CN113703257A - Camera CCD heat abstractor suitable for ultra-thin space - Google Patents
Camera CCD heat abstractor suitable for ultra-thin space Download PDFInfo
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- CN113703257A CN113703257A CN202110795942.3A CN202110795942A CN113703257A CN 113703257 A CN113703257 A CN 113703257A CN 202110795942 A CN202110795942 A CN 202110795942A CN 113703257 A CN113703257 A CN 113703257A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
Abstract
The invention discloses a camera CCD heat dissipation device suitable for an ultrathin space, which relates to the technical field of spacecraft thermal control and comprises the following components: a stress-relieving heat-conducting copper strip and a heat radiator; the CCD device is adhered to one end of the stress-removing heat-conducting copper strip; the other end of the stress-removing heat-conducting copper strip is adhered to the heat radiator; the thickness of the stress-removing heat-conducting copper strip is gradually increased from one end corresponding to the CCD device to one end corresponding to the heat radiator, the thickness of one end connected with the CCD device is 1mm +/-x, and the thickness of one end connected with the heat radiator is more than or equal to 2 mm; wherein x is a set value less than 0.5 mm.
Description
Technical Field
The invention relates to the technical field of spacecraft thermal control, in particular to a camera CCD heat dissipation device suitable for an ultrathin space.
Background
The CCD device is used as a core detection device of the space camera, has higher requirements on the temperature level, and the temperature level directly influences the signal-to-noise ratio of the device, thereby influencing the imaging quality of the space camera. Considering that the CCD device has large power consumption and small heat capacity, the efficient heat dissipation of the CCD device during working is the key point of the thermal control of the CCD device.
At present, two methods are mainly used for heat dissipation of a CCD device:
1) the space camera has no focusing requirement in an on-orbit manner, and the CCD device is directly communicated with the heat radiator through the space heat pipe to form a heat dissipation channel of the CCD device → the heat pipe → the heat radiator. The heat dissipation channel has simple link, small total heat resistance of the whole link and high heat transfer efficiency. The defect is that the heat pipe has certain rigidity, and the mechanical response of the external heat radiator has certain influence on the CCD device through the heat pipe. In addition, the installation of the heat pipe requires an installation space with a height of 5mm or more on the installation interface of the CCD device.
2) The space camera has focusing requirements on an on-orbit, and the heat dissipation channel has certain on-orbit size adjusting capacity. Usually, a plurality of heat pipes are matched with a flexible heat conducting cable to form a heat dissipation channel of the CCD device → the heat pipe i → the heat conducting cable → the heat pipe ii → the heat radiator. The advantage of this mode lies in that the flexible section of heat conduction cable also can block off the influence of heat radiator mechanical response to inside CCD device completely when guaranteeing camera in-orbit focusing. The defects are that the channel link is relatively complex, the whole link has high thermal resistance and low heat transfer efficiency. In addition, the heat transfer link of the heat pipe and the heat conducting cable needs to leave an installation space with a height of more than 5mm at the CCD installation interface part.
For some special space loads, the space available for the mounting interface is extremely limited, subject to the device mounting characteristics. If the length of a pin of a CCD detector of a certain space camera is only 3.8mm, the thickness of a circuit board of the detector is 1.6mm, the pin is required to be higher than the circuit board by more than 0.7mm by a CCD welding process, and the height space of a mounting interface of a CCD device only used for heat dissipation is not more than 1.5mm, the two methods cannot be used. Thermal control of the CCD device becomes a critical issue that must be addressed at this time and is a bottleneck in the thermal design of such cameras.
Disclosure of Invention
In view of the above, the invention provides a camera CCD heat dissipation device suitable for an ultrathin space, wherein a stress-free heat conduction copper strip is combined with a CCD device and a heat radiator, so that the temperature of the CCD device in a narrow temperature zone is controlled, and the device is efficient, flexible, small in size and stable in temperature; the problem of CCD device heat transmission of working in twinkling of an eye under millimeter level spatial dimension is solved to and the interference problem of mechanical response to CCD device on the outside heat dissipation link.
The technical scheme of the invention is as follows: a camera CCD heat dissipation device suitable for ultra-thin space includes: a stress-relieving heat-conducting copper strip and a heat radiator; the CCD device is adhered to one end of the stress-removing heat-conducting copper strip; the other end of the stress-removing heat-conducting copper strip is adhered to the heat radiator; the thickness of the stress-removing heat-conducting copper strip is gradually increased from one end corresponding to the CCD device to one end corresponding to the heat radiator, the thickness of one end connected with the CCD device is 1mm +/-x, and the thickness of one end connected with the heat radiator is more than or equal to 2 mm; wherein x is a set value less than 0.5 mm.
Preferably, two ends of the stress-relief heat-conducting copper strip are respectively connected with the CCD device and the heat radiator through connectors.
Preferably, the connecting piece is made of GD414C silicon rubber.
Preferably, the thickness of the end, connected with the CCD device, of the stress-removing heat-conducting copper belt is 1 mm.
Preferably, the destressing heat-conducting copper strip consists of a rigidity strengthening area, a curing area I, a flexible area and a curing area II; the rigidity strengthening area is used as a base layer, a set size is reserved in the length direction of the rigidity strengthening area and used for being connected with a CCD device, and a plurality of layers of copper foils are additionally arranged on the rest part of the rigidity strengthening area and are sequentially reserved with set sizes in the length direction to be used as a curing area I and a flexible area; the rest part is additionally provided with a plurality of layers of copper foils, then is pressed and welded into a curing area II and is used for being connected with a heat radiator; wherein, the curing area I is formed by pressing and welding, and the flexible area is formed by naturally overlapping a plurality of layers of copper foils.
Preferably, the copper foil has a thickness of 0.01mm to 0.08 mm.
Preferably, the rigidity strengthening area is formed by compounding, pressing and welding 50 layers of copper foil with the thickness of 0.02mm and 2 layers of stainless steel wire meshes; wherein, 2 layers of stainless steel screens are symmetrically arranged in 50 layers of copper foils with the thickness of 0.02mm along the thickness direction of the rigidity strengthening area.
Preferably, the thickness of the solidified area I is 1.5mm, and 75 layers of copper foils with the thickness of 0.02mm are adopted for pressing and welding.
Preferably, the thickness of the flexible region is 1.5mm, and the flexible region is formed by naturally overlapping 75 layers of copper foils with the thickness of 0.02 mm; the total length of the flexible region is 17mm, and the fillet bending is realized through bending.
Preferably, the thickness of the end, connected with the heat radiator, of the stress-relief heat-conducting copper strip is 3mm, and the stress-relief heat-conducting copper strip is formed by pressing and welding 150 layers of copper foils with the thickness of 0.02 mm.
Has the advantages that:
1. the stress-free heat-conducting copper strip designed by the CCD heat dissipation device is thin in size (millimeter level), and can transfer instantaneous working heat loss of a CCD device to the heat radiator, so that the heat radiator radiates the instantaneous working heat loss of the CCD device to a cold space, the problem of external heat dissipation of the CCD under the constraint of millimeter-level ultrathin space scale is solved, and a heat transfer link of the CCD heat dissipation device is simple and reliable.
2. The CCD heat dissipation device is characterized in that the stress-free heat-conducting copper strip is connected with the CCD device and the heat radiator through the connecting piece, so that the thermal contact resistance between the CCD device and the stress-free heat-conducting copper strip and the thermal contact resistance between the stress-free heat-conducting copper strip and the heat radiator can be obviously reduced.
3. The stress-removing heat-radiating copper strip is specifically arranged, so that the heat conduction requirement of a product can be effectively met, and meanwhile, the structural mechanics and space constraints are considered.
4. According to the invention, the rigidity strengthening area is arranged in a manner of pressing and welding the copper foil composite stainless steel wire mesh, so that the rigidity of the installation area of the CCD device can be effectively improved, and the flatness control of the installation area is favorably improved.
5. According to the invention, a multi-layer copper foil composite mode is adopted to form a multi-layer copper foil flexible region, so that the mounting stress of a CCD device and the mechanical response influence of a heat radiator can be effectively absorbed.
Drawings
Fig. 1 is a schematic structural diagram of a CCD heat dissipation device according to the present invention.
FIG. 2 is a schematic structural view of a stress-relieved heat-conductive copper tape according to the present invention.
FIG. 3 is a schematic structural view of a stiffness enhancing region of a destressing heat-conducting copper strip according to the present invention.
The device comprises a CCD (charge coupled device) 1, a connecting piece 2, a stress-removing heat-conducting copper belt 3, a rigidity strengthening area 31, a copper foil 61, a stainless steel wire net 62, a curing area I32, a flexible area 33, a curing area II 34 and a heat radiator 4.
Detailed Description
The invention is described in detail below by way of example with reference to the accompanying drawings.
The embodiment provides a camera CCD heat dissipation device suitable for an ultrathin space, wherein a stress-free heat conduction copper strip is combined with a CCD device and a heat radiator, so that the temperature of the narrow-temperature-zone CCD device is controlled, and the device is efficient, flexible, small in size and stable in temperature; the problem of CCD device heat transmission of working in twinkling of an eye under millimeter level spatial dimension is solved to and the interference problem of mechanical response to CCD device on the outside heat dissipation link.
As shown in fig. 1, the CCD heat sink includes: the device comprises a stress-removing heat-conducting copper strip 3, a connecting piece 2 and a heat radiator 4; the CCD device 1 is directly bonded with one end of a destressing heat-conducting copper strip 3 through a connecting piece 2, so that a good heat-conducting relation between the destressing heat-conducting copper strip 3 and the CCD device 1 is ensured; the other end of the destressing heat-conducting copper strip 3 is adhered to the heat radiator 4 through the connecting piece 2 (in order to ensure the installation effect, installation holes are formed in the curing area II 34 and the heat radiator 4 in a matched mode, and the fixing is reinforced through screws), the destressing heat-conducting copper strip 3 is used for transmitting the instant working heat consumption of the CCD device 1 to the heat radiator 4, the heat radiator 4 is used for radiating the instant working heat consumption of the CCD device 1 to a cold space, and the connecting piece 2 is used for reducing the contact thermal resistance between the CCD device 1 and the destressing heat-conducting copper strip 3 as well as between the destressing heat-conducting copper strip 3 and the heat radiator 4; the thickness of the stress-free heat-conducting copper strip 3 is gradually increased from one end corresponding to the CCD device 1 to one end corresponding to the heat radiator 4, the thickness of one end, connected with the CCD device 1, of the stress-free heat-conducting copper strip 3 is 1mm +/-x (x is a set value smaller than 0.5mm, the thickness of one end, connected with the CCD device 1, of the stress-free heat-conducting copper strip 3 is preferably 1mm and is used for improving the rigidity of a product and providing support for processing of ensuring the flatness of 0.01mm in an installation area), and the thickness of one end, connected with the heat radiator 4, of the stress-free heat-conducting copper strip is more than or equal to 2mm (preferably 3mm) so as to ensure that the heat dissipation requirement of the CCD device 1 in a micro operation space is met;
note that the ultra-thin space refers to a space on a millimeter scale.
In the embodiment, as shown in fig. 2, in order to meet the heat conduction requirement of the product and simultaneously take structural mechanics and space constraints into consideration, the stress-free heat-conducting copper strip 3 is composed of a rigidity strengthening area 31, a curing area i 32, a flexible area 33 and a curing area ii 34; the rigidity strengthening area 31 serves as a base layer, a set size is reserved in the length direction of the rigidity strengthening area and used for being connected with the CCD device 1, a plurality of layers of copper foils 61 are additionally arranged on the rest part, and the set size is reserved in sequence along the length direction and used as a curing area I32 and a flexible area 33, wherein the curing area I32 can obviously strengthen the heat conduction capacity between the rigidity strengthening area 31 and the flexible area 33; the rest part is additionally provided with a plurality of layers of copper foils 61 and then is pressed and welded into a curing area II 34 (used for being connected with the heat radiator 4), thereby ensuring that the stress-free heat-conducting copper strip 3 has both heat transfer capacity and mounting structure strength; the first curing area 32 is formed by pressing and welding, the flexible area 33 is formed by naturally overlapping a plurality of layers of copper foils 61, the heat conduction capacity is met, meanwhile, the flexible area has certain flexibility, stress transfer of the first curing area 32 and the second curing area 34 can be effectively absorbed and released, and the influence of vibration frequency of more than 10Hz corresponding to the heat radiator 4 on the CCD device 1 is filtered.
In this embodiment, the thickness of the copper foil 61 may be arbitrarily selected from 0.01mm to 0.08 mm.
In this embodiment, as shown in fig. 3, the rigidity enhancing region 31 is formed by compounding, pressing and welding 50 layers of copper foils 61 with a thickness of 0.02mm and 2 layers of stainless steel wire meshes 62, so that not only is the heat transfer performance ensured, but also the rigidity is enhanced, the workability of the flatness of the mounting surface is improved, the heat transfer capability and the millimeter-scale thickness dimension constraint are met, and meanwhile, the rigidity of the mounting region is enhanced, which is beneficial to improving the flatness control of the mounting region; wherein, 2 layers of stainless steel wire net 62 are symmetrically arranged in 50 layers of copper foil 61 with the thickness of 0.02mm along the thickness direction of the rigidity strengthening area 31 (the symmetry axis is parallel to the length direction of the rigidity strengthening area 31).
In this embodiment, the thickness of the solidified zone i 32 is 1.5mm, and 75 layers of copper foil 61 with a thickness of 0.02mm are pressed and welded.
In the embodiment, in order to ensure the heat transfer capacity of the stress-relief heat-conducting copper strip 3 and strictly control the thickness and the length of the flexible region 33, the thickness of the flexible region 33 is 1.5mm, the flexible region is formed by naturally overlapping 75 layers of copper foils 61 with the thickness of 0.02mm, the total length is 17mm, and the fillet bending is realized through local bending, so that certain flexibility is maintained while the requirement on the installation size is ensured, and the influence of the installation stress and the mechanical response of the heat radiator 4 is effectively absorbed; meanwhile, the influence of the vibration frequency of 10Hz or more corresponding to the heat radiator 4 on the CCD device 1 can be filtered.
In the embodiment, in order to enhance the heat dissipation capability and ensure the strength of the mounting structure, the thickness of the solidification zone II 34 of the stress-free heat-conducting copper strip 3 is controlled to be 3mm, and 150 layers of copper foils 61 with the thickness of 0.02mm are pressed and welded to form the heat-conducting copper strip, so that the heat transfer capability and the strength of the mounting structure are both considered.
In this embodiment, the connecting member 2 is made of GD414C silicone rubber with low outgassing rate and low volatility, so that the influence of material volatilization of the connecting member 2 on the CCD device 1 is effectively reduced.
In this embodiment, the thickness of the mounting region of the CCD device 1 is controlled within 1mm, so as to satisfy the heat dissipation requirement of the CCD device 1 in the minute operating space.
In this embodiment, the area of the heat radiator 4 required is calculated according to the satellite orbit condition, the heat consumption of the CCD device 1 and the camera layout, the heat radiator 4 is made of an aluminum alloy plate 3mm thick, and KS-ZA white paint is sprayed to the cold space portion, and the white paint has a small emissivity absorption emission ratio and a strong heat dissipation capability.
When the heat dissipation device is used, the heat dissipation path of the CCD heat dissipation device is CCD device 1 → connecting piece 2 → stress-free heat conduction copper strip 3 → connecting piece 2 → heat radiator 4; adopt the destressing heat conduction copper strips 3 of special structural design, direct mount is at the back of CCD device 1, alleviates the influence of the mechanical response of heat radiator 4 to CCD device 1 through the flexible district 33 of destressing heat conduction copper strips 3, reduces thermal contact resistance through heat-conducting connecting piece 2 between the installation interface of destressing heat conduction copper strips 3 and CCD device 1 and heat radiator 4, promotes heat transfer efficiency.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a camera CCD heat abstractor suitable for ultra-thin space which characterized in that includes: a stress-removing heat-conducting copper strip (3) and a heat radiator (4); the CCD device (1) is adhered to one end of the stress-removing heat-conducting copper strip (3); the other end of the stress-removing heat-conducting copper strip (3) is bonded with the heat radiator (4); the stress-removing heat-conducting copper strip (3) gradually increases in thickness from one end corresponding to the CCD device (1) to one end corresponding to the heat radiator (4), the thickness of the end connected with the CCD device (1) is 1mm +/-x, and the thickness of the end connected with the heat radiator (4) is larger than or equal to 2 mm; wherein x is a set value less than 0.5 mm.
2. The camera CCD heat dissipation device suitable for the ultra-thin space as claimed in claim 1, wherein the two ends of the stress-free heat-conducting copper strip (3) are respectively connected with the CCD device (1) and the heat radiator (4) through the connecting piece (2).
3. The camera CCD heat sink adapted for ultra-thin space as claimed in claim 2, wherein said connector (2) uses GD414C silicone rubber.
4. The heat sink for CCD of camera suitable for ultra-thin space of claim 1, wherein the thickness of the end of the heat conducting copper strip (3) connected to the CCD device (1) is 1 mm.
5. The CCD heat dissipation device of the camera suitable for the ultra-thin space as claimed in any one of claims 1-4, wherein the stress-free heat-conducting copper strip (3) is composed of a rigidity strengthening area (31), a curing area I (32), a flexible area (33) and a curing area II (34); the rigidity strengthening area (31) is used as a base layer, a set size is reserved in the length direction of the rigidity strengthening area and used for being connected with the CCD device (1), and a plurality of layers of copper foils (61) are additionally arranged on the rest part of the rigidity strengthening area and sequentially reserved with set sizes in the length direction to be used as a curing area I (32) and a flexible area (33); the rest part is additionally provided with a plurality of layers of copper foils (61), then is pressed and welded into a curing area II (34) for connecting with the heat radiator (4); wherein, the curing area I (32) is formed by pressing and welding, and the flexible area (33) is formed by naturally overlapping a plurality of layers of copper foils (61).
6. The heat sink for camera CCD suitable for ultra thin space as claimed in claim 5, wherein the thickness of the copper foil (61) is 0.01 mm-0.08 mm.
7. The camera CCD heat dissipation device suitable for the ultra-thin space as claimed in claim 6, wherein the rigidity strengthening region (31) is formed by compound pressing and welding of 50 layers of copper foil (61) with the thickness of 0.02mm and 2 layers of stainless steel wire mesh (62); wherein, 2 layers of stainless steel wire nets (62) are symmetrically arranged in 50 layers of copper foils (61) with the thickness of 0.02mm along the thickness direction of the rigidity strengthening area (31).
8. The heat sink for camera CCD suitable for ultra-thin space as claimed in claim 6, wherein the thickness of the solidified area I (32) is 1.5mm, and 75 layers of copper foil (61) with 0.02mm thickness are pressed and welded.
9. The heat sink for camera CCD suitable for ultra thin space as claimed in claim 6, wherein the flexible region (33) has a thickness of 1.5mm, and is formed by naturally laminating 75 layers of 0.02mm thick copper foil (61); the total length of the flexible region (33) is 17mm, and the round corner bending is realized through bending.
10. The CCD heat sink for camera suitable for ultra-thin space as claimed in any one of claims 6-9, wherein the end of the heat radiator (4) connected with the stress-free heat-conducting copper strip (3) has a thickness of 3mm, and is formed by press welding 150 layers of 0.02mm thick copper foil (61).
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| CN202110795942.3A CN113703257B (en) | 2021-07-14 | 2021-07-14 | Camera CCD heat abstractor suitable for ultra-thin space |
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| CN202110795942.3A CN113703257B (en) | 2021-07-14 | 2021-07-14 | Camera CCD heat abstractor suitable for ultra-thin space |
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