CN113692645A - 一种磁膜电感、裸片以及电子设备 - Google Patents

一种磁膜电感、裸片以及电子设备 Download PDF

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Publication number
CN113692645A
CN113692645A CN201980095458.0A CN201980095458A CN113692645A CN 113692645 A CN113692645 A CN 113692645A CN 201980095458 A CN201980095458 A CN 201980095458A CN 113692645 A CN113692645 A CN 113692645A
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magnetic film
magnetic
groove
insulating medium
layer
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CN113692645B (zh
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龚顺强
邹鹏
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

一种磁膜电感、裸片以及电子设备，该磁膜电感包括下磁膜(302)、上磁膜(303)、支撑件(307)、绝缘介质(305)以及至少一个金属线圈(304)，绝缘介质(305)背离下磁膜(302)的表面上还设置有支撑件(307)，支撑件(307)用于将上磁膜(303)支撑固定于下磁膜(302)的表面上；绝缘介质(305)朝向上磁膜(303)的端面凹设有磁通槽(306)，支撑件(307)端部延伸至磁通槽(306)内设置，且位于磁通槽(306)内部的支撑件(307)的外表面(601)的面积大于磁通槽(306)的目标侧壁(602)的面积，目标侧壁(602)为磁通槽(306)与支撑件(307)相连的侧壁。因支撑件(307)的端部够延伸至磁通槽(306)内设置，则使得上磁膜(303)只需要覆盖支撑件(307)的表面即可，无需覆盖支撑件(307)和绝缘介质(305)之间的过渡区域，则避免了上磁膜(303)无法保障在该过渡区域均匀覆盖的弊端。

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PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201980095458.0A 2019-04-16 2019-04-16 一种磁膜电感、裸片以及电子设备 Active CN113692645B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114340143A (zh) * 2021-12-30 2022-04-12 Oppo广东移动通信有限公司 电路板集成电感、其制备方法及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10188222A (ja) * 1996-12-20 1998-07-21 Read Rite S M I Kk 複合型薄膜磁気ヘッド
CN105761880A (zh) * 2016-04-20 2016-07-13 华为技术有限公司 一种薄膜电感和电源转换电路
CN107039395A (zh) * 2017-05-03 2017-08-11 电子科技大学 一种集成螺线管型双层磁膜电感及其制备方法
CN108682542A (zh) * 2018-05-11 2018-10-19 华为技术有限公司 电感结构以及电子设备
US20190006083A1 (en) * 2017-05-19 2019-01-03 International Business Machines Corporation Stress management for thick magnetic film inductors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007110101A (ja) * 2005-09-16 2007-04-26 Tdk Corp 磁性膜およびインダクタ
CN201066606Y (zh) * 2007-07-11 2008-05-28 美桀科技股份有限公司 低感大储能单圈式线圈结构
US8470612B2 (en) * 2010-10-07 2013-06-25 Infineon Technologies Ag Integrated circuits with magnetic core inductors and methods of fabrications thereof
JP2017092071A (ja) * 2015-11-02 2017-05-25 アルプス電気株式会社 インダクタンス素子およびインダクタンス素子の評価方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10188222A (ja) * 1996-12-20 1998-07-21 Read Rite S M I Kk 複合型薄膜磁気ヘッド
CN105761880A (zh) * 2016-04-20 2016-07-13 华为技术有限公司 一种薄膜电感和电源转换电路
CN107039395A (zh) * 2017-05-03 2017-08-11 电子科技大学 一种集成螺线管型双层磁膜电感及其制备方法
US20190006083A1 (en) * 2017-05-19 2019-01-03 International Business Machines Corporation Stress management for thick magnetic film inductors
CN108682542A (zh) * 2018-05-11 2018-10-19 华为技术有限公司 电感结构以及电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114340143A (zh) * 2021-12-30 2022-04-12 Oppo广东移动通信有限公司 电路板集成电感、其制备方法及电子设备

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