CN113707203A - Temperature value output control circuit, temperature value output control method and electronic system - Google Patents
Temperature value output control circuit, temperature value output control method and electronic system Download PDFInfo
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Abstract
The invention provides a temperature value output control circuit, a temperature value output control method and an electronic system, wherein the temperature value output control circuit is arranged in a peripheral circuit of a memory tube core and comprises the following steps: a temperature value output module configured to receive a temperature data signal output by the temperature sensor; and a control module configured to acquire a temperature signal in response to receiving a request from outside the memory die and generate a control signal for driving the temperature value output module to output the temperature data signal, the temperature value output control circuit provided by the present invention does not need to perform an array operation issued by a host before outputting the temperature data signal because a stable temperature data signal is to be acquired, thereby effectively reducing an operation time required when outputting the temperature data signal.
Description
Technical Field
The invention relates to the technical field of memories, in particular to a temperature value output control circuit, a temperature value output control method and an electronic system.
Background
The NAND flash memory is provided with a temperature sensor for detecting the temperature of the NAND flash memory, and the NAND flash memory can perform corresponding temperature compensation on parameters such as the critical voltage, the time sequence and the like of a storage unit of the NAND flash memory through the temperature detected by the temperature sensor so as to enable the storage unit to be better controlled, and a host can perform related configuration of the host according to the detected temperature.
However, in the prior art, when the host needs to obtain the temperature value of the NAND flash memory, the host needs to send an array operation (such as program/read/erase) to the NAND flash memory first, and the temperature value of the NAND flash memory is output to the host only after the temperature value output by the array operation is a stable value, which causes the host to wait for a long time when obtaining the temperature value of the NAND flash memory.
Disclosure of Invention
In order to solve one or more of the problems of the prior art, the present invention provides a temperature value output control circuit disposed in a peripheral circuit of a memory die, the temperature value output control circuit including:
a temperature value output module configured to receive a temperature data signal output by the temperature sensor; and the number of the first and second groups,
a control module configured to generate a control signal for driving the temperature value output module to output the temperature data signal in response to receiving a request to acquire a temperature signal from outside the memory die.
Further preferably, the control module is further configured to:
the control signal for driving the temperature value output module can be generated without receiving an instruction to operate a memory array from outside the memory die but upon receiving a request to acquire a temperature signal from a host; and/or
The control signal for driving the temperature value output module can be generated upon receiving an instruction to operate a memory array from outside the memory die and upon receiving a request to acquire a temperature signal from a host.
Further preferably, the control module is further configured to:
and determining a temperature value for outputting the temperature data signal according to the change of the temperature data signal when the request for acquiring the temperature signal is received.
Further preferably, the control module is further configured to:
if the temperature data signal is at a stable value when the request for acquiring the temperature signal is received, generating a temperature state signal which corresponds to the temperature data signal and represents that the current temperature state is effective, and outputting the stable value as a temperature value of the temperature data signal; and/or
And if the temperature data signal changes dynamically when the request for acquiring the temperature signal is received, generating a temperature state signal which corresponds to the temperature data signal and indicates that the current temperature state is invalid until the temperature data signal is at a stable value, and converting the temperature state signal which indicates that the current temperature state is invalid into the temperature state signal which indicates that the current temperature state is valid.
Further preferably, the control module is further configured to:
generating the control signal in response to the request to acquire a temperature signal and the temperature status signal indicating that the current temperature status is valid.
Further preferably, the temperature value output control circuit is disposed in a microcontroller of the peripheral circuit, and the control module further includes:
a temperature state signal processing unit configured to: and carrying out clock synchronization processing on the received temperature state signal based on a system clock signal of the microcontroller so as to obtain the temperature state signal synchronized by the system clock signal.
Further preferably, the temperature value output control circuit is disposed in a microcontroller of the peripheral circuit, and the control module further includes:
a request acquisition temperature signal processing unit configured to: and carrying out clock synchronization processing on the received temperature signal requesting to acquire based on the system clock signal of the microcontroller so as to acquire the temperature signal requesting to acquire after the system clock signal is synchronized.
Further preferably, the temperature value output control circuit is provided in a microcontroller of the peripheral circuit, and the temperature value output control circuit further includes:
a synchronization module configured to: and performing clock synchronization processing on the temperature data signal output by the temperature value output module based on a system clock signal of the microcontroller to obtain a temperature data signal synchronized by the system clock signal.
Further preferably, the memory die is a three-dimensional NAND flash memory.
On the other hand, the invention also provides a temperature value output control method, which comprises the following steps:
obtaining a request-to-obtain temperature signal from outside the memory die;
in response to the request to acquire a temperature signal, a control signal to output a temperature data signal from a temperature sensor is generated.
Further preferably, before the step of generating the control signal for outputting the temperature data signal from the temperature sensor, the method further includes:
and determining a temperature value for outputting the temperature data signal according to the change of the temperature data signal of the temperature sensor when the temperature signal is requested to be acquired.
Further preferably, the step of determining a temperature value for outputting the temperature data signal according to the change of the temperature data signal of the temperature sensor when the temperature signal is acquired as the request to acquire the temperature signal includes:
if the temperature data signal of the temperature sensor is at a stable value when the temperature signal is acquired, generating a temperature state signal corresponding to the temperature data signal and indicating that the current temperature state is effective, and outputting the stable value as the temperature value of the temperature data signal; and/or
If the temperature data signal of the temperature sensor is dynamically changed when the temperature signal is acquired and requested to be acquired, generating a temperature state signal which corresponds to the temperature data signal and indicates that the current temperature state is invalid until the temperature data signal is at a stable value, and converting the temperature state signal which indicates that the current temperature state is invalid into the temperature state signal which indicates that the current temperature state is invalid.
Further preferably, the step of generating a control signal for outputting a temperature data signal from a temperature sensor specifically includes:
generating the control signal in response to the request to acquire a temperature signal and the temperature status signal indicating that the current temperature status is valid.
Further preferably, the temperature value output control method further includes:
and carrying out clock synchronization processing on the received temperature state signal based on a system clock signal of a microcontroller of a peripheral circuit of the memory die so as to obtain the temperature state signal synchronized by the system clock signal.
Further preferably, the temperature value output control method further includes:
and performing clock synchronization processing on the temperature data signal based on a system clock signal of a microcontroller of a peripheral circuit of the memory die, so as to obtain the temperature data signal synchronized by the system clock signal.
Further preferably, in the step of generating a control signal to output a temperature data signal from the temperature sensor:
generating the control signal for driving the temperature value output module without receiving an instruction to operate a memory array from outside the memory die but with receiving a request to acquire a temperature signal from a host; or
Generating the control signal for driving the temperature value output module upon receiving an instruction to operate a storage array from outside the memory die and upon receiving a request to acquire a temperature signal from a host.
In another aspect, the present invention also provides an electronic system, including:
a memory die for storing data;
a memory controller or host coupled to the memory die;
wherein any one of the temperature value output control circuits is arranged in a peripheral circuit of the memory die;
the memory controller or the host is provided with a component for generating any one of the above-mentioned temperature signal for requesting to obtain.
The embodiment of the invention has the beneficial effects that: according to the temperature value output control circuit provided by the disclosure, the memory die (die) does not need to execute array operation (such as programming/reading/erasing) sent by a host before outputting the temperature data signal because a stable temperature data signal is obtained, so that the operation time required when the temperature data signal is output is effectively reduced, unnecessary operations such as programming/reading/erasing can be effectively reduced because the array operation sent by the host is not needed, and the host is prevented from being interfered.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments according to the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a temperature value output control circuit according to an embodiment of the present invention.
Fig. 2 is a detailed structure diagram of a temperature value output control circuit according to an embodiment of the invention.
Fig. 3 is a timing diagram of a temperature value output control circuit according to an embodiment of the invention.
Fig. 4 is a flowchart illustrating a method for controlling output of temperature values according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an electronic system according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The embodiment of the invention is used for solving the problem that the host computer has long waiting time when acquiring the temperature value of the NAND flash memory in the prior art.
Referring to fig. 1, fig. 1 is a schematic structural diagram illustrating a temperature value output control circuit 100 according to an embodiment of the present invention, in which components of the temperature value output control circuit 100 according to an embodiment of the present invention and relative positions of the components can be intuitively embodied.
As shown in fig. 1, the temperature value output control circuit 100 is disposed in a peripheral circuit of a memory die, and includes a temperature value output module 110 and a control module 120, wherein:
the temperature value output module 110 is configured to receive the temperature Data signal Data output by the temperature sensor 200;
Further, in the prior art, the host 300 issues an array operation (e.g. program/read/erase) to the memory, and after the temperature value outputted by the array operation is a stable value, the temperature value of the memory is outputted to the host 300. In this embodiment, regardless of whether the memory receives an instruction for operating the memory array from outside the memory die, the Control signal Control for driving the temperature value output module 110 is generated according to the Request of the host 300 to obtain the temperature signal Request, so that the temperature value output module 110 outputs the temperature Data signal Data, for example, the Control module 120 is further configured to:
in the case where an instruction to operate the memory array is not received from outside the memory die but a Request to acquire the temperature signal Request is received from the host 300, a Control signal Control for driving the temperature value output module 110 can be generated; and/or
The Control signal Control for driving the temperature value output module 110 can be generated in case of receiving an instruction to operate the memory array from outside the memory die and in case of receiving a Request to acquire a temperature signal Request from the host 300.
Specifically, the Request to acquire the temperature signal Request may come from the host 300 or from the memory controller of the memory die.
It should be noted that, when the temperature Data signal Data is in the process of changing from the previous temperature value to the current temperature value, the temperature Data signal Data is in the Data change state, and in this state, the temperature value represented by the temperature Data signal Data is not a stable value. Since the temperature Data signal Data may be in a Data change state or a stable value when receiving the Request to acquire the temperature signal Request, the control module 120 is further configured to: and determining the temperature value for outputting the temperature Data signal Data according to the change of the temperature Data signal Data when the Request for acquiring the temperature signal Request is received.
Specifically, referring to fig. 2 and fig. 3, fig. 2 is a detailed structure diagram of the temperature value output control circuit 100 according to an embodiment of the present invention, and fig. 3 is a timing diagram of the temperature value output control circuit 100 according to an embodiment of the present invention, as shown in the following figures:
if the control module 120 receives a Request for acquiring the temperature signal Request, the temperature Data signal Data is at a stable value, the temperature sensor 200 generates a temperature State signal State corresponding to the temperature Data signal Data and indicating that the current temperature State is valid, and outputs the stable value as a temperature value of the temperature Data signal Data; and/or
If the control module 120 receives a Request for acquiring the temperature signal Request and the temperature Data signal Data is dynamically changed, the temperature sensor 200 generates a temperature State signal State indicating that the current temperature State is invalid corresponding to the temperature Data signal, and the temperature sensor 200 does not convert the temperature State signal State indicating that the current temperature State is invalid into a temperature State signal State indicating that the current temperature State is valid until the temperature Data signal Data is at a stable value.
It should be noted that, as shown in fig. 3, in one embodiment, the temperature sensor has the second clock CLK _2, before the temperature Data signal Data dynamically changes, the temperature State signal State lasts for at least three periods of the second clock CLK _2 to indicate that the current temperature State is invalid, and when the temperature Data signal Data is at a stable value and lasts for at least one period of the second clock CLK _2, the temperature sensor 200 converts the temperature State signal State indicating that the current temperature State is invalid into the temperature State signal State indicating that the current temperature State is valid.
Further, the Control module 120 has a second logic unit 123, and the second logic unit 123 generates the Control signal Control in response to the Request for obtaining the temperature signal Request and the temperature State signal State indicating that the current temperature State is valid. Specifically, in one embodiment, the second logic unit 123 may be an and gate, or other logic element that may respond to the above-described operations.
Further, the temperature value output control circuit 100 is disposed in a microcontroller of the peripheral circuit, and the control module 120 further includes a request acquisition temperature signal processing unit 121 and a temperature state signal processing unit 122, and the temperature value output control circuit 100 further includes a synchronization module 130, wherein:
the request acquisition temperature signal processing unit 121 is configured to: performing clock synchronization processing on the received Request acquisition temperature signal Request based on a system clock signal CLK _ mcu of the microcontroller to obtain a Request acquisition temperature signal Request _ Sync synchronized by the system clock signal CLK _ mcu;
the temperature state signal processing unit 122 is configured to: performing clock synchronization processing on the received temperature State signal State based on a system clock signal CLK _ mcu of the microcontroller to obtain a temperature State signal State _ Sync synchronized by the system clock signal CLK _ mcu;
the synchronization module 130 is configured to: the temperature Data signal Data output by the temperature value output module 110 is subjected to clock synchronization processing based on the system clock signal CLK _ mcu of the microcontroller to obtain a temperature Data signal Data _ Sync synchronized by the system clock signal CLK _ mcu.
In one embodiment, the temperature value output control circuit 100 performs two-stage clock synchronization on the received Request temperature signal Request based on the system clock signal CLK _ mcu, and the temperature value output control circuit 100 performs two-stage clock synchronization on the received temperature State signal State based on the system clock signal CLK _ mcu.
Further, the temperature value output module 110 has a first logic unit 111, and the first logic unit 111 outputs the temperature Data signal Data in response to the Control signal Control. Specifically, in one embodiment, the first logic unit 111 may be an alternative data selector, or other logic element that may respond to the above-described operations.
Further, in one embodiment, the memory die may be a three-dimensional NAND flash memory.
Different from the prior art, the present invention provides a temperature value output control circuit 100, which is disposed in a peripheral circuit of a memory die, wherein the temperature value output control circuit 100 includes: a temperature value output module 110 configured to receive a temperature Data signal Data output by the temperature sensor 200; and a Control module 120 configured to generate a Control signal Control for driving the temperature value output module 110 to output the temperature Data signal Data in response to receiving a Request for acquiring the temperature signal Request from outside the memory die, the present invention provides the temperature value output Control circuit 100, without performing an array operation (such as program/read/erase) issued by the host 300 before outputting the temperature Data signal Data because stable temperature Data signal Data is acquired, thereby effectively reducing an operation time required when outputting the temperature Data signal Data, and since the array operation issued by the host 300 is not required to be performed, unnecessary operations such as program/read/erase can be effectively reduced, thereby effectively preventing the host 300 from being interfered.
Referring to fig. 4, fig. 4 is a schematic flow chart of a temperature value output control method according to an embodiment of the present invention, and referring to fig. 2 illustrating a detailed structure of a temperature value output control circuit 100 according to an embodiment of the present invention, a specific flow of the temperature value output control method may be as follows:
acquisition step S101: obtaining a Request obtaining temperature signal Request from the outside of the memory tube core;
a generation step S102: in response to the Request for acquiring the temperature signal Request, a Control signal Control to output the temperature Data signal Data from the temperature sensor 200 is generated.
Note that, when receiving the Request for acquiring the temperature signal Request, the temperature Data signal Data may be at a stable value, or the temperature value represented by the temperature Data signal Data may not be a stable value due to a Data change state in which the previous temperature value is changed to the current temperature value, and therefore, before the generating step S102, the method further includes:
a determination step: and determining the temperature value for outputting the temperature Data signal Data according to the change of the temperature Data signal Data of the temperature sensor 200 when the temperature signal Request is acquired.
Specifically, the determining step may include:
a first output step: if the temperature Data signal Data of the temperature sensor 200 is in a stable value when the Request for acquiring the temperature signal Request is acquired, generating a temperature State signal State which corresponds to the temperature Data signal Data and indicates that the current temperature State is valid, and outputting the stable value as the temperature value of the temperature Data signal Data; and/or the presence of a gas in the gas,
a second output step: if the temperature Data signal Data of the temperature sensor 200 is dynamically changed when the Request for acquiring the temperature signal Request is acquired, the temperature State signal State which corresponds to the temperature Data signal Data and indicates that the current temperature State is invalid is generated until the temperature Data signal Data is at a stable value, and the temperature State signal State which indicates that the current temperature State is invalid is converted into the temperature State signal State which indicates that the current temperature State is invalid.
Further, the generating step S102 specifically includes:
the Control signal Control is generated in response to the Request for obtaining the temperature signal Request and the temperature State signal State indicating that the current temperature State is valid.
Further, after receiving the temperature State signal State and the temperature Data signal Data, the signals need to be synchronized with the system clock signal CLK _ mcu of the memory die, so that the signals are consistent with the system clock signal CLK _ mcu of the memory die, for example, the temperature value output control method may include:
a first synchronization step: performing clock synchronization processing on the received temperature State signal State based on a system clock signal CLK _ mcu of a microcontroller of a peripheral circuit of a memory die, so as to obtain a temperature State signal State _ Sync synchronized by the system clock signal CLK _ mcu; and the number of the first and second groups,
a second synchronization step: and performing clock synchronization processing on the temperature Data signal Data based on a system clock signal CLK _ mcu of a microcontroller of a peripheral circuit of the memory die, so as to obtain the temperature Data signal Data _ Sync synchronized by the system clock signal CLK _ mcu.
Further, in the prior art, the host 300 issues an array operation (e.g. program/read/erase) to the memory, and after the temperature value outputted by the array operation is a stable value, the temperature value of the memory is outputted to the host 300. In this embodiment, regardless of whether the memory receives an instruction for operating the memory array from outside the memory die, the Control signal Control for driving the temperature value output module 110 is generated according to the Request of the host 300 to obtain the temperature signal Request, so that the temperature value output module 110 outputs the temperature Data signal Data, for example, the generating step S102 specifically includes:
in the case where an instruction to operate the memory array is not received from outside the memory die but a Request to acquire the temperature signal Request is received from the host 300, a Control signal Control for driving the temperature value output module 110 can be generated; and/or the presence of a gas in the gas,
the Control signal Control for driving the temperature value output module 110 can be generated in case of receiving an instruction to operate the memory array from outside the memory die and in case of receiving a Request to acquire a temperature signal Request from the host 300.
Different from the prior art, the invention provides a temperature value output control method, which comprises the following steps: the temperature value output Control method provided by the invention does not need to execute array operation (such as programming/reading/erasing) sent by the host 300 before outputting the temperature Data signal Data because stable temperature Data signal Data is required to be obtained, thereby effectively reducing the operation time required when the temperature Data signal Data is output, and can effectively reduce unnecessary operations such as programming/reading/erasing and the like because the array operation sent by the host 300 is not required to be executed, thereby effectively avoiding the host 300 from being interfered.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic system 400 according to an embodiment of the invention, from which components of the electronic system 400 according to an embodiment of the invention and relative position relationships of the components can be intuitively embodied.
As shown in fig. 5, the electronic system 400 includes a storage device 500 and the host 300, wherein the storage device 500 includes: a memory die 501 for storing data and a memory controller 502, the memory die 501 is coupled with the memory controller 502 and the host 300, and the memory controller 502 or the host 300 is provided with a component for generating the Request to acquire the temperature signal Request.
Further, the memory die 501 includes: the peripheral circuit 5011 and the memory array 5012, the temperature sensor 200 and the temperature value output control circuit 100 described above are provided in the peripheral circuit 5011.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by using equivalents or equivalent substitutions fall within the protection scope of the claims of the present invention.
In summary, although the preferred embodiments of the present invention have been described above, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (17)
1. A temperature value output control circuit provided in a peripheral circuit of a memory die, the temperature value output control circuit comprising:
a temperature value output module configured to receive a temperature data signal output by the temperature sensor; and the number of the first and second groups,
a control module configured to generate a control signal for driving the temperature value output module to output the temperature data signal in response to receiving a request to acquire a temperature signal from outside the memory die.
2. The temperature value output control circuit of claim 1, wherein the control module is further configured to:
the control signal for driving the temperature value output module can be generated without receiving an instruction to operate a memory array from outside the memory die but upon receiving a request to acquire a temperature signal from a host; and/or
The control signal for driving the temperature value output module can be generated upon receiving an instruction to operate a memory array from outside the memory die and upon receiving a request to acquire a temperature signal from a host.
3. The temperature value output control circuit of claim 1, wherein the control module is further configured to:
and determining a temperature value for outputting the temperature data signal according to the change of the temperature data signal when the request for acquiring the temperature signal is received.
4. The temperature value output control circuit of claim 3, wherein the control module is further configured to:
if the temperature data signal is at a stable value when the request for acquiring the temperature signal is received, generating a temperature state signal which corresponds to the temperature data signal and represents that the current temperature state is effective, and outputting the stable value as a temperature value of the temperature data signal; and/or
And if the temperature data signal changes dynamically when the request for acquiring the temperature signal is received, generating a temperature state signal which corresponds to the temperature data signal and indicates that the current temperature state is invalid until the temperature data signal is at a stable value, and converting the temperature state signal which indicates that the current temperature state is invalid into the temperature state signal which indicates that the current temperature state is valid.
5. The temperature value output control circuit of claim 4, wherein the control module is further configured to:
generating the control signal in response to the request to acquire a temperature signal and the temperature status signal indicating that the current temperature status is valid.
6. The temperature value output control circuit according to claim 1, wherein the temperature value output control circuit is provided in a microcontroller of the peripheral circuit, and the control module further comprises:
a temperature state signal processing unit configured to: and carrying out clock synchronization processing on the received temperature state signal based on a system clock signal of the microcontroller so as to obtain the temperature state signal synchronized by the system clock signal.
7. The temperature value output control circuit according to claim 1, wherein the temperature value output control circuit is provided in a microcontroller of the peripheral circuit, and the control module further comprises:
a request acquisition temperature signal processing unit configured to: and carrying out clock synchronization processing on the received temperature signal requesting to acquire based on the system clock signal of the microcontroller so as to acquire the temperature signal requesting to acquire after the system clock signal is synchronized.
8. The temperature value output control circuit according to claim 1, wherein the temperature value output control circuit is provided in a microcontroller of the peripheral circuit, and the temperature value output control circuit further comprises:
a synchronization module configured to: and performing clock synchronization processing on the temperature data signal output by the temperature value output module based on a system clock signal of the microcontroller to obtain a temperature data signal synchronized by the system clock signal.
9. The temperature value output control circuit of claim 1, wherein the memory die is a three-dimensional NAND flash memory.
10. A temperature value output control method, characterized by comprising:
obtaining a request-to-obtain temperature signal from outside the memory die;
in response to the request to acquire a temperature signal, a control signal to output a temperature data signal from a temperature sensor is generated.
11. The temperature value output control method according to claim 10, characterized by, before the step of generating a control signal to output the temperature data signal from the temperature sensor, further comprising:
and determining a temperature value for outputting the temperature data signal according to the change of the temperature data signal of the temperature sensor when the temperature signal is requested to be acquired.
12. The method according to claim 11, wherein the step of determining the temperature value for outputting the temperature data signal according to the change in the temperature data signal of the temperature sensor when the temperature signal acquisition request is acquired specifically includes:
if the temperature data signal of the temperature sensor is at a stable value when the temperature signal is acquired, generating a temperature state signal corresponding to the temperature data signal and indicating that the current temperature state is effective, and outputting the stable value as the temperature value of the temperature data signal; and/or
If the temperature data signal of the temperature sensor is dynamically changed when the temperature signal is acquired and requested to be acquired, generating a temperature state signal which corresponds to the temperature data signal and indicates that the current temperature state is invalid until the temperature data signal is at a stable value, and converting the temperature state signal which indicates that the current temperature state is invalid into the temperature state signal which indicates that the current temperature state is invalid.
13. The method for controlling output of temperature values according to claim 12, wherein the step of generating a control signal for outputting a temperature data signal from a temperature sensor specifically comprises:
generating the control signal in response to the request to acquire a temperature signal and the temperature status signal indicating that the current temperature status is valid.
14. The temperature value output control method according to claim 10, characterized by further comprising:
and carrying out clock synchronization processing on the received temperature state signal based on a system clock signal of a microcontroller of a peripheral circuit of the memory die so as to obtain the temperature state signal synchronized by the system clock signal.
15. The temperature value output control method according to claim 10, characterized by further comprising:
and performing clock synchronization processing on the temperature data signal based on a system clock signal of a microcontroller of a peripheral circuit of the memory die, so as to obtain the temperature data signal synchronized by the system clock signal.
16. The temperature value output control method according to claim 10, wherein in the step of generating a control signal to output the temperature data signal from the temperature sensor:
generating the control signal for driving the temperature value output module without receiving an instruction to operate a memory array from outside the memory die but with receiving a request to acquire a temperature signal from a host; or
Generating the control signal for driving the temperature value output module upon receiving an instruction to operate a storage array from outside the memory die and upon receiving a request to acquire a temperature signal from a host.
17. An electronic system, comprising:
a memory die for storing data;
a memory controller or host coupled to the memory die;
wherein the temperature value output control circuit of claims 1 to 9 is provided in a peripheral circuit of the memory die;
means are provided in the memory controller or host for generating the request for temperature signal as claimed in claims 1 to 9.
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