CN113690157A - Baffle control method and control system for wafer processing unit - Google Patents
Baffle control method and control system for wafer processing unit Download PDFInfo
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- CN113690157A CN113690157A CN202010420087.3A CN202010420087A CN113690157A CN 113690157 A CN113690157 A CN 113690157A CN 202010420087 A CN202010420087 A CN 202010420087A CN 113690157 A CN113690157 A CN 113690157A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 235000012431 wafers Nutrition 0.000 description 125
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000002178 crystalline material Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a baffle control method and a baffle control system for a wafer processing unit, wherein the method comprises the following steps: judging whether a wafer exists on a robot hand used for transferring the wafer or not; if the wafer is judged to be the first unit, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the machine of the first unit; if the judgment result is no, judging whether a second unit with the wafer exists at present, and if the judgment result is yes, moving the robot hand to the front of the machine of the second unit; and controlling the first unit or the second unit to open a baffle. The method determines the unit for processing the wafer in the next step by judging the current state of the manipulator and controls the opening or closing of the corresponding baffle plate, so that the baffle plate can be opened and closed more accurately, and the processing process and the product quality can be ensured.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a baffle control method and a baffle control system for a wafer processing unit.
Background
The wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystalline material and has a circular shape, and the substrate material includes silicon, germanium, GaAs, InP, GaN, etc., wherein silicon is most commonly used, and if the crystalline material is not particularly specified, silicon wafers are commonly used, and various circuit element structures can be manufactured on the silicon wafers, so that the integrated circuit products with specific electrical functions can be obtained.
When a wafer is processed by a wafer machine, the wafer is generally moved to each processing unit, such as a hot plate unit and a coating unit, by a robot or the like. Among them, some units need to maintain a stable temperature (e.g., hot plate unit), some units need to prevent contamination (e.g., rotary unit), all need to install a shutter, the hot plate unit opens the shutter only when transferring the wafer, and the rotary unit closes the shutter only when processing the wafer. In the prior art, the opening and closing of each unit baffle cannot be accurately and effectively controlled, and the processing process of the wafer and the quality of the wafer are influenced.
Disclosure of Invention
The invention aims to provide a baffle control method and a baffle control system for a wafer processing unit, which can ensure the unit for processing a wafer in the next step by judging the current state of a manipulator and control the opening or closing of a corresponding baffle, can ensure the opening and closing of the baffle to be more accurate, and is beneficial to ensuring the processing progress and the product quality.
The technical scheme provided by the invention is as follows:
the invention provides a baffle control method for a wafer processing unit, which comprises the following steps:
judging whether a wafer exists on a robot hand used for transferring the wafer or not;
if the wafer is judged to be the first unit, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the machine of the first unit; if the judgment result is no, judging whether a second unit with the wafer exists at present, and if the judgment result is yes, moving the robot hand to the front of the machine of the second unit;
and controlling the first unit or the second unit to open a baffle.
By judging whether the wafer exists on the robot hand for transferring the wafer or not, if so, the robot hand is used for transferring the wafer, and the first unit can be accurately controlled to open the baffle plate by moving the robot hand to the front of the machine of the first unit for processing the wafer in the next step; if the wafer does not exist on the manipulator, the wafer is indicated to be processed, and the manipulator is moved to the front of the local machine of the second unit with the wafer currently, so that the baffle can be accurately controlled to open and close the second unit, the baffle is more accurately opened and closed, and the processing process and the product quality are favorably ensured.
Further, after controlling the first unit or the second unit to open the baffle, the method further comprises the following steps:
the robot adds a wafer from the first unit or removes a wafer from the second unit;
controlling the first unit or the second unit to close the baffle.
Further, before the robot adds the wafer from the first unit or removes the wafer from the second unit, the method further comprises the following steps:
judging whether the baffle is opened or not, if so, adding the wafer from the first unit by the robot hand, or removing the wafer from the second unit by the robot hand; if not, repeatedly judging whether the baffle is opened or not.
Whether the baffle is opened or not is judged before the wafer is added into the first unit or removed from the second unit, so that the situation that the baffle is not opened due to reasons such as control errors and the like can be avoided, and the influence on the processing progress of the wafer is avoided.
Further, before controlling the first unit or the second unit to open the baffle, the method further comprises the following steps:
judging whether the local machine of the first unit or the second unit is in a standby state or not;
if the judgment result is yes, controlling the first unit or the second unit to open a baffle; if not, repeatedly judging whether the local machine of the first unit or the second unit is in a standby state.
Whether the machine of the first unit or the second unit is in a standby state or not is judged before the baffle is opened by controlling the first unit or the second unit, so that the wafers can be processed in the first unit or the second unit, the next operation can be carried out, and the influence on the processing of the wafers is avoided.
Further, when the determining whether there is a second unit having a wafer currently, the method further includes:
if not, repeatedly judging whether the wafer exists on the robot hand for transferring the wafer.
The invention also provides a baffle control system for the wafer processing unit, and the baffle control method for the wafer processing unit comprises the following steps:
the first judgment module is used for judging whether a wafer exists on the robot hand or not;
the second judging module is used for judging whether a second unit with a wafer exists at present or not when the first judging module judges that the wafer does not exist on the robot hand;
the driving module is used for driving the robot to move to the front of a local machine of a first unit for processing a wafer in the next step when the first judging module judges that the wafer exists on the robot, or driving the robot to move to the front of the local machine of a second unit when the first judging module judges that the wafer does not exist on the robot and the second judging module judges that the second unit with the wafer currently exists;
and the baffle opening module is used for controlling the first unit or the second unit to open the baffle.
Further, still include:
the operation module is used for controlling the robot to add the wafer from the first unit or controlling the robot to remove the wafer from the second unit;
and the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
Further, still include:
a third judging module, configured to judge whether the baffle is open before the operation module controls the robot to add a wafer from the first unit or controls the robot to remove a wafer from the second unit,
if the judgment result is yes, the operation module controls the robot to add the wafer into the first unit or controls the robot to remove the wafer from the second unit, and if the judgment result is no, the third judgment module repeatedly judges whether the baffle is opened or not.
Further, still include:
a fourth judging module, configured to judge whether the local computer of the first unit or the second unit is in a standby state before the baffle opening module controls the first unit or the second unit to open the baffle,
if the judgment result is yes, the baffle opening module controls the first unit or the second unit to open the baffle, and if the judgment result is no, the fourth judgment module repeatedly judges whether the machine of the first unit or the second unit is in a standby state.
Further, when the second determining module determines that the second unit with the wafer does not exist currently, the first determining module repeatedly determines whether the wafer exists on the robot hand.
According to the baffle control method and the baffle control system for the wafer processing unit, whether the wafer exists on the robot hand for transferring the wafer or not is judged, if yes, the robot hand is used for transferring the wafer at the moment, and the first unit can be accurately controlled to open the baffle by moving the robot hand to the front of the machine of the first unit for processing the wafer in the next step; if the wafer does not exist on the manipulator, the wafer is indicated to be processed, and the manipulator is moved to the front of the local machine of the second unit with the wafer currently, so that the baffle can be accurately controlled to open and close the second unit, the baffle is more accurately opened and closed, and the processing process and the product quality are favorably ensured.
Drawings
The foregoing features, technical features, advantages and embodiments of the present invention will be further explained in the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic overall flow diagram of an embodiment of the present invention;
FIG. 2 is a flowchart of a method for controlling a baffle plate for a wafer processing unit according to an embodiment of the present invention;
fig. 3 is a schematic flow chart between a and B in fig. 2.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
Example 1
In one embodiment of the present invention, as shown in fig. 1, the present invention provides a method for controlling a baffle plate for a wafer processing unit, comprising the steps of:
and S1, judging whether the wafer exists on the robot hand for transferring the wafer.
S2, if yes, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the machine of the first unit; if the judgment result is no, whether a second unit with the wafer exists currently is judged, and if the judgment result is yes, the robot hand is moved to the front of the machine of the second unit.
And S3, controlling the first unit or the second unit to open the baffle.
Further, after controlling the first unit or the second unit to open the baffle, the method further comprises the following steps:
s4, the robot adds the wafer from the first cell, or the robot removes the wafer from the second cell.
And S5, controlling the first unit or the second unit to close the baffle.
Further, when determining whether there is a second unit having a wafer currently, the method further includes:
if not, repeatedly judging whether the wafer exists on the robot hand for transferring the wafer.
By judging whether the wafer exists on the robot hand for transferring the wafer or not, if so, the robot hand is used for transferring the wafer, and the first unit can be accurately controlled to open the baffle plate by moving the robot hand to the front of the machine of the first unit for processing the wafer in the next step; if the wafer does not exist on the manipulator, the wafer is indicated to be processed, and the manipulator is moved to the front of the local machine of the second unit with the wafer currently, so that the baffle can be accurately controlled to open and close the second unit, the baffle is more accurately opened and closed, and the processing process and the product quality are favorably ensured.
Example 2
An embodiment of the present invention, as shown in fig. 2 and 3, further includes, before the robot adds the wafer from the first unit or removes the wafer from the second unit, the steps of:
judging whether the baffle is opened or not, if so, adding the wafer from the first unit by the robot, or removing the wafer from the second unit by the robot; if not, repeatedly judging whether the baffle is opened or not.
Whether the baffle is opened or not is judged before the wafer is added into the first unit or removed from the second unit, so that the situation that the baffle is not opened due to reasons such as control errors and the like can be avoided, and the influence on the processing progress of the wafer is avoided.
Preferably, before controlling the first unit or the second unit to open the baffle, the method further comprises the steps of:
judging whether the local machine of the first unit or the second unit is in a standby state or not; if the judgment result is yes, the first unit or the second unit is controlled to open the baffle; if not, repeatedly judging whether the local machine of the first unit or the second unit is in a standby state.
Whether the machine of the first unit or the second unit is in a standby state or not is judged before the baffle is opened by controlling the first unit or the second unit, so that the wafers can be processed in the first unit or the second unit, the next operation can be carried out, and the influence on the processing of the wafers is avoided.
Example 3
An embodiment of the present invention provides, on the basis of embodiment 1 or 2, a baffle control system for a wafer processing unit, where the baffle control method for a wafer processing unit includes a first determining module, a second determining module, a driving module, and a baffle opening module.
The first judging module is used for judging whether a wafer exists on the robot hand or not; the second judging module is used for judging whether a second unit with a wafer exists at present when the first judging module judges that the wafer does not exist on the robot hand.
Preferably, when the second determining module determines that the second unit with the wafer does not exist currently, the first determining module repeatedly determines whether the wafer exists on the robot hand.
The driving module is used for driving the robot to move to the front of the machine of the first unit for processing the wafer in the next step when the first judging module judges that the wafer exists on the robot; or when the first judging module judges that the wafer does not exist on the robot hand and the second judging module judges that the second unit with the wafer currently exists, the robot hand is driven to move to the front of the machine of the second unit.
The baffle opening module is used for controlling the first unit or the second unit to open the baffle.
Whether a wafer exists on a robot hand for transferring the wafer is judged through the first judging module, if so, the robot hand is indicated to transfer the wafer, the robot hand is moved to the front of a machine of a first unit for processing the wafer in the next step through the driving module, and the baffle opening module can accurately control the first unit to open the baffle; if the first judging module judges that the wafer does not exist on the manipulator and the second judging module judges that the second unit with the wafer currently exists, the wafer is indicated to be processed, the manipulator is moved to the front of the machine of the second unit with the wafer currently existing through the driving module, and the baffle opening module can accurately control the second unit to open the baffle, so that the baffle is opened and closed more accurately, and the processing process and the product quality are guaranteed.
Example 4
In an embodiment of the present invention, based on embodiment 3, the baffle control system for a wafer processing unit further includes an operation module and a baffle closing module, wherein the operation module is used for controlling a robot to add a wafer from the first unit or remove a wafer from the second unit; the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
Preferably, the baffle control system for the wafer processing unit further comprises a third judging module, wherein the third judging module is used for judging whether the baffle is opened or not before the operation module controls the robot to add the wafer from the first unit or controls the robot to remove the wafer from the second unit; if the judgment result is yes, the operation module controls the robot to add the wafer from the first unit or controls the robot to remove the wafer from the second unit, and if the judgment result is no, the third judgment module repeatedly judges whether the baffle is opened or not.
Whether the baffle is opened or not is judged before the wafer is added into the first unit or removed from the second unit, so that the situation that the baffle is not opened due to reasons such as control errors and the like can be avoided, and the influence on the processing progress of the wafer is avoided.
Preferably, the baffle control system for the wafer processing unit further comprises a fourth judging module, and the fourth judging module is used for judging whether the machine of the first unit or the second unit is in a standby state before the baffle opening module controls the first unit or the second unit to open the baffle; if the judgment result is yes, the baffle opening module controls the first unit or the second unit to open the baffle, and if the judgment result is no, the fourth judgment module repeatedly judges whether the machine of the first unit or the second unit is in a standby state.
Whether the machine of the first unit or the second unit is in a standby state or not is judged before the baffle is opened by controlling the first unit or the second unit, so that the wafers can be processed in the first unit or the second unit, the next operation can be carried out, and the influence on the processing of the wafers is avoided.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A baffle control method for a wafer processing unit is characterized by comprising the following steps:
judging whether a wafer exists on a robot hand used for transferring the wafer or not;
if the wafer is judged to be the first unit, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the machine of the first unit; if the judgment result is no, judging whether a second unit with the wafer exists at present, and if the judgment result is yes, moving the robot hand to the front of the machine of the second unit;
and controlling the first unit or the second unit to open a baffle.
2. The method of claim 1, wherein the method further comprises: after controlling the first unit or the second unit to open the baffle, the method further comprises the following steps:
the robot adds a wafer from the first unit or removes a wafer from the second unit;
controlling the first unit or the second unit to close the baffle.
3. The method of claim 2, wherein the method further comprises: before the robot adds the wafer from the first unit or removes the wafer from the second unit, the method further comprises the following steps:
judging whether the baffle is opened or not, if so, adding the wafer from the first unit by the robot hand, or removing the wafer from the second unit by the robot hand; if not, repeatedly judging whether the baffle is opened or not.
4. The method of claim 1, wherein the method further comprises: before controlling the first unit or the second unit to open the baffle, the method further comprises the following steps:
judging whether the local machine of the first unit or the second unit is in a standby state or not;
if the judgment result is yes, controlling the first unit or the second unit to open a baffle; if not, repeatedly judging whether the local machine of the first unit or the second unit is in a standby state.
5. The method of claim 1, wherein the method further comprises: when the second unit with the wafer exists at present, the method further comprises the following steps:
if not, repeatedly judging whether the wafer exists on the robot hand for transferring the wafer.
6. A wafer processing unit baffle control system based on the wafer processing unit baffle control method of any one of claims 1 to 5, comprising:
the first judgment module is used for judging whether a wafer exists on the robot hand or not;
the second judging module is used for judging whether a second unit with a wafer exists at present or not when the first judging module judges that the wafer does not exist on the robot hand;
the driving module is used for driving the robot to move to the front of a local machine of a first unit for processing a wafer in the next step when the first judging module judges that the wafer exists on the robot, or driving the robot to move to the front of the local machine of a second unit when the first judging module judges that the wafer does not exist on the robot and the second judging module judges that the second unit with the wafer currently exists;
and the baffle opening module is used for controlling the first unit or the second unit to open the baffle.
7. The baffle control system for a wafer processing unit of claim 6, further comprising:
the operation module is used for controlling the robot to add the wafer from the first unit or controlling the robot to remove the wafer from the second unit;
and the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
8. The baffle control system for a wafer processing unit of claim 7, further comprising:
a third judging module, configured to judge whether the baffle is open before the operation module controls the robot to add a wafer from the first unit or controls the robot to remove a wafer from the second unit,
if the judgment result is yes, the operation module controls the robot to add the wafer into the first unit or controls the robot to remove the wafer from the second unit, and if the judgment result is no, the third judgment module repeatedly judges whether the baffle is opened or not.
9. The baffle control system for a wafer processing unit of claim 6, further comprising:
a fourth judging module, configured to judge whether the local computer of the first unit or the second unit is in a standby state before the baffle opening module controls the first unit or the second unit to open the baffle,
if the judgment result is yes, the baffle opening module controls the first unit or the second unit to open the baffle, and if the judgment result is no, the fourth judgment module repeatedly judges whether the machine of the first unit or the second unit is in a standby state.
10. The baffle control system for a wafer processing unit as claimed in claim 6, wherein: and when the second judging module judges that the second unit with the wafer does not exist at present, the first judging module repeatedly judges whether the wafer exists on the robot hand or not.
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