CN113714588A

CN113714588A - Pumping source packaging tool, device and packaging method

Info

Publication number: CN113714588A
Application number: CN202111022622.0A
Authority: CN
Inventors: 费华; 胡慧璇; 卢昆忠; 闫大鹏
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Hubei Optics Valley Laboratory; Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2021-11-30

Abstract

The application provides a pumping source packaging tool, a pumping source packaging device and a pumping source packaging method, which comprise the following steps: the first base comprises a first main body part and a first hollow area, and the first main body part encloses to form the first hollow area; the first hollow area is used for accommodating the pump source shell; the second base comprises a heat sink layer; the heat sink layer can be inserted into the first hollow area and connected with the pumping source shell; the first main body part is connected with a heat source, the heat of the heat source is conducted to the pump source shell through the first main body part, and the heat absorbed by the pump source shell is used for melting the solder and enabling the solder to form a welding layer in a molten state on a to-be-welded interface of the pump source; the heat sink layer is directly or indirectly connected with the cold source, and the heat of the pump source shell can be conducted to the cold source through the heat sink layer so as to rapidly cool the welding layer from a melting state to a solidification state to complete the welding and packaging of the pump source. The application provides a pumping source encapsulation frock makes the solder obtain rapid solidification after melting, has improved the production efficiency of pumping source.

Description

Pumping source packaging tool, device and packaging method

Technical Field

The application relates to the technical field of electronic packaging, in particular to a pumping source packaging tool.

Background

In a packaging process of a semiconductor laser as a pump source, a semiconductor laser chip module (COS) is generally soldered to a pump source mount by heating solder, and the pump source mount is soldered to a pump source housing by heating solder.

However, in the related art, the pump source soldering and packaging process generally completes solder solidification by air cooling or natural cooling to ambient temperature, so that the heat dissipation efficiency is low, the heat dissipation time is long, and the production efficiency of the pump source is seriously affected.

Disclosure of Invention

The embodiment of the application provides a pumping source packaging tool, a pumping source packaging device and a pumping source packaging method.

The embodiment of the application provides a pumping source encapsulation frock, it includes:

the first base comprises a first main body part and a first hollow area, and the first main body part encloses the first hollow area; the first hollow area is used for accommodating the pump source shell; and

a second base including a heat sink layer; the heat sink layer can be inserted into the first hollow area and connected with the pumping source shell;

the first main body part is connected with a heat source, heat of the heat source is conducted to the pump source shell through the first main body part, and the heat absorbed by the pump source shell is used for melting the solder and enabling the solder to form a welding layer in a molten state on a to-be-welded interface of the pump source; the heat sink layer is directly or indirectly connected with the cold source, and the heat of the pump source shell can be conducted to the cold source through the heat sink layer so as to rapidly cool the welding layer from a melting state to a solidification state to complete the welding and packaging of the pump source.

The embodiment of the present application further provides a pumping source packaging apparatus, which includes:

a pumping source packaging tool; and

a cooling fluid supply module;

the cooling fluid supply module is used for providing cooling fluid for the refrigeration plate.

The embodiment of the present application further provides a method for packaging a pump source, which includes:

providing a pumping source with a first structure, wherein the pumping source with the first structure comprises a semiconductor laser module, a pumping source base and a pumping source shell, and welding layers are not formed on the semiconductor laser module, the pumping base and the pumping source shell;

placing solder on a contact interface of the semiconductor laser module and the pumping source base, and placing solder on a contact interface of the pumping source base and the pumping source shell to form a pumping source with a second structure;

the pumping source packaging device is used for clamping the pumping source with the second structure in the first hollow area and supplying power to the electric heating structure; when the welding flux is heated and melted to form a welding layer in a molten state, stopping supplying power to the electric heating structure, and simultaneously supplying power to the semiconductor refrigeration piece and continuously introducing cooling water to the channel of the refrigeration plate; when the welding layer is rapidly cooled from a molten state to a solidified state, the welding encapsulation of the pumping source is completed.

In the embodiment of the application, the first main body part is connected with the heat source, the heat of the heat source is guided to the pump source shell, the pump source shell guides the heat to the solder positioned on the interface to be welded of the pump source, and the solder absorbs heat to melt and forms a welding layer in a molten state on the interface to be welded of the pump source; after the welding flux forms the welding layer that is the molten state, be connected pumping source casing and cold source through the heat sink layer, with the heat direction cold source of pumping source casing, the welding flux layer that is the molten state is exothermic becomes the welding flux layer that is the solidification state for obtain rapid solidification after the welding flux melts, improved the production efficiency of pumping source.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of a pump source packaging tool provided in an embodiment of the present application.

Fig. 2 is a schematic diagram of the pump source.

Fig. 3 is an exploded view of fig. 1.

Fig. 4 is a state diagram of the pump source packaging tool shown in fig. 1 packaging the pump source shown in fig. 2.

Fig. 5 is a cross-sectional view of the structure shown in fig. 4 taken along the direction P1-P1.

Fig. 6 is a sectional view of the refrigeration plate shown in fig. 4 taken along the direction P2-P2.

Fig. 7 is a schematic structural view of the clamping assembly shown in fig. 3.

Fig. 8 is an exploded view of the clamping assembly shown in fig. 7.

FIG. 9 is a cross-sectional view of the clamping assembly shown in FIG. 7 taken in the direction P3-P3.

Fig. 10 is a schematic structural diagram of a pump source packaging apparatus according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

Referring to fig. 1 and fig. 2, an embodiment of the present application provides a pump source packaging tool, which includes a first base 2 and a second base 4.

Referring to fig. 1, 3 and 4, the first base 2 includes a first main body 220 and a first hollow area 240. The first body portion 220 encloses a first hollow area 240. The first hollow area 240 is used for accommodating the pump source housing 360. Referring to fig. 3 and 5, the second base 4 includes a heat sink layer 420. The heat sink layer 420 can be inserted into the first hollow region 240 and connected to the pump source housing 360.

It can be understood that, referring to fig. 3 and 5, the first main body portion 220 is used to connect with a heat source, heat of the heat source is conducted to the pump source housing 360 through the first main body portion 220, and the heat absorbed by the pump source housing 360 is used to melt the solder and make the solder form a welding layer in a molten state at the interface to be welded of the pump source 3. The heat sink layer 420 is directly or indirectly connected to the cold source, and the heat of the pump source housing 360 can be conducted to the cold source through the heat sink layer 420, so as to rapidly cool the welding layer from a melting state to a solidifying state to complete the welding and packaging of the pump source 3.

It is understood that, referring to fig. 2, the pump source 3 includes a semiconductor laser module 340, a pump source base 320 and a pump source housing 360. The pump source housing 360 includes a pump source housing bottom wall 361 and a pump source housing side wall 362, the pump source housing side wall 362 is perpendicular to the pump source housing bottom wall 361, and the pump source housing side wall 362 and the pump source housing bottom wall 361 enclose to form an accommodating cavity 363. The pump source housing bottom wall 361 includes a bottom wall inner wall 3614 and a bottom wall outer edge 3612, the bottom wall inner wall 3614 is located inside the accommodating chamber 363, and the bottom wall outer edge 3612 is located outside the accommodating chamber 363. The semiconductor laser module 340 and the pump source base 320 are arranged in the accommodating cavity 363; the semiconductor laser module 340 is welded to the pump source base 320, and the pump source base 320 is welded to a side of the bottom wall inner wall 3614 of the pump source housing 360 facing the accommodating chamber 363.

It will be appreciated that the pump source packaging tool is capable of achieving rapid melting of the solder. Referring to fig. 2, in the use process of the pump source packaging tool, the semiconductor laser module 340 and the pump source base 320 are placed inside the pump source housing 360 placed in the first hollow region 240, and no welding layer is formed between the semiconductor laser module 340 and the pump source base 320 and between the pump base and the pump source housing 360; and placing solder on the contact interface of the semiconductor laser module 340 and the pump source base 320, and placing solder on the contact interface of the pump source base 320 and the pump source shell 360 to form a pump source structure to be welded and packaged.

It can be further understood that, referring to fig. 2 and 5, the first main body 220 is connected to a heat source, heat generated by the heat source is conducted through the first main body 220 to the pump source housing 360 connected to the first main body 220, then conducted from the pump source housing 360 to the solder between the pump source housing 360 and the pump source mount 320, conducted from the pump source housing 360 to the pump source mount 320 connected to the pump source housing 360, and conducted from the pump source mount 320 to the solder between the pump source mount 320 and the semiconductor laser module 340.

Referring to fig. 4 and 6, the second chassis 4 includes a cooling plate 440. The refrigeration plate 440 is directly or indirectly attached to the heat sink layer 420 to allow heat to be conducted from the heat sink layer 420 toward the refrigeration plate 440.

A channel 441 is arranged in the refrigerating plate 440, and the refrigerating plate 440 refrigerates by introducing a cold source into the channel 441; the refrigeration plate 440 has an inlet port 4412 and an outlet port 4414, and a channel 441 is formed between the inlet port 4412 and the outlet port 4414; the cold source is cooling fluid; the cold source flows into the channel 441 from the inlet end 4412 and flows out of the channel 441 from the outlet end 4414; the cold source absorbs the heat of the refrigeration plate 440 by entering the inlet port 4412 and exchanging heat with the refrigeration plate 440 during the flow in the channel 441, and the cold source removes the heat of the refrigeration plate 440 by flowing out of the outlet port 4414.

It will be appreciated that the channel 441 may be shaped as a curved or serpentine track to increase the heat exchange area of the cooling fluid with the refrigeration plate 440.

It is understood that the refrigeration plate 440 includes a first side 442 and a second side 443, and the first side 442 may be coupled with the heat sink layer 420. The second side 443 is perpendicular to the first side 442, and the inlet port 4412 and the outlet port 4414 are disposed on the second side 443, so that the inlet port 4412 and the outlet port 4414 can access the cooling fluid without affecting the connection between the refrigeration plate 440 and the heat sink layer 420. In some embodiments, both the inlet port 4412 and the outlet port 4414 are fitted with tubing 560 interfaces 444 for access to cooling fluid.

Referring to fig. 3 and 5, the second base 4 includes a semiconductor cooling plate 460, the semiconductor cooling plate 460 includes a hot side wall 462 and a cold side wall 461; cold side wall 461 is connected to heat sink layer 420 and hot side wall 462 is connected to refrigeration plate 440; when the semiconductor refrigeration sheet 460 is powered on, the cold-end side wall 461 absorbs heat of the heat sink layer 420, and the hot-end side wall 462 conducts the heat to the refrigeration plate 440; the heat transfer efficiency is improved by the semiconductor cooling fins 460 to rapidly cool the heat sink layer 420.

Referring to fig. 1, 3 and 5, the pump source packaging tool includes an electrical heating structure 7. The electric heating structure 7 generates a heat source when being electrified; the electric heating structure 7 is columnar. The first body portion 220 is a metal heat conductor.

The first body portion 220 is provided with a slot 221 for receiving the insertion of the electric heating structure 7.

When the electric heating structure 7 is inserted into the slot body 221, the outer side wall of the electric heating structure 7 is in contact with the inner side wall of the slot body 221; when the electric heating structure 7 is inserted into the slot 221 and the electric heating structure 7 is powered on, the electric heating structure 7 generates heat, and the heat is conducted to the first main body 220 through the outer side wall of the electric heating structure 7 and the inner side wall of the slot 221, and then conducted to the pump source housing 360 through the first main body 220.

Referring to fig. 1 and 3, the pumping source encapsulation tool includes a thermocouple structure 9; the thermocouple structure 9 is columnar.

The first body portion 220 is provided with a slot 221 for receiving the thermocouple arrangement 9, and the thermocouple arrangement 9 is used for monitoring the temperature of the first body when it is powered on, so as to control the temperature of the first body.

The thermocouple structure 9 is connected with the first main body part 220, the thermocouple structure 9 monitors the temperature of the first main body part when being electrified, and when the temperature rises to the melting point of the solder, the electric heating structure 7 is powered off, so that the electronic components such as a chip in the pumping source device are prevented from being damaged due to overhigh temperature of the first main body part.

Referring to fig. 2, the pump source housing 360 includes a pump source housing bottom wall 361 and a pump source housing side wall 362; the side wall 362 of the pump source housing is perpendicular to the bottom wall 361 of the pump source housing, and the side wall 362 of the pump source housing and the bottom wall 361 of the pump source housing enclose to form an accommodating cavity 363; the bottom wall 361 of the pump source housing comprises a bottom wall inner wall 3614 and a bottom wall outer edge 3612 which are connected, and the bottom wall inner wall 3614 is positioned inside the accommodating cavity 363; the bottom wall outer edge 3612 is located outside the receiving cavity 363.

In the description, it is understood that, referring to fig. 2, a semiconductor laser module 340 and a pump source base 320 are disposed in the accommodating cavity 363; solder is arranged between the semiconductor laser module 340 and the pump source base 320; solder is arranged between the pumping source base 320 and the inner wall of the base; when the first main body part 220 is connected to a heat source, heat is indirectly or directly conducted to the solder through the pump source housing 360, so that the solder is melted to form a soldering layer, and then the heat sink layer 420 is directly or indirectly connected to the cold source, so that the soldering layer is solidified, thereby completing the soldering and packaging process of the pump source 3.

Referring to fig. 3, the first hollow region 240 includes a first sub hollow region 241 and a second sub hollow region 242 which are connected to each other; the first sub-hollow region 241 is used for disposing a pump source housing bottom wall 361; the second sub-hollow region 242 is configured to receive the heat sink layer 420 therethrough.

Referring to fig. 3 and 5, the first main body 220 includes a first wall 222, and the first wall 222 encloses a first sub-hollow area 241; the opening size of the first sub-hollow region 241 is larger than the cross-sectional area of the heat sink layer 420, so that when the heat sink layer 420 is disposed in the first sub-hollow region 241, the side of the heat sink layer 420 facing the first wall surface 222 is spaced from the first wall surface 222, thereby preventing the heat of the first main body part 220 from being directly conducted to the heat sink layer 420.

Referring to fig. 3 and 5, the first main body 220 further includes at least two second walls 223, the at least two second walls 223 enclose the second sub-hollow region 242, so that when the pump source housing 360 is disposed in the second sub-hollow region 242, the at least two second walls 223 are connected to the pump source housing bottom wall 361, the pump source housing bottom wall 361 is clamped between the at least two second walls 223, the pump source housing 360 is clamped in the second sub-hollow region 242, and the side of the heat sink layer 420 facing the pump source housing 360 is connected to the side of the pump source housing bottom wall 361 facing the heat sink layer 420, so as to guide out heat of the pump source housing 360 through the heat sink layer 420.

Referring to fig. 1, the pump source packaging tool includes a clamping assembly 6.

Referring to fig. 3, the first main body 220 includes a boss 224 structure, the second wall 223 is formed on the boss 224 structure, the boss 224 structure corresponds to the second wall 223 one by one, and the boss 224 structure encloses to form the second sub-hollow area 242; a sunken groove 225 is formed between every two adjacent boss 224 structures.

Referring to fig. 3 and 5, the clamping assembly 6 is disposed in the sinking groove 225. Referring to fig. 2, 3 and 5, the clamping assembly 6 can be engaged with the outer edge 3612 of the bottom wall to limit the pump source housing 360 in the second sub-hollow region 242, so that the connection between the second wall 223 and the bottom wall 361 of the pump source housing is more stable, and the connection between the side of the heat sink layer 420 facing the pump source housing 360 and the side of the bottom wall 361 of the pump source housing facing the heat sink layer 420 is more stable, so as to ensure the stability of heat conduction.

Referring to fig. 7-9, the clamping assembly 6 includes a clamping portion 620, a fixing portion 640, and an adjusting lever 660, the adjusting lever 660 is rotatably connected to the clamping portion 620, and the adjusting lever 660 is connected to the fixing portion 640 by a screw; the fixing portion 640 is fixedly connected with the bottom of the sinking groove 225.

Referring to fig. 1, 3, 7 and 8, the clamping portion 620 includes a clamping end 621, the clamping end 621 includes a horizontal wall 6212 and a vertical wall 6214 that are vertically connected to each other, the horizontal wall 6212 and the vertical wall 6214 form a right-angle space 6216, the horizontal wall 6212 is disposed toward the first base 2, and the vertical wall 6214 is disposed toward the second sub-hollow region 242. Referring to fig. 2, a surface of the outer edge 3612 of the bottom wall facing away from the second sub-hollow region 242 is defined as a first surface 3612a, and a surface of the outer edge 3612 of the bottom wall perpendicular to the first surface 3612a is defined as a second surface 3612 b. Referring to fig. 2 and 8, when the outer edge 3612 of the bottom wall extends into the right-angle space 6216, the horizontal wall 6212 is attached to the first surface 3612a of the outer edge 3612 of the bottom wall, and the vertical wall 6214 is attached to the second surface 3612b of the outer edge 3612 of the bottom wall, so that the first surface 3612a is limited on the side of the horizontal wall 6212 facing the first base 2, and the second surface 3612b is limited on the side of the vertical wall 6214 facing the second sub-hollow region 242.

It can be understood that, when the adjusting lever 660 moves towards the direction close to the second sub-hollow region 242 relative to the fixing portion 640, the adjusting lever 660 simultaneously drives the clamping portion 620 to move towards the direction close to the second sub-hollow region 242, so that the bottom wall outer edge 3612 can extend into the right-angle space 6216, so that the clamping portion 620 is in snap connection with the bottom wall outer edge 3612; when the adjusting lever 660 moves away from the second sub-hollow region 242 relative to the fixing portion 640, the adjusting lever 660 simultaneously drives the clamping portion 620 to move away from the second sub-hollow region 242, so that the bottom wall outer edge 3612 can exit from the right-angle space 6216, and the clamping portion 620 and the bottom wall outer edge 3612 are disengaged from each other.

Referring to fig. 7-9, the clamping assembly 6 further includes a limit pin 680.

The clamping portion 620 further includes a connecting end 622, and the connecting end 622 is connected to the clamping end 621; the connecting end 622 is provided with a first hole and a second hole and a

groove

6222 and 6224, the first hole and the groove 6222 is used for accommodating the adjusting rod 660 to pass through; the second slot 6224 is perpendicular to the first slot 6222 and communicates with the first slot 6222, and the second slot 6224 is configured to receive the stopper pin 680.

The adjusting rod 660 is provided with a limiting groove 661, the limiting groove 661 is annular, and the limiting groove 661 is arranged around the periphery of the adjusting rod 660; the spacing groove 661 is disposed opposite the second aperture groove 6224.

When the adjustment lever 660 is attached to the clamping portion 620, the adjustment lever 660 is disposed in the first hole groove 6222, the stopper pin 680 is disposed in the second hole groove 6224, the stopper pin 680 is engaged with the stopper groove 661, and the adjustment lever 660 can rotate in the first hole groove 6222 but cannot advance or retreat along the first hole groove 6222.

Illustratively, when the adjusting lever 660 rotates forward relative to the fixing portion 640, the adjusting lever 660 moves toward the second sub hollow region 242, and the adjusting lever 660 synchronously drives the clamping portion 620 to move away from the second sub hollow region 242. When the adjusting lever 660 rotates in a reverse direction relative to the fixing portion 640, the adjusting lever 660 moves away from the second sub hollow region 242, and the adjusting lever 660 synchronously drives the clamping portion 620 to move away from the second sub hollow region 242.

Referring to fig. 3 and 5, the pump source encapsulation tool includes a third base 8, the third base 8 is located on the side of the first base 2 facing away from the boss 224, and the third base 8 is located on the side of the refrigeration plate 440 facing the first base 2; the third base 8 is fixedly arranged with the refrigeration plate 440; the third chassis 8 includes a second main body portion 820 and a second hollow region 840; the second body 820 is shown as being of a heat resistant and thermally insulating material; the second body portion 820 encloses to form a second hollow region 840; the second hollow area 840 is used for accommodating the heat sink layer 420 to pass through, so as to limit the heat sink layer 420 in the second hollow area 840; one side of the second main body 820 facing the first main body 220 is provided with a sinking groove 225 for limiting the first main body 220 in the sinking groove 225; the projection area of the first base 2 on the refrigeration board 440 is located in the projection area of the third base 8 on the refrigeration board 440, so as to protect the operator from being scalded by the first main body 220 and the heat sink layer 420 and protect the peripheral electronic devices from being damaged by the heat of the first main body 220 and the heat sink layer 420.

The second body 820 comprises a second wall 223, and the second wall 223 encloses a second hollow region 840; the opening size of the second hollow region 840 is larger than the cross-sectional area of the heat sink layer 420, so that when the heat sink layer 420 is disposed in the second hollow region 840, the side of the heat sink layer 420 facing the second wall surface 223 is spaced from the second wall surface 223, thereby preventing heat of the heat sink layer 420 from being directly conducted to the second body portion 820. The second body 820 may be bakelite.

The first main body 220 is a metal heat conductor; the heat sink layer 420 is a metal heat conductor; the refrigeration plate 440 is a metal heat conductor;

the heat sink layer 420 is made of copper or aluminum alloy. The first main body 220 is made of copper or aluminum alloy. The refrigeration plate 440 is made of copper material or aluminum alloy material.

The embodiment of the application also provides a pumping source packaging device.

Referring to fig. 10, the pump source packaging apparatus includes a pump source packaging tool and a cooling fluid supply module 5.

The cooling fluid supply module 5 is used to provide cooling fluid to the cold plate 440.

Referring to fig. 10, the cooling fluid supply module 5 is a water cooler, the cooling fluid is cooling water, and the cooling water is provided by the water cooler; the inlet end 4412 is communicated with the water outlet end 520 of the water cooler through a pipeline 560 to provide cooling water cooled by the water cooler to the channel 441, and the outlet end 4414 is communicated with the water inlet end 540 of the water cooler through the pipeline 560; to recover the cooling water having absorbed the heat of the refrigerating plate 440 from the passage 441 to the water cooler for refrigeration.

In some embodiments, the cooling fluid supply module 5 may also be a liquid nitrogen circulating cooling system, the cooling fluid being liquid nitrogen, the liquid nitrogen circulating cooling system being configured to provide the liquid nitrogen to the cold plate 440.

The embodiment of the application also provides a pumping source packaging method.

Providing a pump source 3 with a first structure, referring to fig. 2, the pump source 3 with the first structure includes a semiconductor laser module 340, a pump source base 320 and a pump source housing 360, and a welding layer is not formed between the semiconductor laser module 340 and the pump base and between the pump base and the pump source housing 360;

placing solder on a contact interface of the semiconductor laser module 340 and the pump source base 320, and placing solder on a contact interface of the pump source base 320 and the pump source shell 360 to form a pump source 3 with a second structure;

providing the pumping source encapsulation device shown in fig. 10, clamping the pumping source 3 with the second structure in the first hollow area 240 to supply power to the electric heating structure; when the welding flux is heated and melted to form a welding layer in a molten state, the power supply for the electric heating structure is stopped, and meanwhile, the power supply for the semiconductor refrigeration piece 460 is supplied and cooling water is continuously introduced into the channel 441 of the refrigeration plate 440; when the solder layer is rapidly cooled from the molten state to the solidified state, the solder encapsulation of the pump source 3 is completed.

The pump source packaging tool, the pump source packaging device and the pump source packaging method provided by the embodiment of the application are introduced in detail, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a pumping source encapsulation frock which characterized in that includes:

a second mount comprising a heat sink layer; the heat sink layer can be inserted into the first hollow area and connected with the pumping source shell;

the first main body part is used for being connected with a heat source, the heat of the heat source is conducted to the pump source shell through the first main body part, and the heat absorbed by the pump source shell is used for melting solder and enabling the solder to form a welding layer in a molten state on a to-be-welded interface of the pump source; the heat sink layer is directly or indirectly connected with a cold source, and the heat of the pump source shell can be conducted to the cold source through the heat sink layer so as to rapidly cool the welding layer from a melting state to a solidification state to complete the welding encapsulation of the pump source.

2. The pump source packaging tool of claim 1, wherein the second base comprises a refrigeration plate; the refrigeration plate is directly or indirectly connected with the heat sink layer so as to conduct heat from the heat sink layer to the refrigeration plate;

a channel is arranged in the refrigeration plate, and the refrigeration plate carries out refrigeration by introducing the cold source into the channel; the refrigerating plate is provided with an inlet end and an outlet end, and the channel is arranged between the inlet end and the outlet end; the cold source is cooling fluid; the cold source flows into the channel from the inlet end and out of the channel from the outlet end; the cold source exchanges heat with the refrigeration plate to absorb heat of the refrigeration plate in the process of entering the inlet end and flowing in the channel, and the cold source flows out from the outlet end to take away heat of the refrigeration plate.

3. The pump source packaging tool of claim 2, wherein the second base comprises a semiconductor chilling plate comprising a hot end side wall and a cold end side wall; the side wall of the cold end is connected with the heat sink layer, and the side wall of the hot end is connected with the refrigeration plate; when the semiconductor refrigerating sheet is electrified, the cold end side wall absorbs the heat of the heat sink layer, and the hot end side wall conducts the heat to the refrigerating plate; the semiconductor refrigeration sheet is used for improving the heat conduction efficiency and rapidly refrigerating the heat sink layer.

4. The pump source packaging tool of claim 3, comprising an electrical heating structure that generates the heat source when energized; the electric heating structure is columnar; the first main body part is a metal heat conductor;

the first main body part is provided with a groove body for accommodating the electric heating structure to be inserted;

when the electric heating structure is inserted into the groove body, the outer side wall of the electric heating structure is in contact with the inner side wall of the groove body; when the electric heating structure is inserted into the groove body and the electric heating structure is electrified, the electric heating structure generates heat, and the heat is conducted to the first main body part through the outer side wall of the electric heating structure and the inner side wall of the groove body and then conducted to the pumping source shell through the first main body part.

5. The pump source packaging tool of claim 4, comprising a thermocouple structure; the thermocouple structure is columnar;

the first main body part is provided with a groove body used for accommodating a thermocouple structure to be inserted, and the thermocouple structure is used for monitoring the temperature of the first main body when being electrified, so that the temperature of the first main body can be controlled conveniently.

6. The pump source packaging tool of any one of claims 2-5, wherein the pump source housing comprises a pump source housing bottom wall and a pump source housing side wall; the side wall of the pump source shell is perpendicular to the bottom wall of the pump source shell, and the side wall of the pump source shell and the bottom wall of the pump source shell enclose to form an accommodating cavity; the bottom wall of the pumping source shell comprises a bottom wall inner wall and a bottom wall outer edge which are connected, and the bottom wall inner wall is positioned on the inner side of the accommodating cavity; the outer edge of the bottom wall is positioned outside the accommodating cavity;

the first hollow region comprises a first sub hollow region and a second sub hollow region which are communicated; the first sub hollow region is used for arranging the bottom wall of the pump source shell; the second sub hollow area is used for accommodating the heat sink layer to penetrate through;

the first main body part comprises a first wall surface, and the first wall surface encloses the first sub hollow area; the opening size of the first sub hollow area is larger than the cross-sectional area of the heat sink layer, so that when the heat sink layer is arranged in the first sub hollow area, the side surface of the heat sink layer facing the first wall surface is arranged at intervals with the first wall surface, and heat of the first main body part is prevented from being directly conducted to the heat sink layer;

the first main body part further comprises at least two second wall surfaces, the at least two second wall surfaces are enclosed to form the second sub-hollow area, when the pumping source shell is arranged in the second sub-hollow area, the at least two second wall surfaces are connected with the bottom wall of the pumping source shell, so that the bottom wall of the pumping source shell is clamped between the at least two second wall surfaces, the pumping source shell is clamped in the second sub-hollow area, the side surface, facing the pumping source shell, of the heat sink layer is connected with the side surface, facing the heat sink layer, of the bottom wall of the pumping source shell, and heat of the pumping source shell is led out through the heat sink layer.

7. The pump source packaging tool of claim 6, comprising a clamping assembly;

the first main body part comprises a boss structure, the second wall surface is formed on the boss structure, the boss structure and the second wall surface are in one-to-one correspondence, and the boss structure encloses to form the second sub-hollow area; a sinking groove is formed between every two adjacent boss structures;

the clamping component is arranged in the sinking groove and can be connected with the outer edge of the bottom wall in a clamping mode, the pumping source shell is limited in the second sub-hollow area, the second wall face is more stable in connection with the bottom wall of the pumping source shell, the heat sink layer faces the side face of the pumping source shell and the bottom wall of the pumping source shell faces the side face of the heat sink layer, and heat conduction stability is guaranteed.

8. The pump source packaging tool of claim 7, wherein the clamping assembly comprises a clamping portion, a fixing portion and an adjusting rod, the adjusting rod is rotatably connected with the clamping portion, and the adjusting rod is in threaded connection with the fixing portion; the fixed part is fixedly connected with the bottom of the sinking groove;

the clamping part comprises a clamping end, the clamping end comprises a horizontal wall surface and a vertical wall surface which are mutually and vertically connected, a right-angle space is formed between the horizontal wall surface and the vertical wall surface, the horizontal wall surface faces the first base, and the vertical wall surface faces the second sub-hollow area; defining the surface of the outer edge of the bottom wall, which faces away from the second sub-hollow area, as a first surface, and defining the surface of the outer edge of the bottom wall, which is perpendicular to the first surface, as a second surface; when the outer edge of the bottom wall extends into the right-angle space, the horizontal wall surface is attached to a first surface of the outer edge of the bottom wall, and the vertical wall surface is attached to a second surface of the outer edge of the bottom wall, so that the first surface is limited on one side of the horizontal wall surface facing the first base, and the second surface is limited on one side of the vertical wall surface facing the second sub-hollow area;

when the adjusting rod moves towards the direction close to the second sub-hollow area relative to the fixing part, the adjusting rod simultaneously drives the clamping part to move towards the direction close to the second sub-hollow area, so that the outer edge of the bottom wall can extend into the right-angle space, and the clamping part is clamped and connected with the outer edge of the bottom wall; when the adjusting rod moves relative to the fixing part in the direction away from the second sub-hollow area, the adjusting rod simultaneously drives the clamping part to move in the direction away from the second sub-hollow area, so that the outer edge of the bottom wall can exit from the right-angle space, and the clamping part is disengaged from the outer edge of the bottom wall.

9. The pump source packaging tool of claim 8, wherein the clamping assembly further comprises a spacer pin; the clamping part also comprises a connecting end, and the connecting end is connected with the clamping end; the connecting end is provided with a first hole groove and a second hole groove, and the first hole groove is used for accommodating the adjusting rod to penetrate through; the second hole groove is perpendicular to the first hole groove and communicated with the first hole groove, and the second hole groove is used for accommodating the limiting pin;

the adjusting rod is provided with a limiting groove, the limiting groove is annular, and the limiting groove is arranged around the periphery of the adjusting rod; the limiting groove is opposite to the second hole groove;

when the adjusting rod is installed on the clamping portion, the adjusting rod is arranged in the first hole groove, the limiting pin is arranged in the second hole groove, the limiting pin is clamped in the limiting groove, and the adjusting rod can rotate in the first hole groove but cannot advance or retreat along the first hole groove.

10. The pump source packaging tool of claim 9, comprising a third base, wherein the third base is located on a side of the first base facing away from the boss, and the third base is located on a side of the refrigeration plate facing the first base; the third base is fixedly arranged with the refrigeration plate; the third base comprises a second main body part and a second hollow area; the second main body part is made of heat-resistant heat-insulating materials; the second main body part encloses to form the second hollow area; the second hollow area is used for accommodating the heat sink layer to penetrate through and limiting the heat sink layer in the second hollow area; a sinking groove is formed in one side, facing the first main body part, of the second main body part and used for limiting the first main body part in the sinking groove; the first base is located in the projection area of the refrigeration plate, the projection area of the third base is located in the projection area of the refrigeration plate, and the first base is used for protecting operators from being scalded by the first main body part and the heat sink layer and protecting peripheral electronic devices from being damaged by the heat of the first main body part and the heat sink layer.

11. The pump source packaging tool of claim 10, wherein the first main body portion, the heat sink layer, and the refrigeration plate are all metal heat conductors.

12. A pump source encapsulation device, comprising:

the pump source encapsulation tooling of any one of claims 2-11; and

a cooling fluid supply module;

wherein the cooling fluid supply module is configured to provide cooling fluid to the refrigeration plate.

13. The pump source packaging apparatus of claim 12, wherein the cooling fluid supply module is a water cooler, the cooling fluid is cooling water, and the cooling water is provided by the water cooler; the inlet end is communicated with the water outlet end of the water cooler through a pipeline and used for providing the cooling water refrigerated by the water cooler for the channel, and the outlet end is communicated with the water inlet end of the water cooler through a pipeline; the cooling water absorbing the heat of the refrigeration plate is recycled to the water cooler from the channel to perform refrigeration.

14. A method of packaging a pump source, comprising:

providing a pumping source with a first structure, wherein the pumping source with the first structure comprises a semiconductor laser module, a pumping source base and a pumping source shell, and welding layers are not formed between the semiconductor laser module and the pumping base and between the pumping base and the pumping source shell;

placing a solder on a contact interface between the semiconductor laser module and the pumping source base, and placing the solder on a contact interface between the pumping source base and the pumping source shell to form a pumping source with a second structure;

providing the pump source packaging device of claim 13, clamping the pump source of the second structure in the first hollow region, and supplying power to the electric heating structure; when the welding flux is heated and melted to form a welding layer in a molten state, stopping supplying power to the electric heating structure, and simultaneously supplying power to the semiconductor refrigeration piece and continuously introducing cooling water to the channel of the refrigeration plate; and when the welding layer is rapidly cooled from a molten state to a solidified state, completing the welding encapsulation of the pumping source.