Other languages
Chinese (zh)
Inventor
孙征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qixin Suzhou Intelligent Technology Co ltd
Original Assignee
Qixin Suzhou Intelligent Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qixin Suzhou Intelligent Technology Co ltd filed Critical Qixin Suzhou Intelligent Technology Co ltd
Priority to CN202110879853.7A priority Critical patent/CN113578867A/en
Publication of CN113578867A publication Critical patent/CN113578867A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B08B5/043—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/06—Arrangements for positively actuating jaws
    • B25B5/10—Arrangements for positively actuating jaws using screws
    • B25B5/109—Arrangements for positively actuating jaws using screws with two screws, e.g. parallel screw clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/16—Details, e.g. jaws, jaw attachments
    • B25B5/163—Jaws or jaw attachments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning In General (AREA)

Abstract

The invention discloses a chip dust removal plastic packaging device which comprises a device body, wherein two rectangular slide rails are fixedly welded between the front inner wall and the rear inner wall of the device body. The device simple structure, the modern design, through the screw rod, three hornblocks, the setting of T shape slider, the rotation of knob makes the major axis drive the screw rod through second bevel gear and first bevel gear and rotates, the screw rod makes the ball extrude three hornblocks through T shape slider and round bar, under the effect of extrusion force, three hornblocks drive anchor clamps and remove and fix the chip to the direction that is close to each other, moreover, the steam generator is simple in operation, time saving and labor saving, the work efficiency of whole plastic envelope is greatly improved, and simultaneously, setting through dust cage and dust absorption fan, can bleed to inside, and then can clear away the dust on the chip, the dust enters the dust collection box through the dust collecting pipe suction, avoid encapsulating the dust into the inside sensitivity that leads to of chip and descend.

Description

Chip dust removal plastic envelope device
Technical Field
The invention relates to the technical field of chip processing equipment, in particular to a chip dust removal and plastic package device.
Background
The chip is the general name of semiconductor element products, and during processing the chip, the chip is subjected to plastic package treatment by a plastic packaging machine, the plastic package treatment is performed by a polyester film coated with hot melt adhesive, the packaged chip is bonded in the plastic film through the processing of a gluing machine, the processing process is performed at certain pressure and high temperature, and the high-quality polyester film and the hot melt adhesive with good visibility are adopted, so that the chip subjected to plastic package treatment can not be damaged at normal temperature, and the visual effect of the chip is increased. In the process of carrying out plastic package on the chip, follow-up operation can be carried out on the fixed rear side of the chip, and because the specification of each chip is different, when different chips are fixed, different clamps are required to be replaced to complete the fixing operation, the replacement wastes time and labor, the working efficiency of the whole plastic package is greatly reduced, meanwhile, dust easily enters the existing chip dust removal plastic package device when the plastic package is carried out, the dust is easily introduced into the chip to enable the sensitivity of the dust to be reduced, the detection is not up to the standard, and the defective rate is increased. Therefore, the chip dust removal and plastic package device is improved.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme:
the invention relates to a chip dust removal plastic package device, which comprises a device body, wherein two rectangular slide rails are fixedly welded between the front inner wall and the rear inner wall of the device body, the sides, far away from each other, of the two rectangular slide rails are respectively connected with a T-shaped slide block in a sliding manner, the sides, close to each other, of the two T-shaped slide blocks are respectively and horizontally fixed with a round rod, one end of each round rod is embedded with a ball, two clamps are arranged in the device body, the sides, far away from each other, of the two clamps are respectively and horizontally provided with two telescopic rods, a spring is arranged between each clamp and the inner wall of the device body, the sides, far away from each other, of the two clamps are respectively and fixedly welded with a triangular block, the triangular blocks are movably contacted with the corresponding balls, two screw rods are rotatably connected between the front inner wall and the rear inner wall of the device body, the T-shaped slide blocks are sleeved on the outer sides of the corresponding screw rods in a threaded manner, and one end of each screw rod extends to the front side of the device body, and the extension end of the screw rod is fixedly provided with a first bevel gear, and the outer side of the first bevel gear is engaged with a second bevel gear.
As a preferable technical scheme of the invention, a dust hood is arranged in the device body, a dust suction fan is arranged at the top end of the dust hood, and the top end of the dust suction fan is fixed through a dust collecting pipe and communicated with a dust collecting box.
As a preferred technical scheme of the invention, a plastic package module is arranged in the device body, a hydraulic rod is fixedly arranged between the top end of the plastic package module and the device body, and the top end of the plastic package module is fixed through a hose and communicated with a material box.
As a preferred technical solution of the present invention, a rectangular through hole is formed on the right side of the apparatus body, a transfer module is disposed inside the apparatus body, and the transfer module penetrates through the apparatus body through the rectangular through hole.
As a preferred technical scheme of the invention, the alarm indicator lamp is fixedly arranged on the upper surface of the device body, the universal wheels are fixedly arranged on the lower surface of the device body through threads, and the universal wheels are provided with wheel brakes.
As a preferable technical scheme of the invention, one side of the T-shaped sliding block is provided with a threaded hole, and the T-shaped sliding block is in threaded connection with the corresponding screw rod through the threaded hole.
As a preferable technical scheme of the invention, one side of the T-shaped sliding block is provided with a rectangular sliding chute, and the inner wall of the rectangular sliding chute is in sliding connection with the outer side of the corresponding rectangular sliding rail.
According to a preferred embodiment of the present invention, a long shaft is horizontally fixed to the front side of the apparatus body, and the long shaft is fixedly connected to the second bevel gear.
As a preferable technical solution of the present invention, a protective cover is fixed to an outer side of the apparatus body by a bolt, one end of the long shaft extends to one side of the protective cover, and a knob is connected to an extending end of the long shaft by a thread.
The invention has the beneficial effects that:
1. according to the chip dust removal plastic package device, the screw rod, the triangular block and the T-shaped sliding block are arranged, the long shaft drives the screw rod to rotate through the second conical gear and the first conical gear due to rotation of the knob, the screw rod enables the rolling balls to extrude the triangular block through the T-shaped sliding block and the round rod, and under the action of extrusion force, the triangular block drives the clamp to move towards the direction close to each other and fix the chip, so that the operation is simple, time and labor are saved, and the working efficiency of integral plastic package is greatly improved;
2. according to the chip dust removal plastic package device, the dust collection cover and the dust collection fan are arranged, so that air can be exhausted from the interior of the chip, dust on the chip can be removed, the dust is pumped into the dust collection box through the dust collection pipe, and the problem that the sensitivity of the chip is reduced due to the fact that the dust is packaged into the chip is avoided;
3. this chip dust removal plastic envelope device, threaded hole has been seted up to one side of T shape slider, T shape slider passes through threaded hole and the screw rod threaded connection who corresponds, when using, through the setting of threaded hole, it can make T shape slider remove to rotate the screw rod, rectangular sliding groove has been seted up to one side of T shape slider, the inner wall of rectangular sliding groove and the outside sliding connection of the rectangle slide rail that corresponds, when using, through the setting of rectangular sliding groove, can play spacing effect, the phenomenon of skew can not appear at the in-process that T shape slider removed.
Drawings
FIG. 1 is a schematic structural diagram of a dust-removing and plastic-packaging device for chips according to the present invention;
FIG. 2 is a schematic view of a partial cross-sectional structure of a dust-removing and plastic-sealing device for chips according to the present invention;
FIG. 3 is a schematic structural diagram of a protective cover of the dust-removing and plastic-sealing device for chips according to the present invention;
FIG. 4 is an enlarged schematic structural view of a portion A in FIG. 2 of the chip dust-removing and plastic-sealing device according to the present invention;
fig. 5 is an enlarged schematic structural diagram of a part B in fig. 2 of the chip dust removal and plastic package device according to the present invention.
In the figure: 1. a device body; 2. a protective cover; 3. a transfer module; 4. an alarm indicator light; 5. a universal wheel; 6. a material box; 7. a dust collection fan; 8. a dust collection cover; 9. a plastic package module; 10. a clamp; 11. a knob; 12. a second bevel gear; 13. a long axis; 14. a first bevel gear; 15. a screw; 16. a rectangular slide rail; 17. a triangular block; 18. a round bar; 19. a telescopic rod; 20. a spring; 21. a T-shaped slider; 22. a hydraulic lever; 23. a dust collecting box.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1-5, the dust-removing and plastic-sealing device for chips comprises a device body 1, wherein two rectangular slide rails 16 are fixedly welded between the front and rear inner walls of the device body 1, the sides of the two rectangular slide rails 16, which are far away from each other, are respectively connected with a T-shaped slide block 21 in a sliding manner, the sides, which are close to each other, of the two T-shaped slide blocks 21 are respectively and horizontally fixed with a round rod 18, one end of the round rod 18 is embedded with a ball, two clamps 10 are arranged inside the device body 1, the sides, which are far away from each other, of the two clamps 10 are respectively and horizontally installed with two telescopic rods 19, a spring 20 is arranged between the clamps 10 and the inner wall of the device body 1, the sides, which are far away from each other, of the two clamps 10 are respectively and fixedly welded with a triangular block 17, the triangular blocks 17 are in movable contact with the corresponding balls, two screw rods 15 are rotatably connected between the front and rear inner walls of the device body 1, and the T-shaped slide blocks 21 are sleeved outside the corresponding screw rods 15 in a threaded manner, one end of the screw 15 extends to the front side of the device body 1, a first bevel gear 14 is fixedly installed at the extending end of the screw 15, and a second bevel gear 12 is engaged and connected with the outer side of the first bevel gear 14.
Wherein, the inside of device body 1 is provided with dust cage 8, and the top of dust cage 8 is provided with dust absorption fan 7, and dust collection box 23 is fixed and be communicated through the dust collecting pipe in the top of dust absorption fan 7, and when using, through dust cage 8 and dust absorption fan 7's setting, can collect the dust in the device body 1 to dust collection box 23 for the dust on chip surface can clear up.
Wherein, the inside of device body 1 is provided with plastic envelope module 9, and fixed mounting has hydraulic stem 22 between the top of plastic envelope module 9 and the device body 1, and the top of plastic envelope module 9 is fixed and is communicated with material case 6 through the hose, and when using, through the setting of hydraulic stem 22, can drive plastic envelope module 9 and reciprocate.
Wherein, the right side of device body 1 has seted up the rectangle through-hole, and the inside of device body 1 is provided with transfer module 3, and transfer module 3 runs through device body 1 through the rectangle through-hole, and when using, through transfer module 3's setting, is convenient for convey the chip.
Wherein, the last fixed surface of device body 1 installs alarm indicator 4, and the lower surface thread tightening of device body 1 has a plurality of universal wheels 5, and universal wheel 5 has the wheel to stop, through alarm indicator 4's setting, is convenient for monitor device body 1, and when using, through the setting of universal wheel 5, is convenient for remove device body 1.
Wherein, threaded hole has been seted up to one side of T shape slider 21, and T shape slider 21 passes through threaded hole and 15 threaded connection of corresponding screw rod, and when using, through the setting of threaded hole, it can make T shape slider 21 remove to rotate screw rod 15.
Wherein, rectangular spout has been seted up to one side of T shape slider 21, the inner wall of rectangular spout and the outside sliding connection of the rectangular slide rail 16 that corresponds, when using, through the setting of rectangular spout, can play spacing effect, the phenomenon of skew can not appear at the in-process that T shape slider 21 removed.
Wherein, a long shaft 13 is horizontally fixed at the front side of the device body 1, the long shaft 13 is fixedly connected with the second bevel gear 12, the rotation of the long shaft 13 drives the rotation of the second bevel gear 12, and the rotation of the first bevel gear 14 and the screw 15 is indirectly driven.
Wherein, the outer bolt of the device body 1 is fixed with the protective cover 2, one end of the long shaft 13 extends to one side of the protective cover 2, the extending end of the long shaft 13 is connected with the knob 11 by screw thread, the outer bolt of the device body 1 is fixed with the protective cover 2 to ensure that the protective cover 2 can perform certain protection operation
The working principle is as follows: firstly, checking whether the device is normal, when the checking is finished, switching on the device, conveying the chip into the device body 1 by the conveying module 3, starting the dust suction fan 7, sucking air from the inside through the dust collection cover 8, further removing dust on the chip, sucking the dust into the dust collection box 23 through the dust collection pipe, avoiding sensitivity reduction caused by packaging the dust into the chip, when the chip is conveyed to the middle position in the device body 1 by the conveying module 3, rotating the knob 11 to drive the long shaft 13 to drive the second bevel gear 12 to rotate, driving the screw 15 to rotate by the first bevel gear 14 through the second bevel gear 12, driving the round rod 18 to move by the T-shaped slide block 21 through the screw 15, driving the ball to extrude the triangular block 17 through the round rod 18, driving the clamp 10 to move towards the direction close to each other and fix the chip through the triangular block 17 under the action of extrusion force, at this time, the hydraulic rod 22 is started, so that the plastic packaging module 9 can be driven to move, and the chip is subjected to plastic packaging work.
Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. The chip dust removal plastic package device comprises a device body (1) and is characterized in that two rectangular sliding rails (16) are fixedly welded between the front inner wall and the rear inner wall of the device body (1), one sides, far away from each other, of the two rectangular sliding rails (16) are connected with T-shaped sliding blocks (21) in a sliding mode, one sides, close to each other, of the two T-shaped sliding blocks (21) are horizontally fixed with round rods (18), balls are embedded at one ends of the round rods (18), two clamps (10) are arranged inside the device body (1), two telescopic rods (19) are horizontally arranged at one sides, far away from each other, of the two clamps (10), springs (20) are arranged between the clamps (10) and the inner wall of the device body (1), one sides, far away from each other, of the two clamps (10) are fixedly welded with triangular blocks (17), and the triangular blocks (17) are in movable contact with the corresponding balls, rotate between the front and back inner wall of device body (1) and be connected with two screw rods (15), and T shape slider (21) thread bush is established in the outside of the screw rod (15) that corresponds, the one end of screw rod (15) extends to device body (1) front side, and the extension end fixed mounting of screw rod (15) has first conical gear (14), the equal meshing in the outside of first conical gear (14) is connected with second conical gear (12).
2. The chip dust-removing plastic package device according to claim 1, wherein a dust hood (8) is arranged inside the device body (1), a dust-collecting fan (7) is arranged at the top end of the dust hood (8), and a dust-collecting box (23) is fixed and communicated with the top end of the dust-collecting fan (7) through a dust-collecting pipe.
3. The chip dust-removing and plastic-packaging device according to claim 1, wherein a plastic-packaging module (9) is arranged inside the device body (1), a hydraulic rod (22) is fixedly arranged between the top end of the plastic-packaging module (9) and the device body (1), and the top end of the plastic-packaging module (9) is fixed through a hose and communicated with the material box (6).
4. The dust-removing and plastic-packaging device for the chips as defined in claim 1, wherein a rectangular through hole is formed in the right side of the device body (1), the transmission module (3) is arranged inside the device body (1), and the transmission module (3) penetrates through the device body (1) through the rectangular through hole.
5. The chip dust-removing and plastic-packaging device according to claim 1, wherein an alarm indicator lamp (4) is fixedly mounted on the upper surface of the device body (1), a plurality of universal wheels (5) are fixedly screwed on the lower surface of the device body (1), and the universal wheels (5) are provided with wheel brakes.
6. The chip dust-removal plastic package device according to claim 1, wherein a threaded hole is formed in one side of the T-shaped sliding block (21), and the T-shaped sliding block (21) is in threaded connection with the corresponding screw (15) through the threaded hole.
7. The chip dust-removing and plastic-packaging device according to claim 1, wherein a rectangular sliding groove is formed in one side of the T-shaped sliding block (21), and the inner wall of the rectangular sliding groove is slidably connected with the outer side of the corresponding rectangular sliding rail (16).
8. The chip dust-removal plastic package device according to claim 1, wherein a long shaft (13) is horizontally fixed to the front side of the device body (1), and the long shaft (13) is fixedly connected with the second bevel gear (12).
9. The chip dust-removing and plastic-sealing device according to claim 8, wherein a protective cover (2) is fixed to the outer side of the device body (1) through a bolt, one end of the long shaft (13) extends to one side of the protective cover (2), and a knob (11) is connected to the extending end of the long shaft (13) in a threaded manner.
CN202110879853.7A 2021-08-02 2021-08-02 Chip dust removal plastic envelope device Withdrawn CN113578867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110879853.7A CN113578867A (en) 2021-08-02 2021-08-02 Chip dust removal plastic envelope device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110879853.7A CN113578867A (en) 2021-08-02 2021-08-02 Chip dust removal plastic envelope device

Publications (1)

Publication Number Publication Date
CN113578867A true CN113578867A (en) 2021-11-02

Family

ID=78253572

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110879853.7A Withdrawn CN113578867A (en) 2021-08-02 2021-08-02 Chip dust removal plastic envelope device

Country Status (1)

Country Link
CN (1) CN113578867A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114678298A (en) * 2022-03-14 2022-06-28 珠海市众知科技有限公司 Integrated circuit block pin packaging hardware

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114678298A (en) * 2022-03-14 2022-06-28 珠海市众知科技有限公司 Integrated circuit block pin packaging hardware

Similar Documents

Publication Publication Date Title
CN115790725B (en) Multifunctional detection equipment for electronic components
CN113578867A (en) Chip dust removal plastic envelope device
CN113132824A (en) Energy consumption data acquisition unit
CN116500033A (en) Adjustable visual outer tube detection equipment and use method thereof
CN115638759B (en) Automatic external diameter measuring device of high efficiency lathe
CN106733769A (en) For the cleaning device of automatic transmission casing
CN209425259U (en) A kind of grinding wafer polissoir
CN110587384A (en) Polishing robot and process flow thereof
CN113490346B (en) Chip mounter and chip mounting method
CN108890185B (en) Intelligent welding robot based on machine vision
CN115157549A (en) Chip dust removal plastic envelope device
CN207564248U (en) A kind of glass edge-grinding machine for facilitating processing
CN113973442B (en) Transmission device used in resistor full-automatic chip mounter
CN211940454U (en) Dust collector for grinder
CN211027147U (en) Contact lens sorting machine
CN218309457U (en) Integrated circuit packaging test device
CN211810429U (en) Automatic workpiece packaging device with detection function
CN207343397U (en) Non-contact cleaning equipment
CN105904386A (en) Dust-free clamp for electronic processing
CN210616037U (en) Rotary positioning jig and deburring machine with same
CN217906530U (en) Robot polishing and cutting automation equipment
CN111215390A (en) Control system and control method for automatic scrap removing production line of parts
CN218968288U (en) Double-span spiral car unloader
CN110238727A (en) A kind of vertical edger unit of glass
CN215744918U (en) Brick machine outlet quality control device for producing nano heat insulation plate

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20211102

WW01 Invention patent application withdrawn after publication