JP5157266B2 - Radiator and method of manufacturing radiator - Google Patents

Description

  The present invention relates to a heat dissipation device used in electronic equipment such as a computer, a display device, a communication device, and a machine control device, and a method for manufacturing the heat dissipation device.

  2. Description of the Related Art In recent years, electronic devices that are used in electronic equipment have become highly functional, an increase in heat generation due to an increase in the amount of electric power associated with higher performance, and an increase in heat generation density due to a miniaturization process, and an electronic device that needs to be equipped with a heat dissipation device Has increased.

  In addition, there is a demand for higher performance of heat dissipation devices due to demands for electronic devices that are lighter, thinner, and shorter. Optimization of the structure using fluid simulation, miniaturization using the latest material processing technology, adoption of new high thermal conductivity materials, etc. The heat dissipation performance is improved in various ways.

By the way, in order to improve the performance of the heat dissipation device, heat generated from a heating element such as an electronic device is efficiently transmitted to the heat dissipation device, that is, the thermal resistance ( _RDH ) between the heating element and the heat dissipation device is reduced. It is necessary to suppress.

  When the heat radiating device is attached to the heating element, a slight air layer may be formed on the contact surface between the two according to the smoothness and flatness of the contact surface. Since the thermal conductivity of this air layer is extremely low, the presence of the air layer causes an increase in thermal resistance. Therefore, in order to reduce the thermal resistance, the contact surface is increased in smoothness and flatness to reduce the air layer, and in order to remove the air layer, the heating element and the heat radiating device have a high thermal conductivity ( Generally, bonding is performed by TIM (Thermal Interface Material).

  FIG. 7 is a diagram illustrating an example of an LSI device to which a conventional heat dissipation device is attached.

  FIG. 7A shows a heat dissipation device 90 including a heat dissipation member 91 having heat dissipation fins 91 a and a TIM layer 92 formed of a bonding material, and the heat dissipation device 90 is connected to the LSI (Large Scale Integration) via the TIM layer 92. FIG. 7B is a view showing an example of an LSI device with a heat radiating device formed by bonding to the device 93. FIG. 7B is a diagram showing a heat radiating member 91 having heat radiating fins 91a; FIG. 7C is a view showing another example of an LSI device with a heat radiating device formed by joining the heat radiating device 96 composed of the heat receiving member 95 and the TIM layer 92 and the heat radiating device 96 to the LSI device 93. ) Includes a liquid cooling jacket (heat receiving member) 97 having a liquid flow path 99 therein and a TIM layer 92, and a heat dissipation device 98. 8 is a view showing another example of an LSI device with a heat dissipation device formed by bonding the heat dissipation device 98 to an LSI device 93. FIG.

  FIG. 8 is a diagram showing a method of forming a LSI device with a heat dissipation device by bonding a conventional heat dissipation device to an LSI device.

  As shown in FIG. 8A, after the heat dissipation member 91 and the LSI device 93 are overlapped with the TIM layer 92 interposed therebetween, as shown in FIG. 8B, the heat dissipation member 91, the TIM layer 92, By applying a load P to the LSI device 93, the heat dissipation member 91 and the TIM layer 92 are joined, and the TIM layer 92 and the LSI device 93 are joined to obtain an LSI device with a heat dissipation device.

In order to reduce the thermal resistance in the heat dissipation device using the TIM layer described above,
(1) Increase the thermal conductivity of the TIM layer,
(2) Lower the thermal resistance between the TIM layer and the heating element and the thermal resistance between the TIM layer and the heat receiving member.
(3) shortening the distance between the heating element and the heat receiving member;
There are various methods, and many improvements have been made for each method.

  Generally, the material of the TIM layer is a grease (non-crosslinked resin such as silicone oil mixed with a heat conductive filler such as metal or ceramic) or a sheet (silicone rubber or other resin that can be crosslinked such as a heat conductive filler). Filled and cross-linked (see, for example, Patent Document 1) is used.

  Grease-based TIM material has good contact with the heating element and can be spread thinly, which is advantageous in terms of heat dissipation performance. However, due to the high fluidity of the TIM material, the heating element and the heat dissipation device are joined and assembled. Workability is poor, and a pump-out phenomenon (a phenomenon in which grease escapes from a gap due to a temperature shock) may occur, which may reduce the reliability of the product.

  The sheet-based TIM material is easy to handle and advantageous in terms of workability during assembly, and the thermal conductivity filler can be filled in the TIM material at a high density, so that the thermal conductivity of the TIM layer can be increased. In order to make good use of workability, a certain degree of thickness (100 μm or more) is required, and accordingly, there is a problem that the distance between the heating element and the heat receiving member becomes long, which tends to be disadvantageous as a product.

Thus, a heat radiating device satisfying all of the workability during assembly, heat radiating performance, and product reliability has not been obtained.
JP 2002-088171 A

  In view of the above circumstances, an object of the present invention is to provide a heat radiating device and a method for manufacturing the heat radiating device that have high workability during assembly and high product reliability and have excellent heat radiating performance.

  The heat dissipating device of the present invention that achieves the above object has a heat receiving member that receives the heat of the heat generating member, and dissipates the heat received by the heat receiving member to the outside, on the heat generating member side of the heat receiving member. It has heat conductive protrusions fixed on the heat receiving surface and projecting toward the heating element, and a resin layer formed on the heat receiving surface so as to be embedded in the protrusions.

  According to the heat radiating device of the present invention, the heat receiving member of the heat receiving member has a structure in which the heat conductive protrusion protruding toward the heat generating element is fixed on the heat receiving surface on the heat generating element side. The heat contact between the heat generating element and the heat receiving member is efficiently absorbed by the protrusions integrated with the heat receiving member through the resin layer. A heat dissipation device having heat dissipation performance can be obtained.

  Here, the resin layer is preferably made of a polymer material and a thermally conductive filler.

  When the heat radiating device of the present invention is configured as described above, the thermal conductivity of the resin layer can be increased, so that the thermal resistance between the heating element and the heat receiving member can be further reduced.

  Further, the protrusion is preferably made of any material selected from metals, alloys, carbon, and carbon composite materials.

  When the heat radiating device of the present invention is configured as described above, the thermal conductivity of the protrusions can be increased, so that the thermal resistance between the heating element and the heat receiving member can be further reduced.

  The protrusions preferably have a height of 30 μm or more and 200 μm or less.

  When the heat radiating device of the present invention is configured as described above, the thermal resistance between the heat generating element and the heat receiving member can be reduced by shortening the distance between the heat generating element and the heat receiving member.

  Moreover, it is preferable that the said protrusion is formed so that the area | region with the larger heat_generation | fever density of the said heat generating body surface may be formed in high density.

  When the heat dissipating device of the present invention is configured as described above, an efficient heat dissipating device can be obtained at low cost by reducing the thermal resistance of the heat generating surface having a large heat generation density.

  The resin layer is preferably formed of a crosslinked polymer material.

  When the heat dissipating device of the present invention is configured as described above, repair is facilitated, and workability during assembly is improved.

  The resin layer preferably has a thickness of 50 μm or more and 250 μm or less.

  When the heat dissipation device of the present invention is configured as described above, the distance between the heating element and the heat receiving member is shortened, and the thermal resistance between the heating element and the heat receiving member can be further reduced.

  In addition, a first heat radiating device manufacturing method of the present invention that achieves the above object is a method of manufacturing a heat radiating device that includes a heat receiving member that receives heat from a heating element and radiates heat received by the heat receiving member to the outside. A step of printing a metal paste on the heat-receiving surface of the heat-receiving member on the heat-generating body side, and a step of printing the metal paste on the heat-receiving member by baking the metal paste printed on the heat-receiving member. And a step of applying a resin to the heat receiving surface on which the protrusion is formed to form a resin layer in which the protrusion is buried on the heat receiving surface.

  According to the first manufacturing method of the heat radiating device of the present invention, the metal paste is printed on the heat receiving surface of the heat receiving member and baked to form the heat conductive protrusions. The apparatus can be manufactured with high workability.

  In addition, a second heat radiating device manufacturing method of the present invention that achieves the above object has a heat receiving member that receives the heat of the heating element, and the heat radiating device manufacturing method that radiates the heat received by the heat receiving member to the outside. A step of forming a partition wall for forming a plurality of voids on the heat-receiving surface of the heat-receiving member of the heat-receiving member with a resist, a step of applying a solder paste to the voids, and the solder paste A step of disposing a metal ball having a size smaller than the void, a step of reflowing the solder paste in a state where the metal ball is disposed on the solder paste, and forming the partition wall Removing the resist, and applying a resin to the heat receiving surface to which the metal balls are soldered to form a resin layer for burying the metal balls on the heat receiving surface Characterized in that it has a.

  According to the second method of manufacturing a heat radiating device of the present invention, a partition wall for forming a plurality of cavities on the heat receiving surface of the heat receiving member is formed of a resist, solder paste is applied to the cavities, and A metal ball having a size smaller than the above-mentioned space is placed on the solder, and the solder is reflowed. Then, the resist is removed, and a resin layer is applied thereon to form a resin layer in which the metal ball is buried on the heat receiving surface. Therefore, a highly reliable heat dissipation device with excellent heat dissipation performance can be manufactured with high workability.

  The third heat radiating device manufacturing method of the present invention that achieves the above object is a method of manufacturing a heat radiating device having a heat receiving member that receives the heat of the heating element and radiating the heat received by the heat receiving member to the outside. A step of forming a partition wall for forming a plurality of cavities on the heat receiving surface of the heat receiving member on the heating element side with a resist, and a surface having a dimension smaller than the vacancy in the vacancy. A step of disposing a metal ball coated with solder; a step of reflowing the solder on the surface of the metal ball in a state where the metal ball is disposed in the space; and removing a resist forming the partition wall. And a step of applying a resin to a heat receiving surface soldered with the metal ball to form a resin layer for burying the metal ball on the heat receiving surface.

  According to the third method of manufacturing a heat radiating device of the present invention, a partition wall for forming a plurality of cavities on the heat receiving surface of the heat receiving member is formed of a resist, and solder paste is applied to the heat receiving surface of the vacant space. A metal ball having a surface smaller than the void and having a surface coated with solder is disposed in the void, and after reflowing the solder, the resist is removed, and a resin is applied on the metal ball on the heat receiving surface. Since the resin layer in which the metal ball is embedded is formed, a highly reliable heat dissipating device having excellent heat dissipating performance can be manufactured with high workability.

  As described above, according to the present invention, a heat radiating device having high workability during assembly and product reliability and excellent heat dissipation performance, and a heat dissipation device having high product reliability and excellent heat dissipation performance. The manufacturing method which can obtain an apparatus with high workability | operativity is realizable.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an embodiment of a heat dissipation device of the present invention.

  FIG. 1A shows a heat receiving surface on the side of the LSI device 13 of the heat receiving member 11 in the heat radiating device 10 that has the heat receiving member 11 that receives the heat of the LSI device 13 and radiates the heat received by the heat receiving member 11 to the outside. 11 shows a heat dissipation device 10 having a heat conductive protrusion 14 fixed to 11s and protruding toward the heating element 13, and a TIM layer 12 formed on the heat receiving surface 11s so as to have the protrusion 14 buried therein. ing.

  The TIM layer 12 in the present embodiment corresponds to an example of a resin layer referred to in the present invention, and the LSI device 13 in the present embodiment corresponds to an example of a heating element referred to in the present invention.

  As shown in FIG. 1B, an LSI device with a heat dissipation device can be obtained by applying a load P to the LSI device 13 and the TIM layer 12 in contact with each other and bonding them. Thus, heat generated from the LSI device 13 is radiated from the heat receiving member 11 to the outside via the TIM layer 12 and the protrusions 14.

  The presence of the protrusions 14 increases the contact area between the heat receiving portion including the protrusions 14 and the heat receiving member 11 and the TIM layer 12, and the load P is dispersed at the tip of the protrusions 14. That is, the resin extrusion phenomenon caused by the thermal stress difference between the LSI device 13 and the heat dissipation device 10 is alleviated, and high reliability can be maintained over a long period of time.

  As the TIM layer 12 in this embodiment, a material obtained by kneading a thermally conductive filler made of zinc oxide in a polymer material made of silicone oil non-crosslinked resin is used. The polymer material is not limited to the silicone oil. The polymer material may be either a crosslinked material or a non-crosslinked material. The heat conductive filler is not limited to ceramics such as zinc oxide, and may be ceramic or metal as long as it has high thermal conductivity.

  In the present embodiment, the TIM layer 12 having a thickness of 120 μm is used, but the resin layer referred to in the present invention only needs to have a thickness of 50 μm or more and 250 μm or less.

  The thickness of the TIM layer 12 needs to be formed so as to fill the protrusion 14. If the thickness of the TIM layer is shorter than the height of the protrusion, the LSI device 13 and the heat receiving member 11 are in direct contact with each other, the bonding between the LSI device 13 and the heat dissipation device 10 becomes incomplete, and the heat dissipation performance decreases. There is a risk of reducing the reliability of the product.

  In the present embodiment, since the thickness of the TIM layer 12 is 120 μm and the height of the protrusion 14 is 100 μm, the height of the protrusion 14 is 20 μm shorter than the thickness of the TIM layer 12, and the LSI device 13 and the heat dissipation device There is no fear that the joint with 10 is incomplete.

  The smaller the difference between the thickness of the TIM layer 12 and the height of the protrusions 14, the more advantageous in terms of heat dissipation performance, but it is desirable that the difference between the height of the protrusions 14 is about 20 μm to 50 μm.

  Copper is used as the protrusions 14 in the present embodiment, but is not limited to copper, and is not limited to metals such as gold, silver, aluminum, solder, alloys thereof, carbon, or carbon composite materials. It may be made of any material selected from.

  There are various methods for fixing the protrusion 14 on the surface of the heat receiving member 10. For example, a method of printing and baking a metal paste, a method of mounting a metal ball and soldering, a method of flocking, etc. can be adopted, but the bonding between the protrusion 14 and the heat receiving member 11 has a small contact thermal resistance. Most preferred is a metal joint. A method for fixing the protrusion will be described later.

  The shape of the protrusion 14 may be a spherical shape (or a saddle shape), a cone shape, a fiber shape, a linear shape, or a composite type thereof. The shape of the protrusion 14 will be described later.

  In the present embodiment, the protrusion 14 has a height of 100 μm, but the protrusion referred to in the present invention only needs to have a height of 30 μm to 200 μm. Note that, from the relationship between the thickness of the TIM layer and the height of the protrusion, the accuracy of the height of the protrusion is desirably ± 10 μm or less.

  The protrusions 14 are preferably formed at a higher density in the region of the LSI device 13 where the heat generation density is higher. In this way, when protrusions are formed at a higher density in a region with a higher heat generation density on the surface of the heating element, the thermal resistance of the region with a higher heat generation density on the surface of the heating element can be effectively reduced, resulting in lower cost. Thus, a heat dissipation device with good heat dissipation performance can be obtained.

  Next, the shape of the protrusion will be described.

  FIG. 2 is a diagram illustrating a planar shape of a protrusion in the heat dissipation device of the present embodiment.

  FIG. 2A shows a plurality of spherical (or bowl-shaped) protrusions 14a fixed to the heat receiving surface 11s of the heat receiving member 11a and protruding toward the heating element.

  FIG. 2B shows a plurality of quadrangular frustum-shaped protrusions 14b that are fixed to the heat receiving surface 11s of the heat receiving member 11b and protrude toward the heating element.

  FIG. 2C shows a plurality of fiber-type protrusions 14c that are fixed to the heat receiving surface 11s of the heat receiving member 11c and protrude toward the heating element.

  FIG. 2D shows a plurality of linear protrusions 14d that are fixed to the heat receiving surface 11s of the heat receiving member 11d and protrude toward the heating element.

  As described above, the shape of the protrusion may be any shape as long as it is fixed to the heat receiving surface of the heat receiving member, protrudes toward the heating element, and is embedded in the resin layer.

  Next, a first embodiment of the method for manufacturing a heat dissipation device of the present invention will be described.

  FIG. 3 is a schematic diagram illustrating each step of the method of manufacturing the heat dissipation device according to the first embodiment.

  The manufacturing method of the heat dissipation device of the first embodiment corresponds to the manufacturing method of the first heat dissipation device of the present invention.

  In the manufacturing method of the first embodiment, first, the metal paste 14p is printed in a protrusion shape on the heat receiving surface 11s (see FIG. 3A) of the heat receiving member 11 and printed on the heat receiving surface 11s. The formed metal paste 14p is baked to form a heat conductive protrusion 14 (see FIG. 3B), and a resin 12r is applied to the heat receiving surface 11s on which the protrusion 14 is formed, and the heat receiving surface 11s is applied to the heat receiving surface 11s. By forming the resin layer 12 in which the protrusions 14 are embedded (see FIG. 3C), a desired heat radiating device can be manufactured.

  An LSI device with a heat dissipation device can be obtained by pressing the LSI device 13 and the heat receiving member 11 in a state where the resin layer 12 is superimposed on the LSI device 13 (see FIG. 1) using the heat dissipation device manufactured in this manner. .

  Next, a second embodiment of the method for manufacturing a heat dissipation device of the present invention will be described.

  FIG. 4 is a schematic diagram illustrating each step of the method for manufacturing the heat dissipation device of the second embodiment.

  The method for manufacturing the heat dissipation device of the second embodiment corresponds to the method for manufacturing the second heat dissipation device of the present invention.

  In the manufacturing method of the second embodiment, first, a partition wall 16 for forming a plurality of cavities 15 is formed with a resist on the heat receiving surface 11s (see FIG. 4A) of the heat receiving member 11. Formed (see FIG. 4B), solder paste 15b is applied to the void 15 (see FIG. 4C), and a metal ball 15c having a size smaller than the void 15 is formed on the solder paste 15b. The solder paste is reflowed in a state where the metal balls 15c are arranged on the solder paste 15b (see FIG. 4E), and the resist forming the partition wall 16 is removed. Then, the resin 12r is applied to the heat receiving surface 11s soldered to the metal ball 15c to form the resin layer 12 in which the metal ball 15c is buried on the heat receiving surface 11s (FIG. 4G). ) See) It is possible to manufacture the heat dissipation device.

  An LSI device with a heat dissipation device can be obtained by pressing the LSI device 13 and the heat receiving member 11 in a state where the resin layer 12 is superimposed on the LSI device 13 (see FIG. 1) using the heat dissipation device manufactured in this manner. .

  Next, a third embodiment of the method for manufacturing a heat dissipation device of the present invention will be described.

  FIG. 5 is a schematic diagram illustrating each step of the method of manufacturing the heat dissipation device according to the third embodiment.

  The method for manufacturing the heat dissipation device of the third embodiment corresponds to the method for manufacturing the third heat dissipation device of the present invention.

  In the manufacturing method of the third embodiment, first, a partition wall 16 for forming a plurality of cavities 15 is formed with a resist on a heat receiving surface 11s (see FIG. 5A) of the heat receiving member 11 on the heat generating body side. Formed (see FIG. 5B), a metal ball 17 having a surface smaller than the void 15 and having a surface coated with solder 17a is disposed in the void 15 (see FIG. 5C). The solder on the surface of the metal ball 17 is reflowed in a state where the metal ball 17 is disposed at the place 15 (see FIG. 5D), and the resist forming the partition wall 16 is removed (see FIG. 5E). The resin layer 12 is formed on the heat receiving surface 11s by applying the resin 12r to the heat receiving surface 11s soldered with the metal balls 17 (see FIG. 5F). The device can be manufactured.

  An LSI device with a heat dissipation device can be obtained by pressing the LSI device 13 and the heat receiving member 11 in a state where the resin layer 12 is superimposed on the LSI device 13 (see FIG. 1) using the heat dissipation device manufactured in this manner. .

  Next, application examples of the heat dissipation device of the present invention will be described.

  FIG. 6 is a diagram showing an application example of the heat dissipation device of the present invention.

  FIG. 6A shows an LSI module with a heat spreader to which the heat dissipation device 10 shown in FIG. 1 is applied. That is, a heat receiving member 11 formed as a large heat spreader (heat diffusion member), a thermoconductive protrusion (see FIG. 1) fixed to the heat receiving surface 11s of the heat receiving member 11, and the protrusions on the heat receiving surface 11s. A heat dissipation device 10 having a TIM layer 12 formed so as to be buried in an object is joined to an LSI device 13 such as an LSI chip to form an LSI module 21, and the LSI module 21 is sandwiched between solder bumps 22. The LSI module 20 with a heat spreader configured to overlap with the substrate 23 is shown.

  In this application example, both ends of the heat receiving member 11 functioning as a large heat spreader are fixed to the substrate 23 by the reinforcing material 24, thereby forming a strong module as a whole.

  FIG. 6B shows a heat dissipation system in which the LSI module 20 with heat spreader shown in FIG. 6A and the heat receiving member 26 with fins 26a are joined with the TIM layer 25 interposed therebetween. . In this heat dissipation system, a larger heat receiving member 26 is joined to the heat receiving member 11 of the LSI module 20 with heat spreader via the TIM layer 25 to form a larger heat dissipation system.

  In FIG. 6 (c), instead of the TIM layer 25 in the heat dissipation system shown in FIG. 6 (b), a heat conductive projection 27 fixed on the heat receiving surface of the heat receiving member 26 is formed to a thickness that fills it. 1 shows a heat dissipation system in which the heat receiving member 26 is joined to the LSI module 20 with a heat spreader (see FIG. 1) through the TIM layer 28.

  In FIG. 6D, the TIM layer in the heat dissipation system shown in FIG. 6B is fixed to the surface of the heat receiving member 11 of the LSI module 20 with heat spreader, protrudes toward the heat receiving member 26, and projects into the TIM layer. 1 shows a heat radiation system in which a TIM layer 29 having a heat-conductive protrusion 27 embedded in the TIM layer 29 is bonded to a heat receiving member 26.

  6 (e) shows the heat receiving member 26 and the TIM layer 28 in the heat dissipation system shown in FIG. 6 (c), and the LSI module 20 with the heat spreader and the TIM layer 29 in the heat dissipation system shown in FIG. 6 (d). A heat dissipation system is shown in which both TIM layers are joined face to face. Here, by forming the protrusions 27 in the TIM layer 28 and the protrusions 30 in the TIM layer 29 at positions where they are engaged with each other, the thermal resistance between the heat receiving member 26 and the LSI module 20 with a heat spreader is effectively reduced. be able to.

It is a figure which shows one Embodiment of the thermal radiation apparatus of this invention. It is a figure which shows the planar shape of the protrusion in the thermal radiation apparatus of this embodiment. It is a schematic diagram which shows the manufacturing method of the thermal radiation apparatus of 1st Embodiment. It is a schematic diagram which shows the manufacturing method of the thermal radiation apparatus of 2nd Embodiment. It is a schematic diagram which shows the manufacturing method of the thermal radiation apparatus of 3rd Embodiment. It is a figure which shows the application example of the thermal radiation apparatus of this invention. It is a figure which shows the example of the LSI device to which the conventional heat radiating device was attached. It is a figure which shows the method of joining the conventional heat radiating device to an LSI device and forming LSI device with a heat radiating device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Heat sink 11 Heat receiving member 11s Heat receiving surface 12 TIM layer 12r Resin 13 LSI device 14, 14a, 14b, 14c, 14d Protrusion 14p Metal paste 15 Space 15a Heat receiving surface 15b Solder paste 15c Metal ball 16 Partition wall 17 Metal ball 17a Solder 20 LSI module with heat spreader 21 LSI module 22 Solder bump 23 Substrate 24 Reinforcement material 25 TIM layer 26 Heat receiving member 26a Fin 27, 30 Protrusion 28, 29 TIM layer 90, 96, 98 Heat radiation device 91 Heat radiation member 95 Heat reception member 91a Heat radiation fin 92 TIM layer 93 LSI device 94 Heat pipe 97 Liquid cooling jacket 99 Liquid flow path

Claims (6)

In a heat dissipation device that has a heat receiving member that receives the heat of the heating element and radiates the heat received by the heat receiving member to the outside,
A thermally conductive protrusion that is fixed to the heat receiving surface of the heat receiving member on the heat generating element side and protrudes toward the heat generating element;
A heat radiating device comprising a resin layer formed on the heat receiving surface so as to have a thickness exceeding the height of the protrusion and to embed the protrusion.   The heat radiating device according to claim 1, wherein the resin layer is made of a polymer material and a thermally conductive filler.   2. The heat dissipation device according to claim 1, wherein the protrusion is made of any material selected from a metal, an alloy, carbon, and a carbon composite material. A method of manufacturing a heat radiating device having a heat receiving member that receives heat from a heating element, and radiating heat received by the heat receiving member to the outside,
A step of printing a metal paste in a protrusion shape on the heat receiving surface of the heat receiving member on the heating element side;
Firing a metal paste printed on the heat receiving member to form a thermally conductive protrusion on the heat receiving surface;
Applying a resin to the heat receiving surface on which the protrusions are formed, and forming a resin layer on the heat receiving surface to a thickness that exceeds the height of the protrusions and to embed the protrusions. A method of manufacturing a heat dissipation device. A method of manufacturing a heat radiating device having a heat receiving member that receives heat from a heating element, and radiating heat received by the heat receiving member to the outside,
Forming a partition wall with a resist for forming a plurality of voids on the heat receiving surface of the heat receiving member on the heat generating body side;
Applying a solder paste to the void;
Placing a metal ball of a size smaller than the void on the solder paste;
Reflowing the solder paste in a state where the metal balls are disposed on the solder paste;
Removing the resist forming the partition wall;
Applying a resin to the heat receiving surface soldered with the metal balls, and forming a resin layer on the heat receiving surface to a thickness exceeding the height of the metal balls and embedding the metal balls. A method of manufacturing a heat dissipation device. A method of manufacturing a heat radiating device having a heat receiving member that receives heat from a heating element, and radiating heat received by the heat receiving member to the outside,
Forming a partition wall with a resist for forming a plurality of voids on the heat receiving surface of the heat receiving member on the heat generating body side;
Placing a metal ball with a surface coated with solder having a size smaller than the void in the void;
Reflowing solder on the surface of the metal ball in a state where the metal ball is disposed in the space;
Removing the resist forming the partition wall;
Applying a resin to the heat receiving surface soldered with the metal balls, and forming a resin layer on the heat receiving surface to a thickness exceeding the height of the metal balls and embedding the metal balls. A method of manufacturing a heat dissipation device.

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