CN113725126B - Integrated circuit packaging wire bonding system and method thereof - Google Patents
Integrated circuit packaging wire bonding system and method thereof Download PDFInfo
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- CN113725126B CN113725126B CN202111019216.9A CN202111019216A CN113725126B CN 113725126 B CN113725126 B CN 113725126B CN 202111019216 A CN202111019216 A CN 202111019216A CN 113725126 B CN113725126 B CN 113725126B
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 141
- 230000001681 protective effect Effects 0.000 claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 23
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 238000003860 storage Methods 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 10
- 239000006023 eutectic alloy Substances 0.000 claims description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 7
- 239000001569 carbon dioxide Substances 0.000 claims description 7
- 230000001012 protector Effects 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses an integrated circuit packaging wire bonding system and a method thereof, and the integrated circuit packaging wire bonding system comprises welding equipment, wherein the welding equipment mainly comprises a clamp, a high-voltage discharge device and a gas generating device, the high-voltage discharge device comprises a lead reel and a high-voltage discharger which are arranged on the high-voltage discharge device, the lead reel is connected with the high-voltage discharger, the gas generating device also comprises a guide pipe and a protective gas acting device, a thin pipe is arranged in the protective gas acting device, and a ceramic pipe is fixedly arranged at the tail end of the thin pipe in the protective gas acting device. Thereby the stress at the bottom of the welding spot of the chip is more uniform.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a wire bonding system and a wire bonding method for integrated circuit packaging.
Background
In the field of conventional semiconductor integrated circuit production (subsequent packaging), the bonding of chips is generally accomplished by an ultrasonic welding process. The process flow is briefly described as follows: the frame substrate, the chip and the bonding wires are arranged at the designed positions of the frame substrate, the chip and the bonding wires for assembly, then the assembled product is fixed on a welding fixture, the fixture with the product fixed is sent into a track for ultrasonic welding, protective gas is filled in the process, then welding is started, and after the welding procedure is finished, the track is opened to send out the product.
In order to avoid oxidation after the chip welding is finished, the used welding wire is usually smaller than the welding point of the chip, and the frame around the chip is easy to extrude aluminum in the welding process; in addition, in the alloy welding process, the ball burning mode is different from that of a palladium copper wire and that of a copper ball, and in the process, the preheating function is not provided, and the rapid cooling of shielding gas causes rapid hardening of the welding wire ball; the solder ball thus tends to overflow in one direction along the edge of the ball, thereby forming cracks under the solder joint.
Disclosure of Invention
The invention provides a system and a method for packaging and bonding wires of an integrated circuit, aiming at overcoming the defects of the prior art that cracks are easy to generate and the production cost is increased due to large ball burning of the bonding wires. The integrated circuit packaging bonding wire system and the method thereof can solve the problem of cracks caused by contact of a welding ball with a high-temperature chip at normal temperature, have better isotropy, and ensure that the welding ball is uniformly distributed on the edge of a power ring on a welding point of the chip, the welding point is small and the cost is reduced because the welding ball is preheated shielding gas before the welding wire ball is formed in the welding process so as to ensure that the high-temperature gas flowing to the chip is arranged in each direction of the welding system.
In order to achieve the purpose, the invention provides the following technical scheme: an integrated circuit package wire bonding system and method thereof, comprising:
the chip or circuit board fixing device comprises a base plate, a clamping table and a fixing device, wherein the clamping table is used for fixing a chip or a circuit board;
the side plate is provided with a lifting mechanism;
the high-voltage discharge device is mounted on the front wall of the side plate, and an output end of the high-voltage discharge device is provided with an output line body;
the mounting table is fixedly connected with the front wall of the side plate, a protective gas storage tank is mounted on the mounting table, a guide pipe is mounted and connected on the protective gas storage tank, and an electromagnetic valve is arranged at the input end of the guide pipe;
the welding wire main body is arranged in front of the side plate and connected with the lifting mechanism, a protective gas acting bin is arranged at the bottom of the welding wire main body, and the protective gas acting bin is communicated with the guide pipe through an output line body;
the substrate and the bonding wire ball are also included; a carbon dioxide protective gas layer is arranged between the substrate and the bonding wire ball, the bonding wire ball is arranged at the top of the substrate, mutually opposite alumina is arranged at the joint of the bonding wire ball and the substrate, and eutectic alloy is arranged on the upper surface of the alumina.
Based on the above, the clamping table can be used for clamping and fixing the chip tube base, and the lifting mechanism is used for lifting the welding wire main body so as to control the height of the welding wire main body, and high-temperature gas generated by the high-voltage discharge device can enable the high-temperature gas flowing to the chip to be arranged in all directions of the welding system, so that the edges of the power rings of the welding balls on the welding spots of the chip are uniformly distributed.
Preferably, the clamping table comprises a first convex block and a second convex block, the first convex block and the second convex block are arranged in parallel, the first convex block and the upper surface of the clamping table are integrally formed, an opening on the side wall of the first convex block is movably connected with at least two parallel pull rods, a fixed plate is fixedly mounted on the outer wall of one side, close to the second convex block, of each pull rod, a pull plate is fixedly mounted at the other end of each pull rod, a return spring is sleeved on the outer wall of each pull rod, and the return spring is arranged between the fixed plate and the first convex block;
the second lug is close to being opposite form on the lateral wall of first lug and has seted up the second spout, the side of second lug is equipped with the removal clamp splice, two remove the equal sliding connection second spout of clamp splice, second positioning bolt is installed to the top trompil of second lug, second positioning bolt's bottom extends to in the inner chamber of second spout and the butt remove the tip of clamp splice, two all install electric putter on the adjacent lateral wall of removal clamp splice, two fixed mounting has the fixed block between the electric putter, the lateral wall of fixed block fixed connection second lug.
Based on the above, electric putter can realize the regulation work to two removal clamp splice front and back positions to with pull rod and reset spring's combined action, can realize carrying out centre gripping fixed operation to chip tube base or great circuit board, improved the suitability of this anchor clamps to different chips or circuit boards simultaneously.
Preferably, the top of the clamping table is provided with at least two parallel first sliding grooves, the bottom end of the second bump is provided with a sliding block matched with the first sliding grooves, a hole in the top of the second bump is provided with a first positioning bolt, and the bottom end of the first positioning bolt extends to the bottom of the inner cavity of the first sliding grooves.
Based on the above, the left and right positions of the second convex block can be adjusted, and the using effect and the adjusting range of the clamping table are further improved.
Preferably, the fixing device further comprises a reserved separating baffle, the side wall of the fixing block, which is far away from the second bump, is provided with an insertion hole, the side wall of the reserved separating baffle is integrally formed with an insertion block matched with the insertion hole of the fixing block, and the reserved separating baffle is detachably connected with the fixing block;
two remove the clamp splice and be horizontal "7" word form setting, and two remove a lateral wall that the clamp splice is adjacent, reserve the both sides wall of separating the baffle and the fixed plate all is equipped with the slipmat on being close to a lateral wall of second lug.
Based on the aforesaid, reserve and separate the baffle and can dismantle the connection fixed block, can separate into two bonding wire stations with this clamp stand front and back, improved bonding wire work efficiency, and the overall structure that removes clamp splice, fixed plate sets up rationally, whole clamping structure is stable, and anti-skidding effect is good.
Preferably, the lifting mechanism comprises a screw rod lifter and a lifting table board;
the lead screw lifter is fixedly installed on the front wall of the side plate, an output lead screw is installed on the lead screw lifter, the lifting table top is provided with a hole and is fixedly provided with a lead screw guide sleeve matched with the output lead screw, a vertical guide groove is formed in the wall of the side plate, and the lifting table top is in sliding connection with the guide groove.
Based on the above, lead screw lift and transmission structure among the elevating system set up rationally, can realize the lift operation to the bonding wire main part, have fine altitude mixture control function, and the suitability can further improvement.
Preferably, the lifting table is provided with a hole and is movably connected with a guide rod, and the guide rod and the output screw rod are arranged in the same horizontal line and are arranged in parallel with the side plates.
Based on the aforesaid, through the setting of guide arm, further improvement lift mesa and bonding wire main part carry out the stability of altitude mixture control during operation, be favorable to carrying out the bonding wire operation.
Preferably, be equipped with the working tube in the protection gas effect storehouse, the ceramic pipe of toper form is installed to the bottom of working tube, the top of working tube extends protection gas effect storehouse and fixed mounting has the feeder pipe, and the outer wall of working tube installs the protector, the inner wall of feeder pipe is equipped with acid-resistant coating.
Based on the above, the electric body that high-voltage discharge device sent, accessible output line body to protective gas act on in the working tube in the storehouse to make the ceramic pipe produce high temperature, heatable protective gas, output voltage, the electric current of protector stable output line body, make welding system's all directions all have the high-temperature gas of flow direction chip.
Preferably, the device comprises a substrate and a bonding wire ball;
the carbon dioxide protective gas layer of protective gas storage jar output is equipped with to the below of base plate, the top of base plate is located to the bonding wire ball, the junction of bonding wire ball and base plate is equipped with the aluminium oxide that opposes each other, the upper surface of aluminium oxide is equipped with eutectic alloy.
Based on the above, a carbon dioxide protective gas layer is arranged between the substrate and the bonding wire ball, so that a good protection operation can be performed during wire bonding, the protective gas can be preheated, the problem of cracks caused by contact between the solder ball and a high-temperature chip at normal temperature can be solved, and the bonding wire ball has good isotropy;
the aluminum oxide improves the bonding wire connection effect, and the eutectic alloy welding has the advantages of high heat conductivity, small resistance, fast heat transfer, strong reliability and large shearing force after bonding, is suitable for interconnection of a chip and a substrate in a high-frequency and high-power device and interconnection of the substrate and a tube shell, and has good heat dissipation effect when eutectic welding is adopted for a power device with higher heat dissipation requirement.
Preferably, the method comprises the following operation methods:
placing a tube base and a chip, namely firstly placing the tube base on a clamping table, pulling a pull rod, placing the tube base between the two movable clamping blocks and a fixed plate through resetting of the pull rod, clamping and fixing the tube base, then placing the chip at the corresponding position of the tube base, then placing the chip under a solder wire, and putting down a solder ball;
opening the protective gas storage tank through a control electromagnetic valve, starting preheating the welding wire main body, enabling the protective gas to pass through a guide pipe to the welding wire main body, and enabling the protective gas to enter a protective gas action bin at the bottom of the welding wire main body after preheating;
moving the welding part of the welding wire main body downwards, pressing the welding wire ball downwards to enable the welding wire ball to vibrate left and right, and simultaneously placing aluminum oxide thin plates and eutectic alloy on two sides of the welding wire ball in sequence;
and step four, finally, entering a wire welding procedure, opening the high-voltage discharge device, enabling the output wire body to carry the high-voltage body to the ceramic tube at the tail end, generating high temperature, welding the chip, the wire welding ball and the substrate, ending the welding procedure, opening the fixing plate, taking out the product, and completing welding.
Based on the above, the operation method can reduce the generation of welding line cracks, thereby saving the cost and ensuring that the welding of the welding points of the chip is firmer.
Preferably, the preheating gas is started before the solder is burnt, and the temperature of the preheating gas is set at 150-200 ℃;
the temperature control of the welding procedure is as follows: at the initial stage of the welding procedure, the temperature is controlled to be slightly lower than that of the welding wire clamp after the temperature rises; after welding is started, the temperature is continuously increased to 30 ℃ when the temperature of the welding wire clamp is increased, and the temperature is continuously unchanged in the welding wire process so as to ensure that the anti-welding wire ball is not rapidly cooled and hardened; and after the wire ball to be welded is contacted with the welding point and welding is finished, finishing welding the product and finishing the welding procedure.
Based on the above, the high-temperature protective gas is opened in the ball burning stage, and the chip is welded at the same temperature as the solder balls, so that the isotropy of the welding system is better, and the stress at the bottom of the welding point of the chip is more uniform. The method is suitable for welding chips in the production process of semiconductor integrated circuits.
Compared with the prior art, the invention has the beneficial effects that:
the invention can solve the problem of cracks caused by the contact of the solder balls with the high-temperature chip at normal temperature, thereby saving the cost and ensuring that the welding of the welding points of the chip is more firm; mainly through stable, adjustable clamp stand setting, its bonding wire equipment can carry out the regulation of height, take simultaneously to carry out pushing down in the ball burning stage, and carry out the vibration about pressure, and the shielding gas after the solder ball begins to preheat before forming, make welding system's all directions all have the high-temperature gas of flow direction chip, thereby guarantee the marginal evenly distributed of solder ball power ring on the chip solder joint, adopt the chip to weld under the same temperature with the solder ball, make welding system's isotropy better, thereby make the atress of chip solder joint bottom more even, be applicable to the welding of semiconductor integrated circuit production (back packaging) in-process chip.
Drawings
FIG. 1 is a schematic view of a welding apparatus according to the present invention;
FIG. 2 is a schematic view of a clamping table according to the present invention;
FIG. 3 is an enlarged view of the invention at A of FIG. 1;
FIG. 4 is an enlarged view taken at B of FIG. 2 in accordance with the present invention;
FIG. 5 is a shielding gas effect housing of the present invention;
FIG. 6 is a schematic view of a wire bond package mounting structure according to the present invention;
fig. 7 is a flow chart of a wire bonding method for packaging an integrated circuit according to the present invention.
The reference numbers in the figures:
1. a base plate;
100. a clamping table; 101. a first bump; 102. a pull rod; 103. a fixing plate; 104. a first chute; 105. a second bump; 106. a first positioning bolt; 107. a second chute; 108. a second positioning bolt; 109. a fixed block; 110. reserving a separation baffle; 111. an electric push rod; 112. moving the clamping block; 113. a return spring;
2. a side plate;
200. a lifting mechanism; 201. a screw rod lifter; 202. an output screw rod; 203. lifting the table top; 204. a guide groove; 205. a guide bar;
3. a high voltage discharge device; 31. outputting a line body;
4. a mounting table; 401. a shielding gas storage tank; 402. an electromagnetic valve; 403. a conduit;
5. a wire bonding body; 51. a protective gas acting bin; 52. a working pipe; 53. a ceramic tube; 54. a protector; 55. a feed pipe; 56. acid-resistant coating;
6. a substrate; 61. a carbon dioxide protective gas layer; 62. alumina; 63. eutectic alloy; 64. and a wire ball.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: comprises a bottom plate 1, wherein a clamping table 100 for fixing a chip or a circuit board is arranged on the bottom plate 1; the side plate 2 is provided with a lifting mechanism 200; the high-voltage discharge device 3 is arranged on the front wall of the side plate 3, and an output end of the high-voltage discharge device 3 is provided with an output line body 31; the mounting table 4 is fixedly connected with the front wall of the side plate 2, a shielding gas storage tank 401 is mounted on the mounting table 4, the shielding gas storage tank 401 is mounted and connected with a guide pipe 403, and an electromagnetic valve 402 is arranged at the input end of the guide pipe 403; the welding wire main body 5 is installed in front of the side plate 2 and connected with the lifting mechanism 200, a protective gas action bin 51 is arranged at the bottom of the welding wire main body 5, and the protective gas action bin 51 is communicated with the tail end of the guide pipe 403 through the output wire body 31.
Based on the above, the clamping table 100 can be used for clamping and fixing the chip tube base, and the lifting mechanism 200 is used for lifting the bonding wire main body 5 so as to control the height of the bonding wire main body 5, and the high-temperature gas generated by the high-voltage discharge device 3 can enable the high-temperature gas flowing to the chip to be arranged in each direction of the welding system, thereby ensuring that the edges of the power ring of the welding balls on the welding spots of the chip are uniformly distributed.
Referring to fig. 2 and 4, specifically, the clamping table 100 includes a first bump 101 and a second bump 105, the first bump 101 and the second bump 105 are arranged in parallel, the first bump 101 and the upper surface of the clamping table 100 are integrally formed, an opening on a side wall of the first bump 101 is movably connected with at least two parallel pull rods 102, a fixing plate 103 is fixedly installed on an outer wall of one side of each pull rod 102 close to the second bump 105, a pull plate is fixedly installed at the other end of each pull rod 102, a return spring 113 is sleeved on an outer wall of each pull rod 102, and the return spring 113 is installed between the fixing plate 103 and the first bump 101; second lug 105 is close to and is provided with second spout 107 on the lateral wall of first lug 101 opposite form, second lug 105's side is equipped with removal clamp splice 112, two equal sliding connection second spouts 107 of removal clamp splice 112, second positioning bolt 108 is installed in the top trompil of second lug 105, the bottom of second positioning bolt 108 extends to in the inner chamber of second spout 107 and the tip of butt removal clamp splice 112, all install electric putter 111 on two adjacent lateral walls of removal clamp splice 112, fixed mounting has fixed block 109 between two electric putter 111, fixed block 109 fixed connection second lug 105's lateral wall.
Based on the above, the electric push rod 111 can adjust the front and rear positions of the two movable clamping blocks 112, and under the combined action of the pull rod 102 and the return spring 113, the electric push rod can clamp and fix a chip tube base or a larger circuit board, and meanwhile, the applicability of the clamp to different chips or circuit boards is improved.
Further, the top of the clamping table 100 is provided with at least two parallel first sliding grooves 104, the bottom end of the second bump 105 is provided with a sliding block matched with the first sliding grooves 104, the top of the second bump 105 is provided with a hole and provided with a first positioning bolt 106, and the bottom end of the first positioning bolt 106 extends to the bottom of the inner cavity of the first sliding groove 104.
Based on the above, the second protrusion 105 can slide on the clamping platform 100 transversely, and correspondingly increases or decreases the distance between the two movable clamping blocks 112 and the fixing plate 103, so that the left and right positions of the second protrusion 105 can be adjusted, and the use effect, stability and adjustment range of the clamping platform 100 are further improved.
Preferably, the fixing device further comprises a reserved separating baffle 110, an insertion hole is formed in the side wall, far away from the second bump 105, of the fixing block 109, an insertion block matched with the insertion hole of the fixing block 109 is integrally formed in the side wall of the reserved separating baffle 110, and the reserved separating baffle 110 is detachably connected with the fixing block 109; the two movable clamping blocks 112 are arranged in a transverse 7 shape, and anti-slip pads are arranged on one side wall adjacent to the two movable clamping blocks 112, two side walls reserved for the separation baffle 110 and one side wall of the fixing plate 103 close to the second bump 105.
Referring to fig. 1 and 3, based on the above, the reserved separation baffle 110 is detachably connected to the fixing block 109, and the clamped components can be increased or decreased, so that the clamping table 100 can be divided into two welding wire stations in front and back, which is suitable for clamping and fixing smaller workpieces, can work in double stations, improves the welding wire work efficiency, and has reasonable overall structure arrangement of the movable clamping block 112 and the fixing plate 103, stable overall clamping structure, and good anti-skid effect.
Specifically, the lifting mechanism 200 comprises a screw rod lifter 201 and a lifting table 203;
the screw rod lifter 201 is fixedly arranged on the front wall of the side plate 2, an output screw rod 202 is arranged on the screw rod lifter 201, a lifting table top 203 is provided with a hole and is fixedly provided with a screw rod guide sleeve matched with the output screw rod 202, a vertical guide groove 204 is formed in the wall of the side plate 2, and the lifting table top 203 is connected with the guide groove 204 in a sliding mode.
Based on the above, lead screw lift 201 and the transmission structure among elevating system 200 set up rationally, can realize the lift operation to bonding wire main part 5 for bonding wire main part 5 has fine height control function, and the suitability can further improve, and when can producing decurrent pressure, rocks about going on, has improved welding effect.
Preferably, the lifting table 203 is provided with an opening and movably connected with a guide rod 205, and the guide rod 205 and the output screw rod 202 are arranged along the same horizontal line and are arranged in parallel with the side plate 2. Through the setting of guide arm 205, further improved lift mesa 203 and bonding wire main part 5 and carried out the stability of height control during operation, be favorable to carrying out the bonding wire operation.
Referring to fig. 5, specifically, a working tube 52 is disposed in the shielding gas effect chamber 51, a conical ceramic tube 53 is mounted at the bottom end of the working tube 52, the top of the working tube 52 extends out of the shielding gas effect chamber 51 and is fixedly mounted with a feeding tube 55, a protector 54 is mounted on the outer wall of the working tube 52, and an acid-resistant coating 56 is disposed on the inner wall of the feeding tube 55.
Based on the above, the electric body emitted from the high-voltage discharge device 3 can pass through the output line body 31 to the working tube 52 in the protective gas acting chamber 51, and the ceramic tube 53 generates high temperature, which can heat the protective gas, and the protector 54 stabilizes the output voltage and current of the output line body 31, so that the welding system has high-temperature gas flowing to the chip in all directions.
Referring to fig. 6, a wire bonding structure of a wire bonding system for integrated circuit package includes a substrate 6 and a wire ball 64; a carbon dioxide protective gas layer 61 output by a protective gas storage tank 401 is arranged below the substrate 6, a bonding wire ball 64 is arranged at the top of the substrate 6, alumina 62 opposite to each other is arranged at the joint of the bonding wire ball 64 and the substrate 6, and eutectic alloy 63 is arranged on the upper surface of the alumina 62.
A carbon dioxide protective gas layer 61 is arranged between the substrate 6 and the bonding wire balls 64 through the lower part of the substrate, so that a good protection work can be realized during wire bonding, the protective gas can be preheated, the problem of cracks caused by the contact of the bonding balls with a high-temperature chip at normal temperature can be solved, and the isotropy is good; the aluminum oxide 62 improves the bonding effect of the bonding wire, and the eutectic alloy 63 has the advantages of high thermal conductivity, small resistance, fast heat transfer, strong reliability and large shearing force after bonding, is suitable for interconnection of a chip and a substrate in a high-frequency and high-power device and interconnection of the substrate and a tube shell, and has good heat dissipation effect when eutectic welding is adopted for a power device with higher heat dissipation requirement.
Referring to fig. 7, the packaging method of the wire bonding system for integrated circuit package is as follows:
placing a tube base and a chip, namely firstly placing the tube base on a clamping table 100, pulling a pull rod 102, placing the tube base between two movable clamping blocks 112 and a fixed plate 103 through resetting of the pull rod 102, clamping and fixing, then placing the chip at a corresponding position of the tube base, then placing the chip right below a solder wire, and putting down a solder ball 64;
step two, protective gas is started, a protective gas storage tank 401 is opened through a control electromagnetic valve 402, preheating of the welding wire main body 5 is started, so that the protective gas flows into the welding wire main body 5 through a guide pipe 403, and enters a protective gas action bin 51 at the bottom of the welding wire main body 5 after preheating;
thirdly, oscillating left and right of the pressure, moving the welding part of the welding wire main body 5 downwards, pressing the welding wire ball 64 downwards to enable the welding wire ball 64 to oscillate left and right, and simultaneously placing aluminum oxide 62 sheets and eutectic alloy 63 on two sides of the welding wire ball 64 in sequence;
and step four, finally, entering a wire welding procedure, opening the high-voltage discharge device 3, enabling the output wire body 31 to carry the high-voltage body to the ceramic tube 53 at the tail end, generating high temperature, welding the chip, the wire welding ball 64 and the substrate 6, ending the welding procedure, opening the fixing plate 103, taking out the product, and completing the welding.
According to the welding operation method of the tube base and the chip in the embodiment, the generation of cracks of the welding line can be reduced, so that the cost is saved, and the welding of the welding point of the chip is firmer.
Further, the preheating gas is started before the solder is used for ball burning, and the temperature of the preheating gas is set at 150-; the IMC detection area after wire bonding is about 80-90% of the area of the welding spot of the chip; the temperature control of the welding procedure was as follows: at the initial stage of the welding procedure, the temperature is controlled to be slightly lower than that of the welding wire clamp after the temperature rises; after welding is started, the temperature is continuously increased to 30 ℃ when the temperature of the welding wire clamp is increased, and the temperature is continuously unchanged in the welding wire process so as to ensure that the solder ball is not rapidly cooled and hardened; and after the wire ball 1 to be welded is contacted with the welding point and welding is finished, the product is welded, and the welding procedure is finished.
High-temperature protective gas is opened in the ball burning stage, and the chip is welded at the same temperature as the solder balls, so that the isotropy of a welding system is better, and the stress at the bottoms of the welding points of the chip is more uniform. The method is suitable for welding the chip in the subsequent packaging process of semiconductor integrated circuit production.
It should be noted that: the invention adopts two important measures to improve the chip welding process: the method is used for solving the problem of cracks caused by contact of the solder balls with a high-temperature chip at normal temperature. Secondly, in order to ensure that the alloy welding system has better isotropy, in the welding process, the preheated protective gas is started before the welding wire ball is formed, so that high-temperature gas flowing to the chip is arranged in each direction of the welding system, and the welding balls are uniformly distributed on the edge of the power ring on the welding point of the chip. Because the existing welding equipment has the automatic temperature compensation function, the high-temperature gas is opened in the stage before the welding line, so that the deviation of the welding ball of the alloy line can not be caused. In production practice, the method can be successfully used in the chip assembly process in the semiconductor integrated circuit production (subsequent packaging).
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An integrated circuit package wire bonding system, comprising: the method comprises the following steps:
the chip or circuit board fixing clamp comprises a base plate (1), wherein a clamp table (100) for fixing a chip or a circuit board is installed on the base plate (1), the clamp table (100) comprises a first bump (101) and a second bump (105), the first bump (101) and the second bump (105) are arranged in parallel, the first bump (101) and the upper surface of the clamp table (100) are integrally formed, at least two parallel pull rods (102) are movably connected to a side wall opening of the first bump (101), a fixing plate (103) is fixedly installed on the outer wall of one side, close to the second bump (105), of each pull rod (102), a pull plate is fixedly installed at the other end of each pull rod, a reset spring (113) is sleeved on the outer wall of each pull rod (102), and the reset springs (113) are arranged between the fixing plate (103) and the first bump (101); the second lug (105) is close to and is opposite on the lateral wall of first lug (101) and seted up second spout (107), the side of second lug (105) is equipped with removal clamp splice (112), two remove equal sliding connection second spout (107) of clamp splice (112), second positioning bolt (108) are installed to the top trompil of second lug (105), the bottom of second positioning bolt (108) extends to in the inner chamber of second spout (107) and the tip of butt removal clamp splice (112), two all install electric putter (111) on the lateral wall that removes clamp splice (112) adjacent, two fixed block (109) have between electric putter (111), the lateral wall of fixed block (109) fixed connection second lug (105), the first spout (104) of two at least parallel forms are seted up at the top of clamp platform (100), a sliding block matched with the first sliding groove (104) is installed at the bottom end of the second bump (105), a first positioning bolt (106) is installed on an opening at the top of the second bump (105), and the bottom end of the first positioning bolt (106) extends to the bottom of an inner cavity of the first sliding groove (104);
the side plate (2), the said side plate (2) is equipped with the lifting gearing (200);
the high-voltage discharging device (3) is mounted on the front wall of the side plate (2), and an output end of the high-voltage discharging device (3) is provided with an output line body (31);
the protective gas storage device comprises a mounting table (4), wherein the mounting table (4) is fixedly connected with the front wall of the side plate (2), a protective gas storage tank (401) is mounted on the mounting table (4), a guide pipe (403) is mounted and connected on the protective gas storage tank (401), and an electromagnetic valve (402) is arranged at the input end of the guide pipe (403);
the welding wire main body (5) is installed in front of the side plate (2) and connected with the lifting mechanism (200), a protective gas action bin (51) is arranged at the bottom of the welding wire main body (5), and the protective gas action bin (51) is communicated with the guide pipe (403) through an output wire body (31);
the device also comprises a substrate (6) and a bonding wire ball (64); a carbon dioxide protective gas layer (61) is arranged between the substrate (6) and the bonding wire ball (64), the bonding wire ball (64) is arranged at the top of the substrate (6), mutually opposite aluminum oxide (62) is arranged at the joint of the bonding wire ball (64) and the substrate (6), and eutectic alloy (63) is arranged on the upper surface of the aluminum oxide (62).
2. The system of claim 1, wherein: the fixing block (109) is provided with a jack on the side wall far away from the second bump (105), the side wall of the reserved separating baffle (110) is integrally formed with an inserting block matched with the jack of the fixing block (109), and the reserved separating baffle (110) is detachably connected with the fixing block (109);
the two movable clamping blocks (112) are arranged in a transverse 7 shape, and anti-skid pads are arranged on one side wall adjacent to the two movable clamping blocks (112), two side walls of the reserved separating baffle (110) and one side wall, close to the second bump (105), of the fixing plate (103).
3. The system of claim 1, wherein: the lifting mechanism (200) comprises a screw rod lifter (201) and a lifting table top (203);
screw rod lift (201) fixed mounting is on the antetheca of curb plate (2), and installs output lead screw (202) on screw rod lift (201), lift mesa (203) trompil and fixed mounting have with output lead screw (202) the screw rod guide pin bushing that matches, set up vertical form guide slot (204) on curb plate (2) wall, lift mesa (203) sliding connection guide slot (204).
4. The system of claim 3, wherein: the lifting table top (203) is provided with a hole and is movably connected with a guide rod (205), and the guide rod (205) and the output screw rod (202) are arranged in the same horizontal line and are arranged in parallel with the side plate (2).
5. The system of claim 1, wherein: be equipped with working tube (52) in protection gas action storehouse (51), ceramic pipe (53) of toper form are installed to the bottom of working tube (52), protection gas action storehouse (51) and fixed mounting have feeding pipe (55) are extended to the top of working tube (52), and the outer wall of working tube (52) installs protector (54), the inner wall of feeding pipe (55) is equipped with acid-resistant coating (56).
6. The method of any one of claims 1-5, comprising the steps of:
firstly, placing a tube base and a chip, namely, firstly placing the tube base on a clamping table (100), pulling a pull rod (102), placing the tube base between two movable clamping blocks (112) and a fixed plate (103) through resetting of the pull rod (102), clamping and fixing, then placing the chip at the corresponding position of the tube base, then placing the chip under a solder wire, and putting down a solder ball (64);
step two, opening the protective gas storage tank (401) through a control electromagnetic valve (402), starting preheating the welding wire main body (5), enabling the protective gas to pass through a guide pipe (403) to enter the welding wire main body (5), and entering a protective gas acting bin (51) at the bottom of the welding wire main body (5) after preheating;
moving the welding part of the welding wire main body (5) downwards, pressing the welding wire ball (64) downwards to enable the welding wire ball (64) to vibrate left and right, and simultaneously placing aluminum oxide (62) sheets and eutectic alloy (63) on two sides of the welding wire ball (64) in sequence;
and step four, finally, entering a wire welding procedure, opening the high-voltage discharge device (3) to enable the output wire body (31) to carry the high-voltage body to the ceramic tube (53) at the tail end, generating high temperature to weld the chip, the wire welding ball (64) and the substrate (6), opening the fixing plate (103) after the welding procedure is finished, taking out the product, and completing welding.
7. The method of claim 6, wherein the bonding wire system comprises: the preheating gas is started before the solder balls are burned, and the temperature of the preheating gas is set at 150-200 ℃;
the temperature control of the welding procedure is as follows: at the initial stage of the welding procedure, the temperature is controlled to be slightly lower than that of the welding wire clamp after the temperature rises; after welding is started, the temperature is continuously increased to 30 ℃ when the temperature of the wire welding clamp is increased, and the temperature is continuously unchanged in the wire welding process so as to ensure that the solder ball (64) is not rapidly cooled and hardened; and after the wire ball (64) to be welded is contacted with the welding point and welding is finished, the product is welded, and the welding procedure is finished.
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