CN113691693B - Photosensitive assembly with anti-shake function, camera module and assembling method thereof - Google Patents
Photosensitive assembly with anti-shake function, camera module and assembling method thereof Download PDFInfo
- Publication number
- CN113691693B CN113691693B CN202010419327.8A CN202010419327A CN113691693B CN 113691693 B CN113691693 B CN 113691693B CN 202010419327 A CN202010419327 A CN 202010419327A CN 113691693 B CN113691693 B CN 113691693B
- Authority
- CN
- China
- Prior art keywords
- photosensitive
- circuit board
- driving
- driving module
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 230000006870 function Effects 0.000 claims description 56
- 238000000465 moulding Methods 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 29
- 238000009434 installation Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 238000005516 engineering process Methods 0.000 claims description 15
- 239000011265 semifinished product Substances 0.000 claims description 8
- 206010070834 Sensitisation Diseases 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 claims description 7
- 230000008313 sensitization Effects 0.000 claims description 7
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 239000012778 molding material Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 11
- 238000013519 translation Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000003351 stiffener Substances 0.000 description 4
- 206010044565 Tremor Diseases 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 230000036544 posture Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The invention relates to a photosensitive assembly with an anti-shake function, which comprises: the circuit board structure comprises a photosensitive chip, a circuit board structure, a driving module base connected with the back of the circuit board structure through a connecting shaft, a plurality of magnets arranged on the back of the circuit board structure and surrounding the connecting shaft, a plurality of first driving elements and a plurality of second driving elements arranged on the driving module base; each first driving element is arranged below one corresponding magnet, each second driving element comprises a fixing shaft arranged on the driving module base and an SMA element, one end of each SMA element is arranged on the other end of each fixing shaft, the other end of each SMA element is a free end, and the free end of each SMA element is arranged on the side face of one magnet. The invention also provides a corresponding photosensitive assembly assembling method, a corresponding camera module and an assembling method thereof. The anti-shake function of the photosensitive assembly is realized in multiple directions at a small space cost; and the manufacturing process can be simplified, which is beneficial to realizing large-scale mass production.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a photosensitive assembly with an anti-shake function, a camera module and an assembling method of the camera module.
Background
With the popularization of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied in many fields such as medical treatment, security, industrial production, and the like. Currently, in the field of consumer electronics (e.g., the field of mobile phones), the optical anti-shake function has become one of the common functions of the camera module.
The anti-shake technique is applied to the camera at first, and general standard focus or wide-angle lens are short because the focus, and weight is little, and handheld just can satisfy the shooting demand, but at the shooting in-process of long focus, micro-distance, under the unchangeable condition of light ring, need sufficient exposure time, if this moment again when handheld shooting, cause the shooting shake very easily. The aperture of the mobile phone is limited, the light entering amount is worried, and a long enough exposure time is needed to obtain a clear picture, and the anti-shake technology is needed to be added at the moment. Specifically, when taking a picture with a hand-held smartphone, the hand shake causes a slight tilt (typically within +/-0.5 degrees) of the camera, which causes a change in the viewing angle of the lens, which corresponds to the movement of the object to be photographed, with the lens as a reference object, and therefore the image is also shifted on the image sensor from the original position, and as a result, the image is always unstable due to the hand shake. Therefore, there is a need for a robust anti-shake technique.
At present, anti-shake techniques can be classified into optical anti-shake, electronic anti-shake, and body sensor anti-shake. If the anti-shake adjustment is carried out according to the freedom of movement, the anti-shake adjustment can be divided into two-axis, three-axis, four-axis and five-axis anti-shake adjustment. Electronic anti-shaking, which typically analyzes the image on the CCD and then compensates with an edge image, typically does not require additional hardware, but requires the DSP to have the ability to handle a large load. However, this compensation method will lose the edge pixels, and the current solution is to use a large wide-angle lens. The electronic anti-shake only carries out post processing to the data of gathering, does not play substantial promotion to image quality, on the contrary has certain degree of damage to holistic image quality.
Optical anti-shake generally requires hardware support. Optical anti-shake is the correction of "optical axis shift" by a floating lens of the lens. The principle is that a gyroscope in a lens detects tiny movement, then a signal is transmitted to a microprocessor, a processor immediately calculates displacement required to be compensated, and then compensation is carried out according to the shaking direction and the displacement of the lens through a compensation lens group, so that image blurring caused by shaking of a camera is effectively compensated. The anti-shake technology has high requirements on lens manufacture (the optical anti-shake technology currently applied in mobile phones mainly drives the whole lens to move together), and the cost is high. The optical anti-shake function has obvious effect, and under the general condition, the 2-3-gear shutter speed can be increased by starting the function, so that the phenomenon of blurring cannot be caused in handheld shooting. Particularly in a large zoom camera, the effect is more obvious, because generally, the larger the zoom is, the more slight shake has a great influence on the imaging quality, and therefore, the longer the zoom is, the greater the demand for the anti-shake function is. Compare in the electron anti-shake, the full-width picture pixel of optics anti-shake all is effective pixel, and the practicality is stronger, and the picture quality can obtain essential promotion, but its shortcoming is that the design cost is high, and components and parts are with high costs, and the electric quantity consumption is big, and needs certain space to lead to the volume of demand when installing great. Due to the limitation of various factors of optical anti-shake, mobile phone manufacturers generally apply optical anti-shake technology to their respective medium-high end models.
In the existing optical anti-shake technology, various design schemes based on different degrees of freedom of movement exist, including two-axis, three-axis, four-axis, five-axis anti-shake and the like, the biggest difference of the design schemes is that the lens can move towards those directions, most of mobile phones in the past are two-axis and three-axis anti-shake, and four-axis anti-shake is further in function based on three-axis anti-shake, and meanwhile, compensation for shake in the transverse direction, the longitudinal direction, the forward-leaning direction and the side-leaning direction is achieved. At present, in some four-axis optical anti-shake schemes, shake in 8 directions is detected at a high speed through a gyroscope and an acceleration sensor in a mobile phone, signals are transmitted to a microprocessor to immediately calculate displacement required to be compensated, then data are transmitted to a micro motor in real time, and the posture of a camera module is rapidly adjusted, so that the blur of images generated by shake of the mobile phone is effectively overcome.
Further, the shake during the daily shooting is analyzed. Firstly, the human eye itself has an extremely "delicate" anti-shake system, and the shake has no effect on the human eye, but for every scene of daily photographing, the shake is often unavoidable. "jitter" in a daily cell phone shooting scenario may include: camera shake, motion blur, and roll-up door effect.
The camera shake mainly refers to the vibration of the slight physiological muscles and hands, and is commonly used for taking pictures and recording videos. The main cause of camera shake is hand shake. The hand trembling is the easiest to overcome in the trembling, and the trembling prevention effect can be improved to a certain extent through certain exercise or certain postures with better stability; in addition, the mobile phone or the camera can be supported by a body during shooting or can be fixed by external facilities (such as a tripod). .
Motion blur may also be referred to as motion blur. Motion blur refers to the fact that a fast movement of the picture causes noticeable blur and dragging marks. The motion blur is mainly caused by two reasons. One is that the motion speed is faster than the exposure time. The longer the exposure time, the greater the "jitter" of the motion blur. Secondly, continuous motion causes the lens to fail to capture the frame of each frame in detail, thereby causing motion blur.
The rolling door effect is also called jelly effect. The formation of this effect is determined by the characteristics of the CMOS sensor, and since most of the cameras of the CMOS sensor use a rolling shutter, it realizes imaging by line-by-line exposure. For the CMOS sensor, in the shooting process, the image sensor scans line by line and exposes line by line until all pixel points are exposed, so that a complete picture is obtained. In general, all operations in the shooting process are completed in an extremely short time, and therefore, the shooting is not affected in general. However, if the object is moving at a high speed or vibrating rapidly relative to the camera, the rolling shutter method is used to shoot the object, the progressive scanning speed is not enough, and the shooting result may be "tilted", "swayed" or "partially exposed". The above phenomenon occurring when the object is photographed in a rolling shutter manner while moving at a high speed or vibrating at a high speed is defined as a jelly effect or a rolling shutter effect.
It should be noted that, in the conventional OIS technology for mobile phone modules, only image offset caused by camera tilt is corrected, and image problems caused by camera up-down, left-right translational shake are not dealt with (this is different from the recognition of the public, so it is necessary to explain). When shooting distant scenes, the image shift caused by the camera translation shake can be considered to be absent without OIS system compensation. Image instability comes entirely from camera tilt jitter. However, when taking macro, the effect of the translational shake of the camera will be gradually revealed. The current OIS camera module of the mobile phone selects to ignore the macro shooting problem caused by translation jitter in order to avoid an excessively complex system architecture. Optical anti-shake has a good shooting effect in some special environments: the imaging device can be used for imaging in a dim light environment, zooming, handheld imaging and moving or imaging in a bumpy state (at the moment, the shake of the external environment is far larger than that caused by hands, and the bumpy feeling can be reduced to a great extent by OIS).
In order to effectively deal with various shakes in the shooting process, a sensor anti-shake technology appears in the current market, and the current sensor anti-shake technology is mainly applied to the field of cameras. The anti-shake technical principle of the sensor is that an image sensor is installed on a support capable of moving freely, and the gyroscope is matched with the vibration direction and amplitude of the camera to sense the vibration direction and amplitude of the camera, so that the sensor is controlled to perform corresponding displacement compensation. The irregularity of the various types of jitter makes the sensor anti-shake technique typically dependent on multi-axis motion techniques to compensate for multiple directional jitter simultaneously. On the other hand, however, if multi-axis anti-shake is to be applied to the image sensor, it may cause an increase in the module volume. Therefore, how to add a multi-axis anti-shake sensor anti-shake technology into a limited space of an electronic device such as a mobile phone is a big problem in the current market.
Further, when being applied to the field of consumer electronics devices such as mobile phones, the anti-shake design of the camera module group needs to take the reliability of devices and the production yield into consideration, that is, the anti-shake scheme of the sensor needs to solve not only the miniaturization problem, but also good operability in the production process, so as to improve the reliability and yield of the assembly.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a sensor anti-shake solution which can realize miniaturization.
In order to solve the above technical problem, the present invention provides a photosensitive assembly with an anti-shake function, comprising: a photosensitive chip having a photosensitive surface; the circuit board structure comprises a circuit board, and the photosensitive chip is mounted on the upper surface of the circuit board; the driving module base is positioned below the circuit board structure, and the circuit board structure is connected with the driving module base through a connecting shaft; a plurality of magnets mounted on the back surface of the circuit board structure and surrounding the connecting shaft; the first driving elements are arranged on the upper surface of the driving module base, the top of each first driving element corresponds to one magnet, each first driving element comprises a coil and a magnetic core, and the magnetic force of the first driving elements acts on the magnets to push the circuit board structure to move in the power-on state of the coil; one or more fixed shafts fixed to the driving module base and surrounding the connecting shaft; and the second driving element is an SMA element, one end of the SMA element is fixed on the fixed shaft, the other end of the SMA element is arranged on the side surface of the magnet, a gap is formed between the SMA element and the magnet in a natural state, and in an electrified state, the SMA element stretches and pushes the magnet from the side surface so as to push the circuit board structure to move in the horizontal direction which is parallel to the direction of the light sensing surface.
The circuit board structure further comprises a frame-shaped magnet installation layer, the magnet installation layer is located on the back face of the circuit board, the lower surface of the magnet installation layer is provided with a plurality of magnet installation positions, and magnets are installed on the magnet installation positions.
Wherein the circuit board structure further comprises a reinforcing layer formed on or attached to a lower surface of the circuit board; the magnet mounting layer is attached to a lower surface of the reinforcement layer.
Wherein, the reinforcing layer is a metal layer or a metal plate.
Wherein, the magnet mounting layer is a square metal layer or a square metal plate.
Wherein the photosensitive assembly with the anti-shake function is adapted to adjust an inclination angle of the circuit board structure relative to the driving module base by controlling directions and magnitudes of currents in the coils of the plurality of first driving elements.
The four magnets are respectively arranged at the central positions of the four edges of the square frame-shaped magnet mounting layer.
Wherein, the center of the magnetite installation layer and the center coincidence of the hardboard of circuit board.
The magnet installation layer is provided with a groove-shaped magnet installation position, and the magnets are installed in the groove-shaped magnet installation position.
The fixing shaft is cylindrical, the SMA elements are fixed on the fixing shaft, and the SMA elements are electrically connected with the driving module base through wires.
The circuit board is provided with a functional circuit for supporting the photosensitive chip, the driving module base is provided with a driving circuit for providing current for the coil and the SMA element, and the functional circuit and the driving circuit are electrically separated from each other.
The bottom surface of the drive module base is suitable for bearing against a mainboard of the electronic equipment, and the bottom surface of the drive module base is provided with a contact array which is suitable for being electrically connected with the mainboard contact array of the mainboard.
The drive module base comprises a bottom plate and a supporting seat formed by upwards extending from the periphery of the bottom plate, the supporting seat surrounds the periphery of the circuit board structure, and a gap is formed between the supporting seat and the side face of the circuit board structure.
Wherein, the supporting seat is suitable for installing the lens component.
Wherein, photosensitive assembly still includes: the metal wire is used for electrically connecting the circuit board and the photosensitive chip based on a routing process; an electronic element mounted on the upper surface of the circuit board and disposed outside the photosensitive chip; the molding base is formed on the upper surface of the circuit board through a molding process and used for plastically packaging the metal wire and the electronic element; and an optical filter mounted on the mold base.
The photosensitive chip, the circuit board structure, the metal wire, the electronic element, the molding base and the optical filter are integrally moved under the driving of the first driving element and/or the second driving element relative to the driving module base.
According to another aspect of the present application, there is also provided a camera module, which includes: a lens assembly; and any photosensitive assembly in the foregoing, wherein the lens assembly is mounted on the driving module base of the photosensitive assembly.
According to another aspect of the present application, there is also provided an assembling method of a photosensitive assembly having an anti-shake function, including: step 1) preparing a photosensitive module and a driving module which are separated from each other; the photosensitive module comprises a circuit board, a photosensitive chip arranged on the front surface of the circuit board and a plurality of magnets positioned on the back surface of the circuit board; the driving module comprises a driving module base, a plurality of coils, a plurality of shafts and a connecting shaft, wherein the coils are arranged on the driving module base; and step 2) installing the photosensitive module in the driving module; the center of the photosensitive chip is aligned to the top of the connecting shaft, then the bottom of the photosensitive module is fixed to the top of the connecting shaft, and the top of each coil of the driving module corresponds to the bottom of one magnet of the photosensitive module respectively.
Wherein, in step 1), the driving module further includes: the fixing shaft is arranged on the upper surface of the bottom plate, one end of each SMA element is fixed on the fixing shaft, and the other end of each SMA element is a free end; the step 2) further comprises the following steps: after the photosensitive module is installed in the driving module, the free end of each SMA element of the driving module is arranged on the side surface of one magnet of the photosensitive module, a gap is formed between the free end of the SMA element and the side surface of the magnet corresponding to the free end of the SMA element in a natural state, and the SMA element stretches to contact and push the magnet corresponding to the SMA element in a state of electrifying the SMA element.
In step 1), the method for preparing the photosensitive module comprises the following substeps: step 11) mounting the photosensitive chip on the circuit board to obtain a photosensitive module semi-finished product; step 12) preparing a frame-shaped magnet installation part, automatically identifying and calibrating installation positions of magnets by using a machine vision technology, and then installing the magnets in the frame-shaped magnet installation part to obtain a magnet assembly; and step 13) mounting the magnet assembly on the back of the semi-finished product of the photosensitive module; wherein, based on machine vision technique to sensitization chip with the position of frame shape magnetite installed part is calibrated, makes the center coincidence of the two, then installs to obtain complete sensitization module.
Wherein the step 11) further comprises: electrically connecting the photosensitive chip with the circuit board through a routing process, and mounting an electronic element on the circuit board; then forming a molding part on the surface of the circuit board through a molding process, wherein the molding part covers the metal wire and the electronic element formed by the wire bonding process, and the molding part is contacted with and covers the edge area of the photosensitive chip; and then installing a color filter on the molding part to obtain the semi-finished product of the photosensitive module.
Wherein the step 11) further comprises: attaching or forming a reinforcing layer on the back of the circuit board for the semi-finished product of the photosensitive module; in the step 13), the frame-shaped magnet attachment member of the magnet assembly is attached to the lower surface of the reinforcement layer.
Wherein, in step 1), the method for preparing the driving module comprises the following substeps: step 14), manufacturing the driving module base; firstly, manufacturing a circuit frame for distributing a driving circuit, then wrapping the circuit frame by using a molding material through a molding process, and forming to obtain a molding driving module base with a required shape; the back surface of the driving module base is provided with a contact array exposed to the outside; step 15) assembling a fixed shaft on the upper surface of the bottom plate of the driving module base; step 16) arranging a shaft on the upper surface of the bottom plate of the driving module base and winding a coil on the shaft; the coil is electrically connected with a driving circuit of the circuit frame; step 17) mounting a plurality of SMA elements on a fixed shaft, wherein one end of each SMA element is fixed on the fixed shaft, and the other end of each SMA element is a free end; the SMA element is electrically connected with a driving circuit of the circuit frame through a lead; and step 18) installing a connecting shaft at the center of the bottom plate of the driving module base, wherein the connecting shaft is an elastic supporting shaft.
Wherein the step 15) and the step 14) are completed synchronously, and the fixed shaft and the driving module base are integrally formed.
According to still another aspect of the present application, there is provided an assembling method of a camera module, including: step a) assembling the photosensitive assembly with the anti-shake function according to any one of the assembling methods of the photosensitive assembly with the anti-shake function; and b) mounting the lens assembly on the photosensitive assembly with the anti-shake function, wherein the bottom surface of the lens assembly is mounted on the top surface of the support seat.
Compared with the prior art, the application has at least one of the following technical effects:
1. this application can realize sensitization component's anti-shake function with less space cost.
2. This application can realize photosensitive assembly's anti-shake function in a plurality of directions.
3. The utility model provides a photosensitive assembly and module of making a video recording can also strengthen circuit board intensity when realizing the anti-shake function, are favorable to preventing the warpage of photosensitive chip.
4. The photosensitive assembly structure and the assembling method can simplify the manufacturing process, so that the chip anti-shake structure is easy to assemble, and mass production is facilitated.
5. In some embodiments of the application, a rapid assembly method capable of realizing a chip anti-shake structure is provided, the method can divide the chip anti-shake structure into a photosensitive module and a driving module, the photosensitive module and the driving module are prefabricated respectively, and then the photosensitive module and the driving module are assembled, and the method can be used for realizing automatic assembly of an anti-shake module.
6. In some embodiments of the application, a method for assembling a camera module with an anti-shake chip is provided, wherein the camera module mainly comprises a lens module, a photosensitive module and a driving module, the lens module, the photosensitive module and the driving module can be respectively prefabricated, then the three are automatically assembled, and the production efficiency of the module can be effectively improved.
7. This application can realize making a video recording the multiaxis anti-shake of module with less drive power, very is favorable to adopting the glass lens (glass lens weight is greater than the plastics lens usually) at the module of making a video recording.
Drawings
Fig. 1 is a schematic perspective view illustrating a camera module with an anti-shake function according to an embodiment of the present application;
FIG. 2 illustrates a side view of a photosensitive module in one embodiment of the present application;
FIG. 3a is a schematic view of the structure of the back surface of the circuit board structure according to an embodiment of the present application;
FIG. 3b shows a schematic side cross-sectional view of the wiring board structure shown in FIG. 3 a;
FIG. 4 illustrates a side view schematic of a drive module in one embodiment of the present application;
FIG. 5 illustrates a schematic top view of a drive module in one embodiment of the present application;
FIG. 6 is a schematic side view showing an assembled driving module and photosensitive module according to an embodiment of the present disclosure.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to examples or illustrations.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Fig. 1 shows a schematic perspective view of a camera module with an anti-shake function in an embodiment of the present application. Referring to fig. 1, in the present embodiment, the anti-shake camera module includes a lens module 10 for focusing and transmitting light, a photosensitive module (the photosensitive module is hidden in fig. 1, and the shape and structure of the photosensitive module can refer to fig. 2) for receiving light and converting the light into an electrical signal, and a driving module 30 for moving a chip, wherein the photosensitive module 20 (refer to fig. 2) is installed in the driving module 30, the lens module 10 and the supporting base of the driving module 30 are bonded together, and meanwhile, the optical axis center of the lens module 10 is aligned with the chip center of the photosensitive module 20, so as to form the camera module. The lens module 10 of the present embodiment may also be referred to as a lens assembly. When the camera module shoots normally, if the camera module shakes, the image sensor (namely, the photosensitive chip) can receive different information, and the phenomenon of unclear shooting is easy to occur. Use the anti-shake module of making a video recording that this embodiment provided, when position sensor detected the shake condition, can give microprocessor with the information transfer of shake, microprocessor control installs the drive module in the circuit board below and drives, make the circuit board carry sensitization chip (sensitization chip and circuit board bond together, when driving the circuit board motion, also be in the position of adjustment chip in fact) according to appointed direction and angle carry out corresponding adjustment, in order to compensate the shake, thereby promote the imaging quality of the module of making a video recording.
In one embodiment, the lens assembly may include an optical lens and a voice coil motor, and the motor may drive the optical lens to move rapidly along the optical axis of the module when taking a picture, thereby implementing a focusing function. In this embodiment, the motor and the optical lens may be combined together by a thread structure, that is, the outer side surface of the lens barrel of the optical lens is provided with an external thread, the inner side surface of the carrier of the motor is provided with an internal thread, and the external thread of the lens is matched with the internal thread of the motor, so as to realize the combination between the motor and the lens. Of course, the carrier of the motor and the lens can be combined together by a traditional gluing process, the lens is adhered to the carrier of the motor, and the lens can be driven to move correspondingly when the motor carrier moves relative to the motor shell, so that the automatic focusing function is realized. In this embodiment, the motor housing may be fixed to the support base of the driving module.
In another embodiment, the optical lens may also be used as a lens assembly, and the optical lens is directly bonded to the supporting base of the driving module, and the lens of the camera module may not have a focusing function. Of course, in another embodiment, the lens may be fixed with the driving module base by a screw structure. Particularly, when the driving module is manufactured, an internal thread can be directly molded at the position where the driving module is matched with the lens module and is directly matched with the external thread of the lens, so that the connection between the lens and the driving module is realized. The connection mode can also save a motor structure in the lens assembly, thereby reducing the height of the module and the complexity of the design. As for the focusing function, in some embodiments of the present application, the driving module provided may perform z-axis direction adjustment on the photosensitive chip, and when focusing is required, the driving module may directly drive the chip to move in the z-axis direction, so as to implement the focusing function (the z-axis direction is a height direction, and the direction is also a direction of an optical axis of the camera module). Specifically, the driving module can be directly utilized to drive the photosensitive chip to move, so that the photosensitive chip moves to the center of the optical axis of the lens, and the focusing function in the photographing process is realized. Of course, if a motor (e.g., a voice coil motor) is disposed at the lens, the lens is driven by the motor to move during focusing, and the photosensitive chip moves in cooperation, so that faster focusing can be achieved. The specific design can be selected according to the actual situation.
FIG. 2 shows a schematic side view of a photosensitive module in one embodiment of the present application. Referring to fig. 2, in the embodiment, the photosensitive chip 21 may be directly adhered to the upper surface of the circuit board 22, and the photosensitive chip 21 and the circuit board 22 are electrically connected through a Wire Bonding process (Wire Bonding). Further, in the present embodiment, the gold wires 25 (i.e., gold wires in the wire bonding process) and some electronic components (e.g., resistors, capacitors, etc., not shown in fig. 2) are directly molded in the filter holder 24 by using a molding process. The filter 23 may be mounted to the filter holder 24. The filter 23 may be, for example, blue glass. The photosensitive module structure of the embodiment can not only protect the gold wire 25, but also effectively reduce the height of the filter support 24, and at the same time, encapsulate the photosensitive chip 21 in the internal space formed by the circuit board 22 and the molding base (i.e. the filter support 24 and the blue glass (i.e. the filter 23), effectively protect the photosensitive chip 21, and prevent the photosensitive chip 21 from being damaged by dust falling from the surface of the photosensitive chip 21 or other factors.
In the above embodiment, after the photosensitive chip and the circuit board are assembled and fixed, the photosensitive chip and the circuit board do not move relatively in the process of working of the camera module, and when the driving module drives the circuit board to move, the driving module actually drives the chip to do corresponding adjustment movement. In the embodiment, the overall quality of the circuit board can be effectively reduced by using a molding process, and the chip can be ensured to move only by providing a proper driving force in the process of adjusting the movement of the chip, so that the structural design of the driving module is simplified. The conventional anti-shake driving is generally to drive the lens by a motor for anti-shake. However, with the improvement of imaging quality requirements, the glass lens gradually replaces the plastic lens with good performance, and this change makes the quality of the lens heavier, and the required driving force is larger, thereby increasing the design difficulty of the lens driving structure. With the method of the present embodiment, no matter how the weight of the lens changes, the driving module drives the movement of the photosensitive chip, so the design of the driving structure is not affected. It can be seen that the design structure can effectively solve the problem of the current lens with heavy quality.
Further, fig. 3a shows a schematic structural diagram of a back surface of the circuit board structure in an embodiment of the present application, and fig. 3b shows a schematic side sectional view of the circuit board structure shown in fig. 3 a. In this embodiment, the structure of the circuit board is designed specially for adapting to the driving module. Referring to fig. 3a and 3b, the wiring board structure of the present embodiment includes a PCB hard board 22a, an FPC soft board 22b, and a connector 22c. Wherein the backside of the PCB 22a may be affixed with a reinforcement layer 26, and the reinforcement layer 26 may be a metal layer (e.g., steel plate). In this embodiment, the stiffener 26 may be attached to the back side of the PCB 22a by prefabricating the stiffener and then bonding or soldering the stiffener to the back side. In another embodiment, the stiffening layer 26 may also be molded directly on the back side of the PCB stiffener 22 a. The reinforcing layer 26 serves to reinforce the strength of the wiring board 22 and prevent the photosensitive chip 21 from warping. With the requirement of the camera module on the imaging quality being improved, a large chip is also a main development trend. In the embodiment, the reinforcing layer 26 is provided, so that the problem of chip warpage can be effectively solved. Further, the circuit board structure in this embodiment further includes a frame-shaped magnet fixing layer 27 (which may also be referred to as a magnet mounting layer), the magnet fixing layer 27 may be bonded (or otherwise attached) to the back surface of the reinforcing layer 26, and the centers of the magnet fixing layer 27 and the reinforcing layer 26 coincide (i.e., coincide with the center of the PCB 22a of the circuit board 21). On one hand, the magnet fixing layer 27 can be used to fix the magnet 28 and provide a moving condition for the driving module 30 (for example, a force-bearing structure is provided at one end of the photosensitive module to receive the driving force provided by the driving module 30), and on the other hand, the center position of the magnet fixing layer 27 coincides with the center position of the circuit board 22, and the square frame-shaped magnet fixing layer 27 is located at a position close to the edge region of the circuit board 22, so that the position of the circuit board 22 close to the edge region is further reinforced on the basis of the reinforcing layer 26, and the circuit board 22 and the photosensitive chip 21 are less prone to warp. In the circuit board structure of this embodiment, the central region of the back surface of the reinforcing layer 26 further has a connecting shaft 31, one end of the connecting shaft 31 is connected to the reinforcing layer 26 (or directly connected to the circuit board 22), and the other end is connected to the base of the driving module 30 (i.e., the driving module base 32). The entire circuit board structure and the photosensitive chip 21, the filter 23, the molding base (i.e. the filter holder 24) and other accessory components packaged inside the molding base, which are mounted on the surface of the circuit board 22, form a combination, which can be regarded as the photosensitive module 20. In this embodiment, the assembly may be moved in multiple degrees of freedom relative to the base of the driver module 30 as a whole to correct chip jitter.
When the camera module works, the driving module receives the information of the processor and can correct some shaking conditions in the shooting process, so that the information received by the photosensitive chip in the single exposure time in the working process of the module is the same, and the phenomenon of blurring or ghosting is avoided. The base of the driving module may include a bottom plate and a support base formed by extending upward from a periphery of the bottom plate, and the support base may surround the photosensitive module. When the photosensitive module is connected in the inner space of the driving module, a certain gap can be kept between the photosensitive module and the supporting seat of the driving module, so that the photosensitive module is not restricted by peripheral components when the photosensitive chip and the circuit board structure move, and the function of correcting the position of the chip is better realized.
Further, fig. 4 shows a schematic side view of a drive module in an embodiment of the present application. Referring to fig. 4, in the embodiment, the photosensitive module 20 is connected to the base of the driving module 30 (i.e. the driving module base 32) through the connecting shaft 31, the bottom of the driving module base 32 can directly abut against the main board of the terminal device, and the array contacts for conducting the circuit can be arranged at the bottom of the driving module, so that the supply of the driving module current can be realized when the contacts of the driving module base 32 and the main board contacts of the terminal device are matched. The side wall of the driving module base 32 may further have an opening 33, the opening 33 may allow the PFC flexible board 22b of the circuit board 22 to pass through, and the current supply during the operation of the photosensitive chip may be realized through the connection contacts (or the connectors 22 c) on the PFC flexible board 22 b. In the working process of the camera module, current supply is respectively realized for the circuit board structure and the driving module 30, so that the two working modules can respectively operate, and the working efficiency of the whole design structure is improved. Specifically, in this embodiment, the circuit board 22 may be connected to a connector 22c through a flexible connection band (i.e., the PFC flexible board 22 b), and then the connector 22c is plugged into a motherboard of the electronic device for power supply, so as to implement power supply of the circuit board 22 and data interaction between the electronic device and the circuit board 22 and the light sensing chip 21. Wherein the side wall of the drive module base 32 may also have a through hole (i.e., opening 33) for the flexible connecting strap to pass through. In this embodiment, the driving module base 32 may include a bottom plate 32a and a supporting base 32b formed to extend upward from a periphery of the bottom plate 32 a. The side wall of the driving module base 32 is the support seat 32b. On the other hand, the bottom surface of the driving module base 32 may be provided with a contact array, which may directly contact with an adaptive contact array of the electronic device motherboard, thereby implementing data interaction between the driving module 30 and the electronic device and power supply to the driving module. The driving circuit of the driving module may be disposed on the driving module base 32, and the width of the wiring in the driving module base 32 may be greater than the width of the wiring in the wiring board 22. Such a design may facilitate providing a greater operating current to the drive module 30, thereby increasing the driving force of the drive module 30. In addition, the scheme of the embodiment can ensure that the driving circuit and the working circuit (referring to the working circuit positioned on the circuit board) for supporting the photosensitive chip to work are electrically separated and cannot mutually influence each other, so that the functions of the driving circuit and the photosensitive chip are smoothly realized.
Still referring to fig. 4, in an embodiment, the driving module further includes a first driving element 34, where the first driving element 34 includes a coil 34a and a metal core (the metal core may be regarded as a shaft 34 b), when the coil is energized, the first driving element 34 generates magnetism, and a magnet is disposed at a top position of the first driving element 34, and the magnet is disposed in the circuit board structure (i.e., disposed in the photosensitive module 20). Specifically, referring to fig. 3a and 3b in combination, the magnets 28 may be provided at mounting positions of the square-frame-shaped magnet fixing layers 27 of the circuit board structure. The mounting location is directly opposite the top of the first drive element. In this embodiment, the first driving element 34 connected to the driving module 30 changes the position of the circuit board 22 (the magnet and the circuit board are fixed together) according to the interaction between the magnetic poles, so as to drive the photosensitive chip 21 mounted on the circuit board 22 to change its position. The intermediate position of the wiring board 22 is fixed by the intermediate connecting shaft 31, and therefore the wiring board 22 is inclined in one direction. In this structure, the first driving elements may cooperate with each other, so that the circuit board can correct pitch and yaw, which will be described in more detail below with reference to other embodiments.
Further, in another embodiment of the present application, the mounting locations of the square-shaped magnet fixing layer may be groove-shaped, which may facilitate accurate assembly of a plurality of magnets to a magnet mounting member (i.e., a magnet fixing layer) using machine vision techniques. On the other hand, the groove-shaped magnet mounting position can also be used for more firmly bonding or fixing the magnet in other modes.
Still referring to fig. 4, in one embodiment, the drive module may further include a second drive element 35, the second drive element 35 may include a fixed shaft 35a and an SMA element 35b (SMA is the acronym for shape memory alloy), and the fixed shaft 35a may be hollow inside. The SMA element 35b is connected to the wire, a fixed block may be connected to one end (free end) of the SMA element 35b, a gap is left between the fixed block and the magnet 28 on the circuit board, when the SMA element 35b is energized, due to the characteristics of the SMA material, the SMA element 35b is extended or contracted to drive the fixed block connected to the fixed block to move, and the fixed block pushes the magnet (i.e., the magnet 28 fixed to the circuit board) adjacent to the fixed block to move, so that the circuit board 22 moves in a plane (i.e., in a plane perpendicular to the optical axis), thereby driving the photosensitive chip fixed to the circuit board to perform position correction. The fixed shafts 35a of the second drive member 35 may be evenly arranged around the connecting shaft. Specifically, the connecting shaft can be used as a center position, four fixed shafts are arranged around the connecting shaft for connecting the SMA elements, and the correction of the chip in the horizontal direction is realized.
Fig. 5 shows a schematic top view of a drive module in an embodiment of the present application. Referring to fig. 5, in the present embodiment, the connecting shaft 31 is located at the center of the driving module base 32, and the connecting shaft 31 may be an elastic member. This connecting axle 31 can link together photosensitive module 20 and drive module 30, and photosensitive module 20's central point puts and drive module 30's central point puts and connects through elastic element, not only can guarantee to use the tie point to realize the correction of equidirectional as the center to reduce drive power in the time of drive circuit board structure, can also make the chip can get back to initial position after the shooting is finished. The driving module base 32 may be integrally formed with a driving element mounting site (e.g., the shaft 34 b) fixed thereon, and the driving element mounting site may be assembled and fixed by a post-processing (e.g., a metal core as the shaft 34b is assembled and fixed by a post-processing). The fixing shaft 35a of the second driving element 35, which realizes the freedom of movement in the horizontal direction, may be directly formed integrally with the driving module base 32, or may be formed first and then the fixing shaft 35a may be attached to the driving module base 32.
Preferably, the fixed shaft of the second driving element effecting the horizontal movement is provided directly with the base. The fixed shaft can be provided with a plurality of fixed shafts, and each fixed shaft can be independently arranged to be a supporting column for leading out the SMA element. The fixed shaft can also be directly designed into a cylindrical structure, and the cylindrical structure can be integrally formed with the base of the driving module. The leads of the SMA element may be placed inside the cylindrical structure, thereby protecting the leads. The SMA element of the leading-out section needs to have higher hardness, so that the horizontal movement can be better realized in the process of pushing the circuit board to move. When the SMA element pushes the circuit board to move according to a preset program, the position of the photosensitive chip is corrected (because the photosensitive chip and the circuit board are directly connected together).
Further, fig. 6 is a schematic side view of an assembled driving module and photosensitive module in an embodiment of the present application. Referring to fig. 6, in the present embodiment, the photosensitive module and the driving module are connected together through an intermediate elastic element. When the camera module is in operation, the photosensitive chip 21 (see fig. 2) is supplied with an operating current from the circuit board 22, and the driving member (including the first driving element 34 and the second driving element 35) is supplied with a current from the driving module base 32. When the camera module shakes during operation, the position detection device (not shown) detects the shaking condition of the camera module and transmits the shaking signal to the microprocessor, and the microprocessor controls the driving module 30 to compensate the shaking condition correspondingly, so that the influence of shaking on imaging is effectively prevented. The specific implementation principle is as follows.
Referring to fig. 6 and 4 in combination, in the working process of the camera module, if the chip tilts due to shaking, the left and right sway needs to be corrected, corresponding current is conducted to the coil 34a of the first driving element 34, at this time, an acting force with the opposite magnetism to the magnet 28 at the bottom of the circuit board 22 is generated at the top end of the first driving element 34, the first driving element 34 and the magnet 28 of the circuit board 22 attract each other, and the magnet 28 is fixed on the base of the circuit board, so that the circuit board is also driven to move correspondingly, and the left and right sway adjustment of the chip is realized. The pitch adjustment principle and the yaw adjustment principle are also the same, and the magnet 28 and the first drive element 34 may be arranged at positions corresponding to the pitch. Referring to fig. 3a, for example, when two magnets 28 are disposed at the first magnet mounting position 28a and the second magnet mounting position 28b, and two corresponding first driving elements are disposed at corresponding positions of the driving module base, the right and left rocking of the photosensitive module may be achieved, and when two magnets 28 are disposed at the third magnet mounting position 28c and the second magnet mounting position 28d, and two corresponding first driving elements are disposed at corresponding positions of the driving module base, the pitch rocking of the photosensitive module may be achieved. Furthermore, by utilizing the lifting driving capability of the first driving element, z-axis translation of the circuit board relative to the driving module base can be realized, wherein the z-axis is a coordinate axis in the vertical direction, and the vertical direction can be regarded as the optical axis direction of the camera module. Still further, referring to fig. 6, in this embodiment, the SMA element in the second drive element is fixed at one end to the fixed shaft and at the other end is a free end. The SMA element is arranged in a horizontal posture and has certain rigidity. Each SMA element may correspond to a magnet (i.e. the magnet on the back of the circuit board that is used to mate with the first drive element). In a natural state, the free end of the SMA element is disposed on a side surface of the corresponding magnet thereof, and a gap is provided between the free end of the SMA element and the side surface of the corresponding magnet. Under the electrified state, the temperature of the SMA element is increased, and based on the characteristics of the SMA material, the SMA element can be heated and stretched, so that the free end of the SMA element can contact the side surface of the magnet, and the magnet and a circuit board connected with the magnet are pushed to move in the horizontal direction. The four SMA elements are mutually matched, so that translation of the circuit board in the directions of an x axis and a y axis can be realized, namely translation of the photosensitive module in the directions of the x axis and the y axis is realized, wherein the x axis and the y axis are two coordinate axes which are mutually vertical in the horizontal direction, and the horizontal direction can be regarded as the direction parallel to the photosensitive surface of the photosensitive chip. The yaw, i.e., the direction of movement about the x-axis, can be referred to as the Rx direction, and the pitch, i.e., the direction of movement about the y-axis, can be referred to as the Ry direction. In summary, in the image capturing module of the present embodiment, the photosensitive chip (or the photosensitive module) can have five degrees of freedom, i.e., x-axis translation, y-axis translation, z-axis translation, rx rotation, and Ry rotation, to achieve anti-shake, so that the image capturing module has a strong compensation capability for shake of the image capturing module.
In the above embodiment, the photosensitive module and the driving module may jointly form a photosensitive assembly with an anti-shake function.
The camera module provided by the invention can be applied to electronic terminal equipment, and in some specific practices, the electronic terminal equipment can be a smart phone, a notebook computer, a television, a vehicle-mounted camera device and the like. Through the module of making a video recording of using this embodiment, electronic terminal equipment still possesses focusing and anti-shake function when possessing the formation of image function, in addition, still can improve the speed of focusing and optics anti-shake, effectively promotes the imaging quality of module.
Further, according to an embodiment of the present application, there is provided an assembling method of a photosensitive assembly with an anti-shake function, which may be implemented by prefabricating each element into a photosensitive module and a driving module, and then assembling the two modules, thereby obtaining the photosensitive assembly with the anti-shake function. The assembling method of the embodiment simplifies the complex assembling process, is very suitable for automatic production, and has good application prospect. Specifically, the method for assembling the photosensitive assembly with the anti-shake function of the present embodiment includes the following steps.
Step S1, a photosensitive module and a driving module separated from each other are prepared. The photosensitive module can comprise a circuit board, a photosensitive chip, a color filter and a color filter support. The photosensitive chip is mounted on the upper surface (namely the front surface) of the circuit board, and the color filter support is mounted on or directly formed on the upper surface of the photosensitive chip and surrounds the photosensitive chip. For example, the color filter holder may be directly formed on the upper surface of the circuit board by a molding process, and a molding portion (or referred to as a molding base) serving as the color filter holder may cover a gold wire for connecting the photosensitive chip and the circuit board. The molding portion may also cover various electronic components (e.g., capacitors, resistors, etc.) on the wiring board. The color filter is mounted to the color filter holder. The lower surface (i.e., the back surface) of the wiring board may have a reinforcing layer, which may be a metal layer. The lower surface of the reinforcing layer may be provided with a frame-shaped magnet mounting member, and the magnet mounting member may be provided with a plurality of magnets. The plurality of magnets may surround the center of the circuit board (i.e., the photosensitive chip). The driving module comprises a driving module base, a plurality of coils arranged on the driving module base, a plurality of shafts, a fixing shaft, a connecting shaft and a plurality of SMA elements. Wherein, every coil all corresponds to a magnetite of being fixed in the circuit board bottom, and sets up under this magnetite. The coil can be wound on a winding shaft, and the bottom end of the winding shaft can be fixed on the driving module base. A plurality of coils and their axes of rotation may be distributed around the connecting shaft. The fixing shaft is a rigid element, one end of the SMA element can be fixed on the fixing shaft, and the other end of the SMA element is a free end and is arranged on the side surface of the magnet fixed on the circuit board. The SMA element may be rigid and arranged horizontally in a natural state, and a gap may be provided between a free end of the SMA element and the magnet in the natural state. Under the power-on state, the SMA element can stretch and contact the side surface of the magnet, so that the circuit board structure is pushed to move in the horizontal direction, and the horizontal direction is parallel to the direction of the photosensitive surface of the photosensitive chip. The driving module base may include a bottom plate and a support base formed to extend upward from a peripheral edge of the bottom plate. The photosensitive module can be arranged in the supporting seat, and a certain gap is formed between the photosensitive module and the inner side face of the supporting seat, so that the photosensitive module can integrally move to realize anti-shake. Further, the photosensitive assembly is suspended in the driving module base under the action of the connecting shaft. The side wall of the supporting seat can also be provided with a through hole which can be used for the flexible connecting belt of the circuit board to pass through.
And S2, installing the photosensitive module in the driving module. The center of the photosensitive chip can be aligned with the top of the connecting shaft, and then the bottom of the photosensitive module is fixed to (the top of the connecting shaft, the connecting shaft can be an elastic supporting shaft, and the elastic supporting shaft is suitable for supporting the photosensitive module, and meanwhile, the elastic supporting shaft allows the photosensitive module to move when being driven by the driving element.
In the step S1, the photosensitive module and the driving module may be prefabricated (i.e., prefabricated) respectively. In one embodiment, the method of prefabricating (or fabricating) the photosensitive module may include the following sub-steps.
Step S11, the photosensitive chip, the circuit board and the color filter are assembled together. Specifically, the photosensitive chip may be mounted on (e.g., attached to) a circuit board, the photosensitive chip may be electrically connected to the circuit board through a wire bonding process, an electronic component may be mounted on the circuit board (i.e., the photosensitive chip may be located on an outer side of the photosensitive chip), a molding portion may be formed on a surface of the circuit board through a molding process, the molding portion may cover a gold wire (a gold wire formed through the wire bonding process) and the electronic component, and the molding portion may contact and cover an edge area of the photosensitive chip (the edge area is a non-photosensitive area). The molding part may serve as a color filter holder to which the color filter may be attached (e.g., adhered).
Step S12, manufacturing a magnet assembly. Specifically, one frame-shaped magnet attachment member may be prepared, and four magnets may be attached to the set four (or other number of) magnet attachment positions. The four magnet mounting positions may be respectively located at central positions of the four sides of the frame-shaped magnet mounting member. The frame-shaped magnet mounting member can be used to assemble four magnets (or other numbers of magnets) into an integral assembly in advance. In the assembling process, the mounting positions of the magnets can be automatically identified and calibrated by using a machine vision technology, so that the accuracy of the mounting positions of the magnets is ensured to reach a preset standard.
And S13, mounting a magnet assembly on the back surface of the circuit board. In one embodiment, the frame-shaped magnet mounting member of the magnet assembly may be directly mounted to (e.g., attached to) the back surface of the circuit board. In the installation process, the positions of a photosensitive chip (or a circuit board) and the frame-shaped magnet installation part can be calibrated based on a machine vision technology, so that the centers of the photosensitive chip (or the circuit board) and the frame-shaped magnet installation part are overlapped, and then the photosensitive chip is installed to obtain a complete photosensitive module.
In another embodiment, in step S11, a reinforcing layer (e.g., a metal layer) may be attached or formed on the back surface of the circuit board. In step S23, a frame-shaped magnet attachment member of the magnet assembly may be attached (e.g., adhered) to the lower surface of the reinforcement layer. Similarly, in the installation process, the positions of the photosensitive chip (or the circuit board) and the frame-shaped magnet installation part can be calibrated based on the machine vision technology, so that the centers of the photosensitive chip (or the circuit board) and the frame-shaped magnet installation part are overlapped, and then the photosensitive chip (or the circuit board) and the frame-shaped magnet installation part are installed to obtain the complete photosensitive module.
Further, in another embodiment, the prefabrication (or fabrication) method of the driving module may include the following substeps.
Step S14, a drive module base is manufactured. The drive module base comprises a bottom plate and a supporting seat formed by extending upwards from the periphery of the bottom plate. The bottom plate and the supporting seat can be integrally formed, or can be prefabricated respectively and then assembled into a whole. In this embodiment, the driving module base may have a built-in driving circuit, specifically, a circuit frame may be fabricated first, and the driving circuit is disposed in the circuit frame. And then, wrapping the circuit frame by using a molding material through a molding process, and molding to obtain the molded driving module base with the required shape. The rear side of the drive module base may have an array of contacts exposed outside the molding, which are located in or electrically connected to the line frame.
And step S15, assembling a fixed shaft on the upper surface of the bottom plate of the driving module base.
And S16, arranging a shaft on the upper surface of the bottom plate of the driving module base and winding a coil on the shaft. The coil is electrically connected with a driving circuit of the line frame.
And S17, mounting an SMA element on the fixed shaft, wherein the SMA element is made of an SMA material and has certain rigidity. One end of the SMA element is fixed to the fixed shaft and the other end may be a free end. The free end can also be provided with a fixed block. The SMA element may be electrically connected to the drive circuitry of the wire frame by a wire.
And S18, mounting a connecting shaft at the center of the bottom plate of the driving module base. The connecting shaft may be an elastic supporting shaft.
Further, in another embodiment of the present invention, in the above step, the fixing shaft may be integrally formed with the driving module base. I.e. said step S15 may be combined with S14.
It should be noted that, in the above embodiments, the photosensitive chip of the assembled camera module has five degrees of freedom of movement, i.e., five-axis anti-shake of the photosensitive chip can be realized. Generally speaking, the more freedom of movement, the more complicated the design of the driving structure, thereby increasing the difficulty of assembly. In the assembly scheme of the invention, all circuit structures and wires for driving the chip to move can be concentrated in the driving module. Therefore, for the photosensitive module, only a structural member matched with the driving module needs to be arranged on the back surface of the circuit board of the photosensitive module, and an additional circuit or a lead for realizing the movement of the driving chip does not need to be added. Therefore, when the photosensitive module and the driving module are assembled, only the photosensitive module and the driving module need to be mechanically connected, and the photosensitive module and the driving module do not need to be electrically connected, so that the complexity of the assembly process is greatly reduced, and the improvement of the production efficiency and the yield is facilitated.
Furthermore, the invention also provides a camera module assembly method, which can be used for obtaining the camera module with the anti-shake function by prefabricating each element into a lens module, a photosensitive module and a driving module and then assembling the three modules. The assembling method of the embodiment simplifies the complex assembling process, is very suitable for automatic production, and has good application prospect. In this embodiment, the photosensitive assembly can be assembled by using the assembly method of the photosensitive assembly with anti-shake function described above, and then the photosensitive assembly and the lens module are assembled together. The bottom surface of the lens module can be arranged on the top surface of the driving module supporting seat. The lens module may be an optical lens that does not include a motor. In another embodiment, the lens module may also include a motor and an optical lens. At this time, the bottom surface of the motor is mounted on the top surface of the support base of the photosensitive assembly.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (23)
1. A photosensitive assembly with an anti-shake function, comprising:
a photosensitive chip having a photosensitive surface;
the circuit board structure comprises a circuit board, and the photosensitive chip is mounted on the upper surface of the circuit board;
the driving module base is positioned below the circuit board structure, the circuit board structure is connected with the driving module base through a connecting shaft, and the connecting shaft is an elastic supporting shaft;
a plurality of magnets mounted on the back of the circuit board structure and surrounding the connecting shaft;
the first driving elements are arranged on the upper surface of the driving module base, the top of each first driving element corresponds to one magnet, each first driving element comprises a coil and a magnetic core, and the magnetic force of the first driving elements acts on the magnets to push the circuit board structure to move in the power-on state of the coil;
one or more fixed shafts fixed to the driving module base and surrounding the connecting shaft; and
the second driving elements are SMA elements, one ends of the SMA elements are fixed on the fixed shaft, the other ends of the SMA elements are arranged on the side surfaces of the magnets, gaps are formed between the SMA elements and the magnets in a natural state, and in an electrified state, the SMA elements stretch and push the magnets from the side surfaces to further push the circuit board structure to move in a horizontal direction which is parallel to the photosensitive surface;
the circuit board structure further comprises a frame-shaped magnet installation layer, the magnet installation layer is located on the back face of the circuit board, the lower surface of the magnet installation layer is provided with a plurality of magnet installation positions, and magnets are installed on the magnet installation positions.
2. The photosensitive assembly with the anti-shake function according to claim 1, wherein the circuit board structure further includes a reinforcing layer formed on or attached to a lower surface of the circuit board; the magnet mounting layer is attached to a lower surface of the reinforcement layer.
3. The photosensitive assembly with an anti-shake function according to claim 2, wherein the reinforcing layer is a metal layer or a metal plate.
4. The photosensitive assembly according to claim 1, wherein the magnet mounting layer is a square metal layer or a square metal plate.
5. The photosensitive assembly with anti-shake function according to claim 1, wherein the photosensitive assembly with anti-shake function is adapted to adjust an inclination angle of the circuit board structure with respect to the driving module base by controlling a direction and a magnitude of current in the coils of the plurality of first driving elements.
6. The photosensitive assembly according to claim 4, wherein four magnets are provided, and each of the four magnets is attached to a central position of four sides of the frame-shaped magnet attachment layer.
7. The photosensitive assembly with an anti-shake function according to claim 4, wherein a center of the magnet mounting layer coincides with a center of the hard board of the circuit board.
8. The photosensitive assembly according to claim 1, wherein the magnet mounting layer has a groove-shaped magnet mounting location, and the magnet is mounted in the groove-shaped magnet mounting location.
9. The photosensitive assembly with an anti-shake function according to claim 1, wherein the fixed shaft is cylindrical, the plurality of SMA elements are fixed to the fixed shaft, and the SMA elements are electrically connected to the driving module base through wires.
10. The photosensitive assembly with an anti-shake function according to claim 1, wherein the circuit board has therein a functional circuit for supporting the photosensitive chip, the driving module base has therein a driving circuit for supplying current to the coil and the SMA element, and the functional circuit and the driving circuit are electrically separated from each other.
11. The photosensitive assembly with an anti-shake function according to claim 1, wherein the bottom surface of the driving module base is adapted to bear against a motherboard of an electronic device, and the bottom surface of the driving module base has a contact array adapted to be electrically connected with the motherboard contact array of the motherboard.
12. The photosensitive assembly according to claim 1, wherein the driving module base comprises a bottom plate and a supporting base extending upward from a periphery of the bottom plate, the supporting base surrounds the circuit board structure and has a gap with a side surface of the circuit board structure.
13. A photosensitive assembly with an anti-shake function according to claim 12, wherein the supporting base is adapted to mount the lens assembly.
14. The photosensitive assembly with the anti-shake function according to claim 1, further comprising:
the metal wire is used for electrically connecting the circuit board and the photosensitive chip based on a routing process;
an electronic element mounted on the upper surface of the circuit board and disposed outside the photosensitive chip;
the molding base is formed on the upper surface of the circuit board through a molding process and used for plastically packaging the metal wire and the electronic element; and
and the optical filter is arranged on the molding seat.
15. The photosensitive assembly with an anti-shake function according to claim 14, wherein the photosensitive chip, the circuit board structure, the metal wires, the electronic component, the mold base and the filter as a whole move integrally under the driving of the first driving element and/or the second driving element with respect to the driving module base.
16. The utility model provides a module of making a video recording which characterized in that includes:
a lens assembly;
the photosensitive assembly of any one of claims 1-15, said lens assembly mounted to said drive module base of said photosensitive assembly.
17. An assembling method of a photosensitive assembly with an anti-shake function is characterized by comprising the following steps:
step 1) preparing a photosensitive module and a driving module which are separated from each other; the photosensitive module comprises a circuit board, a photosensitive chip arranged on the front surface of the circuit board and a plurality of magnets positioned on the back surface of the circuit board; the driving module comprises a driving module base, a plurality of coils, a plurality of shafts and a connecting shaft, wherein the coils are arranged on the driving module base; and
step 2) installing the photosensitive module in the driving module; aligning the center of the photosensitive chip to the top of the connecting shaft, fixing the bottom of the photosensitive module to the top of the connecting shaft, and enabling the top of each coil of the driving module to correspond to the bottom of one magnet of the photosensitive module respectively;
wherein, in step 1), the driving module further includes: the fixing shaft is arranged on the upper surface of the bottom plate, one end of each SMA element is fixed on the fixing shaft, and the other end of each SMA element is a free end;
the step 2) further comprises the following steps: after the photosensitive module is installed in the driving module, the free end of each SMA element of the driving module is arranged on the side surface of one magnet of the photosensitive module, a gap is formed between the free end of the SMA element and the side surface of the magnet corresponding to the free end of the SMA element in a natural state, and the SMA element stretches to contact and push the magnet corresponding to the SMA element in a state of electrifying the SMA element.
18. The method for assembling a photosensitive assembly with an anti-shake function according to claim 17, wherein in step 1), the method for preparing the photosensitive module includes the following sub-steps:
step 11) mounting the photosensitive chip on the circuit board to obtain a photosensitive module semi-finished product;
step 12) preparing a frame-shaped magnet mounting part, automatically identifying and calibrating the mounting positions of the magnets by using a machine vision technology, and mounting the magnets on the frame-shaped magnet mounting part to obtain a magnet assembly; and
step 13) mounting the magnet assembly on the back of the semi-finished product of the photosensitive module; wherein, based on machine vision technique to sensitization chip with the position of frame shape magnetite installed part is calibrated, makes the center coincidence of the two, then installs to obtain complete sensitization module.
19. The method for assembling a photosensitive assembly with an anti-shake function according to claim 18, wherein the step 11) further includes: electrically connecting the photosensitive chip with the circuit board through a routing process, and mounting an electronic element on the circuit board; then forming a molding part on the surface of the circuit board through a molding process, wherein the molding part covers the metal wire and the electronic element formed by the wire bonding process, and the molding part is contacted with and covers the edge area of the photosensitive chip; and then the color filter is arranged on the molding part to obtain the semi-finished product of the photosensitive module.
20. The method for assembling a photosensitive assembly with an anti-shake function according to claim 18, wherein the step 11) further includes: attaching or forming a reinforcing layer on the back of the circuit board for the semi-finished product of the photosensitive module;
in the step 13), a frame-shaped magnet attachment member of the magnet assembly is attached to a lower surface of the reinforcement layer.
21. The method for assembling a photosensitive assembly with an anti-shake function according to claim 17, wherein in step 1), the method for preparing the driving module comprises the sub-steps of:
step 14), manufacturing the driving module base; firstly, manufacturing a circuit frame for distributing a driving circuit, then wrapping the circuit frame by using a molding material through a molding process, and forming to obtain a molding driving module base with a required shape; the back surface of the driving module base is provided with a contact array exposed to the outside;
step 15) assembling a fixed shaft on the upper surface of the bottom plate of the driving module base;
step 16) arranging a shaft on the upper surface of the bottom plate of the driving module base and winding a coil on the shaft; the coil is electrically connected with a driving circuit of the circuit frame;
step 17) mounting a plurality of SMA elements on a fixed shaft, wherein one end of each SMA element is fixed on the fixed shaft, and the other end of each SMA element is a free end; the SMA element is electrically connected with a driving circuit of the circuit frame through a lead; and
and 18) mounting a connecting shaft at the center of the bottom plate of the driving module base.
22. The method for assembling a photosensitive assembly with an anti-shake function according to claim 21, wherein the steps 15) and 14) are performed simultaneously, and the fixing shaft is integrally formed with the driving module base.
23. An assembling method of a camera module is characterized by comprising the following steps:
a step a) of assembling a photosensitive assembly with an anti-shake function according to the method of assembling a photosensitive assembly with an anti-shake function of any one of claims 17 to 22; and
and b) mounting a lens assembly on the photosensitive assembly with the anti-shake function, wherein the bottom surface of the lens assembly is mounted on the top surface of the support seat.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010419327.8A CN113691693B (en) | 2020-05-18 | 2020-05-18 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
| PCT/CN2021/083870 WO2021232948A1 (en) | 2020-05-18 | 2021-03-30 | Photosensitive assembly having anti-shake function, camera module, and assembly methods therefor |
| CN202180035255.XA CN115552884A (en) | 2020-05-18 | 2021-03-30 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010419327.8A CN113691693B (en) | 2020-05-18 | 2020-05-18 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113691693A CN113691693A (en) | 2021-11-23 |
| CN113691693B true CN113691693B (en) | 2022-10-14 |
Family
ID=78575499
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010419327.8A Active CN113691693B (en) | 2020-05-18 | 2020-05-18 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
| CN202180035255.XA Pending CN115552884A (en) | 2020-05-18 | 2021-03-30 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180035255.XA Pending CN115552884A (en) | 2020-05-18 | 2021-03-30 | Photosensitive assembly with anti-shake function, camera module and assembling method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN113691693B (en) |
| WO (1) | WO2021232948A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114257726B (en) * | 2021-12-20 | 2024-02-09 | 江西晶浩光学有限公司 | Camera module and electronic equipment |
| CN114614629B (en) * | 2022-05-10 | 2022-08-30 | 基合半导体（宁波）有限公司 | Anti-shake motor, camera module and electronic equipment |
| CN115967860B (en) * | 2022-12-21 | 2024-07-19 | 广州立景创新科技有限公司 | Optical anti-vibration correction system and method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008129470A (en) * | 2006-11-22 | 2008-06-05 | Canon Inc | Imaging apparatus and portable electronic equipment |
| CN205982857U (en) * | 2016-05-27 | 2017-02-22 | 富鸿扬精密工业（深圳）有限公司 | Optical anti -vibration subassembly and have electron device of this optical anti -vibration subassembly |
| CN110832833A (en) * | 2017-06-27 | 2020-02-21 | Lg伊诺特有限公司 | Camera module |
| CN210246879U (en) * | 2019-08-09 | 2020-04-03 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8982464B2 (en) * | 2010-10-22 | 2015-03-17 | Tdk Taiwan Corporation | Tilt-type anti-shake compensation structure for auto-focus module |
| TWI546604B (en) * | 2012-07-05 | 2016-08-21 | 鴻海精密工業股份有限公司 | Actuator and camera module using same |
| CN107277304B (en) * | 2016-04-01 | 2020-11-20 | 台湾东电化股份有限公司 | Camera module and control method thereof |
| KR102653016B1 (en) * | 2018-09-18 | 2024-03-29 | 삼성전자주식회사 | Chuck driving device and substrate processing apparatus |
-
2020
- 2020-05-18 CN CN202010419327.8A patent/CN113691693B/en active Active
-
2021
- 2021-03-30 CN CN202180035255.XA patent/CN115552884A/en active Pending
- 2021-03-30 WO PCT/CN2021/083870 patent/WO2021232948A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008129470A (en) * | 2006-11-22 | 2008-06-05 | Canon Inc | Imaging apparatus and portable electronic equipment |
| CN205982857U (en) * | 2016-05-27 | 2017-02-22 | 富鸿扬精密工业（深圳）有限公司 | Optical anti -vibration subassembly and have electron device of this optical anti -vibration subassembly |
| CN110832833A (en) * | 2017-06-27 | 2020-02-21 | Lg伊诺特有限公司 | Camera module |
| CN210246879U (en) * | 2019-08-09 | 2020-04-03 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115552884A (en) | 2022-12-30 |
| WO2021232948A1 (en) | 2021-11-25 |
| CN113691693A (en) | 2021-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113691693B (en) | Photosensitive assembly with anti-shake function, camera module and assembling method thereof | |
| TWI662770B (en) | Actuator, camera module, and portable terminal provided with camera | |
| TWI516855B (en) | Tri-axis closed-loop anti-shake structure | |
| JP6792145B2 (en) | Actuators, camera modules and camera mounting devices | |
| CN115061260A (en) | Lens driving device, camera module, and optical apparatus | |
| CN113711581B (en) | Camera module and optical device | |
| JP2024019569A (en) | Camera device and optical apparatus | |
| CN113489881A (en) | Imaging device and electronic apparatus | |
| CN113840060B (en) | Camera module and electronic equipment | |
| CN115914832A (en) | Anti-shake motor, camera module and electronic equipment | |
| CN116349236A (en) | Camera module with cradle head | |
| CN114520858A (en) | Optical anti-shake camera module | |
| CN214381107U (en) | Camera module and mobile terminal | |
| KR102525608B1 (en) | camera device and optical apparatus | |
| CN114755873B (en) | Image pickup module, optical adjustment method thereof and electronic equipment | |
| CN114554068A (en) | Optical anti-shake camera module | |
| CN114222051B (en) | Image pickup assembly and electronic apparatus | |
| US20230171497A1 (en) | Camera module | |
| KR20100092822A (en) | Photographing module | |
| CN114554073A (en) | Driving structure for optical actuator and corresponding camera module | |
| CN114428436A (en) | Optical anti-shake camera module | |
| CN113949788B (en) | Camera module with cloud platform | |
| CN216748244U (en) | Three-axis automatic focusing anti-shake periscope motor | |
| KR102374600B1 (en) | Camera module | |
| CN221263901U (en) | Camera module and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |