CN113725177A - Microelectronic chip heat dissipation device and heat dissipation method thereof - Google Patents
Microelectronic chip heat dissipation device and heat dissipation method thereof Download PDFInfo
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- CN113725177A CN113725177A CN202111002565.XA CN202111002565A CN113725177A CN 113725177 A CN113725177 A CN 113725177A CN 202111002565 A CN202111002565 A CN 202111002565A CN 113725177 A CN113725177 A CN 113725177A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 238000004377 microelectronic Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 8
- 239000000428 dust Substances 0.000 claims abstract description 36
- 238000004140 cleaning Methods 0.000 claims abstract description 31
- 239000002344 surface layer Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 15
- 238000007599 discharging Methods 0.000 claims abstract description 8
- 229920000742 Cotton Polymers 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 241000883990 Flabellum Species 0.000 abstract 1
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a microelectronic chip heat dissipation device, wherein the bottom of one side of a shell, which is far away from each other, is provided with two symmetrical air inlet holes, a placing plate positioned above the air inlet holes is fixedly connected in the shell, the top of the placing plate is provided with a plurality of chips, a first sliding plate positioned above the chips is connected in the shell in a sliding manner, a heat dissipation assembly for dissipating heat of the chips is arranged in the first sliding plate, a discharge assembly for separately discharging heat dissipated by the chips is arranged in the shell, the bottom of the first sliding plate is provided with a cleaning assembly for cleaning the surface layers of the chips, the top of the shell is provided with a plurality of exhaust holes, and a rotating door which is in contact with the first sliding plate is rotatably connected in the shell; the problem of current microelectronic chip heat abstractor hot-air exhaust port fixed, the chip top layer covers the dust easily, and the fan flabellum piles up the dust, influences fan exhaust hot-air efficiency is solved.
Description
Technical Field
The invention belongs to the field of microelectronic chips, and relates to a microelectronic chip heat dissipation device and a heat dissipation method thereof.
Background
A chip is an integrated circuit, also called a thin film integrated circuit, in which a circuit is manufactured on a surface of a semiconductor chip. Another thick film integrated circuit is a miniaturized circuit formed by integrating an independent semiconductor device and a passive component on a substrate or a circuit board, and can generate more heat during the operation of a chip, so that the heat needs to be discharged in time through a heat dissipation device, and the influence on the normal operation of the chip is avoided.
The chip is used in electrical apparatus such as the computer more, traditional radiating mode is through the fan with hot-air discharge to the outside, but when discharging hot-air, the discharge direction of hot-air is in fixedly, a large amount of hot-air discharge department gathering under long-time, not only influence near air circumstance and still make the hot-air plug up the discharge port, hinder the discharge of hot-air, and then influence the heat dissipation of microelectronic chip, and at the in-process through the fan heat dissipation, the dust in the air can pile up on the top layer of microelectronic chip, can't dispel the heat to the chip, in addition under the long-time operational aspect of fan, a large amount of dust can also be piled up on the fan top layer, seriously influence the efficiency that the fan discharged hot-air.
Disclosure of Invention
In view of the above, the present invention provides a microelectronic chip heat dissipation device and a heat dissipation method thereof, which are used to solve the problems that the heat air discharge port in the conventional microelectronic chip heat dissipation device is fixed, the surface layer of the chip is easily covered with dust, and the fan blades accumulate dust, thereby affecting the efficiency of the fan discharging hot air.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a microelectronic chip heat abstractor, includes the casing, one side bottom that the casing kept away from each other is equipped with two symmetrical inlet ports, fixedly connected with is located the board of placing of inlet port top in the casing, the top of placing the board is provided with a plurality of chips, sliding connection has the first slide that is located the chip top in the casing, be equipped with in the first slide and be used for separately discharging the radiating radiator unit of chip, be equipped with the emission subassembly that is used for separately discharging the heat that the chip gived off in the casing, the bottom of first slide is equipped with the clearance subassembly that is used for clearing up the chip top layer, the top of casing is equipped with a plurality of exhaust holes, the casing internal rotation is connected with the revolving door that touches mutually with first slide.
Further, the heat dissipation assembly comprises a rectangular through hole arranged in the first sliding plate, a rectangular block is connected in the rectangular through hole in a sliding mode, a rotating shaft penetrates through the bottom of the rectangular block in a rotating mode, fan blades located in the rectangular block are fixedly connected to the top end of the rotating shaft, a worm wheel is fixedly connected to the bottom end of the rotating shaft, a worm meshed with the worm wheel is connected in the shell in a transverse rotating mode, a first gear is fixedly sleeved on the outer wall of the worm, a driving motor is fixedly connected to one side of the shell, an output shaft of the driving motor penetrates through one side of the shell and is fixedly connected with one end of the worm, a plurality of second springs are fixedly connected to the inner wall of one side of the rectangular through hole, the other ends of the plurality of second springs are fixedly connected with one side of the rectangular block, a rotating groove is formed in the first sliding plate, and a screw rod is connected in the rotating groove in a rotating mode through a fixed block, be equipped with in the casing and rotate the circular through-hole of groove with the centre of a circle, it has the nut piece that touches mutually with the rectangular block to rotate inslot sliding connection, and the screw rod one end screw thread of keeping away from circular through-hole runs through the nut piece, the screw rod one end fixedly connected with plectane of keeping away from the nut piece, one side that the screw rod was kept away from to the plectane is equipped with the hexagonal recess.
Further, it is including being the dead lever of horizontal fixed connection in the casing to discharge the subassembly, and the dead lever is located the top of first slide, the outer wall of dead lever rotates the cover and is equipped with deflector and third gear, one side inner wall of casing rotates and is connected with the axis of rotation, the outer wall fixed cover of axis of rotation is equipped with cam and second gear, and second gear and first gear mesh mutually, one side inner wall sliding connection of casing has the first rack with third gear mesh mutually, and the bottom of first rack and the outer wall sliding connection of cam.
Further, the clearance subassembly includes two symmetrical fixed plates of fixed connection in first slide bottom, two one side that the fixed plate is close to each other rotates and runs through same dwang, the one end fixedly connected with fourth gear of dwang, the second rack of one side inner wall fixedly connected with and fourth gear engaged with of casing, the fixed cover of outer wall of dwang is equipped with the rotary drum brush that touches mutually with the chip top.
Furthermore, fixedly connected with airstrainer in the inlet port, and during the air of external air passed through the inlet port gets into the casing, and airstrainer filtered the dust in the air of external, avoided external dust too much, covered on the chip top layer.
Further, place the inboard and be equipped with a plurality of bell mouths, the air passes through the bell mouth and gets into between first slide and the chip, and the air after the filtration can accelerate the velocity of flow of air when passing through the bell mouth, and then can take away the heat on chip top layer, reaches the purpose of quick cooling to the chip.
Further, one side fixedly connected with rubber layer that the nut piece is close to the rectangular block can avoid the nut piece to cause wearing and tearing to the surface of rectangular block through the rubber layer.
Further, the fixed cover of outer wall of cam is equipped with the slide rail, the bottom fixedly connected with of first rack rotates the slider, and rotates slider and slide rail sliding fit.
Furthermore, one side of the shell is rotatably connected with a rotating plate, a second sliding plate is connected in the rotating plate in a sliding manner, one side of the second sliding plate, which is close to the shell, is fixedly connected with a plurality of first springs, the other ends of the plurality of first springs are fixedly connected with the inner wall of one side of the rotating plate, one side of the second sliding plate, which is close to the shell, is fixedly connected with a first magnet penetrating through the rotating plate, one side of the shell is fixedly embedded with a second magnet matched with the first magnet, one side of the second sliding plate, which is far away from the shell, is fixedly connected with cleaning cotton, the rotating plate is rotated anticlockwise, the magnetic attraction between the first magnet and the second magnet disappears, because the first spring is always in a compressed state, after the magnetic force between the first magnet and the second magnet disappears, the second sliding plate slides outwards under the elastic force of the first spring, and at the moment, the cleaning cotton can extend into the rectangular block to be contacted with the fan blades, then the rotating shaft drives the fan blades to rotate, and the cleaning cotton can clean the dust on the surface layers of the fan blades.
A heat dissipation method of a microelectronic chip heat dissipation device comprises the following steps:
s1, a driving motor is started to drive a worm to rotate, the worm is meshed with the worm wheel, the worm drives the worm wheel, a rotating shaft and fan blades to rotate, heat is generated when the chip operates, the heat is filled between a first sliding plate and a placing plate, then the fan blades can upwards discharge hot air between the first sliding plate and the placing plate, external air enters a shell through an air inlet, an air filter screen filters dust in the external air, the filtered air enters a space between the first sliding plate and the placing plate through a tapered hole, the flow rate of the air can be accelerated when the filtered air passes through the tapered hole, and then the heat on the surface layer of the chip can be taken away, so that the purpose of rapidly cooling the chip is achieved;
s2, the worm rotates to drive the first gear to rotate, the first gear is meshed with the second gear, the rotating shaft and the cam start to rotate, the first rack starts to slide up and down along with the rotation of the cam due to the sliding connection of the cam and the first rack, the first rack is meshed with the third gear, the third gear and the guide plate can further rotate in a reciprocating mode, and therefore when the fan blades discharge hot air upwards, the hot air can be discharged from exhaust holes in different directions through the reciprocating rotation of the guide plate, and the hot air is prevented from being accumulated in one exhaust hole;
s3, when the chip and the fan blade are fully covered with dust, the hexagonal screw plate is inserted into the hexagonal groove through the circular through hole, the hexagonal screw plate drives the screw rod to rotate, the screw rod is in threaded connection with the nut block, the nut block starts to push the rectangular block towards the direction of the second spring, the second spring starts to compress at the moment, the worm and the worm wheel are disengaged, then the hexagonal screw plate is taken away, the rotating door is rotated to pull the first sliding plate outwards, and the rotating rod starts to rotate under the action of the second rack and the fourth gear when the first sliding plate moves outwards, so that the rotating drum brush can remove the dust on the surface layer of the chip;
s4, when the rectangular block and the fan blade are moved out of the shell, the rotating plate is rotated anticlockwise, the magnetic attraction force between the first magnet and the second magnet disappears, the first spring is always in a compressed state, after the magnetic force between the first magnet and the second magnet disappears, the second sliding plate slides outwards under the elastic force of the first spring, the cleaning cotton can extend into the rectangular block to be in contact with the fan blade at the moment, then the fan blade is driven to rotate through the rotating shaft, the cleaning cotton can clean dust on the surface layer of the fan blade, after cleaning is finished, the rotating plate is rotated reversely until the rotating plate is attached to the shell, under the magnetic attraction force between the first magnet and the second magnet, the second sliding plate slides towards the shell, and the first spring begins to be compressed again;
and S5, the first sliding plate enters the shell again until the rotating groove is aligned with the circular through hole, the first sliding plate is inserted into the hexagonal groove through the hexagonal screw to drive the screw rod to rotate reversely, the nut block slides towards the circular through hole at the moment, the rectangular block starts to slide towards the circular through hole under the action of the elastic force of the second spring until the worm wheel and the worm are contacted, and then the worm is slowly rotated until the worm and the worm wheel are meshed again.
The invention has the beneficial effects that:
1. according to the microelectronic chip heat dissipation device disclosed by the invention, the worm is driven to rotate by starting the driving motor, so that the fan blades can rotate, hot air between the first sliding plate and the placing plate can move upwards, the guide plate can be driven to rotate in a reciprocating manner, the hot air is discharged to the outside through the exhaust holes in different directions, and the influence on subsequent hot air discharge caused by accumulation of the hot air at one outlet is avoided.
2. According to the microelectronic chip heat dissipation device disclosed by the invention, the outside air enters the shell through the air inlet hole, the air filter screen filters dust in the outside air, the filtered air enters the space between the first sliding plate and the chip through the tapered hole, and the flow velocity of the air can be accelerated when the filtered air passes through the tapered hole, so that the heat on the surface layer of the chip can be taken away, and the purpose of rapidly cooling the chip is achieved.
3. According to the microelectronic chip heat dissipation device disclosed by the invention, the first sliding plate is pulled outwards, and when the first sliding plate moves outwards, the rotating rod starts to rotate under the action of the second rack and the fourth gear, so that the rotating drum brush can remove dust on the surface layer of the chip, and the situation that the heat dissipation of the chip is influenced by the fact that the chip is fully covered with dust is prevented.
4. According to the microelectronic chip heat dissipation device disclosed by the invention, through rotating the rotating plate, the magnetic attraction between the first magnet and the second magnet disappears, the second sliding plate slides outwards under the elastic force of the first spring, the cleaning cotton can extend into the rectangular block to be in contact with the fan blades at the moment, and further the fan blades can be in contact with the cleaning cotton through rotating the rotating shaft and the fan blades, so that the cleaning cotton can remove dust on the surface layers of the fan blades, and the heat dissipation efficiency is prevented from being influenced by excessive dust on the surface layers of the fan blades.
5. According to the microelectronic chip heat dissipation device disclosed by the invention, the worm is driven to rotate by starting the driving motor, so that heat emitted by a chip can be discharged from the exhaust holes in different directions, the heat is prevented from being accumulated at one outlet to influence subsequent heat dissipation, the flow velocity of air can be accelerated through the tapered hole, the heat on the surface layer of the chip can be taken away, the purpose of rapidly cooling the chip is achieved, in addition, dust fully distributed on the fan blades and the chip can be timely removed, excessive dust is prevented, and the heat dissipation efficiency is improved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the means of the instrumentalities and combinations particularly pointed out hereinafter.
Drawings
For the purposes of promoting a better understanding of the objects, aspects and advantages of the invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a front cross-sectional view of a microelectronic die heat sink of the present invention;
FIG. 2 is a first cross-sectional view taken along line A-A of FIG. 1 in accordance with the present invention;
FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1 in accordance with the present invention;
FIG. 4 is a cross-sectional view taken along line C-C of FIG. 1 in accordance with the present invention;
FIG. 5 is an enlarged view taken at D of FIG. 2 in accordance with the present invention;
FIG. 6 is an enlarged view of FIG. 2 at E in accordance with the present invention;
FIG. 7 is a second cross-sectional view taken along line A-A of FIG. 1 in accordance with the present invention;
fig. 8 is an enlarged view of the invention at F in fig. 7.
Reference numerals: 1. a housing; 2. an air inlet; 3. placing the plate; 4. a chip; 5. a first slide plate; 6. an exhaust hole; 7. a rectangular through hole; 8. a rectangular block; 9. a rotating shaft; 10. a fan blade; 11. a worm gear; 12. a worm; 13. a drive motor; 14. a first gear; 15. a rotating shaft; 16. a cam; 17. a second gear; 18. a first rack; 19. fixing the rod; 20. a guide plate; 21. a third gear; 22. a circular through hole; 23. a rotating groove; 24. a screw; 25. a circular plate; 26. a hexagonal groove; 27. a nut block; 28. a fixing plate; 29. rotating the rod; 30. a fourth gear; 31. a second rack; 32. a drum brush; 33. a rotating plate; 34. a second slide plate; 35. a first spring; 36. a first magnet; 37. a second magnet; 38. cleaning cotton; 39. an air filter screen; 40. a tapered hole; 41. a rubber layer; 42. a slide rail; 43. rotating the slide block; 44. a rotating door; 45. a second spring.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention in a schematic way, and the features in the following embodiments and examples may be combined with each other without conflict.
Wherein the showings are for the purpose of illustrating the invention only and not for the purpose of limiting the same, and in which there is shown by way of illustration only and not in the drawings in which there is no intention to limit the invention thereto; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not an indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes, and are not to be construed as limiting the present invention, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.
Example one
A microelectronic chip heat dissipation device as shown in fig. 1-6, which comprises a housing 1, two symmetrical air inlets 2 are disposed at the bottom of one side of the housing 1 away from each other, an air filter 39 is fixedly connected in each air inlet 2 through a bolt, the outside air enters the housing 1 through the air inlets 2, the air filter 39 filters dust in the outside air to prevent the outside dust from being too much and covering the surface of a chip 4, a placing plate 3 is fixedly connected in the housing 1 and located above the air inlets 2, a plurality of tapered holes 40 are disposed in the placing plate 3, the air enters between the first sliding plate 5 and the chip 4 through the tapered holes 40, the flow rate of the air can be accelerated when the filtered air passes through the tapered holes 40, and further the heat on the surface of the chip 4 can be taken away, so as to achieve the purpose of rapidly cooling the chip 4, a plurality of chips 4 are disposed on the top of the placing plate 3, a first sliding plate 5 positioned above a chip 4 is connected in the shell 1 in a sliding manner, a heat dissipation assembly used for dissipating heat of the chip 4 is arranged in the first sliding plate 5, a discharge assembly used for separately discharging heat dissipated by the chip 4 is arranged in the shell 1, the discharge assembly comprises a fixed rod 19 transversely and fixedly connected in the shell 1, the fixed rod 19 is positioned above the first sliding plate 5, the outer wall of the fixed rod 19 is rotatably sleeved with a guide plate 20 and a third gear 21, the inner wall of one side of the shell 1 is rotatably connected with a rotating shaft 15, the outer wall of the rotating shaft 15 is fixedly sleeved with a cam 16 and a second gear 17 through a jackscrew, the outer wall of the cam 16 is fixedly sleeved with a sliding rail 42, the bottom end of the first rack 18 is fixedly connected with a rotating slider 43, the rotating slider 43 is in sliding fit with the sliding rail 42, the second gear 17 is meshed with the first gear 14, the inner wall of one side of the shell 1 is slidably connected with a first rack 18 meshed with the third gear 21, the bottom end of the first rack 18 is slidably connected to the outer wall of the cam 16, the bottom of the first sliding plate 5 is provided with a cleaning assembly for cleaning the surface layer of the chip 4, the top of the housing 1 is provided with a plurality of exhaust holes 6, and the housing 1 is rotatably connected with a rotating door 44 which is in contact with the first sliding plate 5.
In the invention, the heat radiation component comprises a rectangular through hole 7 arranged in a first sliding plate 5, a rectangular block 8 is connected in the rectangular through hole 7 in a sliding way, a rotating shaft 9 penetrates through the bottom of the rectangular block 8 in a rotating way, the top end of the rotating shaft 9 is fixedly connected with a fan blade 10 positioned in the rectangular block 8 through a screw, a worm wheel 11 is welded at the bottom end of the rotating shaft 9, a worm 12 meshed with the worm wheel 11 is connected in a transverse rotating way in a shell 1, a first gear 14 is fixedly sleeved on the outer wall of the worm 12, a driving motor 13 is fixedly connected to one side of the shell 1, the output shaft of the driving motor 13 penetrates through one side of the shell 1 and is fixedly connected with one end of the worm 12, a plurality of second springs 45 are fixedly connected to the inner wall of one side of the rectangular through hole 7, the other ends of the plurality of second springs 45 are fixedly connected with one side of the rectangular block 8, a rotating groove 23 is arranged in the first sliding plate 5, a screw 24 is rotatably connected in the rotating groove 23 through a fixing block, a circular through hole 22 concentric with the rotating groove 23 is arranged in the shell 1, a nut block 27 touching the rectangular block 8 is connected in the rotating groove 23 in a sliding manner, a rubber layer 41 is fixedly connected on one side of the nut block 27 close to the rectangular block 8, the surface of the rectangular block 8 can be prevented from being abraded by the nut block 27 through the rubber layer 41, a thread at one end of the screw rod 24 far away from the circular through hole 22 penetrates through the nut block 27, a circular plate 25 is fixedly connected on one end of the screw rod 24 far away from the nut block 27, a hexagonal groove 26 is arranged on one side of the circular plate 25 far away from the screw rod 24, the worm 12 is driven to rotate by starting the driving motor 13, the fan blades 10 can be rotated, hot air between the first sliding plate 5 and the placing plate 3 is moved upwards, the guide plate 20 can be driven to rotate in a reciprocating manner, the hot air is discharged to the outside through the exhaust holes 6 in different directions, and the hot air is prevented from being accumulated in an outlet, affecting the subsequent hot air discharge.
In the invention, the cleaning assembly at the bottom of the first sliding plate 5 comprises two symmetrical fixing plates 28 fixedly connected to the bottom of the first sliding plate 5, one side of the two fixing plates 28, which is close to each other, is rotatably penetrated by a same rotating rod 29, one end of the rotating rod 29 is fixedly connected with a fourth gear 30, the inner wall of one side of the shell 1 is welded with a second rack 31 meshed with the fourth gear 30, and the outer wall of the rotating rod 29 is fixedly sleeved with a rotary drum brush 32 contacting with the top of the chip 4.
In the invention, by pulling the first sliding plate 5 outwards, when the first sliding plate 5 moves outwards, the rotating rod 29 starts to rotate under the action of the second rack 31 and the fourth gear 30, and further the rotating drum brush 32 can remove dust on the surface layer of the chip 4, so that the chip 4 is prevented from being full of dust and affecting the heat dissipation of the chip 4.
Example two
As a further improvement of the previous embodiment, as shown in fig. 1-8, a microelectronic chip heat dissipation device includes a housing 1, two symmetrical air inlets 2 are disposed at the bottom of one side of the housing 1 away from each other, an air filter 39 is fixedly connected in each air inlet 2 through a bolt, external air enters the housing 1 through the air inlets 2, the air filter 39 filters dust in the external air to prevent the external dust from being too much and cover the surface layer of a chip 4, a placing plate 3 is fixedly connected in the housing 1 and located above the air inlets 2, a plurality of tapered holes 40 are disposed in the placing plate 3, the air enters between a first sliding plate 5 and the chip 4 through the tapered holes 40, the filtered air can accelerate the flow rate of the air when passing through the tapered holes 40, so as to take away heat on the surface layer of the chip 4, and achieve the purpose of rapidly cooling the chip 4, the top of the placing plate 3 is provided with a plurality of chips 4, a first sliding plate 5 positioned above the chips 4 is connected in the shell 1 in a sliding manner, a heat dissipation assembly used for dissipating heat of the chips 4 is arranged in the first sliding plate 5, a discharge assembly used for separately discharging heat dissipated by the chips 4 is arranged in the shell 1, the discharge assembly comprises a fixed rod 19 which is transversely and fixedly connected in the shell 1, the fixed rod 19 is positioned above the first sliding plate 5, the outer wall of the fixed rod 19 is rotatably sleeved with a guide plate 20 and a third gear 21, the inner wall of one side of the shell 1 is rotatably connected with a rotating shaft 15, the outer wall of the rotating shaft 15 is fixedly sleeved with a cam 16 and a second gear 17 through a jackscrew, the outer wall of the cam 16 is fixedly sleeved with a sliding rail 42, the bottom end of the first rack 18 is fixedly connected with a rotating slide block 43, the rotating slide block 43 is in sliding fit with the sliding rail 42, and the second gear 17 is meshed with the first gear 14, the inner wall of one side of casing 1 sliding connection has the first rack 18 with third gear 21 engaged with, and the bottom of first rack 18 and the outer wall sliding connection of cam 16, and the bottom of first slide 5 is equipped with the clearance subassembly that is used for clearing up the chip 4 top layer, and the top of casing 1 is equipped with a plurality of exhaust holes 6, and casing 1 internal rotation is connected with the rotating door 44 that touches with first slide 5.
In the invention, the heat radiation component comprises a rectangular through hole 7 arranged in a first sliding plate 5, a rectangular block 8 is connected in the rectangular through hole 7 in a sliding way, a rotating shaft 9 penetrates through the bottom of the rectangular block 8 in a rotating way, the top end of the rotating shaft 9 is fixedly connected with a fan blade 10 positioned in the rectangular block 8 through a screw, a worm wheel 11 is welded at the bottom end of the rotating shaft 9, a worm 12 meshed with the worm wheel 11 is connected in a transverse rotating way in a shell 1, a first gear 14 is fixedly sleeved on the outer wall of the worm 12, a driving motor 13 is fixedly connected to one side of the shell 1, the output shaft of the driving motor 13 penetrates through one side of the shell 1 and is fixedly connected with one end of the worm 12, a plurality of second springs 45 are fixedly connected to the inner wall of one side of the rectangular through hole 7, the other ends of the plurality of second springs 45 are fixedly connected with one side of the rectangular block 8, a rotating groove 23 is arranged in the first sliding plate 5, a screw 24 is rotatably connected in the rotating groove 23 through a fixing block, a circular through hole 22 concentric with the rotating groove 23 is arranged in the shell 1, a nut block 27 touching the rectangular block 8 is connected in the rotating groove 23 in a sliding manner, a rubber layer 41 is fixedly connected on one side of the nut block 27 close to the rectangular block 8, the surface of the rectangular block 8 can be prevented from being abraded by the nut block 27 through the rubber layer 41, a thread at one end of the screw rod 24 far away from the circular through hole 22 penetrates through the nut block 27, a circular plate 25 is fixedly connected on one end of the screw rod 24 far away from the nut block 27, a hexagonal groove 26 is arranged on one side of the circular plate 25 far away from the screw rod 24, the worm 12 is driven to rotate by starting the driving motor 13, the fan blades 10 can be rotated, hot air between the first sliding plate 5 and the placing plate 3 is moved upwards, the guide plate 20 can be driven to rotate in a reciprocating manner, the hot air is discharged to the outside through the exhaust holes 6 in different directions, and the hot air is prevented from being accumulated in an outlet, affecting the subsequent hot air discharge.
In the invention, the cleaning assembly comprises two symmetrical fixed plates 28 fixedly connected to the bottom of the first sliding plate 5, one side of the two fixed plates 28, which is close to each other, is rotatably penetrated by a same rotating rod 29, one end of the rotating rod 29 is fixedly connected with a fourth gear 30, a second rack 31 meshed with the fourth gear 30 is welded on the inner wall of one side of the shell 1, and a rotary drum brush 32 contacted with the top of the chip 4 is fixedly sleeved on the outer wall of the rotating rod 29.
In the invention, by pulling the first sliding plate 5 outwards, when the first sliding plate 5 moves outwards, the rotating rod 29 starts to rotate under the action of the second rack 31 and the fourth gear 30, and further the rotating drum brush 32 can remove dust on the surface layer of the chip 4, so that the chip 4 is prevented from being full of dust and affecting the heat dissipation of the chip 4.
In the invention, a rotating plate 33 is rotatably connected to one side of a shell 1, a second sliding plate 34 is slidably connected to the rotating plate 33, a plurality of first springs 35 are fixedly connected to one side of the second sliding plate 34 close to the shell 1, the other ends of the plurality of first springs 35 are fixedly connected with the inner wall of one side of the rotating plate 33, a first magnet 36 penetrating through the rotating plate 33 is fixedly connected to one side of the second sliding plate 34 close to the shell 1, a second magnet 37 matched with the first magnet 36 is fixedly embedded on one side of the shell 1, a cleaning cotton 38 is fixedly connected to one side of the second sliding plate 34 far away from the shell 1, the rotating plate 33 is rotated anticlockwise, the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, because the first springs 35 are always in a compressed state, after the magnetic force between the first magnet 36 and the second magnet 37 disappears, the second sliding plate 34 slides outwards under the elastic force of the first springs 35, at this time, the cleaning cotton 38 can extend into the rectangular block 8 to touch the fan blade 10, and then the rotating shaft 9 drives the fan blade 10 to rotate, so that the cleaning cotton 38 can clean the dust on the surface layer of the fan blade 10.
The advantages of the second embodiment over the first embodiment are: a rotating plate 33 is rotatably connected to one side of the housing 1, a second sliding plate 34 is slidably connected to the rotating plate 33, a plurality of first springs 35 are fixedly connected to one side of the second sliding plate 34 close to the housing 1, the other ends of the plurality of first springs 35 are fixedly connected to the inner wall of one side of the rotating plate 33, a first magnet 36 penetrating through the rotating plate 33 is fixedly connected to one side of the second sliding plate 34 close to the housing 1, a second magnet 37 matched with the first magnet 36 is fixedly embedded to one side of the housing 1, a cleaning cotton 38 is fixedly connected to one side of the second sliding plate 34 far from the housing 1, the rotating plate 33 is rotated counterclockwise, the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, because the first spring 35 is always in a compressed state, after the magnetic attraction disappears between the first magnet 36 and the second magnet 37, the second sliding plate 34 slides outwards under the elastic force of the first spring 35, at this time, the cleaning cotton 38 can extend into the rectangular block 8 to touch the fan blade 10, and then the rotating shaft 9 drives the fan blade 10 to rotate, so that the cleaning cotton 38 can clean the dust on the surface layer of the fan blade 10.
A heat dissipation method of a microelectronic chip heat dissipation device comprises the following steps:
s1, the driving motor 13 is started to drive the worm 12 to rotate, the worm 12 is meshed with the worm wheel 11, the worm 12 drives the worm wheel 11, the rotating shaft 9 and the fan blade 10 to rotate, heat is generated when the chip 4 operates, the heat is filled between the first sliding plate 5 and the placing plate 3, then the fan blade 10 can upwards discharge hot air between the first sliding plate 5 and the placing plate 3, external air enters the shell 1 through the air inlet 2, the air filter screen 39 filters dust in the external air, the filtered air enters the space between the first sliding plate 5 and the placing plate 3 through the tapered holes 40, the flow rate of the air can be accelerated when the filtered air passes through the tapered holes 40, and then the heat on the surface layer of the chip 4 can be taken away, so that the purpose of rapidly cooling the chip 4 is achieved;
s2, the worm 12 rotates to drive the first gear 14 to rotate, the first gear 14 is meshed with the second gear 17, the rotating shaft 15 and the cam 16 start to rotate, the cam 16 is connected with the first rack 18 in a sliding mode, the first rack 18 starts to slide up and down in a reciprocating mode along with the rotation of the cam 16, the first rack 18 is meshed with the third gear 21, the third gear 21 and the guide plate 20 can further rotate in a reciprocating mode, when the fan blades 10 discharge hot air upwards, the hot air can be discharged from the exhaust holes 6 in different directions through the reciprocating rotation of the guide plate 20, and the hot air is prevented from being accumulated in one exhaust hole;
s3, when the chip 4 and the fan blade 10 are full of dust, the hexagonal screw is inserted into the hexagonal groove 26 through the circular through hole 22, the hexagonal screw drives the screw 24 to rotate, the screw 24 is in threaded connection with the nut block 27, the nut block 27 starts to push the rectangular block 8 towards the direction of the second spring 45, at this time, the second spring 45 starts to compress, the worm 12 and the worm wheel 11 are disengaged, then the hexagonal screw is taken away, the rotating door 44 is rotated to pull the first sliding plate 5 outwards, because the fourth gear 30 is engaged with the second gear 31, when the first sliding plate 5 moves outwards, the rotating rod 29 starts to rotate under the action of the second gear 31 and the fourth gear 30, and then the rotating drum brush 32 can remove the dust on the surface layer of the chip 4;
s4, when the rectangular block 8 and the fan blade 10 are moved out of the housing 1, the rotating plate 33 is rotated counterclockwise, the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, because the first spring 35 is always in a compressed state, after the magnetic attraction between the first magnet 36 and the second magnet 37 disappears, the second sliding plate 34 slides outward under the elastic force of the first spring 35, at this time, the cleaning cotton 38 can extend into the rectangular block 8 to touch the fan blade 10, and then the fan blade 10 is driven to rotate by the rotating shaft 9, so that the cleaning cotton 38 can clean the dust on the surface layer of the fan blade 10, after the cleaning is finished, the rotating plate 33 is rotated reversely until the rotating plate 33 is attached to the housing 1, and under the magnetic attraction between the first magnet 36 and the second magnet 37, the second sliding plate 34 slides toward the housing 1, and the first spring 35 starts to be compressed again;
s5, the first sliding plate 5 enters the housing 1 again until the rotation slot 23 is aligned with the circular through hole 22, and then the screw 24 is driven to rotate reversely by inserting the hexagonal screw into the hexagonal recess 26, at which time the nut block 27 slides toward the circular through hole 22, and the rectangular block 8 starts to slide toward the circular through hole 22 under the elastic force of the second spring 45 until the worm wheel 11 and the worm 12 touch each other, and then the worm 12 is slowly rotated until the worm 12 and the worm wheel 11 are re-engaged.
Finally, the above embodiments are only intended to illustrate the technical solutions of the present invention and not to limit the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions, and all of them should be covered by the claims of the present invention.
Claims (10)
1. A microelectronic chip heat dissipation device comprises a shell (1) and is characterized in that two symmetrical air inlet holes (2) are formed in the bottom of one side, away from each other, of the shell (1), a placing plate (3) located above the air inlet holes (2) is fixedly connected in the shell (1), a plurality of chips (4) are arranged at the top of the placing plate (3), a first sliding plate (5) located above the chips (4) is connected in the shell (1) in a sliding mode, a heat dissipation assembly used for dissipating heat of the chips (4) is arranged in the first sliding plate (5), a discharge assembly used for separately discharging heat dissipated by the chips (4) is arranged in the shell (1), a cleaning assembly used for cleaning the surface layers of the chips (4) is arranged at the bottom of the first sliding plate (5), a plurality of exhaust holes (6) are formed in the top of the shell (1), a rotating door (44) which is contacted with the first sliding plate (5) is rotatably connected in the shell (1).
2. The microelectronic chip heat dissipation device according to claim 1, wherein the heat dissipation assembly comprises a rectangular through hole (7) disposed in the first sliding plate (5), a rectangular block (8) is slidably connected in the rectangular through hole (7), a rotating shaft (9) is rotatably penetrated through the bottom of the rectangular block (8), a fan blade (10) located in the rectangular block (8) is fixedly connected to the top end of the rotating shaft (9), a worm wheel (11) is fixedly connected to the bottom end of the rotating shaft (9), a worm (12) engaged with the worm wheel (11) is rotatably connected in the housing (1) in a transverse direction, a first gear (14) is fixedly sleeved on the outer wall of the worm (12), a driving motor (13) is fixedly connected to one side of the housing (1), and an output shaft of the driving motor (13) penetrates through one side of the housing (1) and is fixedly connected to one end of the worm (12), the utility model discloses a novel motor casing, including rectangle through-hole (7), one side inner wall fixedly connected with a plurality of second springs (45) of rectangle through-hole (7), and the other end of a plurality of second springs (45) all with one side fixed connection of rectangular block (8), be equipped with in first slide (5) and rotate groove (23), it is connected with screw rod (24) to rotate through the fixed block in groove (23) to rotate, be equipped with in casing (1) and rotate circular through-hole (22) of the same centre of a circle of groove (23), it has nut piece (27) that touch with rectangular block (8) to rotate groove (23) sliding connection, and one end screw thread that circular through-hole (22) was kept away from in screw rod (24) runs through nut piece (27), the one end fixedly connected with plectane (25) of nut piece (27) are kept away from in screw rod (24), one side that screw rod (24) were kept away from in plectane (25) is equipped with hexagonal recess (26).
3. The microelectronic chip heat dissipation device according to claim 1, wherein the discharge assembly comprises a fixing rod (19) fixedly connected in the housing (1) in a transverse direction, the fixing rod (19) is located above the first sliding plate (5), the outer wall of the fixing rod (19) is rotatably sleeved with a guide plate (20) and a third gear (21), the inner wall of one side of the housing (1) is rotatably connected with a rotating shaft (15), the outer wall of the rotating shaft (15) is fixedly sleeved with a cam (16) and a second gear (17), the second gear (17) is engaged with the first gear (14), the inner wall of one side of the housing (1) is slidably connected with a first rack (18) engaged with the third gear (21), and the bottom end of the first rack (18) is slidably connected with the outer wall of the cam (16).
4. The microelectronic chip heat dissipation device according to claim 1, wherein the cleaning assembly comprises two symmetrical fixing plates (28) fixedly connected to the bottom of the first sliding plate (5), one side of the two fixing plates (28) close to each other is rotatably penetrated by a same rotating rod (29), one end of the rotating rod (29) is fixedly connected with a fourth gear (30), a second rack (31) meshed with the fourth gear (30) is fixedly connected to the inner wall of one side of the housing (1), and a rotating drum brush (32) touching the top of the chip (4) is fixedly sleeved on the outer wall of the rotating rod (29).
5. The microelectronic chip heat sink according to claim 1, characterized in that an air filter (39) is fixedly connected in the air inlet hole (2).
6. The microelectronic chip heat sink according to claim 1, characterized in that a plurality of conical holes (40) are provided in the placement plate (3).
7. The microelectronic chip heat sink according to claim 2, characterized in that a rubber layer (41) is fixedly attached to the nut block (27) on the side close to the rectangular block (8).
8. The microelectronic chip heat dissipation device according to claim 3, wherein a sliding rail (42) is fixedly sleeved on the outer wall of the cam (16), a rotating slider (43) is fixedly connected to the bottom end of the first rack (18), and the rotating slider (43) is slidably engaged with the sliding rail (42).
9. The microelectronic chip heat dissipation device according to claim 1, wherein a rotating plate (33) is rotatably connected to one side of the housing (1), a second sliding plate (34) is slidably connected to the rotating plate (33), a plurality of first springs (35) are fixedly connected to one side of the second sliding plate (34) close to the housing (1), the other ends of the plurality of first springs (35) are fixedly connected to an inner wall of one side of the rotating plate (33), a first magnet (36) penetrating through the rotating plate (33) is fixedly connected to one side of the second sliding plate (34) close to the housing (1), a second magnet (37) matched with the first magnet (36) is fixedly embedded to one side of the housing (1), and a cleaning cotton (38) is fixedly connected to one side of the second sliding plate (34) far away from the housing (1).
10. A heat dissipation method of a microelectronic chip heat dissipation device is characterized by comprising the following steps:
s1, a driving motor (13) is started to drive a worm (12) to rotate, the worm (12) is meshed with a worm wheel (11), the worm (12) drives the worm wheel (11), a rotating shaft (9) and fan blades (10) to rotate, then the fan blades (10) can upwards discharge hot air between a first sliding plate (5) and a placing plate (3), and outside air enters a shell (1) through an air inlet hole (2), so that heat on the surface layer of a chip (4) can be taken away, and the purpose of rapidly cooling the chip (4) is achieved;
s2, the worm (12) rotates to drive the first gear (14) to rotate, the first gear (14) is meshed with the second gear (17), the rotating shaft (15) and the cam (16) start to rotate, the first rack (18) starts to slide up and down in a reciprocating mode along with the rotation of the cam (16), the first rack (18) is meshed with the third gear (21), and when the fan blades (10) discharge hot air upwards, the hot air is discharged from the exhaust holes (6) in different directions through the reciprocating rotation of the guide plate (20);
s3, inserting a hexagonal screw into a hexagonal groove (26) through a circular through hole (22), driving a screw rod (24) to rotate through the hexagonal screw, enabling a nut block (27) to push a rectangular block (8) towards a second spring (45), enabling the second spring (45) to be compressed at the moment, enabling a worm (12) and a worm wheel (11) to be disengaged, taking away the hexagonal screw, rotating a rotating door (44) to pull a first sliding plate (5) outwards, and enabling a rotating rod (29) to start to rotate under the action of a second rack (31) and the fourth rack (30) due to the fact that the fourth gear (30) is engaged with the second rack (31) when the first sliding plate (5) moves outwards, and enabling the rotating drum brush (32) to clean dust on the surface layer of a chip (4);
s4, when the rectangular block (8) and the fan blades (10) are moved out of the shell (1), the rotating plate (33) is rotated anticlockwise, magnetic attraction force between the first magnet (36) and the second magnet (37) disappears, after magnetic force between the first magnet (36) and the second magnet (37) disappears, the second sliding plate (34) slides outwards under the elastic force action of the first spring (35), the cleaning cotton (38) can extend into the rectangular block (8) to be in contact with the fan blades (10), then the fan blades (10) are driven to rotate through the rotating shaft (9), and further the cleaning cotton (38) can clean dust on the surface layers of the fan blades (10);
s5, the first sliding plate (5) enters the shell (1) again until the rotating groove (23) is aligned with the circular through hole (22), then the first sliding plate is inserted into the hexagonal groove (26) through the hexagonal screw to drive the screw rod (24) to rotate reversely, at the moment, the nut block (27) slides towards the circular through hole (22), the rectangular block (8) starts to slide towards the circular through hole (22) under the action of the elastic force of the second spring (45) until the worm wheel (11) is contacted with the worm (12), and then the worm (12) is slowly rotated until the worm (12) is re-meshed with the worm wheel (11).
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|---|---|---|---|---|
| CN114256160A (en) * | 2022-02-28 | 2022-03-29 | 河南芯睿电子科技有限公司 | Packaging structure for power management chip |
| CN114421918A (en) * | 2022-03-31 | 2022-04-29 | 深圳新声半导体有限公司 | Bulk acoustic wave filter chip |
| CN114825766A (en) * | 2022-05-16 | 2022-07-29 | 湖南迎德祥机电科技有限公司 | Intelligent control motor with good temperature control function and machining device thereof |
Citations (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108832681A (en) * | 2018-06-26 | 2018-11-16 | 郑州格瑞塔电子信息技术有限公司 | A kind of use for electronic products has the charging cabinet of disinfection and sterilization |
| CN109285818A (en) * | 2018-11-20 | 2019-01-29 | 盐城盈信通科技有限公司 | A kind of heat dissipation of electronic chip device |
| CN209358920U (en) * | 2018-11-06 | 2019-09-06 | 安徽职业技术学院 | A kind of information engineering communication equipment heat dissipation dust-extraction unit |
| CN209570901U (en) * | 2019-05-05 | 2019-11-01 | 白阿宾 | A kind of radiator of Designing of Reinforced Computer |
| CN210781866U (en) * | 2019-09-05 | 2020-06-16 | 河南瑞驰电子科技有限公司 | Special converter heat abstractor of hoist |
| CN211352879U (en) * | 2019-11-04 | 2020-08-25 | 深圳市奥尔科技发展有限公司 | Dustproof heat dissipation device for electronic equipment |
| CN111584445A (en) * | 2020-06-02 | 2020-08-25 | 温州空云如电子科技有限公司 | Chip heat dissipation device with cleaning function |
| CN211406649U (en) * | 2019-08-07 | 2020-09-01 | 安徽维普电子科技有限公司 | Big dipper commander owner accuse machine |
| CN211481812U (en) * | 2020-02-26 | 2020-09-11 | 佛山市斯奈特能源电气科技有限公司 | Novel constant temperature solar inverter box |
| CN211720952U (en) * | 2020-01-14 | 2020-10-20 | 上海求彤控制电器有限公司 | Program-controlled control double-circuit band-type brake power supply with dustproof function |
| CN211982394U (en) * | 2020-05-14 | 2020-11-20 | 江西景泰路桥工程有限公司 | Highway tunnel electromechanical operation and maintenance management device |
| CN212013443U (en) * | 2020-06-24 | 2020-11-24 | 杭州莱约科技有限公司 | Data analysis terminal device |
| CN112135481A (en) * | 2020-09-15 | 2020-12-25 | 南京陇度凡电子商务有限公司 | New generation information technology switch heat dissipation mechanism |
| CN212278596U (en) * | 2020-06-16 | 2021-01-01 | 浙江中新电力工程建设有限公司 | Information processing device based on block chain |
| CN212487070U (en) * | 2020-07-30 | 2021-02-05 | 常州能辉自动化科技有限公司 | Comprehensive measuring instrument of electric equipment |
| CN112333991A (en) * | 2020-11-20 | 2021-02-05 | 上海霆亘电脑有限公司 | Heat dissipation equipment capable of realizing overvoltage protection of chip |
| CN212573337U (en) * | 2020-06-10 | 2021-02-19 | 盐城市荣翔机械科技有限公司 | Heater temperature regulation and control system |
| CN212846682U (en) * | 2020-08-14 | 2021-03-30 | 成都昱格电子科技有限公司 | Efficient stable server device |
| CN213187013U (en) * | 2020-09-18 | 2021-05-11 | 天津市赛安科技发展有限公司 | Intelligent voltage stabilizing device with dustproof function |
| CN213343143U (en) * | 2020-10-26 | 2021-06-01 | 常州诺冠自动化科技有限公司 | Automatic control device for regenerative oxidation furnace |
| CN213457938U (en) * | 2020-07-17 | 2021-06-15 | 林琳 | Computer power supply cooling fan |
| CN213522935U (en) * | 2020-12-16 | 2021-06-22 | 郑州恒吉信息技术有限公司 | Ethernet core switch heat dissipation case |
| CN213565700U (en) * | 2020-10-27 | 2021-06-29 | 重庆电子工程职业学院 | Intelligent internet automobile navigation device based on internet platform |
| CN113133284A (en) * | 2021-04-15 | 2021-07-16 | 滁州扬子热能设备科技有限公司 | Radiator convenient for cleaning ash |
| CN213802420U (en) * | 2020-05-07 | 2021-07-27 | 泉州市华思特电子科技有限公司 | Heat dissipation dust pelletizing system of platform customer end electrical components |
| CN213844045U (en) * | 2020-12-25 | 2021-07-30 | 西安智牛网络科技有限公司 | Computer host for network technology development |
| CN213880750U (en) * | 2020-12-29 | 2021-08-03 | 天津联盛辉煌智能科技有限公司 | Electrical control box with electrical control element not prone to thermal aging |
| CN213880769U (en) * | 2021-01-12 | 2021-08-03 | 安倩楠 | Heat radiator for computer communication computer lab |
| CN214011788U (en) * | 2020-11-16 | 2021-08-20 | 西安智悦达软件有限责任公司 | Hydraulic power plant flood-proof workshop alarm control system based on PLC |
| CN214046529U (en) * | 2021-01-22 | 2021-08-24 | 谢擎宇 | Cabinet for cloud computing data center |
-
2021
- 2021-08-30 CN CN202111002565.XA patent/CN113725177B/en active Active
Patent Citations (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108832681A (en) * | 2018-06-26 | 2018-11-16 | 郑州格瑞塔电子信息技术有限公司 | A kind of use for electronic products has the charging cabinet of disinfection and sterilization |
| CN209358920U (en) * | 2018-11-06 | 2019-09-06 | 安徽职业技术学院 | A kind of information engineering communication equipment heat dissipation dust-extraction unit |
| CN109285818A (en) * | 2018-11-20 | 2019-01-29 | 盐城盈信通科技有限公司 | A kind of heat dissipation of electronic chip device |
| CN209570901U (en) * | 2019-05-05 | 2019-11-01 | 白阿宾 | A kind of radiator of Designing of Reinforced Computer |
| CN211406649U (en) * | 2019-08-07 | 2020-09-01 | 安徽维普电子科技有限公司 | Big dipper commander owner accuse machine |
| CN210781866U (en) * | 2019-09-05 | 2020-06-16 | 河南瑞驰电子科技有限公司 | Special converter heat abstractor of hoist |
| CN211352879U (en) * | 2019-11-04 | 2020-08-25 | 深圳市奥尔科技发展有限公司 | Dustproof heat dissipation device for electronic equipment |
| CN211720952U (en) * | 2020-01-14 | 2020-10-20 | 上海求彤控制电器有限公司 | Program-controlled control double-circuit band-type brake power supply with dustproof function |
| CN211481812U (en) * | 2020-02-26 | 2020-09-11 | 佛山市斯奈特能源电气科技有限公司 | Novel constant temperature solar inverter box |
| CN213802420U (en) * | 2020-05-07 | 2021-07-27 | 泉州市华思特电子科技有限公司 | Heat dissipation dust pelletizing system of platform customer end electrical components |
| CN211982394U (en) * | 2020-05-14 | 2020-11-20 | 江西景泰路桥工程有限公司 | Highway tunnel electromechanical operation and maintenance management device |
| CN111584445A (en) * | 2020-06-02 | 2020-08-25 | 温州空云如电子科技有限公司 | Chip heat dissipation device with cleaning function |
| CN212573337U (en) * | 2020-06-10 | 2021-02-19 | 盐城市荣翔机械科技有限公司 | Heater temperature regulation and control system |
| CN212278596U (en) * | 2020-06-16 | 2021-01-01 | 浙江中新电力工程建设有限公司 | Information processing device based on block chain |
| CN212013443U (en) * | 2020-06-24 | 2020-11-24 | 杭州莱约科技有限公司 | Data analysis terminal device |
| CN213457938U (en) * | 2020-07-17 | 2021-06-15 | 林琳 | Computer power supply cooling fan |
| CN212487070U (en) * | 2020-07-30 | 2021-02-05 | 常州能辉自动化科技有限公司 | Comprehensive measuring instrument of electric equipment |
| CN212846682U (en) * | 2020-08-14 | 2021-03-30 | 成都昱格电子科技有限公司 | Efficient stable server device |
| CN112135481A (en) * | 2020-09-15 | 2020-12-25 | 南京陇度凡电子商务有限公司 | New generation information technology switch heat dissipation mechanism |
| CN213187013U (en) * | 2020-09-18 | 2021-05-11 | 天津市赛安科技发展有限公司 | Intelligent voltage stabilizing device with dustproof function |
| CN213343143U (en) * | 2020-10-26 | 2021-06-01 | 常州诺冠自动化科技有限公司 | Automatic control device for regenerative oxidation furnace |
| CN213565700U (en) * | 2020-10-27 | 2021-06-29 | 重庆电子工程职业学院 | Intelligent internet automobile navigation device based on internet platform |
| CN214011788U (en) * | 2020-11-16 | 2021-08-20 | 西安智悦达软件有限责任公司 | Hydraulic power plant flood-proof workshop alarm control system based on PLC |
| CN112333991A (en) * | 2020-11-20 | 2021-02-05 | 上海霆亘电脑有限公司 | Heat dissipation equipment capable of realizing overvoltage protection of chip |
| CN213522935U (en) * | 2020-12-16 | 2021-06-22 | 郑州恒吉信息技术有限公司 | Ethernet core switch heat dissipation case |
| CN213844045U (en) * | 2020-12-25 | 2021-07-30 | 西安智牛网络科技有限公司 | Computer host for network technology development |
| CN213880750U (en) * | 2020-12-29 | 2021-08-03 | 天津联盛辉煌智能科技有限公司 | Electrical control box with electrical control element not prone to thermal aging |
| CN213880769U (en) * | 2021-01-12 | 2021-08-03 | 安倩楠 | Heat radiator for computer communication computer lab |
| CN214046529U (en) * | 2021-01-22 | 2021-08-24 | 谢擎宇 | Cabinet for cloud computing data center |
| CN113133284A (en) * | 2021-04-15 | 2021-07-16 | 滁州扬子热能设备科技有限公司 | Radiator convenient for cleaning ash |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256160A (en) * | 2022-02-28 | 2022-03-29 | 河南芯睿电子科技有限公司 | Packaging structure for power management chip |
| CN114256160B (en) * | 2022-02-28 | 2022-05-20 | 河南芯睿电子科技有限公司 | Packaging structure for power management chip |
| CN114421918A (en) * | 2022-03-31 | 2022-04-29 | 深圳新声半导体有限公司 | Bulk acoustic wave filter chip |
| CN114421918B (en) * | 2022-03-31 | 2022-06-21 | 深圳新声半导体有限公司 | Bulk acoustic wave filter chip |
| CN114825766A (en) * | 2022-05-16 | 2022-07-29 | 湖南迎德祥机电科技有限公司 | Intelligent control motor with good temperature control function and machining device thereof |
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| CN113725177B (en) | 2023-10-03 |
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