CN113709988A - Manufacturing method of polyimide-containing suspension circuit substrate - Google Patents
Manufacturing method of polyimide-containing suspension circuit substrate Download PDFInfo
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- CN113709988A CN113709988A CN202111024788.6A CN202111024788A CN113709988A CN 113709988 A CN113709988 A CN 113709988A CN 202111024788 A CN202111024788 A CN 202111024788A CN 113709988 A CN113709988 A CN 113709988A
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- copper foil
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- steel sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Abstract
The invention relates to a method for manufacturing a suspension circuit substrate containing polyimide, which comprises the steps of firstly pressing a stainless steel sheet, a polyimide film and a copper foil into a copper-clad plate according to the sequence from bottom to top, then pre-etching the uppermost copper foil into a required pattern by a photoetching method, then using the etched copper foil as a mask, processing the polyimide film by using titanium dioxide pulse laser to obtain an insulating layer structure with the same pattern as the etched copper foil, etching the copper foil into a finally required circuit wiring port by etching again, plating a layer of nickel on the obtained copper foil wiring port as a protective layer, spin-coating a layer of epoxy resin as a surface protective layer to protect the wiring port and the nickel layer, and finally etching the stainless steel sheet into the required structure by etching the copper foil to obtain the suspension circuit substrate. According to the manufacturing method of the present invention, a circuit board for head suspension can be manufactured, which can secure the floating function of the magnetic head.
Description
Technical Field
The invention relates to a method for manufacturing a suspension circuit substrate containing polyimide, belonging to the field of application of organic functional materials to integrated circuits and chips.
Background
The levitated circuit board can secure a floating function of the magnetic head, and information recording using the levitated magnetic head can realize high-density information recording with a small recording magnetic field, and has a wide application prospect in hard disk drives of computers. With the rapid spread of computers and the rapid development of the internet, the personal computer has a significantly increased information processing amount or is required to have an increased information processing speed, and the utilization rate of information recording by using a levitated magnetic head is also increased, so that the requirement for a part for levitating a magnetic head for recording information is increased, and the transition from the conventional type of signal line such as a gold wire to a wiring-integrated type called wireless levitation is currently performed. On the other hand, as computers and other electronic devices are being highly integrated and miniaturized, a magnetic head circuit for recording information is also required to be highly integrated, and as the magnetic head circuit is highly integrated, a magnetic head for recording information is easily affected by electrostatic charge and causes other problems due to its high sensitivity, and in the worst case, is broken to cause a circuit failure.
In response to these problems, a grounding device has been reported which electrically connects the magnetic head slider and the suspension with a conductive resin. However, since conventional conductive resins have insufficient conductivity, there is a problem that the static electricity cannot be sufficiently removed by the connection with such conductive resins. Further, the conductive resin does not have sufficient adhesive strength, and therefore, there is a problem that the slider cannot be bonded to the suspension with sufficient strength. Patent CN103068153A provides a substrate for suspension having a grounding device capable of sufficiently preventing electrostatic destruction or suppressing noise even when signal wiring lines with a narrow pitch are formed due to high density. On the other hand, as computers and other electronic devices are being highly integrated and miniaturized, in addition to the demand for integration and integration in various periods, new demands are being made for flexibility of various electronic devices, and the present invention proposes to use flexible polyimide as an intermediate layer of a suspension substrate, and a suspension circuit substrate having good flexibility, which can secure a floating function of a magnetic head, is obtained by etching and laser processing a base plate using a copper foil and a stainless steel sheet having good flexibility.
Disclosure of Invention
The invention provides a method for manufacturing a polyimide suspension circuit board, which is used for manufacturing an integrated suspension circuit board with good flexibility, and overcomes the problems that static electricity cannot be sufficiently removed and the toughness of the circuit board is poor in the conventional grounding device for electrically connecting a magnetic head slider and a suspension by using conductive resin. The method comprises the steps of firstly pressing a stainless steel sheet, a polyimide film and a copper foil to form a copper-clad plate according to the sequence from bottom to top, then pre-etching the uppermost copper foil to form a required pattern by a photoetching method, then using the etched copper foil as a mask, processing the polyimide film by using titanium dioxide pulse laser to obtain an insulating layer structure with the same pattern as the etched copper foil, etching the copper foil to form a finally required circuit wiring port by etching again, plating a layer of nickel on the obtained copper foil wiring port to serve as a protective layer, spin-coating a layer of epoxy resin to serve as a surface protective layer to protect the copper foil wiring port and a nickel layer, and finally etching the stainless steel sheet to form the required structure by etching to obtain the suspension circuit substrate.
The invention adopts the technical scheme for solving the problems, and the manufacturing method of the polyimide-containing suspension circuit substrate comprises the following steps:
(1) preparing a copper-clad plate: pressing a stainless steel sheet of 10-40 microns, a polyimide film of 10-40 microns and a copper foil of 10-30 microns at 150-200 ℃ under the pressure of 2-5 MPa for 0.5-3 h from bottom to top to obtain a copper-clad plate;
(2) pre-etching of copper foil: forming a predetermined pattern on a copper foil by coating a photoresist on the copper foil and performing exposure, development and etching;
(3) processing of the polyimide film: processing the polyimide film by using the copper foil pattern subjected to pre-etching as a mask and using a carbon dioxide laser beam, and blowing 10-30L/min of air to a system during processing so as to take away processed waste, thereby obtaining a polyimide pattern with the same pattern as the copper foil; wherein the carbon dioxide laser beam is a pulse laser, and the energy density of 1 pulse is 3-7J/cm2The frequency is 10kHz, the pulse peak output is 500-5000W, and the laser wavelength is 9.6 mu m;
(4) further etching of the copper foil: forming a final copper foil wiring port by coating a photoresist on a pre-etched copper foil and performing exposure, development and etching;
(5) coating of a protective layer: a 2-7 mu m nickel protective layer is vapor-plated on the copper foil pattern, then a layer of epoxy resin with the thickness of 15-40 mu m is coated to protect the copper foil and the nickel layer, and the temperature is kept at 100-200 ℃ for 0.5-4 h to solidify the epoxy resin;
(6) etching of stainless steel sheets: a stainless steel sheet is placed on top, and a predetermined pattern is formed on the stainless steel sheet by coating a photoresist on the stainless steel sheet and performing exposure, development and etching, resulting in the suspension circuit substrate of the present invention.
The invention has the beneficial effects that: according to the manufacturing method of the present invention, a circuit board for head suspension can be manufactured, which can secure the floating function of the magnetic head. The suspension circuit substrate manufactured by the invention is an integrated substrate, has good flexibility and is suitable for highly integrated electrical devices. The invention has simple production operation, low equipment requirement, green and environment-friendly production process, can be produced in large scale and greatly reduces the production cost.
Drawings
FIG. 1 is a planar view of a copper-clad plate prepared in the present invention
FIG. 2 is a schematic plane view of a copper foil after a pre-etching step in example 1 of the present invention
FIG. 3 is a schematic view of a polyimide film of example 1 of the present invention after processing
FIG. 4 is a schematic view of a copper foil after etching to form a final copper foil wiring terminal in example 1 of the present invention
FIG. 5 is a schematic plan view showing a step after nickel plating in example 1 of the present invention
FIG. 6 is a schematic plane view of the epoxy resin coating step of example 1 of the present invention
FIG. 7 is a schematic plane view of a stainless steel sheet after etching step in example 1 of the present invention
FIG. 8 is a plan view of a stainless steel sheet in a circuit substrate prepared in example 1 of the present invention
FIG. 9 is a plan view of a polyimide layer in the circuit substrate prepared in example 1 of the present invention
FIG. 10 is a plan view of a copper foil wiring port in the circuit substrate prepared in example 1 of the present invention
FIG. 11 is a plan view of a copper foil wiring port in a circuit substrate prepared in example 4 of the present invention
FIG. 12 is a schematic plane view of a stainless steel sheet after etching step in example 5 of the present invention
FIG. 13 is a plan view of a stainless steel sheet in a circuit substrate prepared in example 5 of the present invention
Detailed Description
The following examples of the preparation process of the present invention are presented, but the following examples are illustrative of the present invention and do not constitute any limitation to the claims of the present invention.
Example 1
(1) Preparing a copper-clad plate: pressing a stainless steel sheet with the thickness of 25 microns, a polyimide film with the thickness of 25 microns and a copper foil with the thickness of 18 microns for 1h at the temperature of 150 ℃ and under the pressure of 3MPa according to the sequence from bottom to top to obtain a copper-clad plate, wherein a planing surface picture after the step is shown as an attached drawing 1;
(2) pre-etching of copper foil: forming a predetermined pattern on the copper foil by coating a photoresist on the copper foil and performing exposure, development and etching, the planed surface after this step being as shown in fig. 2;
(3) processing of the polyimide film: processing the polyimide film by using the copper foil pattern subjected to pre-etching as a mask and using a carbon dioxide laser beam, and blowing air of 20L/min to a system during processing so as to take away processed waste, thereby obtaining a polyimide pattern with the same pattern as the copper foil; wherein the carbon dioxide laser beam is pulse laser, and the energy density of 1 pulse is 3J/cm2The frequency is 10kHz, the pulse peak output is 500W, the laser wavelength is 9.6 μm, and the planing surface graph after the step is shown in figure 3;
(4) further etching of the copper foil: forming a final copper foil wiring port by coating a photoresist on the pre-etched copper foil and performing exposure, development and etching, the planed surface after this step being as shown in fig. 4;
(5) coating of a protective layer: evaporating a 3 μm nickel protective layer on the copper foil pattern, wherein the planar view after the step is shown in FIG. 5; then coating a layer of epoxy resin with the thickness of 25 mu m to protect the copper foil and the nickel layer, and preserving heat at 120 ℃ for 1h to cure the epoxy resin, wherein the planed surface after the step is shown as the attached drawing 6;
(6) etching of stainless steel sheets: a stainless steel sheet was placed on top, and a predetermined pattern was formed on the stainless steel sheet by coating a photoresist on the stainless steel sheet and performing exposure, development and etching, to obtain a suspension circuit board according to the present invention, and the planed surface after this step is shown in fig. 7, and further, a plan view of the stainless steel sheet in the circuit board prepared in this example is shown in fig. 8, a plan view of the polyimide layer in the circuit board prepared in this example is shown in fig. 9, and a plan view of the copper foil wiring port in the circuit board prepared in this example is shown in fig. 10.
Example 2
(1) Preparing a copper-clad plate: pressing a 10-micron stainless steel sheet, a 10-micron polyimide film and a 10-micron copper foil at 150 ℃ under 3MPa for 1h according to the sequence from bottom to top to obtain a copper-clad plate, wherein the planed surface picture after the step is shown as the attached drawing 1;
(2) pre-etching of copper foil: the planing surface after this step is shown in FIG. 2, as in example 1;
(3) processing of the polyimide film: the planing surface after this step is shown in FIG. 3, as in example 1;
(4) further etching of the copper foil: the planing surface after this step is shown in FIG. 4, as in example 1;
(5) coating of a protective layer: the same nickel plating as in example 1 was performed, and the planed surface after this step is shown in FIG. 5; then, a layer of epoxy resin is coated on the copper foil and the nickel layer to protect the copper foil and the nickel layer in the same way as in the example 1, and the planed surface after the step is shown in the attached figure 6;
(6) etching of stainless steel sheets: the planar view after this step is shown in fig. 7 in the same example 1, and the top view of the stainless steel sheet in the circuit board prepared in this example is shown in fig. 8, the top view of the polyimide layer in the circuit board prepared in this example is shown in fig. 9, and the top view of the copper foil wiring port in the circuit board prepared in this example is shown in fig. 10.
Example 3
(1) Preparing a copper-clad plate: pressing a stainless steel sheet of 40 micrometers, a polyimide film of 40 micrometers and a copper foil of 30 micrometers for 1h at 150 ℃ under the pressure of 3MPa according to the sequence from bottom to top to obtain a copper-clad plate, wherein the planed surface after the step is shown as the attached drawing 1;
(2) pre-etching of copper foil: the planing surface after this step is shown in FIG. 2, as in example 1;
(3) processing of the polyimide film: the planing surface after this step is shown in FIG. 3, as in example 1;
(4) further etching of the copper foil: the planing surface after this step is shown in FIG. 4, as in example 1;
(5) coating of a protective layer: the same nickel plating as in example 1 was performed, and the planed surface after this step is shown in FIG. 5; then, a layer of epoxy resin is coated on the copper foil and the nickel layer to protect the copper foil and the nickel layer in the same way as in the example 1, and the planed surface after the step is shown in the attached figure 6;
(6) etching of stainless steel sheets: the planar view after this step is shown in fig. 7 in the same example 1, and the top view of the stainless steel sheet in the circuit board prepared in this example is shown in fig. 8, the top view of the polyimide layer in the circuit board prepared in this example is shown in fig. 9, and the top view of the copper foil wiring port in the circuit board prepared in this example is shown in fig. 10.
Example 4
(1) Preparing a copper-clad plate: the same procedure as in example 1 was followed, and the planed surface after this procedure is shown in FIG. 1;
(2) pre-etching of copper foil: the planing surface after this step is shown in FIG. 2, as in example 1;
(3) processing of the polyimide film: the planing surface after this step is shown in FIG. 3, as in example 1;
(4) further etching of the copper foil: a final copper foil wiring port was formed by coating a photoresist on a pre-etched copper foil and performing exposure, development and etching, but a mask different from that of example 1 was used in this step, and the planar view after this step is shown in fig. 4, but the top view thereof is shown in fig. 11;
(5) coating of a protective layer: the same nickel plating as in example 1 was performed, and the planed surface after this step is shown in FIG. 5; then, a layer of epoxy resin is coated on the copper foil and the nickel layer to protect the copper foil and the nickel layer in the same way as in the example 1, and the planed surface after the step is shown in the attached figure 6;
(6) etching of stainless steel sheets: the planar view after this step is shown in fig. 7 in the same example 1, and the top view of the stainless steel sheet in the circuit board prepared in this example is shown in fig. 8, the top view of the polyimide layer in the circuit board prepared in this example is shown in fig. 9, and the top view of the copper foil wiring port in the circuit board prepared in this example is shown in fig. 11.
Example 5
(1) Preparing a copper-clad plate: the same procedure as in example 1 was followed, and the planed surface after this procedure is shown in FIG. 1;
(2) pre-etching of copper foil: the planing surface after this step is shown in FIG. 2, as in example 1;
(3) processing of the polyimide film: the planing surface after this step is shown in FIG. 3, as in example 1;
(4) further etching of the copper foil: the planing surface after this step is still as shown in FIG. 4, as in example 1;
(5) coating of a protective layer: the same nickel plating as in example 1 was performed, and the planed surface after this step is shown in FIG. 5; then, a layer of epoxy resin is coated on the copper foil and the nickel layer to protect the copper foil and the nickel layer in the same way as in the example 1, and the planed surface after the step is shown in the attached figure 6;
(6) etching of stainless steel sheets: a suspension circuit board according to the present invention was obtained by placing a stainless steel sheet on top, applying a photoresist to the stainless steel sheet, and performing exposure, development and etching, but in this step, a predetermined pattern was formed on the stainless steel sheet using a mask different from that of example 1, and the planar view after this step is shown in fig. 12, and further, a plan view of the stainless steel sheet in the circuit board produced in this example is shown in fig. 13, a plan view of the polyimide layer in the circuit board produced in this example is shown in fig. 9, and a plan view of the copper foil wiring port in the circuit board produced in this example is shown in fig. 10.
Claims (1)
1. A method for manufacturing a suspension circuit board containing polyimide, comprising: the manufacturing method of the circuit substrate comprises the following steps:
(1) preparing a copper-clad plate: pressing a stainless steel sheet of 10-40 microns, a polyimide film of 10-40 microns and a copper foil of 10-30 microns at 150-200 ℃ under the pressure of 2-5 MPa for 0.5-3 h from bottom to top to obtain a copper-clad plate;
(2) pre-etching of copper foil: forming a predetermined pattern on a copper foil by coating a photoresist on the copper foil and performing exposure, development and etching;
(3) processing of the polyimide film: processing the polyimide film by using the copper foil pattern subjected to pre-etching as a mask and using a carbon dioxide laser beam, and blowing 10-30L/min of air to a system during processing so as to take away processed waste, thereby obtaining a polyimide pattern with the same pattern as the copper foil; wherein the carbon dioxide laser beam is a pulse laser, and the energy density of 1 pulse is 3-7J/cm2The frequency is 10kHz, the pulse peak output is 500-5000W, and the laser wavelength is 9.6 mu m;
(4) further etching of the copper foil: forming a final copper foil wiring port by coating a photoresist on a pre-etched copper foil and performing exposure, development and etching;
(5) coating of a protective layer: a 2-7 mu m nickel protective layer is vapor-plated on the copper foil pattern, then a layer of epoxy resin with the thickness of 15-40 mu m is coated to protect the copper foil and the nickel layer, and the temperature is kept at 100-200 ℃ for 0.5-4 h to solidify the epoxy resin;
(6) etching of stainless steel sheets: a stainless steel sheet is placed on top, and a predetermined pattern is formed on the stainless steel sheet by coating a photoresist on the stainless steel sheet and performing exposure, development and etching, resulting in the suspension circuit substrate of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111024788.6A CN113709988A (en) | 2021-09-02 | 2021-09-02 | Manufacturing method of polyimide-containing suspension circuit substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111024788.6A CN113709988A (en) | 2021-09-02 | 2021-09-02 | Manufacturing method of polyimide-containing suspension circuit substrate |
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| CN113709988A true CN113709988A (en) | 2021-11-26 |
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| CN202111024788.6A Pending CN113709988A (en) | 2021-09-02 | 2021-09-02 | Manufacturing method of polyimide-containing suspension circuit substrate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918114A (en) * | 1995-04-28 | 1997-01-17 | Sony Chem Corp | Production of flexible circuit board |
| JPH10224008A (en) * | 1997-02-10 | 1998-08-21 | Nippon Steel Chem Co Ltd | Method for manufacturing suspension substrate |
| JP2000099910A (en) * | 1998-09-25 | 2000-04-07 | Nippon Steel Chem Co Ltd | Production of suspension substrate |
| CN101681628A (en) * | 2007-04-18 | 2010-03-24 | 大日本印刷株式会社 | Substrate for suspension, method for producing the same, magnetic head suspension, and hard disk drive |
| JP2010067317A (en) * | 2008-09-11 | 2010-03-25 | Dainippon Printing Co Ltd | Substrate for suspension |
| KR20130078230A (en) * | 2011-12-30 | 2013-07-10 | (주)인터플렉스 | A method for manufacturing flexible printed circuit board |
-
2021
- 2021-09-02 CN CN202111024788.6A patent/CN113709988A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918114A (en) * | 1995-04-28 | 1997-01-17 | Sony Chem Corp | Production of flexible circuit board |
| JPH10224008A (en) * | 1997-02-10 | 1998-08-21 | Nippon Steel Chem Co Ltd | Method for manufacturing suspension substrate |
| JP2000099910A (en) * | 1998-09-25 | 2000-04-07 | Nippon Steel Chem Co Ltd | Production of suspension substrate |
| CN101681628A (en) * | 2007-04-18 | 2010-03-24 | 大日本印刷株式会社 | Substrate for suspension, method for producing the same, magnetic head suspension, and hard disk drive |
| JP2010067317A (en) * | 2008-09-11 | 2010-03-25 | Dainippon Printing Co Ltd | Substrate for suspension |
| KR20130078230A (en) * | 2011-12-30 | 2013-07-10 | (주)인터플렉스 | A method for manufacturing flexible printed circuit board |
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